Substrate transport method and substrate processing system

Abstract

A substrate transport method and a substrate processing system are provided that, in a substrate processing system including a transport device that transports a plurality of substrates simultaneously, corrects positional deviations of the substrates before transporting them. [Solution] A substrate transport method for a substrate processing system 100, comprising the steps of: acquiring, for each of the processing chamber mounting sections, a relative positional deviation, which is the amount of deviation between the center position of a substrate and the center position of the processing chamber mounting section, when a substrate placed at the center position of a mounting section 131-134 of a load lock chamber 130 is transported by a vacuum transport device 160 from the load lock chamber mounting section to a processing chamber mounting section 111-116; and placing multiple substrates on the load lock chamber mounting sections based on the substrate transport path and the relative positional deviation, and when the transport path transports substrates to any one of multiple processing chambers, the multiple substrates are placed on the load lock chamber mounting sections based on the average of the relative positional deviation amounts of the candidate transport processing chambers.

Description

[Technical Field]

[0001] The present disclosure relates to a substrate transport method and a substrate processing system. [Background technology]

[0002] Patent Document 1 discloses a wafer processing apparatus including a load lock chamber, a transfer chamber, and a processing chamber for processing two wafers simultaneously.

[0003] Patent Document 2 discloses a transfer device that simultaneously transfers a plurality of substrates from a transfer chamber to a processing chamber. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-94530 [Patent Document 2] Japanese Patent Publication No. 2020-61472 Summary of the Invention [Problem to be solved by the invention]

[0005] One aspect of the present disclosure provides a substrate transport method and a substrate processing system that corrects positional deviations of substrates when transporting the substrates in a substrate processing system including a transport device that transports a plurality of substrates simultaneously. [Means for solving the problem]

[0006] A substrate transfer method according to one aspect of the present disclosure is a substrate transfer method for a substrate processing system including a plurality of processing chambers, a load lock chamber, a vacuum transfer device provided in a vacuum transfer chamber connecting the load lock chamber and the processing chambers and transferring a plurality of substrates simultaneously, and an atmospheric transfer device provided in an atmospheric transfer chamber and transferring a substrate from a carrier to the load lock chamber, the method comprising: The method includes the steps of: acquiring, for each of the processing chamber mounting sections, a relative positional deviation amount, which is the amount of deviation between the center position of the substrate placed on the mounting section of the processing chamber and the center position; and placing the plurality of substrates on the mounting sections of the load lock chamber based on the transport path of the substrate and the relative positional deviation amount, wherein when the transport path transports the substrate to any one of the plurality of processing chambers, the plurality of substrates are placed on the mounting sections of the load lock chamber based on the average of the relative positional deviation amounts of the processing chambers that are candidate for transport. [Effects of the Invention]

[0007] According to one aspect of the present disclosure, there is provided a substrate transport method and a substrate processing system including a transport device that transports a plurality of substrates simultaneously, in which positional deviation of the substrates is corrected before transporting the substrates. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view showing an example of a configuration of a substrate processing system according to an embodiment; [Figure 2] FIG. 1 is a perspective view showing an example of a substrate transport device. [Figure 3] 10 is an example of a flowchart illustrating the operation of the substrate processing system. [Figure 4] 10 is an example of a flowchart illustrating the operation of the substrate processing system. [Figure 5] 10 is an example of a table stored in a control unit. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and redundant explanations may be omitted.

[0010] <Substrate Processing System 100> An example of the overall configuration of a substrate processing system 100 according to an embodiment will be described with reference to Fig. 1. Fig. 1 is a plan view showing the configuration of an example of a substrate processing system 100 according to an embodiment.

[0011] 1 is a cluster structure (multi-chamber type) system. The substrate processing system 100 includes a plurality of processing chambers 110 (110A to 110F), a vacuum transfer chamber 120, a load lock chamber 130, an atmospheric transfer chamber 140, a load port 150, and a control unit 200.

