Tape mounter, processing device, and workpiece processing method

Abstract

To prevent a device from becoming complicated even when a plurality of works are to be stuck on a tape of a frame set. [Solution] A tape mounter (70) attaches a workpiece (W) to tape (T) that is attached so as to close an opening (F1) of a ring frame (F). The tape mounter includes a frame rail (71) that supports a frame set (FS) to which tape is attached so as to close the opening of the ring frame, a work moving mechanism (75) that moves the workpiece to the tape of the frame set supported by the frame rail, a table (72) that supports the surface opposite to the tape attachment surface, and an attachment mechanism (76) that attaches the workpiece moved by the work moving mechanism to the attachment surface of the tape supported by the table.

Description

[Technical Field]

[0001] The present invention relates to a tape mounter, a processing device, and a method for processing a workpiece. [Background technology]

[0002] Patent Document 1 discloses a tape mounter that forms a work set by integrating a ring frame and a work by applying tape. The tape mounter of Patent Document 1 includes a ring frame holding table that holds the ring frame, and a work table that holds the work in an opening of the ring frame. The tape mounter of Patent Document 1 also includes an applying means that applies tape to the upper surface of the ring frame held on the ring frame holding table and the upper surface of the work held on the work table. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-019114 Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, when multiple workpieces are to be attached to tape inside a single ring frame, multiple work tables must be arranged. Therefore, as the number of workpieces to be attached to tape increases, the number of work tables must also increase, which creates a problem of the device becoming more complicated.

[0005] The present invention has been made in consideration of these points, and one of its objects is to provide a tape mounter, processing device, and workpiece processing method that can avoid the device becoming complicated even when there are multiple works to be attached to the tape of a frame set. [Means for solving the problem]

[0006] One embodiment of the tape mounter of the present invention is a tape mounter that attaches a workpiece to tape that is affixed so as to cover an opening in a ring frame, and includes a frame rail that supports a frame set to which the tape is affixed so as to cover the opening of the ring frame, a work moving mechanism that moves the workpiece to the tape of the frame set supported by the frame rail, a table that supports the side opposite the affixed side of the tape, and an attachment mechanism that attaches the workpiece moved by the work moving mechanism to the affixed side of the tape supported by the table.

[0007] One embodiment of the processing device of the present invention is a processing device comprising a chuck table that holds a work set formed by integrating a ring frame and a workpiece with tape adhered thereto, a processing unit that processes the workpiece held on the chuck table, and a transport mechanism that transports the workpiece to the chuck table, and further comprising a frame cassette stage that places a frame cassette that houses the frame set with the tape adhered thereto so as to cover the opening of the ring frame, a work cassette stage that places a workpiece cassette that houses the workpiece, and the above-mentioned tape mounter that adheres the workpiece to the tape of the frame set to form the workpiece. [Effects of the Invention]

[0008] According to the tape mounter of the present invention, the workpiece is moved by the workpiece moving mechanism to the tape of the frame set supported by the frame rail, so when attaching multiple workpieces, the workpieces can be moved and attached one by one. This makes it possible to accommodate changes in the number of workpieces to be attached without increasing the number of devices for holding the workpieces, and avoids making the device more complicated. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view of the appearance of a cutting device according to an embodiment; [Figure 2] 1 is a perspective view of the inside of a cutting device according to an embodiment; [Figure 3]FIG. 2 is a perspective view of each housing according to the embodiment. [Figure 4] FIG. 2 is a perspective view of the inside of the lowermost container according to the embodiment. [Figure 5] FIG. 10 is a perspective view of the interior of the center stage container of the embodiment. [Figure 6] FIG. 2 is a perspective view of the inside of the topmost container according to the embodiment. [Figure 7] FIG. 7 is an exploded view of FIG. [Figure 8] FIG. 8A is an explanatory diagram of a frame set transport process, and FIG. 8B is an explanatory diagram of a workpiece transport process. [Figure 9] 9A to 9C are explanatory diagrams of the workpiece adhering step. [Figure 10] 10A and 10B are explanatory diagrams of the workpiece adhering step, and FIG. 10C is an explanatory diagram of the workpiece set transport step. [Figure 11] FIG. 10 is a block diagram of an input unit and a control unit according to a modified example. [Figure 12] FIG. 10 is a diagram showing an example of an input screen of an input unit in a modified example. [Figure 13] FIG. 10 is a diagram showing an example of a ring frame data table according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, a case where a processing device according to an embodiment is applied to a cutting device will be described with reference to the accompanying drawings. Note that the cutting device according to the embodiment is not limited to the configuration shown below and can be modified as appropriate.

[0011] FIG. 1 is an external perspective view of a cutting device according to an embodiment. First, the overall configuration of the cutting device 1 will be described with reference to FIG. 1. The X-axis, Y-axis, and Z-axis directions shown in FIG. 1 are perpendicular to one another. The X-axis and Y-axis directions are substantially horizontal, and the Z-axis direction is the up-down direction (vertical direction). In addition, in the following drawings, the front side in the X-axis direction will be referred to as the +X side, the rear side as the -X side, the right side in the Y-axis direction as the +Y side, the left side as the -Y side, and the upper side in the Z-axis direction as the +Z side and the lower side as the -Z side.

