Plating apparatus, waveguide manufacturing method, and waveguide plating method

Abstract

To obtain a plating device capable of surely and easily plating the entire part of the inside wall surface of the passage of a waveguide.SOLUTION: The plating device 100 includes a storage tank 1 that stores a treatment liquid 6, a waveguide 2 that is disposed in the storage tank 1 and in which a flow path 2d through which the treatment liquid 6 flows is formed, a nozzle 3 that is disposed in the storage tank 1 and in which a path 3c through which the treatment liquid 6 flows is formed, a jig 4 that is formed separately from the waveguide 2 and the nozzle 3 and holds relative positions of the waveguide 2 and the nozzle 3, and a circulating member 5 that circulates the treatment liquid 6 in the flow path 2d, the path 3c, and the storage tank 1. The waveguide 2 has an opening end surface 2d where a channel 2h is opened. The jig 4 holds the waveguide 2 and the nozzle 3 in a state where the 2h of the opening end surface of the waveguide 2 and the 3e of the tip of the nozzle 3 are separated from each other in the axial direction and the 2e of the opening of the waveguide 2 and the 3c of the path of the nozzle 3 are coaxially disposed.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a plating apparatus for plating the inner wall surface of a flow path of a waveguide, a method for manufacturing a waveguide using this plating apparatus, and a method for plating a waveguide. [Background technology]

[0002] A flow path for transmitting radio waves is provided inside the waveguide, and the inner wall surface of the flow path is usually plated with a low-resistance noble metal.

[0003] There are two types of plating: electrolytic plating, in which electrons from an external power source react with cations in the plating solution in a reservoir tank to deposit metal ions, and electroless plating, which does not require an external power source and deposits metal ions through the reaction of a reducing agent in the plating solution in a reservoir tank.

[0004] When plating the inner wall surface of a waveguide flow path by electrolytic plating, it is necessary to pass an anode rod through the waveguide flow path and then apply electricity to it.On the other hand, when plating the inner wall surface of a waveguide flow path by electroless plating, it is necessary to rock the waveguide itself or circulate the plating solution in a reservoir tank through the flow path to replace the plating solution in the flow path with the plating solution in the reservoir tank.

[0005] In recent years, the openings of waveguides (the inlet and outlet of the flow path) have become narrower due to the increasing frequency of radio waves, and there are even waveguides with openings that are approximately 1 mm long and 2 mm wide. In addition, in order to connect devices, recent waveguides have been given three-dimensional bends and twists, making the shape of the waveguide more complex.

[0006] For this reason, it has become difficult to pass an anode rod, which is necessary for electrolytic plating, through the flow path in recent waveguides, or to circulate a plating solution through the flow path in electroless plating.

[0007] Patent Document 1 does not disclose a method for plating the inner wall surface of a waveguide flow path, but does disclose a method for plating the inner wall surface of a mold flow path by electroless plating. The plating method disclosed in Patent Document 1 is a technology in which cylindrical inlet and outlet portions communicating with the flow path are integrally formed on the outer surface of the mold, the inlet and outlet portions are connected to the inside of a storage tank by hoses or the like, and the electroless plating solution in the storage tank is sent into the flow path by a pump to circulate between the inside of the storage tank and the inside of the flow path. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2001-073160 Summary of the Invention [Problem to be solved by the invention]

[0009] When the technology disclosed in Patent Document 1 is applied to a method of plating the inner wall surface of a waveguide flow path, it is difficult to provide an inlet port in the waveguide due to constraints on assembling the waveguide and fitting the waveguide to other components. If an inlet port is provided in the waveguide, it must be removed after plating is complete. In this case, the cut surface of the inlet port becomes unplated, and burrs occur at the inlet of the flow path. This requires deburring and re-plating the cut surface, making the plating process cumbersome.

[0010] One effective method for ensuring the circulation of electroless plating solution through a waveguide flow path, where it is difficult to provide an inlet, is to insert the tip of a nozzle for supplying the solution into the flow path. However, this method can result in the electroless plating solution remaining on the inner wall surface of the flow path in the portion from the open end of the waveguide to the tip of the nozzle, leaving part of the inner wall surface of the flow path unplated.

[0011] Before bending or twisting the waveguide, the waveguide is linear, so by swinging the waveguide itself, the electroless plating solution can be circulated within the flow path, making it possible to plate the inner wall surface of the flow path. However, bending or twisting after plating can cause the plating film to peel off from the inner wall surface of the flow path.

[0012] The present disclosure has been made in view of the above, and aims to provide a plating device that can reliably and easily plate the entire inner wall surface of a flow path of a waveguide. [Means for solving the problem]

[0013] In order to solve the above-mentioned problems and achieve the object, the plating apparatus according to the present disclosure includes a storage tank for storing a treatment liquid, a waveguide disposed in the storage tank and having a flow path formed therein through which the treatment liquid flows, a nozzle disposed in the storage tank and having a passage formed therein through which the treatment liquid flows, a jig formed separately from the waveguide and the nozzle and for maintaining the relative positions of the waveguide and the nozzle, and a circulation member for circulating the treatment liquid within the flow path, the passage, and the storage tank. The waveguide has an open end face through which the flow path opens. The jig holds the waveguide and the nozzle in a state in which the open end face of the waveguide and the tip of the nozzle are separated axially and the opening of the waveguide and the passage of the nozzle are coaxially arranged. [Effects of the Invention]

[0014] The plating apparatus according to the present disclosure has the advantage that the entire inner wall surface of the flow path of the waveguide can be plated reliably and easily. [Brief explanation of the drawings]

[0015] [Figure 1] Schematic diagram showing a plating apparatus according to a first embodiment. [Figure 2] 1 is a cross-sectional view showing a waveguide, a nozzle, a jig, and a hose according to the first embodiment. [Figure 3] FIG. 3 is a partially enlarged cross-sectional view showing the nozzle and the jig shown in FIG. [Figure 4]FIG. 1 is a perspective view showing a base plate according to the first embodiment; [Figure 5] FIG. 1 is a perspective view showing a clamp holder according to a first embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0016] Hereinafter, a plating apparatus, a method for manufacturing a waveguide, and a method for plating a waveguide according to embodiments will be described in detail with reference to the drawings.

