Molding apparatus

Abstract

To reduce an ink flow from a gate part GT to a cavity CV.SOLUTION: The molding apparatus 1 includes a fixed mold 3, a movable mold 5, and a gate portion GT. The decorated film 20 is set in the fixed mold 3. The movable mold 5 is disposed to face the fixed mold 3 in the X direction, and forms a cavity CV with the fixed mold 3. The gate portion GT is provided at an end portion CVe of the cavity CV in the Y direction orthogonal to the X direction, and the molten resin MR injected into the cavity CV flows into the gate portion GT. The film 20 has a main body portion 21 disposed in the cavity CV and a flange portion 22 extending from the main body portion 21 and disposed in the gate portion GT. The thickness T3 of the flow path of the molten plastic MR of the gate portion GT is thicker than the thickness T1 of the end portion in the Y direction of the cavity CV to which the gate portion GT is connected.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a molding apparatus. [Background technology]

[0002] The molding device can produce resin molded articles used in, for example, automobile interior parts and home appliances (see, for example, Patent Document 1). In the molding machine, a film is placed in a cavity formed between a fixed mold and a movable mold, and molten resin is injected into the cavity. The film is decorated by printing ink on it. When the molten resin in the cavity solidifies, a molded product with the decorated film is produced. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-14965 Summary of the Invention [Problem to be solved by the invention]

[0004] The molding device has a gate at the end of the cavity through which molten resin is introduced from an external injection device. The film is set so that it extends into the gate. However, the heat and pressure of the molten resin are particularly high at the gate where the molten resin is introduced. The film extending into the gate or the ink printed on the film may soften due to the heat of the molten resin, and the ink may flow from the gate into the cavity due to the flow pressure of the molten resin. The ink flowing from the gate into the cavity may result in a defective appearance of the molded product.

[0005] In a molding device, it is desired to reduce the flow of ink from the gate portion to the cavity. [Means for solving the problem]

[0006] The molding device according to the present invention comprises: a first mold in which the decorated film is set; a second mold disposed opposite the first mold in a first direction and forming a cavity between the first mold and the second mold; a gate portion provided at an end of the cavity in a second direction intersecting the first direction, through which molten resin injected into the cavity flows; the film has a body portion disposed in the cavity and a flange portion extending from the body portion and disposed in the gate portion; The thickness of the flow path for the molten resin at the gate portion is greater than the thickness of the end portion of the cavity in the second direction. [Effects of the Invention]

[0007] According to the present invention, the flow of ink from the gate portion to the cavity can be reduced. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a cross-sectional view schematically illustrating a configuration of a molding device according to an embodiment. [Figure 2] 1A and 1B are diagrams showing an example of a molded body that can be manufactured by the molding device. [Figure 3] 10A and 10B are diagrams illustrating the movement of a movable mold and the operation of a push-out mechanism. [Figure 4] FIG. 2 is an enlarged view of area A in FIG. [Figure 5] FIG. 5 is a view of the core surface of FIG. 4 as seen from the X1 side. [Figure 6] FIG. 6 is a cross-sectional view of the gate portion taken along line AA in FIG. 5. [Figure 7] FIG. 10 is a diagram illustrating a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, a molding device according to an embodiment will be described with reference to the drawings. Fig. 1 is a cross-sectional view that schematically shows the configuration of a molding apparatus 1 according to an embodiment. Fig. 1 shows a state in which a fixed mold 3 and a movable mold 5 are clamped together. Fig. 2 is a diagram showing an example of a molded body 10 that can be manufactured by the molding apparatus 1. In Fig. 2, the film 20 attached to the surface of the molded body 10 is shown hatched. Fig. 3 is a diagram illustrating the movement of the movable die 5 and the operation of the ejection mechanism 6. Fig. 3 shows a state in which the fixed die 3 and the movable die 5 are opened. Note that Fig. 3 does not show the sprue 7, runner 8, and injection unit 9. In the following explanation, the positional relationship will be explained based on the X direction (first direction), Y direction (second direction), and Z direction (third direction) shown in Figure 1 etc. The X, Y, and Z directions are orthogonal (intersecting) to each other. One side of the X direction (the right side in Figure 1) is the X1 side, and the other side (the left side in Figure 1) is the Y2 side. One side of the Y direction (the upper side in Figure 1) is the Y1 side, and the other side (the lower side in Figure 1) is the Y2 side.