[0012] The processing chambers 110 (110A to 110F) are depressurized to a predetermined vacuum atmosphere, and a desired process (etching process, film formation process, cleaning process, ashing process, etc.) is performed on a wafer (substrate) W therein. The processing chambers 110 are disposed adjacent to the vacuum transfer chamber 120. The processing chambers 110 and the vacuum transfer chamber 120 are connected by opening and closing a gate valve 119. The processing chamber 110A has a mounting portion 111 on which a substrate W is placed. The processing chamber 110B has a mounting portion 112 on which a substrate W is placed. The processing chambers 110A and 110B are disposed side by side on one side of the vacuum transfer chamber 120 and constitute a set of processing chambers 110. The set of processing chambers 110 simultaneously transfers and unloads a substrate W by a vacuum transfer device 160, which will be described later. The processing chamber 110C also has a mounting portion 113 on which a substrate W is placed. The processing chamber 110D has a mounting portion 114 on which a substrate W is placed. The processing chamber 110C and the processing chamber 110D are arranged side by side on one side of the vacuum transfer chamber 120, and constitute a set of processing chambers 110. The processing chamber 110E has a mounting portion 115 on which a substrate W is placed. The processing chamber 110F has a mounting portion 116 on which a substrate W is placed. The processing chamber 110E and the processing chamber 110F are arranged side by side on one side of the vacuum transfer chamber 120, and constitute a set of processing chambers 110. The operation of each portion for processing in the processing chamber 110 is controlled by the control unit 200.

[0013] The vacuum transfer chamber 120 is connected to multiple chambers (processing chamber 110, load lock chamber 130) via gate valves 119 and 136, and is depressurized to a predetermined vacuum atmosphere. A vacuum transfer device 160 for transferring substrates W is provided inside the vacuum transfer chamber 120. The vacuum transfer device 160 has picks 161 and 162 for holding substrates W. The pick 161 has substrate holders 161R and 161L for holding substrates W, and is configured to be able to transfer two substrates W simultaneously. Similarly, the pick 162 has substrate holders 162R and 162L for holding substrates W, and is configured to be able to transfer two substrates W simultaneously. The vacuum transfer device 160 transfers substrates W between the processing chamber 110 and the vacuum transfer chamber 120 in response to the opening and closing of the gate valve 119. Furthermore, the vacuum transfer device 160 transfers the substrate W between the load lock chamber 130 and the vacuum transfer chamber 120 in response to the opening and closing of the gate valve 136. The operation of the vacuum transfer device 160 and the opening and closing of the gate valves 119 and 136 are controlled by the control unit 200.

[0014] An example of the vacuum transfer device 160 will now be described with reference to Fig. 2. Fig. 2 is a perspective view showing an example of the vacuum transfer device 160. The vacuum transfer device 160 has picks 161 and 162, arms 163 to 166, and a base 167. Note that Fig. 2 illustrates a state in which the picks 161 and 162 are arranged in two layers, one above the other, and substrates W are held by substrate holding portions 161R and 161L of the pick 161 (see Fig. 1) and substrate holding portions 162R and 162L of the pick 162, respectively.

[0015] The pick 161, the arm 163, and the arm 165 form a first arm. One end of the arm 165 is rotatably connected to the base 167. The other end of the arm 165 and one end of the arm 163 are rotatably connected. The other end of the arm 163 and the base of the pick 161 are rotatably connected. The pick 161 branches into two branches from the base of the pick 161, and one branch is provided with a substrate holding unit 161R (see FIG. 1), and the other branch is provided with a substrate holding unit 161L (see FIG. 1). The control unit 200 can extend and retract the first arm and control the position and orientation of the pick 161 by controlling the angles of the joints of the first arm.

[0016] Similarly, pick 162, arm 164, and arm 166 form a second arm. One end of arm 166 is rotatably connected to base 167. The other end of arm 166 and one end of arm 164 are rotatably connected. The other end of arm 164 and the base of pick 162 are rotatably connected. Pick 162 branches into two branches from the base of pick 162, and substrate holding unit 162R is provided on one branch, and substrate holding unit 162L is provided on the other branch. Control unit 200 can extend and retract the second arm and control the position and orientation of pick 162 by controlling the angles of the joints of the second arm.

[0017] The base 167 is provided on the floor of the vacuum transfer chamber 120. The base 167 also has an elevator mechanism (not shown) that raises and lowers the first arm and the second arm. The control unit 200 controls the elevator mechanism to raise and lower the first arm and the second arm.