[0017] Embodiment 1 FIG. 1 is a schematic diagram showing a plating apparatus 100 according to a first embodiment. FIG. 2 is a cross-sectional view showing a waveguide 2, a nozzle 3, a jig 4, and a hose 5c according to the first embodiment. In FIG. 1, the nozzle 3 is not shown, and the jig 4 is depicted in a simplified form. As shown in FIGS. 1 and 2, the plating apparatus 100 includes a storage tank 1, a waveguide 2, a nozzle 3, a jig 4, and a circulation member 5. The plating apparatus 100 is an apparatus for electroless plating the inner wall surface of the flow path 2d of the waveguide 2 shown in FIG. 2. A clamp holder 42 (described later) of the jig 4 is formed in a cylindrical shape having a central axis C. Hereinafter, the direction parallel to the central axis C will be referred to as the axial direction.

[0018] 1, a storage tank 1 stores a processing liquid 6 such as an electroless plating solution. The storage tank 1 is a box-shaped container that is open at the top.

[0019] The waveguide 2 is disposed within the storage tank 1. A flow path 2d through which the treatment liquid 6 flows is formed within the waveguide 2. In this embodiment, the waveguide 2 is a rectangular metal tube. Hereinafter, the axial direction of the waveguide 2 will be referred to as the tube axis direction. As shown in FIG. 2, the tube axis direction coincides with the central axis C where the waveguide 2 is disposed within the jig 4, but does not coincide with the central axis C elsewhere. As shown in FIG. 1, in this embodiment, the cross-sectional shape of the waveguide 2 when cut in a direction perpendicular to the tube axis direction of the waveguide 2 is a rectangle with two parallel long sides and two parallel short sides. The waveguide 2 has a cylindrical tube portion 2a and cylindrical waveguide flange portions 2b and 2c extending from the end of the tube portion 2a in the tube axis direction in a direction perpendicular to the tube axis direction.

[0020] In this embodiment, the tube portion 2a and the waveguide flange portions 2b and 2c are rectangular tubular. The tube portion 2a has a complex shape formed by three-dimensionally bending a rectangular metal tube. The tube portion 2a may have a complex shape formed by three-dimensionally bending or twisting a cylindrical metal tube. As shown in FIG. 2, a single flow path 2d is formed inside the tube portion 2a. The flow path 2d is a space for transmitting radio waves. An opening 2e, which serves as an inlet for the flow path 2d, is provided on one end face 2g of the tube portion 2a in the tube axis direction. Hereinafter, the end face 2g of the tube portion 2a in the tube axis direction may also be referred to as the open end face 2h. One end of the tube portion 2a in the tube axis direction is inserted into the waveguide flange portion 2b. As shown in FIG. 1, an opening 2f, which serves as an outlet for the flow path 2d, is provided on the other end face 2i of the tube portion 2a in the tube axis direction. The other end of the tube portion 2a in the tube axis direction is inserted into the waveguide flange portion 2c.

[0021] The waveguide flanges 2b and 2c are provided at both ends of the tube portion 2a in the tube axis direction. As shown in FIG. 2, the waveguide flange portion 2b has one end face 2j facing the nozzle 3 and the other end face 2k facing away from the nozzle 3. The one end face 2j is adjacent to the open end face 2h. The portion of the one end face 2j located around the open end face 2h is located on the same plane as the open end face 2h in the axial direction. A protrusion 2m is formed at the boundary of the other end face 2k with the outer peripheral surface of the tube portion 2a. The protrusion 2m is a protruding portion formed by welding the tube portion 2a and the waveguide flange portion 2b together. The protrusion 2m protrudes from the other end face 2k in the axial direction toward the base plate 41 (described later). In this embodiment, the shape of the protrusion 2m is rectangular. The outer circumferential dimension of the protruding portion 2m is larger than the outer circumferential dimension of the tubular portion 2a and smaller than the outer circumferential dimension of the waveguide flange portion 2b.

[0022] The nozzle 3 is disposed in the storage tank 1. A passage 3c is formed inside the nozzle 3, through which the treatment liquid 6 flows. The nozzle 3 injects the treatment liquid 6 toward the waveguide 2. The nozzle 3 has a tip 3e facing toward the waveguide 2 and a base end 3f facing away from the waveguide 2. The shape of the nozzle 3 is cylindrical in this embodiment, but is not particularly limited as long as it can inject the treatment liquid 6 toward the waveguide 2. The inner diameter of the nozzle 3 is constant over the entire axial length.

[0023] FIG. 3 is a partially enlarged cross-sectional view showing the nozzle 3 and the jig 4 shown in FIG. 2. As shown in FIG. 3, in this embodiment, the nozzle 3 is formed by fitting an inner cylindrical portion 3a into an outer cylindrical portion 3b, but is not limited to this. The inner cylindrical portion 3a is made of a soft resin material such as polypropylene. The outer cylindrical portion 3b is made of a hard resin material. The interior of the inner cylindrical portion 3a forms a passage 3c. A portion of the inner cylindrical portion 3a protrudes axially from the interior of the outer cylindrical portion 3b toward the waveguide 2 (see FIG. 2). The nozzle 3 is formed with a stepped second shoulder portion 3d extending in a direction intersecting the axial direction. The second shoulder portion 3d is formed on the end surface of the outer cylindrical portion 3b facing the waveguide 2. The second shoulder portion 3d is contactable with a first shoulder portion 42h, which will be described later.

[0024] As shown in Fig. 2, the jig 4 is formed separately from the waveguide 2 and the nozzle 3 and holds the relative positions of the waveguide 2 and the nozzle 3. The jig 4 holds the waveguide 2 and the nozzle 3 in a state where the opening end face 2h of the waveguide 2 and the tip 3e of the nozzle 3 are separated in the axial direction and the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 are coaxially arranged. The jig 4 holds the waveguide 2 and the nozzle 3 so that they cannot move. The jig 4 has a base plate 41, a clamp holder 42, a guide shaft 43, a nut 44, a spacer 45, and a joint 46.

[0025] As shown in FIG. 2, the base plate 41 has one end face 41a facing the clamp holder 42 and another end face 41b facing away from the clamp holder 42. The base plate 41 is formed with a through hole 41c that penetrates in the axial direction from the one end face 41a to the other end face 41b. FIG. 4 is a perspective view showing the base plate 41 in the first embodiment. As shown in FIG. 4, the through hole 41c is composed of a first through hole 41d and a second through hole 41e. The first through hole 41d and the second through hole 41e are in communication with each other through portions of their inner walls. The base plate 41 is generally C-shaped.