[0010] 1, the molding apparatus 1 has a fixed mold 3 (first mold) and a movable mold 5 (second mold). The fixed mold 3 (first mold) and the movable mold 5 (second mold) are arranged opposite to each other in the X direction. The movable mold 5 is provided so as to be movable along the X direction by a movement mechanism (not shown). When the movable mold 5 moves to the X1 side, it approaches the fixed mold 3, and when it moves to the X2 side, it moves away from the fixed mold 3.

[0011] As shown in FIG. 1, when the movable mold 5 moves toward the X1 side, the fixed mold 3 and the movable mold 5 are clamped together. In this clamped state, a cavity CV and a gate portion GT for introducing molten resin into the cavity CV are formed between the fixed mold 3 and the movable mold 5. The gate portion GT is provided at each of the Y1-side and Y2-side ends of the cavity CV. The gate portion GT is connected to a molten resin injection device 9 via a sprue 7 and a runner 8 provided inside the fixed mold 3. The molten resin injected from the injection device 9 is injected into the cavity CV through the gate portion GT. The molten resin injected into the cavity CV solidifies, producing a resin molded body 10 (see FIG. 2). As shown in FIG. 3, when the molded body 10 is to be released from the mold, the movable mold 5 is moved toward the X2 side, and the fixed mold 3 and the movable mold 5 are opened.

[0012] The molded article 10 can be used, for example, in vehicle interior parts, home appliances, and the like. 2 shows a curved panel as an example of a molded body 10 that can be produced by the molding apparatus 1. The X, Y, and Z directions shown in FIG. 2 indicate the positional relationship when the molded body 10 is positioned within the cavity CV of the molding apparatus 1. As shown in Fig. 2, the molded body 10 has a main body portion 11 and a flange portion 12. The main body portion 11 is formed by solidifying the molten resin injected into the cavity CV. The flange portion 12 is formed by solidifying the molten resin injected into the gate portion GT. Note that the molded body 10 also has a portion formed by solidifying the molten resin filled in the sprue 7, but this portion is not shown in the figure. The main body 11 is curved from the Y1-side and Y2-side ends toward the center in the Y direction, protruding toward the X1 side. The flanges 12 are connected to the Y1-side and Y2-side ends of the main body 11. The flanges 12 are cut off after the molded body 10 is released from the molding device 1.

[0013] As shown in FIG. 1, the cavity CV is specifically formed between the cavity surface 31 of the fixed mold 3 and the core surface 51 of the movable mold 5. The cavity surface 31 has a shape corresponding to the X1 side surface of the main body 11 of the molded body 10 shown in Fig. 2. The core surface 51 has a shape corresponding to the X2 side surface of the main body 11. The cavity surface 31 and the core surface 51 are formed in regions that overlap each other when viewed from the X direction. When the fixed die 3 and the movable die 5 are clamped together, the cavity surface 31 and the core surface 51 face each other with a gap in the X direction. This gap forms the cavity CV.

[0014] Note that Figure 1 shows an example in which the cavity surface 31 and the core surface 51 have shapes corresponding to the molded body 10 shown in Figure 2, but this is not limited to the example shown, and the cavity surface 31 and the core surface 51 can be appropriately formed with unevenness, curves, grooves, inclinations, patterns, etc. depending on the shape of the molded body 10 to be produced by the molding device 1. Furthermore, if the shape of the molded body 10 cannot be molded using only the fixed mold 3 and the movable mold 5, a slide core that is movable in the Y direction may be provided in the molding device 1. The slide core is sandwiched between the fixed mold 3 and the movable mold 5 when the fixed mold 3 and the movable mold 5 are clamped together. A cavity CV corresponding to the shape of the molded body 10 is formed between the fixed mold 3, the movable mold 5, and the slide core.

[0015] As shown in FIG. 1, a decorated film 20 is set on the cavity surface 31 . The film 20 is made of a resin sheet such as polycarbonate, and is decorated by printing a design such as black, wood grain, marble, or metallic with ink. With the film 20 set on the cavity surface 31, molten resin is injected into the cavity CV. As a result, the surface of the molded body 10 produced in the cavity CV is covered with the decorated film 20, as shown in FIG.

[0016] As shown in Fig. 1, the molding device 1 includes an extrusion mechanism 6 that extrudes the molded body 10 and releases it from the mold. The extrusion mechanism 6 is provided inside the movable mold 5. The extrusion mechanism 6 includes a moving body 61 that is provided so as to be movable in the X direction by a movement mechanism (not shown), and a plurality of extrusion pins 62 connected to the moving body 61.