[0012] 1, the cutting device 1 is provided with a display unit 48 that receives operations from an operator, and various processing conditions for the cutting device 1 are set by the display unit 48. The cutting device 1 is configured to move the cutting blade 28 (see FIG. 2) and the workpiece W held on the chuck table 14 relatively based on the setting conditions set on the display unit 48, thereby cutting the workpiece W on the chuck table 14 along the streets.

[0013] The workpiece W may be any object to be machined, and an example thereof is a plate-like member having a rectangular shape in a planar view, such as a PCB (Printed Circuit Board) substrate. When the workpiece W is held on the chuck table 14 and cut, it is attached to the tape T of the frame set FS, which has tape T attached so as to cover the opening F1 of the ring frame F. In this embodiment, the state in which the workpiece W is attached to the tape T of the frame set FS is referred to as the state of the workpiece WS. In other words, the workpiece WS is formed by integrating the ring frame F and the workpiece W with the tape T attached to them. In this embodiment, the upper surface of the tape T serves as the attachment surface and is attached to the ring frame F and the workpiece W. The workpiece WS is formed by a tape mounter 70 (see FIG. 6 ), which will be described later. An example of the tape T is an adhesive tape having an adhesive layer applied to a tape substrate.

[0014] The cutting device 1 has a rectangular parallelepiped housing 10 that covers the machining space for cutting, and a support base 13 that is adjacent to the housing 10 and forms a standby space and a cleaning space. The center of the top surface of the support base 13 is open so as to extend toward the inside of the housing 10, and this opening is covered by a moving plate 15 that is movable together with the chuck table 14 and a bellows-shaped waterproof cover 16. A processing feed mechanism 21 (see FIG. 2) that moves the chuck table 14 in the processing feed direction, which is the X-axis direction, is provided below the waterproof cover 16. FIG. 1 shows a state in which the chuck table 14 has been moved to the outside of the housing 10 and is on standby on the support base 13.

[0015] The chuck table 14 has a holding surface 17 formed of a porous ceramic material, and the workpiece W is held by suction due to the negative pressure generated on this holding surface 17. Four air-driven clamps 18 are provided around the periphery of the chuck table 14, and the ring frame F of the workpiece WS is clamped and fixed from all four sides by each clamp 18. A pair of guides 19 extending in the Y-axis direction are provided above the chuck table 14. The workpiece WS is positioned in the X-axis direction relative to the chuck table 14 by the pair of guides 19 moving closer and farther apart in the X-axis direction.

[0016] FIG. 2 is a perspective view of the inside of a cutting device according to an embodiment. As shown in FIG. 2, a ball-screw type processing feed mechanism 21 is provided on a base 20 within the housing 10 and the support base 13 (see FIG. 1). The processing feed mechanism 21 moves the chuck table 14 in a processing feed direction, which is the X-axis direction. A gate-shaped standing wall portion 22 is provided on the base 20 so as to straddle the movement path of the chuck table 14. The standing wall portion 22 is provided with an indexing feed mechanism 25 that moves the processing unit 24 in an indexing feed direction, which is the Y-axis direction, and a cutting feed mechanism 26 that moves the processing unit 24 in a cutting feed direction, which is the Z-axis direction. In this embodiment, the processing unit 24 and the cutting feed mechanism 26 are provided in pairs in the Y-axis direction.

[0017] A cutting blade 28 for machining the workpiece W of the workpiece set WS held on the chuck table 14 is rotatably mounted on the spindle of each machining unit 24. Each cutting blade 28 is formed into a disk shape by, for example, bonding diamond abrasive grains with a binder.

[0018] Returning to FIG. 1, a first transport mechanism 30 (transport mechanism) that transports the work set WS to the chuck table 14 is provided on the side surface 11 of the housing 10. The first transport mechanism 30 includes a ball screw type drive mechanism 31 installed on the side surface 11 of the housing 10, a slide arm 32 that moves in the Y-axis direction by the drive mechanism 31, and an inversion mechanism 33 whose base is supported on the lower end of the slide arm 32. The first transport mechanism 30 also includes a clamp 35 and a workpiece holder 36 that are provided at the tip (end on the +X side) of the inversion mechanism 33.

[0019] The inversion mechanism 33 is provided so that the clamp 35 and the workpiece holding part 36 can rotate in 180° increments around the X axis, and drives the clamp 35 or the workpiece holding part 36 so that one can be selectively directed to the -Y side. The clamp 35 has gripping pieces that open and close vertically, and holds the end of the ring frame F by clamping it. The workpiece holding part 36 is provided so that, when directed to the -Y side by the inversion mechanism 33, the upper surface can suction-hold the underside of the workpiece W.

[0020] A cleaning unit 38 that cleans the machined workpiece set WS is provided on the +Y side of the chuck table 14. The cleaning unit 38 lowers the spinner table 39 that holds the workpiece set WS into the support base 13, and sprays cleaning water toward the workpiece set WS that is being rotated at high speed to clean the workpiece set WS. Thereafter, the cleaning unit 38 sprays dry air instead of cleaning water to dry the workpiece set WS.

[0021] A second transport mechanism 40 that transports the work set WS between the chuck table 14 and the spinner table 39 is further provided on the side surface 11 of the housing 10. The second transport mechanism 40 includes a ball screw type drive mechanism 42 installed on the side surface 11 of the housing 10, a slider 43 that moves in the Y-axis direction by the drive mechanism 42, and an elevator 44 supported on the lower end of the slider 43.