[0026] The first through hole 41d has a rectangular shape. The first through hole 41d penetrates a central portion of the base plate 41 in a direction perpendicular to the axial direction. As shown in FIG. 2, a protrusion 2m is disposed in the first through hole 41d. The protrusion 2m is in contact with the inner wall surface of the first through hole 41d. The first through hole 41d and the protrusion 2m are formed so that the opening 2e of the waveguide 2 and the jig 4 are coaxially arranged by bringing the protrusion 2m into contact with the inner wall surface of the first through hole 41d. The opening dimension of the first through hole 41d is larger than the outer peripheral dimension of the tube portion 2a and the outer peripheral dimension of the protrusion 2m, and smaller than the outer peripheral dimension of the waveguide flange portion 2b.

[0027] The second through hole 41e shown in Fig. 4 is a hole for passing the pipe portion 2a when the waveguide 2 shown in Fig. 2 is installed in the jig 4. The shape of the second through hole 41e is rectangular. The second through hole 41e is provided from the first through hole 41d to the outer peripheral surface of the base plate 41, and opens to the outer peripheral surface of the base plate 41. The opening width of the second through hole 41e is formed to be large enough to pass the pipe portion 2a through.

[0028] A plurality of first protrusions 41f are provided on one end face 41a of the base plate 41. Each of the first protrusions 41f protrudes in the axial direction from the one end face 41a of the base plate 41 toward the clamp holder 42 (see FIG. 5). The plurality of first protrusions 41f are provided around the portion of the through hole 41c that opens to the one end face 41a, and are spaced apart at equal angles. The number of first protrusions 41f is four in this embodiment, but may be changed as appropriate. The base plate 41 is also formed with a plurality of first mounting holes 41g that penetrate in the axial direction from the one end face 41a to the other end face 41b. The plurality of first mounting holes 41g are provided on the outer periphery side of the first protrusions 41f, and are spaced apart at equal angles. The number of first mounting holes 41g is three in this embodiment, but may be changed as appropriate.

[0029] 2, the clamp holder 42 is disposed axially apart from the base plate 41. The clamp holder 42 cooperates with the base plate 41 to immobilize the waveguide 2. The clamp holder 42 also immobilizes the nozzle 3. The clamp holder 42 has a clamp holder main body 42a and an attachment flange 42b extending in a direction perpendicular to the axial direction from an end of the outer circumferential surface of the clamp holder main body 42a that faces the base plate 41.

[0030] The clamp holder main body 42a has a cylindrical shape. The clamp holder main body 42a has one end face 42c facing the base plate 41 and another end face 42d facing away from the base plate 41. The clamp holder main body 42a has an axially penetrating housing hole 42e formed therein from the one end face 42c to the other end face 42d. The nozzle 3, spacer 45, and part of the joint 46 are disposed in the housing hole 42e. The nozzle 3, spacer 45, and joint 46 are disposed in this order along the axial direction from the side closest to the base plate 41. The housing hole 42e is composed of a first housing hole 42f and a second housing hole 42g.

[0031] A part of the inner cylindrical portion 3a of the nozzle 3 is disposed in the first accommodating hole 42f. The first accommodating hole 42f is circular. The first accommodating hole 42f opens to one end face 42c. The first accommodating hole 42f extends in the axial direction from the one end face 42c to the other end face 42d. The opening dimension (inner diameter) of the first accommodating hole 42f is smaller than the opening dimension (inner diameter) of the second accommodating hole 42g. The opening dimension (inner diameter) of the first accommodating hole 42f is equal to or slightly larger than the outer peripheral dimension (outer diameter) of the inner cylindrical portion 3a, and smaller than the outer peripheral dimension (outer diameter) of the outer cylindrical portion 3b.

[0032] The second accommodating hole 42g accommodates the remaining portion of the inner cylindrical portion 3a of the nozzle 3, the outer cylindrical portion 3b, the spacer 45, and a portion of the joint 46. The second accommodating hole 42g is circular. The second accommodating hole 42g is connected to the first accommodating hole 42f. The second accommodating hole 42g extends axially from the first accommodating hole 42f to the other end face 42d. The second accommodating hole 42g opens to the other end face 42d. The opening dimension of the second accommodating hole 42g is larger than the outer peripheral dimensions of the inner cylindrical portion 3a and the outer cylindrical portion 3b. A stepped first shoulder portion 42h extending in a direction intersecting the axial direction is formed on the inner wall surface of the second accommodating hole 42g. The first shoulder portion 42h is formed at the boundary between the inner wall surface of the second accommodating hole 42g and the first accommodating hole 42f. A female screw portion 42i is formed on the inner wall surface of the second accommodating hole 42g. The female screw portion 42i is disposed at a position farther axially from the base plate 41 than the first shoulder portion 42h. The female screw portion 42i is formed on the inner wall surface of the first accommodating hole 42f at a position closer to the other end face 42d than the axial center.

[0033] Fig. 5 is a perspective view showing clamp holder 42 in embodiment 1. As shown in Fig. 5, mounting flange portion 42b has a disk shape. Mounting flange portion 42b has one end face 42j facing toward base plate 41 (see Fig. 4) and the other end face 42k facing away from base plate 41. One end face 42j of mounting flange portion 42b and one end face 42c of clamp holder main body portion 42a are located on the same plane in the axial direction. The other end face 42k of mounting flange portion 42b and the other end face 42d of clamp holder main body portion 42a are separated in the axial direction.

[0034] A plurality of second protrusions 42m are provided on one end surface 42j of the mounting flange portion 42b. Each second protrusion 42m protrudes in the axial direction from one end surface 42j of the mounting flange portion 42b toward the base plate 41 (see FIG. 4). The plurality of second protrusions 42m are provided around the portion of the first receiving hole 42f that opens to one end surface 42c, and are spaced apart at equal angles. In this embodiment, the number of second protrusions 42m is four, but this may be changed as appropriate.

[0035] As shown in FIG. 2, the first protrusions 41f and the second protrusions 42m are positioned opposite each other in the axial direction. The tip end surface of the first protrusion 41f contacts the other end surface 2k of the waveguide flange 2b. Meanwhile, the tip end surface of the second protrusion 42m contacts the one end surface 2j of the waveguide flange 2b. In other words, the waveguide flange 2b is sandwiched between the base plate 41 and the clamp holder 42 in the axial direction. Note that the base plate 41 and the clamp holder 42 are immersed in the electroless plating solution and are therefore made of a material that is not reactive with the reducing agent in the electroless plating solution. Examples of such materials include resins such as PEEK (Poly Ether Ether Ketone).