[0017] The movable body 61 is disposed in a housing portion 63 formed inside the movable mold 5. The movable body 61 is capable of moving a predetermined distance in the X direction inside the housing portion 63. The predetermined distance is set appropriately according to the distance required to release the molded body 10 from the mold. The ejector pin 62 is a rod-shaped member that protrudes from the end of the movable body 61 on the X1 side. The multiple ejector pins 62 are arranged at intervals from one another in the Y direction and the Z direction. The number of ejector pins 62 can be set appropriately depending on the size and weight of the molded body 10 to be released from the mold.

[0018] The movable die 5 is provided with a through-hole 64 that passes through from the accommodation portion 63 of the movable body 61 to the core surface 51. The ejector pin 62 is inserted into the through-hole 64 so as to be movable in the X direction. As shown in FIG. 1 , when the movable die 5 and the fixed die 3 are clamped together, the tip of the ejector pin 62 is located at the opening end of the through-hole 64 on the X1 side and is flush with the core surface 51.

[0019] 3, after the molten resin injected into cavity CV has solidified, movable mold 5 is moved toward X2 to open the mold, and movable body 61 is moved toward X1 within accommodation section 63. Extrusion pin 62 connected to movable body 61 moves toward X1. The tip of extrusion pin 62 protrudes toward X1 from the opening end of through-hole 64 formed in core surface 51, pushing molded body 10 out of core surface 51 and releasing it from the mold.

[0020] Fig. 4 is an enlarged view of region A in Fig. 1, showing the configuration of gate section GT. Fig. 4 is a cross-sectional view taken along line L1 shown in Fig. 5. Fig. 4 shows an ink layer 23 formed by printing on film 20. The thickness of ink layer 23 is exaggerated. Fig. 5 is a view of the core surface 51 of Fig. 4 as seen from the X1 side. In Fig. 5, the positions of the gate cavity surface 32 of the movable mold 5, the flange portion 22 of the film 20, and the opening 7a of the sprue 7 are shown by imaginary lines. Fig. 6 is a cross-sectional view taken along line AA in Fig. 5. In Fig. 6, one side in the Z direction (the right side in Fig. 6) is the Z1 side, and the other side (the left side in Fig. 6) is the Z2 side. As shown in FIG. 1, the gate portion GT is provided on both the Y1 side and the Y2 side of the cavity CV, but in FIGS. 4 to 6, the configuration of the gate portion GT on the Y1 side is shown as a representative example.

[0021] As shown in FIG. 4, the gate part GT is connected to the end CVe of the cavity CV on the Y2 side, and is connected to a sprue 7 (an inlet for the molten resin MR) provided in the fixed mold 3 on the Y1 side. The gate portion GT is formed between the gate cavity surface 32 (first surface) of the fixed mold 3 and the core surface 51 of the movable mold 5, in regions that face each other in the X direction. The gate cavity surface 32 is connected to the Y1 side of the cavity surface 31 that forms the cavity CV.

[0022] The gate cavity surface 32 is formed by digging a length T2 in the X direction from the cavity surface 31 that constitutes the end CVe of the cavity CV toward the X1 side. The gate cavity surface 32 extends from the Y2 side, where it connects to the cavity surface 31, to the Y1 side. A connection surface 33 (second surface) with the sprue 7 is provided on the Y1 side of the gate cavity surface 32. The tip of the sprue 7 opens at the connection surface 33. An opening 7a of the sprue 7 can be opened and closed by a valve gate (not shown). The connection surface 33 protrudes toward the X2 side from the gate cavity surface 32 by a length T2 in the X direction. An end 32e of the gate cavity surface 32, which is the boundary with the connection surface 33, is a stepped portion having a height T2.

[0023] 4, a guide portion 52 that guides the molten resin MR is provided in an area of ​​the core surface 51 that faces the gate cavity surface 32 in the X direction. A recess 53 is provided in an area of ​​the core surface 51 that faces the connection surface 33 in the X direction. Although not shown, a gas vent hole and a gas vent pin are provided in the recess 53, so that gas generated in the cavity CV can be discharged.

[0024] As shown in Fig. 6, the guide portion 52 is a groove dug into the core surface 51 toward the X2 side. Fig. 6 shows a line segment L2 along the X direction that passes through the center in the Z direction of the gate cavity surface 32. The guide portion 52 is provided on the line segment L2. As shown in Fig. 5, the guide portion 52 is connected to the end CVe of the cavity CV on the Y2 side and to the recess 53 on the Y1 side. The guide portion 52 is also arranged alongside the opening 7a of the sprue 7, which is the inlet for the molten resin MR, on a line segment L1. The line segment L1 is a line segment that runs along the Y direction and passes through the center of the gate cavity surface 32 in the Z direction. The guide portion 52 is formed so that the width of the groove in the Z direction increases from the Y1 side toward the Y2 side.

