Device manufacturing system, semiconductor manufacturing system, and exhaust pipe joint unit
JP2026032807APending Publication Date: 2026-02-27AMNEXT TECH INC
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Patent Information
- Application Number
- JP2024135772
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-08-15
- Publication Date
- 2026-02-27
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Figure 2026032807000001_ABST
Abstract
To provide a device manufacturing system capable of accurately estimating a deposition amount of a component deposited in a flow path for guiding gas.SOLUTION: A semiconductor manufacturing system 11, which is an embodiment of a device manufacturing system, includes a first apparatus 13 having a chamber 12 that holds a gas, a second apparatus 14 connected to the chamber 12 and disposed in a flow path that guides a gas containing a deposition component, a joint 21 that at least partially defines the flow path upstream or downstream of the second apparatus 14, and a pressure measuring device 35 that is coupled to the joint 21 and measures a pressure in the flow path at a detection position 36 set in the flow path.SELECTED DRAWING: Figure 1
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