[0036] As shown in Fig. 5, the mounting flange portion 42b is formed with a plurality of second mounting holes 42n that penetrate in the axial direction from one end face 42j to the other end face 42k. The plurality of second mounting holes 42n are provided on the outer circumferential side of the second protrusion portion 42m and are spaced apart at equal angles. In this embodiment, the number of second mounting holes 42n is three, but this may be changed as appropriate. The plurality of first mounting holes 41g (see Fig. 4) and the plurality of second mounting holes 42n are provided in positions that face each other in the axial direction.

[0037] As shown in FIG. 2 , the guide shaft 43 is inserted into the first mounting hole 41g of the base plate 41 and the second mounting hole 42n of the clamp holder 42 to connect the base plate 41 and the clamp holder 42. One guide shaft 43 is inserted into each of the first mounting holes 41g and the second mounting holes 42n. The guide shaft 43 preferably has an outer diameter precision sufficient to allow it to be inserted into the first mounting hole 41g and the second mounting hole 42n by transition fitting. The guide shaft 43 is, for example, a reamer bolt or a pin bolt. Since the guide shaft 43 is immersed in the electroless plating solution, it is made of a material that is not reactive with the reducing agent in the electroless plating solution. Examples of such materials include resins such as PEEK.

[0038] The guide shaft 43 is inserted from the first mounting hole 41g toward the second mounting hole 42n. A nut 44 is threaded onto the tip of the guide shaft 43. The nut 44 prevents the guide shaft 43 from slipping out of the first mounting hole 41g and the second mounting hole 42n. The nut 44 is in contact with the other end surface 42k of the mounting flange portion 42b.

[0039] The spacer 45 is disposed in the housing hole 42e and between the nozzle 3 and the joint 46 in the axial direction. The spacer 45 serves to make the axis of the nozzle 3 parallel to the axial direction. The spacer 45 is in contact with the base end 3f of the nozzle 3 (the end surface of the outer cylinder portion 3b facing away from the waveguide 2). The spacer 45 is disposed in the second housing hole 42g. The spacer 45 is cylindrical in shape. A hole 45a is formed in the spacer 45, penetrating it in the axial direction. A flat surface 3g extending in a direction perpendicular to the axial direction is formed at the base end 3f of the nozzle 3. A flat surface 45b extending in a direction perpendicular to the axial direction is formed at the end surface of the spacer 45 facing the nozzle 3. The nozzle 3 and the spacer 45 are in contact with each other at their flat surfaces 3g and 45b. The outer cylinder portion 3b of the nozzle 3 is sandwiched between the first shoulder portion 42h and the spacer 45 in the axial direction.

[0040] The joint 46 is located on the opposite side of the nozzle 3 in the axial direction across the spacer 45 and is a hose coupling for connection to the hose 5c (described later). The joint 46 is generally cylindrical. A hole 46a is formed through the joint 46 in the axial direction. One end portion 46b of the joint 46 in the axial direction is disposed in the second housing hole 42g. A male thread portion 46e that threadably engages with the female thread portion 42i is formed on the outer peripheral surface of the one end portion 46b of the joint 46. When the male thread portion 46e and the female thread portion 42i are threadably engaged, the joint 46 is rotated toward the base plate 41, causing the second shoulder portion 3d of the nozzle 3 to contact the first shoulder portion 42h. As a result, the outer cylinder portion 3b of the nozzle 3 is sandwiched between the first shoulder portion 42h and the spacer 45.

[0041] The other axial end portion 46c of the joint 46 protrudes from the second housing hole 42g and is disposed within the hose 5c. The outer peripheral surface of the other axial end portion 46c of the joint 46 is formed with corrugated irregularities. The outer peripheral surface of the other axial end portion 46c of the joint 46 is tapered, gradually narrowing as it extends away from the spacer 45 and the nozzle 3 in the axial direction. An intermediate portion 46d between the one axial end portion 46b and the other axial end portion 46c of the joint 46 is the thickest portion of the joint 46.

[0042] The circulation member 5 circulates the treatment liquid 6 through the flow path 2d, the passage 3c, and the storage tank 1. As shown in Fig. 1, the circulation member 5 has a pump 5a disposed outside the storage tank 1, and a plurality of hoses 5b and 5c that connect the inside of the storage tank 1 with the suction side of the pump 5a and that connect the discharge side of the pump 5a with the jig 4.

[0043] Each of the multiple hoses 5b, 5c is arranged inside and outside the storage tank 1. In this embodiment, there are two hoses 5b, 5c. One hose 5b is a hose for sucking the treatment liquid 6. One longitudinal end of one hose 5b is arranged inside the storage tank 1. The other longitudinal end of one hose 5b is connected to the suction side of the pump 5a. The other hose 5c is a hose for discharging the treatment liquid 6. One longitudinal end of the other hose 5c is connected to the discharge side of the pump 5a. The other longitudinal end of the other hose 5c is connected to a joint 46 shown in FIG. 2 inside the storage tank 1.

[0044] As shown in FIG. 1, pump 5a is disposed outside storage tank 1. Pump 5a sucks treatment liquid 6 from storage tank 1 through hose 5b and discharges the sucked treatment liquid 6 toward waveguide 2. The treatment liquid 6 in storage tank 1 flows sequentially through hose 5b, pump 5a, hose 5c, hole 46a of joint 46 shown in FIG. 2, hole 45a of spacer 45, passage 3c of nozzle 3, and flow path 2d of waveguide 2. Then, treatment liquid 6 is discharged into storage tank 1 through opening 2f of waveguide flange 2c shown in FIG. 1. By repeating this operation, treatment liquid 6 in storage tank 1 can be circulated through flow path 2d of waveguide 2.

[0045] Next, the flow rate and various dimensions of the pump 5a of the plating apparatus 100 according to this embodiment will be described.

[0046] The upper limit of the flow rate of the pump 5a is preferably 2 ml / s or more and 8 ml / s or less. The upper limit of the flow rate of the pump 5a can be set, for example, based on the discharge capacity of the pump 5a used. A flow rate several times the above-mentioned value will not hinder electroless plating. However, as the flow rate of the pump 5a increases, a high-pressure water flow is generated, which may cause turbulence and result in unplated areas around the opening 2e of the waveguide 2. For this reason, the flow rate of the pump 5a is preferably approximately 40 ml / s or less. On the other hand, if the flow rate of the pump 5a is insufficient, the electroless plating solution cannot be delivered to the flow path 2d of the waveguide 2, which may result in unplated areas throughout the entire flow path 2d.