[0018] Returning to FIG. 1 , the vacuum transfer chamber 120 has sensors 170 that detect the position of the substrate W held by the picks 161 and 162. The sensors 170 have, for example, two light-shielding sensors for the transfer path of one substrate W, and are provided on the front side of the gate valves 119 and 136. When the substrate W held by the substrate holders 161R and 161L of the pick 161 is transferred from the vacuum transfer chamber 120 to the processing chamber 110 or the load lock chamber 130, the substrate W held by the pick 161 passes through the sensor 170. At this time, the sensor 170 detects the edge of the substrate W. This makes it possible to detect the position of the substrate W on the pick 161 (the relative position of the substrate W with respect to the pick 161). In other words, it is possible to detect the amount of deviation of the position of the substrate W actually held by each substrate holder 161R and 161L from a reference holding position on each substrate holder 161R and 161L. Similarly, when the substrate W is transported by the pick 162, the amount of misalignment of the substrate W can be detected.

[0019] The load lock chamber 130 is provided between the vacuum transfer chamber 120 and the atmospheric transfer chamber 140. The load lock chamber 130 has placement units 131 to 134 on which a substrate W is placed. The load lock chamber 130 is capable of switching between an atmospheric atmosphere and a vacuum atmosphere. The load lock chamber 130 and the vacuum transfer chamber 120, which has a vacuum atmosphere, are connected by opening and closing a gate valve 136. The load lock chamber 130 and the atmospheric transfer chamber 140, which has an atmospheric atmosphere, are connected by opening and closing a door valve 137. The switching between the vacuum atmosphere and the atmospheric atmosphere in the load lock chamber 130 is controlled by the control unit 200.

[0020] The placement sections 131, 132 and the placement sections 133, 134 are arranged one above the other, but in FIG. 1, the lower placement sections 131, 132 and the upper placement sections 133, 134 are shown as being vertically shifted from each other.

[0021] The atmospheric transfer chamber 140 has an atmospheric atmosphere, and for example, a downflow of clean air is formed. An atmospheric transfer device 180 for transferring the substrate W is provided inside the atmospheric transfer chamber 140. The atmospheric transfer device 180 transfers the substrate W between the load lock chamber 130 and the atmospheric transfer chamber 140 in response to the opening and closing of a door valve 137. The operation of the atmospheric transfer device 180 and the opening and closing of the door valve 137 are controlled by a control unit 200.

[0022] A load port 150 is provided on a wall surface of the atmospheric transfer chamber 140. A carrier C containing a substrate W or an empty carrier C is attached to the load port 150. As the carrier C, for example, a FOUP (Front Opening Unified Pod) or the like can be used.

[0023] The atmospheric transfer device 180 can remove the substrate W accommodated in the carrier C attached to the load port 150 and place it on the placement units 131 to 134 of the load lock chamber 130. The atmospheric transfer device 180 can also remove the substrate W placed on the placement units 131 to 134 of the load lock chamber 130 and store it in the carrier C attached to the load port 150.

[0024] The atmospheric transfer device 180 includes a first arm having a first pick 181 that holds a substrate W, a second arm having a second pick 182 that holds a substrate W, a base (not shown), and a slide mechanism (not shown). The first pick 181 and the second pick 182 are arranged at different heights, and are configured so that the first pick 181 holding the substrate W and the second pick 182 holding the substrate W can be arranged so as to be stacked in two levels, one above the other.

[0025] The first arm is, for example, a SCARA arm, one end of which is rotatably connected to a base, and the other end of which has a first pick 181. The control unit 200 can extend and retract the first arm and control the position and orientation of the first pick 181 by controlling the angle of each joint of the first arm. Similarly, the second arm is, for example, a SCARA arm, one end of which is rotatably connected to a base, and the other end of which has a second pick 182. The control unit 200 can extend and retract the second arm and control the position and orientation of the second pick 182 by controlling the angle of each joint of the second arm.

[0026] The base has a lifting mechanism (not shown) that raises and lowers the first arm and the second arm. The control unit 200 controls the lifting mechanism to raise and lower the first arm and the second arm.

[0027] The slide mechanism is configured to freely move the base in parallel along the row of load ports 150. The control unit 200 controls the slide mechanism to move the first arm, the second arm, and the base in the slide direction.