[0025] As described above, the sprue 7 is connected to the injection device 9 via the runner 8 (see FIG. 1). As shown in FIG. 4, when the valve gate (not shown) of the sprue 7 is opened, the molten resin MR supplied from the injection device 9 is injected into the gate part GT from the opening 7a of the sprue 7 provided on the connection surface 33. The molten resin MR flows from the Y1 side to the Y2 side within the gate portion GT along the guide portion 52 and flows into the end portion CVe of the cavity CV. That is, as shown in Fig. 6, a flow path for the molten resin MR in the gate portion GT is formed between the gate cavity surface 32 and the guide portion 52 facing the gate cavity surface 32 in the X direction.

[0026] As described above, the gate cavity surface 32 is formed by digging from the cavity surface 31 that constitutes the end CVe of the cavity CV toward the X1 side by a length T2 in the X direction (see FIG. 4). The end CVe of the cavity CV has a thickness T1. Meanwhile, the flow path for the molten resin MR in the gate portion GT has a thickness T3 (T1 + T2) because the gate cavity surface 32 is formed by recessing the gate cavity surface 32 by a length T2. In other words, the thickness T3 of the flow path for the molten resin MR in the gate portion GT is thicker than the thickness T1 of the end CVe of the cavity CV (T3 > T1). The "thickness" refers to the length in a direction perpendicular to the flow direction of the molten resin MR (in the illustrated example, the X direction perpendicular to the Y direction). The thickness T3 corresponds to the distance in the X direction between the guide portion 52 and the gate cavity surface 32. The thickness T1 corresponds to the distance in the X direction between the cavity surface 31 and the core surface 51.

[0027] As shown in FIG. 4, the film 20 set in the cavity CV extends from the cavity CV to the Y1 side and into the gate portion GT. Specifically, the film 20 has a main body portion 21 disposed in the cavity CV and a flange portion 22 disposed in the gate portion GT. As shown in Fig. 2, the main body portion 21 of the film 20 covers the main body portion 11 of the molded body 10, and the flange portion 22 covers the flange portion 12 of the molded body 10.

[0028] As shown in FIG. 4, the flange portion 22 of the film 20 is set on the gate cavity surface 32 at the gate portion GT. An end 22e of the flange portion 22 on the Y1 side is located near an end 32e of the gate cavity surface 32. The height (T2) of the end 32e of the gate cavity surface 32 can be set, for example, to be the same as or slightly higher than the thickness of the film 20. In this case, when the flange portion 22 of the film 20 is set on the gate cavity surface 32, the end 32e overlaps the flange portion 22 when viewed from the Y direction.

[0029] The ink layer 23 extends from the main body 21 of the film 20 and is also formed on the flange 22, but as shown in Fig. 4, the ink layer 23 does not reach the end 22e on the Y1 side of the flange 22. In other words, the ink layer 23 is not formed in the region of the end 22e of the flange 22.

[0030] As shown in FIG. 6, the flange portion 22 is sandwiched and held between the gate cavity surface 32 and the area of ​​the core surface 51 excluding the guide portion 52 within the gate portion GT. Furthermore, the gate portion GT is provided with a positioning portion P for reducing positional deviation of the flange portion 22. The positioning portion P is composed of a positioning pin 34 provided on the gate cavity surface 32 and a hole 55 provided on the core surface 51 and into which the tip of the positioning pin 34 is housed. The positioning pin 34 protrudes from the gate cavity surface 32 on the X2 side toward the opposing core surface 51. The tip of the positioning pin 34 is inserted into a hole 55 provided in the core surface 51. The positioning pin 34 and the hole 55 are provided on the Z1 side and the Z2 side of the guide part 52 located on the line segment L2. That is, the positioning portion P is provided at a position offset from the guide portion 52 when viewed from the Y direction so as not to obstruct the flow of the molten resin MR in the guide portion 52. Furthermore, by providing the positioning portions P at two points, the positioning accuracy can be improved.

[0031] The flange portion 22 of the film 20 is provided with holes 24a and 24b through which the positioning pins 34 can be inserted. The holes 24a and 24b are provided corresponding to the positioning pins 34 on the Z1 side and the Z2 side, respectively. In the example of FIG. 5, the hole 24a on the Z1 side is a round hole that follows the shape of the positioning pin 34, and the hole 24b on the Z2 side is an elongated hole that extends along the Z direction.

