Standalone High Voltage Galvanic Isolation Capacitors

Abstract

The galvanic isolation capacitor device (400D) includes a semiconductor substrate (402) and a PMD layer (404) over the semiconductor substrate. The PMD layer has a first thickness (T1). A lower metal plate (412A) overlies the PMD layer, and an ILD layer (416) overlies the lower metal plate. The ILD layer has a second thickness (T2). The ratio of the first thickness to the second thickness is between about 1 and about 1.55, inclusive. A first upper metal plate (424A) over the ILD layer has a first area, and a second upper metal plate (424B) over the ILD layer has a second area. The ratio of the first area to the second area is greater than about 5. The galvanic isolation capacitor device can be part of a multi-chip module.

Description

[Technical Field]

[0001] The described implementations relate generally to the field of semiconductor devices and more particularly, but not exclusively, to stand-alone high-voltage galvanic isolation capacitors. [Background technology]

[0002] Conventional galvanic isolation capacitor devices are typically integrated as embedded components in individual integrated circuits built on silicon wafers. To achieve increased isolation, these capacitors are typically equal-area paired in series between two dies in a multi-chip module (MCM), one die with its silicon substrate at a low potential and the other die with its silicon substrate at a high potential, so that each capacitor sees only half of the total voltage difference across the MCM. Previously, polyimide / gold / polyimide / gold / polyimide transformers were used for stand-alone galvanic isolation. These galvanic isolation transformer devices have a large area, are expensive, and have lower isolation working voltages than silicon-based capacitors. Summary of the Invention

[0003] The described implementations provide low-cost, stand-alone galvanic isolation capacitors that can be integrated into multi-chip modules to reduce costs compared to using embedded capacitors. Series capacitors are mounted on a common substrate with the bottom plates tied together and left electrically floating. Fabrication of the stand-alone galvanic isolation capacitors uses a simple process flow involving only dielectric / metal / dielectric / metal to produce high-voltage isolation components.

[0004] When a chip including a stand-alone galvanically isolated capacitor is used in an MCM and the stand-alone galvanically isolated capacitor is placed on a die attach pad (DAP) along with a high-voltage device, the two capacitors forming the galvanically isolated series capacitor pair are fabricated to have asymmetric areas. In one implementation, the ratio of the area of ​​the first capacitor to the area of ​​the second capacitor is between about 5 and about 10. The ratio of the thickness of the pre-metal dielectric (PMD) layer between the substrate and the bottom capacitor plate to the interlayer dielectric (ILD) layer between the bottom capacitor plate and the top capacitor plate can be optimized to a value between about 1 and about 1.55 to balance the electric field between the high-voltage and low-voltage capacitors. While such an implementation is expected to improve the capabilities of such stand-alone galvanically isolated capacitors in terms of size, operating voltage, and wafer cost, no particular result is a requirement of the described invention unless expressly recited in a particular claim.

[0005] In one aspect, an implementation of a galvanically isolated capacitor device is described. The galvanically isolated capacitor device includes a PMD layer having a first thickness disposed over a semiconductor substrate. A lower metal plate is disposed over the PMD layer, and an interlevel dielectric (ILD) layer is disposed over the lower metal plate. The ILD layer has a second thickness, and the ratio of the first thickness to the second thickness is between about 1 and about 1.55. A first upper metal plate having a first area and a second upper metal plate having a second area are disposed over the ILD layer. The ratio of the first area to the second area is greater than about 5 and less than about 10.

[0006] In another aspect, a multi-chip module implementation is described. The multi-chip module includes a first die having a first integrated circuit configured to operate at a first voltage level and a second die having a second integrated circuit configured to operate at a second voltage level, where the difference between the first and second voltage levels is greater than approximately 500V. The multi-chip module further includes a third die including a first capacitor coupled in series with a second capacitor through a bottom metal plate. The first capacitor has a first area and includes a first upper metal plate coupled to the first integrated circuit. The second capacitor has a second area and includes a second upper metal plate coupled to the second integrated circuit. The ratio of the first area to the second area is 5.0 or greater.

[0007] In yet another aspect, a process implementation for forming an integrated circuit is described. The process includes forming a PMD layer having a first thickness over a semiconductor substrate and forming a lower metal plate over the PMD layer. An ILD layer having a second thickness is formed over the lower metal plate, where the ratio of the first thickness to the second thickness is between about 1.0 and about 1.55. A first upper metal plate having a first area and a second upper metal plate having a second area are formed over the ILD layer, where the ratio of the first area to the second area is greater than 5.0. [Brief explanation of the drawings]

[0008] Implementations of the present description are illustrated by way of example, but not limitation, in the figures of the accompanying drawings, in which like reference numerals denote like elements. Different references to "a" or "an" implementation in this description are not necessarily to the same implementation, and such references may mean at least one. Also, when a particular feature, structure, or characteristic is described in connection with one implementation, it is within the knowledge of one skilled in the art to achieve such feature, structure, or characteristic in connection with other implementations, whether explicitly described or not. As used herein, the term "couple" means an indirect or direct electrical connection, unless limited as in the case of "communicatively couple," which may include a wireless connection. Thus, when a first device couples to a second device, the connection may be by a direct electrical connection or by an indirect electrical connection via other devices and connections. The accompanying drawings are not necessarily drawn to scale, and no dimensional comparisons should be inferred therefrom, unless the relationship between parts of the drawings is explicitly stated.