[0022] The second transport mechanism 40 further includes a transport pad 46 that is provided below the lifting unit 44 and that can be moved in the Z-axis direction, which is the up and down direction, by driving the lifting unit 44. The transport pad 46 is provided so that it can adsorb the upper surface of the ring frame F of the work set WS. By driving the lifting unit 44 to lower the transport pad 46, the work set WS held by the transport pad 46 can be placed on the chuck table 14, or the work set WS on the chuck table 14 can be held by the transport pad 46. In addition, by driving the lifting unit 44 to raise the transport pad 46, the transport pad 46 and other components can be retracted to avoid contact with the first transport mechanism 30.

[0023] A display unit 48 consisting of a touch panel monitor or the like is provided on the -Y side surface of the housing 10. The display unit 48 displays processing conditions and the like, as well as an operation screen for setting the processing conditions and the like. The cutting device 1 is also provided with a control unit (not shown) that controls each part of the device. The control unit is made up of a processor that executes various processes, a memory, and the like. The memory is made up of one or more storage media such as a ROM (Read Only Memory) or a RAM (Random Access Memory) depending on the application. The memory stores, for example, a control program that controls each part of the device, as well as a processing program that executes image processing, which will be described later.

[0024] A lifting mechanism 50 capable of moving the containers C1 to C3, which are stacked three levels above each other, in the Z-axis direction, which is the up-down direction, is provided on the support base 13 adjacent to the chuck table 14. The lifting mechanism 50 is configured with a ball screw type drive mechanism that moves a stage 51, on which the containers C1 to C3 are placed, in the Z-axis direction. By driving the lifting mechanism 50, the height positions (positions in the Z-axis direction) of the containers C1 to C3 can be controlled.

[0025] FIG. 3 is a perspective view of each container according to the embodiment, with the interior of each container omitted. As shown in FIG. 3, the containers C1 to C3, stacked three levels vertically, are each box-shaped and open on the +Y side. Although the sizes in the Z-axis direction are different, the sizes in the X-axis and Y-axis directions are the same. Of the three containers C1 to C3 stacked vertically, the internal space of the bottom container C1 is formed as a frame cassette area, and its bottom wall forms a frame cassette stage 53. Furthermore, of the three containers C1 to C3 stacked vertically, the internal space of the container C2 in the middle level is formed as a work cassette area, and its bottom wall forms a work cassette stage 54. Furthermore, of the three containers C1 to C3 stacked vertically, the internal space of the topmost container C3 is formed as an attachment area, and its bottom wall forms an attachment stage 55.

[0026] FIG. 4 is a perspective view of the inside of the lowest storage unit in this embodiment. As shown in FIG. 4, one frame cassette 57 that stores a frame set FS is placed on the frame cassette stage 53. The frame cassette 57 can store not only the frame set FS but also a work set WS, which is a frame set FS with a workpiece W attached thereto. However, the following description will focus on the case where a frame set FS is stored. The frame cassette stage 53 is provided with positioning portions 58 that position the four corners. The positioning portions 58 are formed in an L-shape when viewed from above, and in this embodiment, a total of four positioning portions 58 are provided corresponding to one frame cassette 57 (one positioning portion is not shown). The positioning portions 58 come into contact with the four corners of the frame cassette 57, thereby positioning the frame cassette 57.

[0027] The frame cassette 57 has an opening 60 formed on the +Y side, through which the frame sets FS are loaded and unloaded by the first transport mechanism 30 (see FIG. 1). The frame cassette 57 has multiple shelves 61 inside for storing multiple frame sets FS. The shelves 61 are provided so as to protrude inward by a predetermined amount from the inner surface of the side walls on both sides in the X-axis direction of the frame cassette 57, and partially support both sides in the X-axis direction of the frame sets FS stored therein.

[0028] 5 is a perspective view of the inside of the container on the center tier in the embodiment. As shown in FIG. 5, two work cassettes 63 each containing a workpiece W are placed side by side in the X-axis direction on the work cassette stage 54. The work cassette stage 54 is provided with positioning units 64 that position the four corners of the two work cassettes 63. The positioning units 64 are formed in an L-shape when viewed from above, and in this embodiment, a total of eight positioning units 64 are provided corresponding to the two work cassettes 63 (two are not shown). The positioning units 64 abut against the four corners of the work cassette 63, thereby positioning the work cassette 63.

[0029] The work cassette 63 has an opening 66 formed on the +Y side, through which the first transport mechanism 30 (see FIG. 1) loads and unloads the workpieces W. The work cassette 63 has multiple shelves 67 therein for storing multiple workpieces W. The shelves 67 are provided so as to protrude inward by a predetermined amount from the inner surface of the side walls on both sides in the X-axis direction of the work cassette 63, and partially support both sides in the X-axis direction of the stored workpieces W. Therefore, the workpieces W supported on the shelves 67 are exposed on their undersides except for partial areas on both sides in the X-axis direction, and the workpieces W can be adsorbed and held by the workpiece holder 36 of the first transport mechanism 30 when in contact with them from below.