[0032] If hole 24a is a round hole that conforms to the shape of positioning pin 34, positioning accuracy can be improved by press-fitting positioning pin 34 into the round hole. However, for example, processing errors may cause variations in the positions of hole 24a, 24b in film 20. Therefore, by making hole 24b an elongated hole that can tolerate size variations, positioning accuracy can be maintained and positioning can be reliably performed.

[0033] The operation of the molding device 1 of this embodiment will be described below in comparison with a comparative example. 7 is a diagram showing a comparative example. In the comparative example, the thickness of the flow path for the molten resin MR in the gate portion GT is set to a thickness T1 that is the same as the thickness of the end CVe of the cavity CV. Specifically, the gate cavity surface 32A in the comparative example is not recessed from the end CVe toward the X1 side. Therefore, the end 32e on the Y1 side of the gate cavity surface 32A is not a stepped portion, and the gate cavity surface 32A is formed flush with the connection surface 33 of the sprue 7. Furthermore, in the comparative example, the ink layer 23 is also formed in the region of the end 22e of the flange portion 22 of the film 20.

[0034] As shown in FIG. 1, when producing a molded body 10 using the molding device 1, the user sets a film 20 in the fixed mold 3 and clamps the fixed mold 3 and the movable mold 5 together. Specifically, the main body 21 of the film 20 is placed along the cavity surface 31 of the fixed mold 3, and the flange 22 is placed along the gate cavity surface 32. Then, the round hole and the elongated hole of the flange 22 are inserted onto the positioning pins 34 of the positioning portion P provided on the gate cavity surface 32 (see FIGS. 5 and 6). Once the setting of the film 20 is complete, the user moves the movable mold 5 to the X1 side and clamps the fixed mold 3 and the movable mold 5 together (see FIG. 1). A cavity CV is formed between the cavity surface 31 of the fixed mold 3 and the core surface 51 of the movable mold 5. A gate portion GT is formed between the gate cavity surface 32 of the fixed mold 3 and the core surface 51. The positioning pin 34 of the gate cavity surface 32 is housed in a hole portion 73 provided in the core surface 51 (see FIG. 6).

[0035] The user then opens the valve gate (not shown) of the sprue 7 and supplies the molten resin MR from the injection device 9. As shown in FIG. 4, the molten resin MR is injected into the gate part GT from the opening 7a of the sprue 7 provided on the connection surface 33. In the gate part GT, the molten resin MR flows in the Y direction along a flow path formed between a guide part 52 (see FIG. 5) provided on the core surface 51 and the gate cavity surface 32, and is finally injected into the cavity CV.

[0036] As described above, the ink layer 23 is also formed on the flange portion 22 of the film 20 disposed within the gate portion GT. The flange portion 22 is a portion that does not require printing, since it is cut out together with the flange portion 12 of the molded body 10 after demolding. However, the film 20 may expand and contract, distort, etc. due to the heat and pressure of the molten resin MR. If the ink layer 23 is formed only on the main body portion 21 of the film 20, the expansion and contraction and distortion of the film 20 may cause defects in appearance, such as chipped printing and distortion, on the main body portion 11 of the molded body 10. As shown in FIG. 4, by forming the ink layer 23 so that it extends up to the flange portion 22, expansion and contraction, distortion, etc. of the film 20 can be absorbed, and defects in the appearance of the molded product 10 can be reduced.

[0037] However, the hot molten resin MR is introduced at high pressure from the sprue 7 into the gate portion GT where the flange portion 22 of the film 20 is set. 7, when the flange portion 22 of the film 20 or the ink layer 23 formed on the flange portion 22 at the gate portion GT softens due to the heat of the molten resin MR, the ink i may be pushed toward the cavity CV by the pressure of the molten resin MR. If the ink i in the flange portion 22 flows into the cavity CV, the main body 11 of the molded body 10 may suffer from poor appearance, such as chipped or distorted printing.

[0038] In order to reduce ink flow, it is desirable to make the flange portion 22 and the ink layer 23 of the film 20 at the gate portion GT less susceptible to the heat and pressure of the molten resin MR. Therefore, in this embodiment, the ink layer 23 is not formed in the region of the end 22e of the flange portion 22 of the film 20 on the Y1 side, as shown in FIG. The ink layer 23 on the flange portion 22 only needs to have an area sufficient to absorb the expansion and contraction and distortion of the film 20, and does not need to be formed over the entire surface of the flange portion 22. The end 22e of the flange portion 22 on the Y1 side is located near the end 32e of the gate cavity surface 32. In other words, the end 22e of the flange portion 22 is located near the sprue 7, which is most susceptible to the heat and pressure of the molten resin MR. By not forming the ink layer 23 in the region of the end 22e of the flange portion 22, the ink layer 23 can be kept away from the sprue 7, reducing the effects of the heat and pressure of the molten resin MR.