[0028] The control unit 200 has a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), and HDD (Hard Disk Drive). The control unit 200 may have other storage areas such as an SSD (Solid State Drive) instead of an HDD. The HDD, RAM, and other storage areas store recipes in which process procedures, process conditions, and transport conditions are set.

[0029] The CPU controls the processing of the substrate W in each processing chamber 110 in accordance with a recipe and controls the transport of the substrate W. The HDD or RAM may store a program for executing the processing of the substrate W in each processing chamber 110 and the transport of the substrate W. The program may be provided by being stored in a storage medium, or may be provided from an external device via a network.

[0030] FIG. 3 is an example of a flowchart illustrating the operation of the substrate processing system 100.

[0031] In step S101, the control unit 200 detects the relative positional deviation amount of the mounting portion of each processing chamber 110 (110A to 110F). FIG.

[0032] Here, the substrate W is placed at the center position of the placement part 111 of the processing chamber 110A. The control part 200 controls the vacuum transfer device 160 to receive the substrate W placed on the placement part 111 with the substrate holding part 161R of the pick 161 and transfer it out of the processing chamber 110A. At this time, the position of the substrate W on the pick 161 (the relative position of the substrate W with respect to the pick 161) is detected by the sensor 170 provided on the front side of the gate valve 119 of the processing chamber 110A. This detects the amount of deviation of the position of the substrate W actually held by the substrate holding part 161R from a reference holding position in the substrate holding part 161R.

[0033] Next, the substrate W is placed at the center position of the placement part 133 of the load lock chamber 130. The control part 200 controls the vacuum transfer device 160 to receive the substrate W placed on the placement part 133 with the substrate holding part 161R of the pick 161 and transfer it from the load lock chamber 130 to the processing chamber 110A. At this time, the position of the substrate W on the pick 161 (the relative position of the substrate W with respect to the pick 161) is detected by a sensor 170 provided on the front side of the gate valve 119 of the processing chamber 110A. This detects the amount of deviation of the position of the substrate W actually held by the substrate holding part 161R from a reference holding position in the substrate holding part 161R.

[0034] Based on these detected displacements, the relative positional displacement of the mounting portion 111 of the processing chamber 110A with respect to the center position of the mounting portion 133 (positional displacement A in the X direction) is calculated. 31 ,Y-direction positional deviation B 31) is calculated. In other words, when the substrate W placed at the center of the placement section 133 is transferred from the placement section 133 to the placement section 111 by the vacuum transfer device 160, the amount of deviation between the center position of the placement section 111 and the placed substrate W is calculated. Note that, for example, the X direction may be the horizontal direction and the width direction of the opening of the door valve 137, the Y direction may be the horizontal direction and the penetration direction of the opening of the door valve 137, and the Z direction may be the height direction (vertical direction). Also, the positional deviation amount C in the Z direction 31 may be set to 0.

[0035] Similarly, the relative positional deviation amount (positional deviation amount A in the X direction) of the mounting portion 113 of the processing chamber 110C with respect to the center position of the mounting portion 133 is 32 ,Y-direction positional deviation B 32 , Z-direction positional deviation C 32 ) is calculated. Also, the relative positional deviation amount (positional deviation amount A in the X direction) of the mounting portion 115 of the processing chamber 110E with respect to the center position of the mounting portion 133 is calculated. 33 ,Y-direction positional deviation B 33 , Z-direction positional deviation C 33 ) is calculated. Also, the relative positional deviation amount (positional deviation amount A in the X direction) of the mounting portion 112 of the processing chamber 110B with respect to the center position of the mounting portion 134 is calculated. 41 ,Y-direction positional deviation B 41 , Z-direction positional deviation C 41 ) is calculated. Also, the relative positional deviation amount (positional deviation amount A in the X direction) of the mounting portion 114 of the processing chamber 110D with respect to the center position of the mounting portion 134 is calculated. 42 ,Y-direction positional deviation B 42 , Z-direction positional deviation C 42 ) is calculated. Also, the relative positional deviation amount (positional deviation amount A in the X direction) of the mounting portion 112 of the processing chamber 110F with respect to the center position of the mounting portion 134 is calculated. 43 ,Y-direction positional deviation B 43 , Z-direction positional deviation C 43 ) is calculated.