[0030] Fig. 6 is a perspective view of the inside of the topmost container in the embodiment, and Fig. 7 is an exploded view of Fig. 6. As shown in Fig. 6 and Fig. 7, a tape mounter 70 is provided inside the topmost container C3. The tape mounter 70 includes a frame rail 71 and a table 72 disposed on the adhering stage 55, and a work moving mechanism 75 and an adhering mechanism 76 disposed on the underside of the top wall 74 of the container C3.

[0031] Two frame rails 71 are provided, extending in the Y-axis direction, and are spaced apart in the X-axis direction with a table 72 in between. The frame rails 71 support the ring frame F of the frame set FS on their upper surfaces. Positioning ribs 78 extending in the Y-axis direction parallel to the frame rails 71 are formed on the upper surfaces of the frame rails 71, and position the ring frame F placed (supported) on the upper surfaces of the frame rails 71 by sandwiching them in the X-axis direction.

[0032] The distance between the two frame rails 71 in the X-axis direction can be adjusted by a distance adjustment mechanism 80. The distance adjustment mechanism 80 includes a pair of guide rails 81 that are arranged on the bonding stage 55 and are parallel to the X-axis direction, and the guide rails 81 support the frame rails 71 from below while guiding their movement in the X-axis direction.

[0033] The gap adjustment mechanism 80 also includes a motor 82, a ball screw 83 parallel to the X-axis direction, a transmission mechanism 85 equipped with a pulley and a belt for transmitting the rotation of the motor 82 to the ball screw 83, and two nut portions 86 threadedly engaged with the ball screw 83. A frame rail 71 is fixed to each nut portion 86. In the gap adjustment mechanism 80, by driving and rotating the motor 82, the ball screw 83 is rotated, and the nut portions 86 and the frame rails 71 move in directions moving away from or toward each other in the X-axis direction, thereby adjusting the gap between the two frame rails 71 in the X-axis direction.

[0034] In this embodiment, the table 72 is formed of a circular plate that is larger than the planar size of the workpiece W. The table 72 is provided so as to be movable up and down via an elevator 88 such as a cylinder (not shown in FIGS. 6 and 7, see FIGS. 9A and 9B). More specifically, the table 72 is provided so as to be movable up and down between a position below and spaced apart from the tape T of the frame set FS supported by the frame rails 71 and a position where the tape T is lifted above the upper surface of the ring frame F by driving the elevator 88.

[0035] The workpiece moving mechanism 75 includes two suction cups 90 that serve as suction sections, two support pipes 91 that extend vertically and support the suction cups 90 at their lower ends, a support base 92 to which the upper ends of the support pipes 91 are connected, and a horizontal moving mechanism 93. A suction passage 94 (see FIG. 8A) is formed in each support pipe 91 and support base 92, and each suction cup 90 communicates with a suction source 95 (see FIG. 8A) via the suction passage 94, enabling the suction cups 90 to hold the upper surface of the workpiece W by suction.

[0036] The horizontal movement mechanism 93 has a pair of guide rails 97 arranged on the underside of the top wall 74 and parallel to the X-axis direction, and the guide rails 97 support the support base 92 from above while guiding its movement in the X-axis direction.

[0037] The horizontal movement mechanism 93 also includes a motor 100, a ball screw 101 parallel to the X-axis direction, a transmission mechanism 102 equipped with a pulley and a belt for transmitting the rotation of the motor 100 to the ball screw 101, and a nut portion 103 threadedly engaged with the ball screw 101. A support base 92 is fixed to the nut portion 103. In the horizontal movement mechanism 93, by driving and rotating the motor 100, the ball screw 101 is rotated, and the nut portion 103, the support base 92, the support pipes 91, and the suction cups 90 are moved in the X-axis direction. As a result, the workpiece W held by the suction cups 90 is moved in the X-axis direction, and the workpiece W can be moved to a position where it will be stuck to the tape T of the frame set FS supported by the frame rails 71.

[0038] The bonding mechanism 76 includes a pair of cylinders 105 that function as a pressing mechanism, and a pressing plate 106 connected to the lower end of each cylinder 105. The pair of cylinders 105 are arranged at a predetermined distance in the Y-axis direction. The pressing plate 106 is formed in a planar shape that is larger than the workpiece W. The pressing plate 106 preferably has flexibility so that it can elastically deform from a flat state to a shape in which the center in the Y-axis direction curves downward. The pressing plate 106 is formed with holes 107 (see FIG. 8A ) through which each support pipe 91 is inserted. In the bonding mechanism 76, the pair of cylinders 105 are driven with a time lag to elastically deform the pressing plate 106 and move it downward to a flat state, thereby pressing the workpiece W, which has been moved above the tape T by the work moving mechanism 75, against the tape T to bond it.

[0039] Next, a method for forming the work set WS in the above embodiment will be described. Here, it is assumed that a frame set FS, in which tape T is attached to a ring frame F, is contained in the frame cassette 57, and a work W is contained in the work cassette 63.

[0040] In the method for forming the work set WS in this embodiment, a frame set transport process is carried out in which a frame set FS housed in a frame cassette 57 of the lowest housing unit C1 is moved to and supported on the frame rails 71 of the highest housing unit C3. In the frame set transport process, the clamp 35 is directed toward the housing unit C1 via the reversing mechanism 33 of the first transport mechanism 30 (see FIG. 1). Around the same time, the stage 51 of the lifting mechanism 50 is moved in the Z-axis direction, and the stage 51 and the three housing units C1 to C3 are moved in the Z-axis direction so that the frame set FS to be transported is positioned in the Z-axis direction corresponding to the clamp 35.