[0047] The inner diameter of the passage 3c of the nozzle 3 shown in FIG. 2 (the inner diameter of the inner cylindrical portion 3a) is preferably at least 0.3 mm smaller than the opening diameter of the opening 2e of the waveguide 2. The inner diameter of the passage 3c of the nozzle 3 is preferably 0.81 mm, for example. When the opening 2e of the waveguide 2 is rectangular as in this embodiment, the shorter side of the rectangle is taken as the opening diameter. When the opening 2e of the waveguide 2 is circular, the diameter of the circle is taken as the opening diameter. When the opening 2e of the waveguide 2 is elliptical, the minor axis of the ellipse is taken as the opening diameter.

[0048] The axial distance between the open end face 2h of the waveguide 2 and the tip 3e of the nozzle 3 is defined as D. For example, under the conditions of using a pump 5a with an upper flow rate of 2 ml / s to 8 ml / s and a nozzle 3 with an inner diameter of the passage 3c of 0.81 mm, the distance D is preferably 2 mm or more and 10 mm or less. Experiments by the inventors have shown that, under the above conditions, if the distance D exceeds 10 mm, the electroless plating solution sprayed from the nozzle 3 diffuses, making it difficult to guide into the flow path 2d of the waveguide 2, and preventing smooth flow within the flow path 2d. On the other hand, when a flow visualization simulation was performed under the above conditions, it was found that if the distance D is less than 2 mm, a stagnation area of ​​the electroless plating solution, i.e., an unplated area, occurs within the flow path 2d of the waveguide 2.

[0049] The opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 are arranged coaxially. Here, the coaxiality of the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 includes not only a case where the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 completely overlap when viewed along the axial direction, but also a case where the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 partially overlap when viewed along the axial direction. Even when the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 partially overlap, the inner wall surface of the flow path 2d of the waveguide 2 is plated. Therefore, the coaxiality of the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 includes not only a case where the axis of the opening 2e of the waveguide 2 and the axis of the passage 3c of the nozzle 3 completely coincide, but also a case where the axis of the opening 2e of the waveguide 2 and the axis of the passage 3c of the nozzle 3 are misaligned to the extent that the state where the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 at least partially overlap when viewed along the axial direction can be maintained.

[0050] Next, a method for manufacturing the waveguide 2 according to this embodiment will be described.

[0051] The method for manufacturing the waveguide 2 is a method for manufacturing the waveguide 2 in which the inner wall surface of the flow path 2d is plated, and includes a preparation step, a pretreatment step, a water washing step, and an electroless plating step.

[0052] The preparation step is a step of preparing the plating apparatus 100 shown in FIG. 1. In the preparation step, as shown in FIG. 2, the waveguide flange portion 2b is sandwiched between a base plate 41 and a clamp holder 42, a guide shaft 43 is inserted into a first mounting hole 41g of the base plate 41 and a second mounting hole 42n of the clamp holder 42, and a nut 44 is screwed onto the tip of the guide shaft 43. This holds (fixes) the waveguide 2 in the jig 4. The waveguide 2 is a processed waveguide 2 that has been subjected to three-dimensional bending. Next, in the preparation step, the nozzle 3 and the spacer 45 are inserted in this order into the receiving hole 42e of the clamp holder 42, and the male thread portion 46e of the joint 46 is screwed into the female thread portion 42i of the receiving hole 42e. When the joint 46 is rotated and advanced axially toward the base plate 41, the nozzle 3 and the spacer 45 also advance axially toward the base plate 41. As the nozzle 3 moves axially toward the base plate 41, the first shoulder 42h of the nozzle 3 comes into contact with the second shoulder 3d of the clamp holder 42, and the nozzle 3, the spacer 45, and the joint 46 stop. At this time, the outer cylinder 3b of the nozzle 3 is sandwiched between the second shoulder 3d and the spacer 45. This causes the nozzle 3 to be held (fixed) to the jig 4. Next, in the preparation step, one end in the longitudinal direction of the hose 5c shown in FIG. 1 is connected to the discharge side of the pump 5a, and the other end in the longitudinal direction of the hose 5c is connected to the joint 46 shown in FIG. 2. Next, in the preparation step, the other end in the longitudinal direction of the hose 5b shown in FIG. 1 is connected to the suction side of the pump 5a.

[0053] The pretreatment process is a process for removing oil, dust, and other contaminants adhering to the inner wall surface of the flow path 2d of the waveguide 2 shown in FIG. 2. In the pretreatment process, a pretreatment liquid is poured into the storage tank 1 shown in FIG. 1 as the treatment liquid 6, and one longitudinal end of the hose 5b is immersed in the pretreatment liquid in the storage tank 1. Next, in the pretreatment process, the waveguide 2, the nozzle 3 (see FIG. 2), and the jig 4 are immersed in the pretreatment liquid, and the pump 5a is operated. As a result, the pretreatment liquid in the storage tank 1 flows through the hose 5b, the pump 5a, the hose 5c, the hole 46a of the joint 46 shown in FIG. 2, the hole 45a of the spacer 45, the passage 3c of the nozzle 3, and the flow path 2d of the waveguide 2 in this order. The pretreatment liquid is then discharged into the storage tank 1 through the opening 2f of the waveguide flange portion 2c shown in FIG. 1. This removes contaminants adhering to the inner wall surface of the flow path 2d of the waveguide 2. After the pretreatment process has been performed for a preset time, the hoses 5b and 5c, the waveguide 2, the nozzle 3, and the jig 4 are lifted out of the pretreatment liquid and held in that state, and the pretreatment liquid remaining in the pump 5a and the hoses 5b and 5c is discharged.

[0054] The water rinsing process is a process for cleaning the pretreatment liquid adhering to the inner wall surface of the flow path 2d of the waveguide 2 shown in FIG. 2 during the pretreatment process. In the water rinsing process, water rinsing is poured into the storage tank 1 shown in FIG. 1 as the treatment liquid 6, and one end of the hose 5b in the longitudinal direction is immersed in the water rinsing in the storage tank 1. Next, in the water rinsing process, the waveguide 2, the nozzle 3 (see FIG. 2), and the jig 4 are immersed in the water rinsing, and the pump 5a is operated. As a result, the water rinsing in the storage tank 1 flows through the hose 5b, the pump 5a, the hose 5c, the hole 46a of the joint 46 shown in FIG. 2, the hole 45a of the spacer 45, the passage 3c of the nozzle 3, and the flow path 2d of the waveguide 2 in this order. The water rinsing is then discharged into the storage tank 1 through the opening 2f of the waveguide flange portion 2c shown in FIG. 1. This removes the pretreatment liquid adhering to the inner wall surface of the flow path 2d of the waveguide 2. After the water washing process has been carried out for a preset time, the hoses 5b and 5c, the waveguide 2, the nozzle 3, and the jig 4 are lifted out of the washing water and held in that state, and the washing water remaining in the pump 5a and the hoses 5b and 5c is drained.