[0036] In step S102, the control unit 200 calculates the placement position on the placement units 133, 134 of the load lock chamber 130 based on the transport path of the substrate W. Here, the transport path refers to the path along which the substrate W is transported from the carrier C to the load lock chamber 130, transported to one or more processing chambers 110, and the processed substrate W is returned to the load lock chamber 130 and then returned to the carrier C. A method for calculating the placement position on the placement units 133, 134 based on the transport path of the substrate W will be described later using the flow in FIG.

[0037] In step S103, the control unit 200 controls the atmospheric transfer device 180 to transfer the substrate W from the carrier C to the load lock chamber 130. At this time, the control unit 200 places the substrate W on the placement units 133, 134 based on the placement positions on the placement units 133, 134 calculated in step S102.

[0038] In step S104, the control unit 200 controls the vacuum transfer device 160 to transfer the substrate W from the load lock chamber 130 to the processing chamber 110. At this time, the control unit 200 transfers the substrate W to the processing chamber 110 based on the transfer path of the substrate W.

[0039] In step S105, the control unit 200 controls the processing chamber 110 to subject the substrate W to processing.

[0040] In step S106, the control unit 200 determines whether all process treatments have been completed for the substrate W. If not completed (S106: NO), the control unit 200 returns to step S104, transports the substrate W to the next treatment chamber 110 based on the transport path of the substrate W (S104), and performs the next process treatment on the substrate W (S105). If all process treatments have been completed (S106: YES), the control unit 200 proceeds to step S107.

[0041] In step S107, the control unit 200 controls the vacuum transfer device 160 to transfer the processed substrate W from the processing chamber 110 to the load lock chamber .

[0042] In step S108, the control unit 200 controls the atmospheric transfer device 180 to transfer the substrate W from the load lock chamber 130 to the carrier C.

[0043] Next, a method for calculating the placement positions on the placement tables 133 and 134 in step S102 will be described with reference to Fig. 4. Fig. 4 is an example of a flowchart illustrating the operation of the substrate processing system 100.

[0044] In step S201, the control unit 200 acquires a transport route for the substrate W. Here, the transport route may be, for example, a transport route in which the substrate W is transported to one processing chamber 110 and then to another processing chamber 110 (serial transport), a transport route in which the substrate W is transported to a fixed processing chamber 110, a transport route in which the substrate W is transported to any one of the multiple processing chambers 110 (OR transport), or the like.

[0045] In step S202, the control unit 200 determines whether the transport path of the substrate W is serial transport (crossover transport). If it is serial transport (S202 YES), the process by the control unit 200 proceeds to step S204. If it is not serial transport (S202 NO), the process by the control unit 200 proceeds to step S203.

[0046] In step S203, the control unit 200 determines whether the transport path of the substrate W is a fixed processing chamber 110. If the substrate W is transported to a fixed processing chamber 110 (S203: Yes), the process by the control unit 200 proceeds to step S205. If the substrate W is transported (OR transported) to any one of the multiple processing chambers 110 (S203: NO), the process by the control unit 200 proceeds to step S206.

[0047] In step S204, the control unit 200 calculates the placement position based on the average value of the relative positional misalignment amounts of the serially transferred processing chambers 110. For example, when the substrates W are serially transferred to the processing chambers 110A and 110B, the control unit 200 calculates the correction amount (relative positional misalignment amount) of the placement position in the load lock chamber 130 based on the average value of the relative positional misalignment amount of the processing chamber 110A and the relative positional misalignment amount of the processing chamber 110B.

[0048] That is, the correction amount of the placement part 133 of the load lock chamber 130 is ((A 31 +A 32 ) / 2,(B 31 +B 32 ) / 2,(C 31 +C 32 The correction amount of the mounting part 134 of the load lock chamber 130 is expressed as ((A 41 +A 42 ) / 2,(B 41 +B 42 ) / 2,(C 41 +C 42 ) / 2).

[0049] As a result, when the atmospheric transfer device 180 places the substrate W on the placement unit 133 (see S103), the correction amount ((A 31 +A 32 ) / 2,(B 31 +B 32 ) / 2,(C 31 +C 32 Similarly, when the atmospheric transfer device 180 places the substrate W on the receiver 134 (see S103), the substrate W is placed at a position corrected by the correction amount ((A 41 +A 42 ) / 2,(B 41 +B 42 ) / 2,(C 41 +C 42 ) / 2) and place the substrate W at the corrected placement position.