[0041] Next, the drive mechanism 31 of the first transport mechanism 30 is driven, and the clamp 35, with its gripping pieces separated, is moved in the -Y axis direction to the frame set FS housed in the frame cassette 57. Then, after the end of the ring frame F is clamped and held by the gripping pieces of the clamp 35, the clamp 35 and the frame set FS are pulled out to the +Y side of the frame cassette 57 (housing body C1) via the drive mechanism 31.

[0042] In this pulled-out state, the stage 51 of the lifting mechanism 50 is moved in the -Z axis direction, and the frame set FS held by the clamp 35 is moved relatively to the height position of the frame rail 71 in the uppermost housing body C3. Thereafter, as shown in Fig. 8A, the clamp 35 and the frame set FS are moved in the -Y axis direction via the drive mechanism 31, and the frame set FS is placed on the frame rail 71. After this placement, the clamp 35 releases the hold of the frame set FS, and the clamp 35 is moved in the +Y axis direction via the drive mechanism 31 and retracted to the outside of the housing body C3.

[0043] Before or after the frame set transport process, a work transport process is carried out in which the workpiece W stored in the work cassette 63 in the central tier container C2 is moved to and held by the suction cup 90 of the top tier container C3. In the work transport process, the workpiece holding section 36 is turned toward the -Y side, which is the container C2 side, via the reversing mechanism 33 of the first transport mechanism 30. Around the same time, the stage 51 of the lifting mechanism 50 is moved in the Z-axis direction, and the stage 51 and the three tier containers C1 to C3 are moved in the Z-axis direction so that the workpiece W to be transported is positioned in the Z-axis direction corresponding to the workpiece holding section 36.

[0044] Next, the drive mechanism 31 of the first transport mechanism 30 is driven, and the workpiece holding part 36 is moved in the -Y axis direction to below the workpiece W stored in the workpiece cassette 63. Then, after the lower surface of the workpiece W is held by the workpiece holding part 36, the workpiece holding part 36 and the workpiece W are pulled out to the outside, which is the +Y side of the workpiece cassette 63 (storage body C2), via the drive mechanism 31.

[0045] In this state, the stage 51 of the lifting mechanism 50 is moved in the -Z axis direction, and the workpiece W held by the workpiece holder 36 is moved relatively to the height position of the suction cups 90 of the workpiece moving mechanism 75 in the uppermost container C3. Thereafter, as shown in Fig. 8B, the workpiece holder 36 and the workpiece W are moved in the -Y axis direction via the drive mechanism 31, and the upper surface of the workpiece W is sucked and held by the suction cups 90. After this suction holding, the workpiece W is released from its hold by the workpiece holder 36, and the workpiece holder 36 is moved in the +Y axis direction via the drive mechanism 31 and retracted to the outside of the container C3.

[0046] After the frame set transport process and the work transport process are performed, a work adhering process is performed in which the work W is adhered to the tape T of the frame set FS. In the work adhering process, as shown in Fig. 9A, the horizontal movement mechanism 93 of the work moving mechanism 75 is driven in a state in which the work W, which is sucked and held by the suction cups 90, is positioned above the tape T on the frame set FS. This causes the work W to move in the X-axis direction relative to the tape T of the frame set FS supported by the frame rails 71, and the adhering position of the work W in the X-axis direction relative to the tape T is adjusted.

[0047] Around the time of movement of the workpiece W in the X-axis direction, as shown in Fig. 9B, the table 72 is raised by driving the lifting unit 88. As the table 72 rises, the tape T of the frame set FS supported by the frame rail 71 is slightly raised, and the table 72 supports the underside of the tape T (the side opposite the adhered surface), so that the tape T of the frame set FS and the underside of the workpiece W suction-held by the suction cups 90 are close to each other but not in contact with each other, with a slight gap between them. Note that Fig. 9B illustrates the tape T being stretched and lifted by the rise of the table 72, but in reality, the tape T is displaced within the range of slack in the tape T adhered to the ring frame F.

[0048] 9C, the cylinder 105 of the adhering mechanism 76 is driven to move the pressure plate 106 downward, and the workpiece W held by the suction cup 90 is pressed against the upper surface (adhering surface) of the tape T via the pressure plate 106 to be adhered. In this adhering, only one of the two cylinders 105 lined up in the Y-axis direction (the cylinder 105 on the +Y side in FIG. 9C) is driven to tilt the pressure plate 106, so that the outer peripheral edge of the workpiece W on the +Y side is pressed against the tape T.

[0049] 10A, the other cylinder 105 (the cylinder 105 on the -Y side in the figure) is driven, and the tilted pressing plate 106 is gradually brought to a horizontal position. As a result, the pressing area by the pressing plate 106 gradually expands from the +Y side of the workpiece W toward the outer periphery on the -Y side, and the adhesion of the workpiece W to the tape T also gradually progresses from the +Y side toward the outer periphery on the -Y side. While the workpiece W is being pressed against the tape T by the pressing plate 106, the tape T is supported by the table 72, so that the workpiece W is supported from below the tape T, and the suction and holding of the workpiece W by the suction cups 90 is released.