[0055] The electroless plating process is a process of plating the inner wall surface of the flow path 2d of the waveguide 2 shown in FIG. 2. In the electroless plating process, an electroless plating solution is poured into the storage tank 1 shown in FIG. 1 as the treatment solution 6, and one longitudinal end of the hose 5b is immersed in the electroless plating solution in the storage tank 1. Next, in the electroless plating process, the waveguide 2, the nozzle 3 (see FIG. 2), and the jig 4 are immersed in the electroless plating solution, and the pump 5a is operated. As a result, the electroless plating solution in the storage tank 1 flows sequentially through the hose 5b, the pump 5a, the hose 5c, the hole 46a of the joint 46 shown in FIG. 2, the hole 45a of the spacer 45, the passage 3c of the nozzle 3, and the flow path 2d of the waveguide 2. The electroless plating solution is then discharged into the storage tank 1 through the opening 2f of the waveguide flange portion 2c shown in FIG. 1. By repeating this operation, the electroless plating solution in the reservoir 1 can be circulated within the flow path 2d of the waveguide 2, and the inner wall surface of the flow path 2d of the waveguide 2 is plated. After the electroless plating process has been carried out for a preset time, the hoses 5b and 5c, the waveguide 2, the nozzle 3, and the jig 4 are lifted out of the electroless plating solution and held in that state, and the electroless plating solution remaining in the pump 5a and the hoses 5b and 5c is discharged.

[0056] By carrying out the above steps, a waveguide 2 having a plated inner wall surface of the flow path 2d can be manufactured. The same reservoir 1 may be used for the pretreatment step, the water washing step, and the electroless plating step, or a dedicated reservoir 1 may be used for each of the pretreatment step, the water washing step, and the electroless plating step. The waveguide plating method is a method for plating the inner wall surface of the flow path 2d of the waveguide 2, and includes a preparation step, a pretreatment step, a water washing step, and an electroless plating step. Each step is the same as the method for manufacturing the waveguide 2 described above, so a description thereof will be omitted here.

[0057] Next, the effects of the plating apparatus 100 according to this embodiment will be described.

[0058] In this embodiment, as shown in FIG. 2 , the plating apparatus 100 includes a jig 4 formed separately from the waveguide 2 and the nozzle 3 and used to maintain the relative positions of the waveguide 2 and the nozzle 3. This configuration eliminates the need to remove any portion after plating is completed, as opposed to the conventional technique of forming a cylindrical inlet port connected to the flow path 2d integrally with the open end face 2h of the waveguide 2. This eliminates the need for any unplated portion due to the removal of the portion. Furthermore, in this embodiment, the jig 4 holds the waveguide 2 and the nozzle 3 so that the open end face 2h of the waveguide 2 and the tip 3e of the nozzle 3 are spaced apart in the axial direction and the opening 2e of the waveguide 2 and the passage 3c of the nozzle 3 are coaxially aligned. This configuration eliminates the need to insert the tip 3e of the nozzle 3 into the flow path 2d, as in the conventional technique. Therefore, this embodiment allows reliable and easy plating of the entire inner wall surface of the flow path 2d of the waveguide 2.

[0059] In this embodiment, as shown in Fig. 1, the waveguide 2 has a cylindrical tube portion 2a and a cylindrical waveguide flange portion 2b extending from the end of the tube portion 2a in the tube axis direction in a direction perpendicular to the tube axis direction. Also, in this embodiment, as shown in Fig. 2, the jig 4 has a base plate 41 and a clamp holder 42 arranged axially apart from the base plate 41, and the waveguide flange portion 2b is sandwiched between the base plate 41 and the clamp holder 42 in the axial direction. With this configuration, the waveguide 2 can be securely held by the jig 4.

[0060] 2, in the present embodiment, a first mounting hole 41g is formed in the base plate 41, penetrating in the axial direction, and a second mounting hole 42n is formed in the clamp holder 42, penetrating in the axial direction. Furthermore, in the present embodiment, the plating apparatus 100 is provided with a guide shaft 43 that is inserted into the first mounting hole 41g and the second mounting hole 42n to connect the base plate 41 and the clamp holder 42. This configuration increases the connecting force between the base plate 41 and the clamp holder 42 by the guide shaft 43, thereby enabling the waveguide flange portion 2b to be securely sandwiched between the base plate 41 and the clamp holder 42. This allows the waveguide 2 to be securely held by the jig 4.

[0061] In this embodiment, as shown in FIG. 2, the jig 4 includes a joint 46 connected to the hose 5c of the circulation member 5. Also, in this embodiment, the clamp holder 42 is formed with a receiving hole 42e that penetrates in the axial direction and in which the nozzle 3 and a portion of the joint 46 are disposed. Also, in this embodiment, the inner wall surface of the receiving hole 42e is formed with a stepped first shoulder portion 42h that extends in a direction intersecting the axial direction, and a female thread portion 42i that is positioned axially farther from the base plate 41 than the first shoulder portion 42h. Also, in this embodiment, the nozzle 3 is formed with a second shoulder portion 3d that can come into contact with the first shoulder portion 42h. Also, in this embodiment, the outer peripheral surface of the joint 46 is formed with a male thread portion 46e that screws into the female thread portion 42i. Furthermore, in this embodiment, by rotating the joint 46 toward the base plate 41, the second shoulder portion 3d comes into contact with the first shoulder portion 42h, and the nozzle 3 is sandwiched between the first shoulder portion 42h and the spacer 45. With this configuration, the nozzle 3 can be securely sandwiched between the first shoulder portion 42h and the spacer 45 by the fastening force of the joint 46, and therefore the nozzle 3 can be securely held by the jig 4. Note that the spacer 45 may be omitted and the nozzle 3 may be sandwiched between the first shoulder portion 42h and the joint 46.