[0050] In step S205, the control unit 200 calculates the placement position based on the relative positional misalignment amount of a predetermined processing chamber 110. For example, when transferring to the processing chamber 110A, the control unit 200 calculates the correction amount (relative positional misalignment amount) of the load lock chamber 130 based on the relative positional misalignment amount of the processing chamber 110A.

[0051] That is, the correction amount of the placement part 133 of the load lock chamber 130 is (A 31 ,B 31 ,C 31 The correction amount of the mounting part 134 of the load lock chamber 130 is expressed as (A 41 ,B 41 ,C 41 )

[0052] As a result, when the atmospheric transfer device 180 places the substrate W on the placement unit 133 (see S103), a correction amount (A 31 ,B 31 ,C 31 Similarly, when the atmospheric transfer device 180 places the substrate W on the placement unit 134 (see S103), the substrate W is placed at a position corrected by the correction amount (A 41 ,B 41 ,C 41 ) and place the substrate W at the corrected position.

[0053] In step S206, the control unit 200 calculates the placement position based on the average value of the relative positional misalignment amounts of the candidate transfer processing chambers 110. For example, when transferring to one of the processing chambers 110A, 110B, and 110C, the control unit 200 calculates the correction amount (relative positional misalignment amount) of the load lock chamber 130 based on the average value of the relative positional misalignment amount of the processing chamber 110A, the relative positional misalignment amount of the processing chamber 110B, and the relative positional misalignment amount of the processing chamber 110C.

[0054] That is, the correction amount of the placement part 133 of the load lock chamber 130 is ((A 31 +A 32 +A 33 ) / 3,(B 31 +B 32 +B33 ) / 3,(C 31 +C 32 +C 33 The correction amount of the mounting part 134 of the load lock chamber 130 is expressed as ((A 41 +A 42 +A 43 ) / 3,(B 41 +B 42 +B 43 ) / 3,(C 41 +C 42 +C 43 ) / 3).

[0055] As a result, when the atmospheric transfer device 180 places the substrate W on the placement unit 133 (see S103), the correction amount ((A 31 +A 32 +A 33 ) / 3,(B 31 +B 32 +B 33 ) / 3,(C 31 +C 32 +C 33 Similarly, when the atmospheric transfer device 180 places the substrate W on the receiver 134 (see S103), the substrate W is placed at a position corrected by the correction amount ((A 41 +A 42 +A 43 ) / 3,(B 41 +B 42 +B 43 ) / 3,(C 41 +C 42 +C 43 ) / 3) and place the substrate W at the corrected placement position.

[0056] Furthermore, in step S206, if the candidate processing chamber 110 is either the processing chamber 110B or the processing chamber 110C due to, for example, a malfunction in the processing chamber 110A, the correction amount (relative positional misalignment amount) for the load lock chamber 130 is calculated based on the average value of the relative positional misalignment amount of the processing chamber 110B and the relative positional misalignment amount of the processing chamber 110C. This improves the correction accuracy.

[0057] That is, the correction amount of the placement part 133 of the load lock chamber 130 is ((A 32 +A 33 ) / 2,(B 32 +B 33 ) / 2,(C 32 +C 33 The correction amount of the mounting part 134 of the load lock chamber 130 is expressed as ((A 42 +A 43 ) / 2,(B 42 +B 43 ) / 2,(C 42 +C 43 ) / 2).

[0058] As a result, when the atmospheric transfer device 180 places the substrate W on the placement unit 133 (see S103), the correction amount ((A 32 +A 33 ) / 2,(B 32 +B 33 ) / 2,(C 32 +C 33 Similarly, when the atmospheric transfer device 180 places the substrate W on the receiver 134 (see S103), the substrate W is placed at a position corrected by the correction amount ((A 42 +A 43 ) / 2,(B 42 +B 43 ) / 2,(C 42 +C 43 ) / 2) and place the substrate W at the corrected placement position.

[0059] The vacuum transfer device 160 of the substrate processing system 100 is configured to simultaneously transfer multiple (two) substrates W. Therefore, the multiple substrates W being transferred simultaneously are transferred from one placement unit (e.g., placement units 133 and 134) to the other placement unit (e.g., placement units 111 and 112) while maintaining the relative positional relationship between them.