[0050] By completing the bonding of the workpiece W to the tape T, a workpiece set WS is formed in which the workpiece W is bonded to the tape T of the frame set FS. Once the bonding of the workpiece W is complete, as shown in FIG. 10B , the lifting unit 88 is driven to lower the table 72, and the table 72 is positioned away from the underside of the tape T of the frame set FS. The cylinder 105 is driven to raise the pressure plate 106, and the pressure plate 106 is positioned away from the workpiece W bonded to the tape T. In the above embodiment, the pressure plate 106 is tilted. However, the pressure plate 106 may be curved downward in a convex shape at its center, and the +Y-side end of the pressure plate 106 is brought into contact with the workpiece W, and the curved pressure plate 106 is returned to a flat shape. This expands the area of ​​the workpiece W bonded to the tape T in the -Y-axis direction, and the entire underside of the workpiece W is bonded to the tape T. The number of cylinders 105 is not limited to one pair, i.e., two, but three or more may be provided.

[0051] When two or more workpieces W are to be attached to the tape T of the frame set FS, the above-described workpiece transport process and workpiece attachment process are repeated in the same manner after the attachment of the first workpiece W. This allows two or more workpieces W to be attached to the tape T without arranging multiple tables or the like for holding the workpieces W side by side.

[0052] After the workpiece adhering process is performed, a workpiece set transport process is performed in which the workpiece set WS formed in the workpiece adhering process is transported to the chuck table 14. In the workpiece set transport process, the clamp 35 is turned toward the -Y side, which is the container C3 side, via the reversing mechanism 33 of the first transport mechanism 30. Around the same time, the stage 51 of the lifting mechanism 50 is moved in the Z-axis direction, and the stage 51 and the three containers C1 to C3 are moved in the Z-axis direction so that the workpiece set WS to be transported is positioned in the Z-axis direction corresponding to the clamp 35.

[0053] Next, the drive mechanism 31 of the first transport mechanism 30 is driven, and the clamp 35, with its gripping pieces released, is moved in the -Y axis direction to the work set WS on the frame rail 71. Then, as shown in FIG. 10C, the gripping pieces of the clamp 35 clamp and hold the end of the ring frame F of the work set WS, and then the clamp 35 and work set WS are pulled out to the +Y side of the housing C3 via the drive mechanism 31. This causes the work set WS to be moved and held on the chuck table 14 (see FIG. 1), completing the work set transport process. After the work set transport process is completed, the machining unit 24 performs cutting on the workpiece W of the work set WS held on the chuck table 14.

[0054] The tape mounter 70 of this embodiment is equipped with a work moving mechanism 75 that can move the work W. As a result, when multiple workpieces W are to be attached to the tape T of the frame set FS, the workpieces W can be moved and attached one by one by repeatedly performing the workpiece transport process and the workpiece attaching process described above. Therefore, even when there are multiple workpieces W to be attached, this can be handled without increasing the number of devices that hold the workpieces W, and the device can be prevented from becoming complicated.

[0055] Furthermore, in the tape mounter 70, the tape T is supported from below by the table 72, while the application mechanism 76 applies the workpiece W to the tape T from above. As a result, the tape mounter 70 can prevent air bubbles from getting between the tape T and the workpiece W even if the application time is shortened, compared to a conventional configuration in which a roller is rolled to apply tape to the top surface of a workpiece. In other words, the tape mounter 70 of this embodiment can reduce the application time while properly applying the tape T to the workpiece W, compared to a conventional configuration. Furthermore, because the workpiece W is applied by pressing it against the tape T applied to the ring frame F, the application mechanism 76 can be arranged in a smaller space than in the past.

[0056] Furthermore, in this embodiment, in each of the housings C1 to C3, the frame cassette stage 53 on which the frame cassette 57 is placed, the work cassette stage 54 on which the work cassette 63 is placed, and the tape mounter 70 are all arranged together in the lifting mechanism 50. This allows the cutting device 1 to simultaneously perform cutting of the work W and formation of the work set WS by adhering the work W to the tape T. Therefore, when the processing time for cutting the work W is long, this processing time can be used to form the work set WS, thereby improving process efficiency. Furthermore, the work set WS may be formed using the above-mentioned machining time plus the cleaning time required to clean the work set WS after cutting.

[0057] The present invention is not limited to the above-described embodiment, and various modifications can be made to the present invention. In the above-described embodiment, the size and shape shown in the accompanying drawings are not limited to these, and can be modified as appropriate within the scope of the effects of the present invention. In addition, the present invention can be modified as appropriate without departing from the scope of the object of the present invention.

[0058] For example, the support pipe 91 supporting the suction cup 90 may be configured as a cylindrical member formed in a bellows shape and extending and contracting in the Z-axis direction. In this configuration, when the cylinder 105 is driven to press the workpiece W against the tape T with the pressure plate 106, the suction cup 90 can maintain suction of the workpiece W even after the support pipe 91 extends and contracts and the workpiece W is adhered to the tape T. For example, even when the pressure plate 106 is curved so that its center protrudes downward, the suction cup 90 can maintain suction of the workpiece W.