[0062] 2, the end face of the joint 46 facing the nozzle 3 may not be flat due to the influence of the male thread portion 46e, and so if this end face is brought into direct contact with the nozzle 3, the axis of the nozzle 3 may be tilted relative to the axial direction. In this regard, in the present embodiment, the jig 4 includes a spacer 45 that is disposed in the accommodation hole 42e and is disposed between the nozzle 3 and the joint 46 in the axial direction, and the nozzle 3 and the spacer 45 are in contact with each other at their flat surfaces 3g and 45b. This configuration makes it possible to keep the axis of the nozzle 3 parallel to the axial direction.

[0063] In this embodiment, as shown in FIG. 1, the circulation member 5 includes a pump 5a disposed outside the reservoir 1 and multiple hoses 5b and 5c that connect the reservoir 1 to the suction side of the pump 5a and connect the discharge side of the pump 5a to the jig 4. In this embodiment, the upper limit of the flow rate of the pump 5a is 2 ml / s to 8 ml / s, and the inner diameter of the passage 3c of the nozzle 3 shown in FIG. 2 is 0.81 mm. In this embodiment, the axial distance D between the opening end face 2h of the waveguide 2 and the tip 3e of the nozzle 3 is 2 mm or more and 10 mm or less. These configurations allow the electroless plating solution sprayed from the nozzle 3 to be easily guided into the flow path 2d of the waveguide 2 without diffusing, allowing it to flow smoothly within the flow path 2d, and preventing unplated portions from occurring on the inner wall surface of the flow path 2d of the waveguide 2.

[0064] Next, a modification of this embodiment will be described.

[0065] In the above embodiment, as shown in FIG. 1, the cross-sectional shape of the waveguide 2 when cut in a direction perpendicular to the tube axis direction of the waveguide 2 is rectangular. However, this may be modified as appropriate, for example, to a circular shape. In this configuration, the cross-sectional shapes of the tube portion 2a, the waveguide flange portions 2b and 2c, and the protruding portion 2m are circular, and the first through-hole 41d shown in FIG. 4 is also circular. Furthermore, the cross-sectional shape of the tube portion 2a and the cross-sectional shapes of the waveguide flange portions 2b and 2c may be different from each other. For example, the cross-sectional shape of the tube portion 2a may be rectangular, and the cross-sectional shapes of the waveguide flange portions 2b and 2c may be circular. In this configuration, the cross-sectional shapes of the protruding portion 2m and the first through-hole 41d are also circular to match the cross-sectional shape of the waveguide flange portions 2b.

[0066] 2, the first protrusion 41f is provided on the base plate 41 and the second protrusion 42m is provided on the clamp holder 42, but the first protrusion 41f and the second protrusion 42m may be omitted. In this configuration, the waveguide flange 2b may be sandwiched between the flat portion of one end surface 41a of the base plate 41 and the flat portion of one end surface 42j of the clamp holder 42.

[0067] In the above embodiment, as shown in FIG. 3, the first shoulder portion 42h and the second shoulder portion 3d are perpendicular to the axial direction, but may be oblique to the axial direction.

[0068] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, and parts of the configurations may be omitted or modified without departing from the spirit of the invention.

[0069] Various aspects of the present disclosure are summarized below as appendices.

[0070] (Appendix 1) a storage tank for storing a processing liquid; a waveguide disposed in the storage tank and having a flow path formed therein through which the treatment liquid flows; a nozzle disposed in the storage tank and having a passage formed therein through which the treatment liquid flows; a jig formed separately from the waveguide and the nozzle, for holding the relative positions of the waveguide and the nozzle; a circulation member that circulates the treatment liquid through the flow path, the passage, and the storage tank; Equipped with the waveguide has an open end surface at which the flow path opens, The jig holds the waveguide and the nozzle in a state where the open end face of the waveguide and the tip of the nozzle are spaced apart in the axial direction, and the opening of the waveguide and the passage of the nozzle are coaxially arranged. (Appendix 2) the waveguide has a cylindrical tube portion and a cylindrical waveguide flange portion extending from an end portion of the tube portion in a tube axis direction in a direction perpendicular to the tube axis direction, The jig includes a base plate and a clamp holder disposed apart from the base plate in the axial direction, 2. The plating apparatus according to claim 1, wherein the waveguide flange portion is sandwiched between the base plate and the clamp holder in the axial direction. (Appendix 3) The base plate has a first mounting hole formed therethrough in the axial direction, The clamp holder has a second mounting hole formed therethrough in the axial direction, The plating apparatus described in Appendix 2, characterized in that the jig has a guide shaft that is inserted into the first mounting hole and the second mounting hole to connect the base plate and the clamp holder. (Appendix 4) the jig includes a joint connected to the circulation member, the clamp holder has an axially extending receiving hole formed therein, in which the nozzle and a portion of the joint are disposed; The inner wall surface of the accommodating hole is formed with a stepped first shoulder portion extending in a direction perpendicular to the axial direction, and a female screw portion disposed at a position farther away from the base plate in the axial direction than the first shoulder portion, the nozzle is formed with a second shoulder portion that can come into contact with the first shoulder portion; a male screw portion that screws into the female screw portion is formed on the outer circumferential surface of the joint, 4. The plating apparatus of claim 2, wherein the second shoulder contacts the first shoulder by rotating the joint toward the base plate, and the nozzle is sandwiched between the first shoulder and the joint. (Appendix 5) the jig includes a spacer that is disposed in the accommodating hole and is disposed between the nozzle and the joint in the axial direction; 5. The plating apparatus according to claim 4, wherein the nozzle and the spacer are in contact with each other at their flat surfaces. (Appendix 6) the circulation member includes a pump disposed outside the storage tank, and a plurality of hoses connecting the inside of the storage tank with a suction side of the pump and connecting a discharge side of the pump with the jig; The upper limit of the flow rate of the pump is 2 ml / s to 8 ml / s, The inner diameter of the passage of the nozzle is 0.81 mm; 6. The plating apparatus according to any one of claims 1 to 5, wherein the axial distance between the open end face of the waveguide and the tip of the nozzle is 2 mm or more and 10 mm or less. (Appendix 7) a nozzle disposed in the storage tank and having a passage formed therein through which the processing liquid flows; a jig formed separately from the waveguide and the nozzle and configured to hold the waveguide and the nozzle in relative positions; and a circulation member that circulates the processing liquid within the passage, the passage, and the storage tank, wherein the waveguide has an open end face through which the passage opens, and the jig holds the waveguide and the nozzle in a state in which the open end face of the waveguide and a tip of the nozzle are spaced apart in the axial direction and the opening of the waveguide and the passage of the nozzle are coaxially arranged, a reservoir tank filled with an electroless plating solution as the treatment liquid, the waveguide, the nozzle, and the jig being immersed in the electroless plating solution, and then the circulation member is operated. (Appendix 8) a nozzle disposed in the storage tank and having a passage formed therein through which the processing liquid flows; a jig formed separately from the waveguide and the nozzle and configured to hold the relative positions of the waveguide and the nozzle; and a circulation member that circulates the processing liquid through the passage, the passage, and the storage tank, wherein the waveguide has an open end face through which the passage opens, and the method for plating an inner wall surface of the passage of the waveguide using a plating device that holds the waveguide and the nozzle by the jig in a state in which the open end face of the waveguide and a tip of the nozzle are spaced apart in the axial direction and the opening of the waveguide and the passage of the nozzle are coaxially arranged, a method for plating a waveguide, comprising an electroless plating step of charging an electroless plating solution as the treatment liquid into the storage tank, immersing the waveguide, the nozzle, and the jig in the electroless plating solution, and then operating the circulation member. [Explanation of symbols]