[0039] In this embodiment, as shown in FIG. 4, the thickness T3 of the flow path of the molten resin MR at the gate portion GT is made thicker than the thickness T1 of the end portion CVe of the cavity CV (T3>T1). Specifically, the gate cavity surface 32 is recessed from the cavity surface 31 toward the X1 side by a length T2 in the X direction, thereby widening the gap in the X direction between the gate cavity surface 32 and the guide portion 52 formed on the core surface 51. The pressure of the molten resin MR is applied in the Y direction, which is the direction in which the molten resin MR flows. By widening the thickness of the flow path of the molten resin MR in the X direction, the pressure of the molten resin MR is dispersed. This reduces the pressure of the molten resin MR applied to the flange portion 22 and the ink layer 23. 7, the thickness of the flow path for the molten resin MR at the gate portion GT is the same as the thickness T1 of the end portion CVe of the cavity CV. That is, the distance between the gate cavity surface 32A and the core surface 51 in the X direction is narrower than in this embodiment (see FIG. 4). Therefore, in the comparative example, the pressure of the molten resin MR in the gate portion GT is not easily dispersed, and the film 20 and the ink layer 23 set on the gate cavity surface 32A are easily subjected to the pressure of the molten resin MR.

[0040] Here, the effects of the heat and pressure of the molten resin MR can also be reduced by increasing the length of the gate section GT in the Y direction and moving the position of the sprue 7 toward the Y1 side, away from the film 20. However, increasing the length of the gate section GT in the Y direction may lead to an increase in the size of the molding apparatus 1. In this embodiment, as shown in FIG. 4, the gate cavity surface 32 is dug down from the cavity surface 31 toward the X1 side to increase the thickness of the flow path for the molten resin MR, so that the pressure of the molten resin MR can be dispersed while avoiding an increase in the size of the molding apparatus 1.

[0041] Furthermore, the end 32e on the Y1 side of the gate cavity surface 32 is a stepped portion having a height T2. When viewed from the X direction, the end 32e is located between the sprue 7 and the flange portion 22. The end 32e also protrudes from the gate cavity surface 32 toward the X2 side so as to cover the end 22e of the flange portion 22 of the film 20. That is, the molten resin MR injected from the opening 7a of the sprue 7 provided on the connection surface 33 is blocked by the protruding end 32e, making it difficult for the molten resin MR to come into direct contact with the end 22e of the flange portion 22.

[0042] In addition, in this embodiment, the gate cavity surface 32 of the fixed mold 3 is formed by digging down on the X1 side between the cavity surface 31 and the connection surface 33, so that the end portion 32e can be formed as a step portion, thereby reducing the effects of heat and pressure of the molten resin MR with a simple configuration.

[0043] As described above, this embodiment reduces the influence of the heat and pressure of the molten resin MR flowing in from the sprue 7 on the flange portion 22 and ink layer 23 of the film 20 set in the gate portion GT. This reduces the possibility that the flange portion 22 and ink layer 23 will soften due to the heat of the molten resin MR, and that the pressure of the molten resin MR will push the ink toward the cavity CV. Reducing the ink flow reduces defects in the appearance of the molded body 10, improving the quality of the molded body 10 and increasing production efficiency.

[0044] Here, the flange portion 12 (see FIG. 2) of the molded body 10 formed from the molten resin filled in the gate portion GT is a portion that does not require a large thickness because it is ultimately cut off from the main body portion 11. For this reason, it has conventionally been common for the thickness of the flow path for the molten resin MR at the gate portion GT to be the same as or thinner than the thickness T1 of the end portion CVe of the cavity CV. However, after extensive research into a configuration for reducing ink flow, the inventors came up with the idea of ​​reducing the effect of heat and pressure of the molten resin MR on the flange portion 22 and the ink layer 23 within the gate portion GT. The inventor further conducted extensive research into a configuration that reduces the effects of heat and pressure of the molten resin MR while avoiding the molding device 1 becoming larger, and came up with the idea of ​​making the thickness T3 of the flow path for the molten resin MR at the gate portion GT thicker than the thickness T1 of the end portion CVe of the cavity CV.