[0059] Furthermore, when forming the work set WS, each of the containers C1 to C3 is raised and lowered by the lifting mechanism 50, but the configuration may be changed so that the first transport mechanism 30 is provided with a Z-axis movement mechanism to transport the transport object, such as the work W, in the Z-axis direction.

[0060] Furthermore, the number of frame cassettes 57 installed on the frame cassette stage 53 and the number of work cassettes 63 installed on the work cassette stage 54 are not particularly limited and may be increased or decreased as appropriate. In other words, the frame cassette 57 installed on the frame cassette stage 53 may be one or two or more, and when one frame cassette 57 is installed, the machined work set WS is stored in the location where the frame set FS was removed from the frame cassette 57.

[0061] Furthermore, in this embodiment, a cutting device with a two-axis processing unit 24 has been described as an example of the processing device, but the present invention is not limited to this configuration. For example, other processing devices such as a cutting device with a single axis processing unit, a laser cutting device, or a cluster device that combines these may also be used. Furthermore, the processing device may be a grinding device that grinds one side of the workpiece W with a grinding wheel in a processing unit, or a polishing device that polishes one side of the workpiece W with a polishing pad in a processing unit.

[0062] In addition to the above-mentioned configuration, the workpiece W to be processed may be a semiconductor substrate such as silicon or gallium arsenide, or an inorganic material substrate such as ceramic, glass, or sapphire, or even a packaging substrate for a semiconductor product.

[0063] 11 to 13 may be employed as a modified example. FIG. 11 is a block diagram of an input unit and a control unit according to the modified example. In the modified example, the display unit 48 (see FIG. 1), which is configured as a touch panel monitor or the like, described above, is provided with the function of an input unit 120 for inputting the conditions and the like described below. Furthermore, in the modified example, the control unit 130, which is not shown in the above embodiment, is provided with the function described below. In the modified example, the tape mounter 70 is configured to include the input unit 120 and the control unit 130, but the input unit 120 and the control unit 130 of the cutting device 1 as a whole may be used in the tape mounter 70.

[0064] 11 , the input unit 120 includes a ring frame type setting unit 121, a work size setting unit 122, and a work number setting unit 123. The input unit 120 can be configured by a touch panel included in the display unit 48. The input unit 120 receives input of various information related to the cutting device 1, including the tape mounter 70, from the operator and transmits the information to the control unit 130.

[0065] The ring frame type setting unit 121 receives and sets the type of the ring frame F. The work size setting unit 122 receives and sets, for example, the vertical and horizontal dimensions of a rectangular work W. The work number setting unit 123 receives and sets the number of work W to be attached to the tape T by the attachment mechanism 76 for one frame set FS.

[0066] Fig. 12 is a diagram showing an example of an input screen of the input unit in a modified example. For example, as shown in Fig. 12, the input screen of the input unit 120 is displayed on part or all of the monitor of the display unit 48. On the input screen of Fig. 12, the words "ring frame type," "work size," and "number of workpieces" are displayed as machining conditions, and conditions and information can be entered in the parentheses to the right of these in Fig. 12. Therefore, on the input screen of Fig. 12, the display area for "ring frame type" functions as an input interface for the ring frame type setting unit 121, the display area for "work size" functions as an input interface for the work size setting unit 122, and the display area for "number of workpieces" functions as an input interface for the workpiece number setting unit 123.

[0067] Returning to Fig. 11, the control unit 130 of the modified example includes a ring frame data table 131, a ring frame inner diameter setting unit 132, and a maximum adhered sheet number calculation unit 133, which are represented as functional blocks. These functional blocks are realized by the control unit 130 executing a program stored in the memory of the control unit 130. Note that the functional blocks of the control unit 130 shown in Fig. 11 only show the components related to the present invention, and other components are omitted.

[0068] As shown in Fig. 13, the ring frame data table 131 stores conditions such as dimensions for the ring frame type of the ring frame F. In the ring frame data table 131 of Fig. 13, the diameter dimension, which is the maximum outer dimension, the width dimension, which is the minimum outer dimension, and the inner diameter are associated as conditions with the ring frame type. As shown in Fig. 4, etc., the ring frame F has a shape with multiple notches on the circular outer edge, so the maximum outer dimension is the diameter dimension, and the minimum outer dimension is the width dimension of two parallel sides. Furthermore, when the inner diameter begins with "φ", the inner circumference is circular, and when two dimensions are set with an "x" between them, the inner circumference is rectangular.

[0069] The ring frame inner diameter setting unit 132 refers to the ring frame data table 131 and sets the inner diameter of the ring frame F for the ring frame type input by the ring frame type setting unit 121. The inner diameter can be selected from the inner diameter column in the ring frame data table 131 shown in FIG.

[0070] The maximum number of adhered sheets calculation unit 133 calculates the maximum number of adhered sheets, i.e., how many workpieces W whose dimensions are set by the work size setting unit 122 can be adhered to the inner diameter of the ring frame F set by the ring frame inner diameter setting unit 132. For example, the maximum number of adhered sheets calculation unit 133 finds a value obtained by dividing the inner diameter of the ring frame F by the sum of the lateral dimension of the workpiece W and the pre-stored clearance between the workpieces W, and rounds down the value to the nearest integer to calculate the maximum number of adhered sheets.

[0071] The above-mentioned conditions and values ​​may be set values ​​stored in the control unit 130 as device data including a plurality of setting items for cutting the workpiece W.