[0071] 1 storage tank, 2 waveguide, 2a tube portion, 2b, 2c waveguide flange portion, 2d flow path, 2e, 2f opening, 2g, 2j, 41a, 42c, 42j one end face, 2h opening end face, 2i, 2k, 41b, 42d, 42k other end face, 2m protrusion portion, 3 nozzle, 3a inner cylinder portion, 3b outer cylinder portion, 3c passage, 3d second shoulder portion, 3e tip, 3f base end, 3g, 45b flat surface, 4 jig, 5 circulation member, 5a pump, 5b, 5c hose, 6 processing liquid, 41 base plate, 41c through hole, 41d first through hole, 41e second through hole, 41f first protrusion portion, 41g first mounting hole, 42 clamp holder, 42a Clamp holder main body portion, 42b mounting flange portion, 42e accommodating hole, 42f first accommodating hole, 42g second accommodating hole, 42h first shoulder portion, 42i female thread portion, 42m second protrusion portion, 42n second mounting hole, 43 guide shaft, 44 nut, 45 spacer, 45a, 46a hole, 46 joint, 46b one end portion, 46c other end portion, 46d intermediate portion, 46e male thread portion, 100 plating device.

Claims

1. a storage tank for storing a processing liquid; a waveguide disposed in the storage tank and having a flow path formed therein through which the treatment liquid flows; a nozzle disposed in the storage tank and having a passage formed therein through which the treatment liquid flows; a jig formed separately from the waveguide and the nozzle, for holding the relative positions of the waveguide and the nozzle; a circulation member that circulates the treatment liquid through the flow path, the passage, and the storage tank; Equipped with the waveguide has an open end surface at which the flow path opens, The jig holds the waveguide and the nozzle in a state where the open end face of the waveguide and the tip of the nozzle are spaced apart in the axial direction, and the opening of the waveguide and the passage of the nozzle are coaxially arranged.

2. the waveguide has a cylindrical tube portion and a cylindrical waveguide flange portion extending from an end portion of the tube portion in a tube axis direction in a direction perpendicular to the tube axis direction, The jig includes a base plate and a clamp holder disposed apart from the base plate in the axial direction, 2. The plating apparatus according to claim 1, wherein the waveguide flange portion is sandwiched between the base plate and the clamp holder in the axial direction.

3. a first mounting hole penetrating the base plate in the axial direction; a second mounting hole penetrating the clamp holder in the axial direction; 3. The plating apparatus according to claim 2, wherein the jig includes a guide shaft that is inserted into the first mounting hole and the second mounting hole to connect the base plate and the clamp holder.

4. the jig includes a joint connected to the circulation member, the clamp holder has an axially extending receiving hole formed therein, in which the nozzle and a portion of the joint are disposed; An inner wall surface of the accommodating hole is formed with a stepped first shoulder portion extending in a direction perpendicular to the axial direction, and a female screw portion disposed at a position farther away from the base plate in the axial direction than the first shoulder portion, the nozzle is formed with a second shoulder portion that can come into contact with the first shoulder portion; a male screw portion that screws into the female screw portion is formed on the outer circumferential surface of the joint, 3. The plating apparatus according to claim 2, wherein by rotating the joint toward the base plate, the second shoulder portion contacts the first shoulder portion, and the nozzle is sandwiched between the first shoulder portion and the joint.

5. the jig includes a spacer that is disposed in the accommodating hole and is disposed between the nozzle and the joint in the axial direction; 5. The plating apparatus according to claim 4, wherein the nozzle and the spacer are in contact with each other at their flat surfaces.

6. the circulation member includes a pump disposed outside the storage tank, and a plurality of hoses connecting the inside of the storage tank with a suction side of the pump and connecting a discharge side of the pump with the jig; the upper limit of the flow rate of the pump is 2 ml / s to 8 ml / s; The inner diameter of the passage of the nozzle is 0.81 mm; 6. The plating apparatus according to claim 1, wherein the axial distance between the open end face of the waveguide and the tip of the nozzle is 2 mm to 10 mm.

7. a nozzle disposed in the storage tank and having a passage formed therein through which the processing liquid flows; a jig formed separately from the waveguide and the nozzle and configured to hold the waveguide and the nozzle in relative positions; and a circulation member that circulates the processing liquid within the passage, the passage, and the storage tank, wherein the waveguide has an open end face through which the passage opens, and the jig holds the waveguide and the nozzle in a state in which the open end face of the waveguide and a tip of the nozzle are spaced apart in the axial direction and the opening of the waveguide and the passage of the nozzle are coaxially arranged, a reservoir tank filled with an electroless plating solution as the treatment liquid, the waveguide, the nozzle, and the jig being immersed in the electroless plating solution, and then the circulation member is operated.

8. a nozzle disposed in the storage tank and having a passage formed therein through which the processing liquid flows; a jig formed separately from the waveguide and the nozzle and configured to hold the relative positions of the waveguide and the nozzle; and a circulation member that circulates the processing liquid through the passage, the passage, and the storage tank, wherein the waveguide has an open end face through which the passage opens, and the method for plating an inner wall surface of the passage of the waveguide using a plating device that holds the waveguide and the nozzle by the jig in a state in which the open end face of the waveguide and a tip of the nozzle are spaced apart in the axial direction and the opening of the waveguide and the passage of the nozzle are coaxially arranged, a method for plating a waveguide, comprising an electroless plating step of charging an electroless plating solution as the treatment liquid into the storage tank, immersing the waveguide, the nozzle, and the jig in the electroless plating solution, and then operating the circulation member.

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