[0045] As described above, the molding device 1 according to this embodiment has, for example, the following configuration. (1) The molding device 1 includes a fixed mold 3 (first mold), a movable mold 5 (second mold), and a gate unit GT. A decorated film 20 is set in the fixed mold 3. The movable mold 5 is disposed opposite the fixed mold 3 in the X direction (first direction), and forms a cavity CV between itself and the fixed mold 3. The gate portion GT is provided at an end portion CVe of the cavity CV in the Y direction (second direction) perpendicular to (intersecting with) the X direction, and the molten resin MR injected into the cavity CV flows into the gate portion GT. The film 20 has a main body portion 21 disposed within the cavity CV, and a flange portion 22 extending from the main body portion 21 and disposed within the gate portion GT. The thickness T3 of the flow path of the molten resin MR at the gate part GT is greater than the thickness T1 of the end part CVe in the Y direction of the cavity CV to which the gate part GT is connected.

[0046] The flange portion 22 of the film 20 disposed within the gate portion GT is susceptible to the heat and pressure of the molten resin MR. If the flange portion 22 or the ink layer 23 formed on the flange portion 22 softens due to the heat of the molten resin MR, the pressure of the molten resin MR may push the ink toward the cavity CV. If the ink in the flange portion 22 flows from the gate portion GT into the cavity CV, the appearance of the molded body 10 may be impaired.

[0047] In this embodiment, the thickness T3 of the flow path for the molten resin MR at the gate portion GT is made thicker than the thickness T1 of the end portion CVe of the cavity CV. By increasing the thickness of the flow path, the flange portion 22 of the film 20 can be positioned at the gate portion GT in a location that is less susceptible to the heat and pressure of the molten resin MR. This reduces the occurrence of defects in the appearance of the molded body 10 due to ink flow at the gate portion GT, and is expected to improve the quality of the molded body 10 and increase productivity.

[0048] Note that "thickness" refers to the length in a direction perpendicular to the direction in which the molten resin MR flows. In the embodiment, an example is shown in which the gate portion GT extends along the Y direction (see FIG. 4). In this case, "thickness" refers to the length in the X direction perpendicular to the Y direction. However, the shape of the gate portion GT is not limited to that shown in the figure, and it is also possible for it to extend along the X direction, for example. In this case, "thickness" refers to the length in the Y direction perpendicular to the X direction.

[0049] (2) An ink layer 23 is formed on the film 20 by printing. The ink layer 23 can be formed over the main body portion 21 of the film 20 and at least a portion of the flange portion 22 .

[0050] The film 20 may expand and contract, or distort due to the heat and pressure of the molten resin MR. If the ink layer 23 is formed only on the main body portion 21 of the film 20, the expansion and contraction, distortion, etc. of the film 20 may cause defects in appearance such as missing print or distortion in the main body portion 11 of the molded body 10. By forming the ink layer 23 to extend to the flange portion 22, the expansion and contraction, distortion, etc. of the film 20 can be absorbed, and defects in appearance of the molded body 10 can be reduced.

[0051] (3) The gate portion GT has a Y2 side (one side) in the Y direction connected to the cavity CV, and a Y1 side (other side) connected to the sprue 7 which is an inlet for the molten resin MR. The ink layer 23 is not formed on the end 22e of the flange portion 22 of the film 20 on the Y2 side in the Y direction.

[0052] The area near the sprue 7 of the gate part GT is the area most affected by the heat and pressure of the molten resin MR. The ink layer 23 is not formed on the end 22e of the flange part 22 of the film 20 located in this area. This reduces the influence of the heat and pressure of the molten resin MR on the ink layer 23 and the occurrence of ink flow.

[0053] (4) The flange portion 22 is disposed on the gate cavity surface 32 (first surface) of the gate portion GT located on the fixed mold 3 side in the X direction (X1 side, first mold side). The sprue 7 opens to a connection surface 33 (second surface) provided on the Y1 side of the gate cavity surface 32. Between the gate cavity surface 32 and the connection surface 33, an end portion 32e is provided as a step portion.

[0054] For example, the end 32e between the gate cavity surface 32 and the connection surface 33 where the opening 7a of the sprue 7 is provided is made a step portion. This reduces direct contact of the molten resin MR injected from the sprue 7 into the gate portion GT with the flange portion 22 of the film 20 set on the gate cavity surface 32. This makes it possible to reduce ink flow at the gate portion GT.

[0055] (5) The gate section GT is provided with a positioning section P for positioning the flange section 22 of the film 20.

[0056] This reduces the possibility that the film 20 will be displaced due to the pressure of the molten resin MR flowing into the gate portion GT.