[0072] Next, a method for machining workpieces W using a cutting device 1 equipped with a modified tape mounter 70 will be described. In preparation for carrying out this machining method, a frame set FS with tape T attached to a ring frame F is housed in a frame cassette 57, and the workpieces W are housed in a work cassette 63, similar to the method for forming a workpiece set WS in the above embodiment. The modified method for machining workpieces W includes a condition setting step, a workpiece number setting step, a workpiece set forming step, a holding step, and a machining step. Note that when a method similar to the above embodiment is used, the description may be omitted or simplified.

[0073] In the method for machining the workpiece W, a condition setting step is first carried out. In the condition setting step, the type of the ring frame F is set in the ring frame type setting unit 121 and the dimensions of the workpiece W are set in the workpiece size setting unit 122 via input by the operator on the touch panel of the display unit 48. In addition, machining conditions required for cutting the workpiece W are input via the touch panel of the display unit 48.

[0074] Furthermore, in the condition setting process, the ring frame inner diameter setting unit 132 may set the inner diameter of the ring frame F by referring to the ring frame data table 131, and the maximum number of sheets to be attached may be set in the maximum number of sheets to be attached calculation unit 133.

[0075] After the condition setting step is performed, a workpiece number setting step is performed in which the number of workpieces W is set by the workpiece number setting unit 123. The number of workpieces W is the number of workpieces W to be attached to the tape T by the attachment mechanism 76 for one frame set FS, and is set by the operator through an input operation on the touch panel of the display unit 48.

[0076] Furthermore, when the maximum number of workpieces to be adhered is set in the condition setting step, the number of workpieces W set in the workpiece number setting step is compared with the maximum number of workpieces to be adhered. If the number of workpieces W is greater than the maximum number of workpieces to be adhered, the operator is notified of this by an error message or the like on the display unit 48.

[0077] After the workpiece number setting process is performed, a workpiece set forming process is performed in which the adhering mechanism 76 adheres the number of workpieces W set by the workpiece number setting unit 123 to the tape T of the frame set FS to form a workpiece set WS. The workpiece set forming process is performed in the same manner as the frame set transporting process in the above embodiment. After the frame set transporting process is performed, the workpiece transporting process and workpiece adhering process in the above embodiment are repeatedly performed according to the number of workpieces W set by the workpiece number setting unit 123. More specifically, the number of times the workpiece transporting process and workpiece adhering process are repeated is the same as the number of workpieces W. As a result, two or more workpieces W are adhered side by side to the tape T of one frame set FS, and a workpiece set WS is formed.

[0078] After the work set forming process is performed, the work set transport process in the above embodiment is performed as a holding process, and the work set WS is held on the chuck table 14. After the holding process is performed, a processing process is performed in which the machining unit 24 performs cutting processing as described above on the multiple workpieces W in the work set WS held on the chuck table 14 in the holding process. [Industrial Applicability]

[0079] As described above, the present invention has the effect of preventing the device from becoming complicated even when a plurality of workpieces are to be attached to the tape of the frame set. [Explanation of symbols]

[0080] 1: Cutting equipment (processing equipment) 14: Chuck table 24: Processing unit 31: First transport mechanism (transport mechanism) 53: Frame cassette stage 54: Work cassette stage 57: Frame cassette 63: Work cassette 70: Tape mounter 71: Frame rail 72: Table 75: Workpiece moving mechanism 76: Adhesion mechanism 122: Work size setting section 123: Workpiece number setting section 132: Ring frame inner diameter setting part F: Ring frame F1:Aperture FS: Frameset T: Tape W: Work WS: Workset

Claims

1. A tape mounter that attaches a work to a tape that is attached so as to close an opening of a ring frame, a frame rail supporting a frame set to which the tape is attached so as to close the opening of the ring frame; a workpiece moving mechanism that moves the workpiece to the tape of the frame set supported by the frame rail; a table that supports the surface of the tape opposite to the surface to be applied; and an adhering mechanism that adheres the work moved by the work moving mechanism to the adhering surface of the tape supported by the table.

2. 2. The tape mounter according to claim 1, further comprising a workpiece number setting unit that sets the number of works to be adhered to the tape by the adhering mechanism.

3. 2. The tape mounter according to claim 1, further comprising: a ring frame inner diameter setting unit that sets an inner diameter of the ring frame; and a work size setting unit that sets dimensions of the work.

4. A processing device comprising: a chuck table that holds a work set formed by integrating a ring frame and a workpiece with tape attached thereto; a processing unit that processes the workpiece held on the chuck table; and a transport mechanism that transports the workpiece set to the chuck table, a frame cassette stage for placing a frame cassette containing a frame set with the tape attached so as to close the opening of the ring frame; a work cassette stage on which a work cassette containing the work is placed; 3. A processing device comprising: a tape mounter according to claim 2, which forms the work set by adhering the work to the tape of the frame set.

5. A method for machining a workpiece using the machining device according to claim 4, comprising: a workpiece number setting step of setting the number of the workpieces in the workpiece number setting unit; a work set forming step of forming the work set by adhering the number of works set in the work number setting unit to the tape of the frame set by the adhering mechanism; a holding step of holding the work set on the chuck table; a machining step of machining the plurality of workpieces in the work set held in the holding step.

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