[0060] Furthermore, in the substrate processing system 100, due to assembly errors, the positional relationship between the mounting portions 111 and 112 of the processing chambers 110A and 110B, the positional relationship between the mounting portions 113 and 114 of the processing chambers 110C and 110D, and the positional relationship between the mounting portions 115 and 116 of the processing chambers 110E and 110F may differ.

[0061] In contrast to this, the substrate processing system 100 according to one embodiment can dynamically switch the correction amount when the atmospheric transfer device 180 places the substrate W on the placement units 133, 134 of the load lock chamber 130, depending on the state of the device and the transfer path of the substrate W. This improves the positional accuracy on the placement units 133, 134 of the processing chamber 110, compared to a configuration in which the substrate W is placed at a predetermined position on the placement units 133, 134.

[0062] Furthermore, the substrate processing system 100 according to one embodiment can simplify the transfer process by the vacuum transfer device 160. This can improve the throughput of the substrate processing system 100 and the productivity of the substrate processing system 100.

[0063] Although the table has been described as storing the relative positional deviation of the mounting parts of the processing chambers 110 relative to the center positions of the mounting parts 133, 134, the present invention is not limited to this configuration. The table may store the control position of the atmospheric transfer device 180 when transferring the substrate W to the mounting parts 133, 134 (for example, the coordinates of the picks 181, 182 at the reference positions).

[0064] The substrate processing system 100 has been described above, but the present disclosure is not limited to the above embodiments, and various modifications and improvements are possible within the scope of the gist of the present disclosure as described in the claims. [Explanation of symbols]

[0065] 100 Substrate Processing System 110, 110A~110F Processing Room 111~116 Placement area 120 Vacuum Transfer Chamber 130 Load Lock Chamber 140 Atmospheric Transfer Chamber 150 Loading Port 160 Vacuum conveying device 161,162 picks 161R,161L,162R,162L Board holder 170 sensors 180 Atmospheric transport device 200 control section W substrate

Claims

1. a plurality of processing chambers; a load lock chamber; a vacuum transfer device provided in a vacuum transfer chamber connecting the load lock chamber and the processing chamber, for simultaneously transferring a plurality of substrates; an atmospheric transfer device provided in an atmospheric transfer chamber and configured to transfer a substrate from a carrier to the load lock chamber, the method comprising: a step of acquiring, for each mounting portion of the processing chamber, a relative positional deviation amount, which is an amount of deviation between the center position of the substrate placed on the mounting portion of the processing chamber and the center position of the mounting portion of the processing chamber, when the substrate placed on the center position of the mounting portion of the load lock chamber is transferred from the mounting portion of the load lock chamber to the mounting portion of the processing chamber by the vacuum transfer device; placing the plurality of substrates on a placement portion of the load lock chamber based on the substrate transfer path and the relative positional deviation amount; When the transfer path transfers the substrate to any one of the plurality of processing chambers, placing the plurality of substrates on the placement units of the load lock chamber based on the average of the relative positional misalignment amounts of the candidate processing chambers; Substrate transport method.

2. the atmospheric transfer device transfers the substrates one by one; The substrate transfer method according to claim 1 .

3. a plurality of processing chambers; a load lock chamber; The vacuum transfer chamber is provided to connect the load lock chamber and the processing chamber, and the vacuum transfer chamber is provided to transfer a plurality of substrates simultaneously. a vacuum transport device that transports the material at regular intervals; an atmospheric transfer device provided in the atmospheric transfer chamber for transferring substrates from a carrier to the load lock chamber; Place and a control unit, The control unit The substrate placed at the center position of the placement section of the load lock chamber is transferred by the vacuum transfer device. When the substrate is transferred from the loading section of the load lock chamber to the loading section of the processing chamber, The amount of deviation between the center position of the substrate placed on the placement part of the processing chamber and the center position of the placement part is acquiring a relative positional deviation amount for each mounting portion of the processing chamber; The plurality of substrates are transported along the loads based on the transport path of the substrates and the amount of relative positional deviation. and placing the sample on a placement portion of the lock chamber. When the transfer path transfers the substrate to any one of the plurality of processing chambers, placing the plurality of substrates on the placement units of the load lock chamber based on the average of the relative positional misalignment amounts of the candidate processing chambers; Substrate processing system.

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