[0057] (6) The gate portion GT extends along the Y direction and has a guide portion 52 that guides the molten resin MR toward the cavity CV. The positioning portion P is provided at a position offset from the guide portion 52 when viewed from the Y direction.

[0058] This can reduce interference of the positioning portion P with the flow of the molten resin MR at the gate portion GT.

[0059] (7) The positioning portion P has a positioning pin 34 that extends from the X1 side to the X2 side in the X direction at the gate portion GT. The flange portion 22 of the film 20 has holes 24a and 24b through which the positioning pins 34 can be inserted.

[0060] As a result, when setting film 20, positioning pins 34 of gate portion GT are inserted into holes 24a, 24b of flange portion 22, so that film 20 can be easily positioned.

[0061] (8) The positioning pins 34 are provided on the Y1 side and the Y2 side (one side and the other side) of the guide portion 52 when viewed from the Y direction. The holes include, for example, a hole 24a (first hole) through which the positioning pin 34 on the Y1 side is inserted, and a hole 24b (second hole) through which the positioning pin 34 on the Y2 side is inserted. The hole 24a is a round hole that follows the shape of the positioning pin 34, and the hole 24b is an elongated hole that extends along the Z direction (third direction) that is perpendicular to (intersects with) the X direction and the Y direction.

[0062] Positioning accuracy can be improved by positioning the flange portion 22 with the two positioning pins 34. Furthermore, by making the holes 24a, 24b through which the two positioning pins 34 are inserted a round hole and an elongated hole, it is possible to allow for variations in the size of the holes while maintaining positioning accuracy, thereby ensuring reliable positioning.

[0063] (i) In the molding device 1, the first mold can be a fixed mold 3, and the second mold can be a movable mold 5 that moves toward or away from the fixed mold 3 along the X direction (first direction). The gate portion GT can be formed between the core surface 51 of the movable mold 5 and the gate cavity surface 32 of the fixed mold 3 . [Explanation of symbols]

[0064] 1 Molding equipment 3 Fixed type (first type) 5 Movable type (second type) 6 Extrusion mechanism 7 Sprue (inlet) 8 Runner 9 Injection device 10 Molded body 11 Main body 12 Flange 20 Film 21 Main body 22 Flange 22e end 23 Ink layer 24a, 24b holes 31 Cavity surface 32 Gate cavity surface 32e end 33 Opposite Surface 34 Locating pin 51 Core Surface 52 Guide section 52e end 53 Recess 61 Mobile 62 ejector pin 63 Storage unit 64 through holes CV cavity MR molten resin GT Gate Section P Positioning part

Claims

1. a first mold in which the decorated film is set; a second mold disposed opposite the first mold in a first direction and forming a cavity between the first mold and the second mold; a gate portion provided at an end of the cavity in a second direction intersecting the first direction, through which molten resin injected into the cavity flows; the film has a body portion disposed in the cavity and a flange portion extending from the body portion and disposed in the gate portion; A molding device, wherein the thickness of the flow path for the molten resin at the gate portion is greater than the thickness of the end portion of the cavity in the second direction.

2. In claim 1, An ink layer is formed on the film, The ink layer is formed over the main body portion and at least a portion of the flange portion.

3. In claim 2, one side of the gate portion in the second direction is connected to the cavity, and the other side is connected to an inlet for the molten resin; A molding device, wherein the ink layer is not formed on the other end of the flange portion in the second direction.

4. In claim 3, the flange portion is disposed on a first surface of the gate portion that is located on the first die side in the first direction, the inlet opens to a second surface provided on the other side of the first surface, A molding apparatus, wherein a step portion is provided between the first surface and the second surface.

5. In claim 2, The molding apparatus is configured such that the gate portion is provided with a positioning portion that positions the flange portion.

6. In claim 5, the gate portion has a guide portion that extends along the second direction and guides the molten resin toward the cavity, A molding device, wherein the positioning portion is provided at a position offset from the guide portion when viewed from the second direction.

7. In claim 6, the positioning portion has a positioning pin extending from one side to the other side in the first direction in the gate portion, a flange portion of the film having a hole into which the positioning pin can be inserted;

8. In claim 7, the positioning pins are provided on one side and the other side of the guide portion when viewed from the second direction, the hole portion includes a first hole portion through which the positioning pin on the one side is inserted and a second hole portion through which the positioning pin on the other side is inserted, A molding device, wherein the first hole portion is a round hole that follows the shape of the positioning pin, and the second hole portion is an elongated hole that extends along a third direction that intersects the first direction and the second direction.

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