[0009] The accompanying drawings are incorporated into and constitute a part of this specification for the purpose of illustrating one or more example implementations of the present description. Various advantages and features will be explained in the following detailed description, taken in conjunction with the appended claims, and with reference to the accompanying drawings.

[0010] [Figure 1] 1 illustrates a multi-chip module that may use stand-alone galvanic isolation capacitor devices according to certain example implementations.

[0011] [Figure 1A] 1 provides graphs illustrating ramp-to-breakdown (RTB) test results for stand-alone galvanic isolation capacitor devices having different capacitor area ratios and PMD / ILD ratios.

[0012] [Figure 2A] 1 illustrates a top view of an element of a chip including a stand-alone series-coupled high-voltage galvanic isolation capacitor according to an implementation.

[0013] [Figure 2B] 2B illustrates a cross section of the second capacitor of FIG. 2A according to one implementation.

[0014] [Figure 2C] 1 illustrates a chip including two sets of galvanic isolation capacitors according to an implementation.

[0015] [Figure 3A] 1 illustrates a top view of an element of an IC chip including a stand-alone high-voltage galvanic isolation capacitor according to an implementation.

[0016] [Figure 3B] 3B illustrates modifications to the effective capacitor dimensions of the second capacitor of FIG. 3A according to some implementations.

[0017] [Figure 4A] 3B illustrates a cross section of the IC chip of FIG. 3A at a stage in a process for forming the IC chip, according to an implementation. [Figure 4B] 3B illustrates a cross section of the IC chip of FIG. 3A at a stage in a process for forming the IC chip, according to an implementation. [Figure 4C] 3B illustrates a cross section of the IC chip of FIG. 3A at a stage in a process for forming the IC chip, according to an implementation. [Figure 4D] 3B illustrates a cross section of the IC chip of FIG. 3A at a stage in a process for forming the IC chip, according to an implementation. [Figure 4E] 3B illustrates a cross section of the IC chip of FIG. 3A at a stage in a process for forming the IC chip, according to an implementation.

[0018] [Figure 4A1] 1A-1C illustrate top views of an IC chip corresponding to different stages in a process of forming the IC chip according to an implementation. [Figure 4B1] 1A-1C illustrate top views of an IC chip corresponding to different stages in a process of forming the IC chip according to an implementation. [Figure 4C1] 1A-1C illustrate top views of an IC chip corresponding to different stages in a process of forming the IC chip according to an implementation. [Figure 4D1] 1A-1C illustrate top views of an IC chip corresponding to different stages in a process of forming the IC chip according to an implementation. [Figure 4E1] 1A-1C illustrate top views of an IC chip corresponding to different stages in a process of forming the IC chip according to an implementation.

[0019] [Figure 5] 1 shows a flowchart of a process for forming an integrated circuit according to an implementation.

[0020] [Figure 5A] We provide additional elements that may be part of the process of FIG. [Figure 5B] We provide additional elements that may be part of the process of FIG. [Figure 5C] We provide additional elements that may be part of the process of FIG. [Figure 5D] We provide additional elements that may be part of the process of FIG. [Figure 5E] We provide additional elements that may be part of the process of FIG. [Figure 5F] We provide additional elements that may be part of the process of FIG. [Figure 5G] We provide additional elements that may be part of the process of FIG. [Figure 5H] We provide additional elements that may be part of the process of FIG. [Figure 5I] We provide additional elements that may be part of the process of FIG.

[0021] [Figure 6A] 1 shows a cross section of a baseline isolation capacitor.

[0022] [Figure 6B]6A illustrates the baseline isolation capacitor 600 used in a multi-chip module. DETAILED DESCRIPTION OF THE INVENTION

[0023] Specific implementations of the present invention will now be described in detail with reference to the accompanying drawings. In the following detailed description of implementations of the present invention, numerous specific details are set forth to provide a more thorough understanding of the present invention. However, the present invention may be practiced without these specific details. In other instances, well-known features have not been described in detail to avoid unnecessarily obscuring the description.

[0024] 6A illustrates a cross section of a baseline isolation capacitor 600A that may be incorporated into an IC chip that includes additional circuit elements (not specifically shown). The additional circuit elements may include, for example, transistors (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs), complementary metal-oxide-semiconductor (CMOS) transistors, bipolar junction transistors (BJTs), high-voltage transistors, high-frequency transistors, p-channel and / or n-channel field-effect transistors (PFETs / NFETs), etc.), resistors, diodes, capacitors, inductors, and other suitable elements. Once the additional circuit elements are formed, a PMD (not specifically shown), which may include silicon oxide in one example, is formed on the IC chip, and a first metallization layer (also not specifically shown) is formed on the PMD. A first ILD layer 602, which is silicon oxide in one example, is formed on the first metallization layer, and a second metallization layer is formed on the first ILD layer 602. In the baseline isolation capacitor 600A, the second metallization layer includes a lower metal plate 604.

[0025] A second ILD layer 606, a third ILD layer 608, and a fourth ILD layer 609 are each formed sequentially. In one implementation, the second ILD layer 606, the third ILD layer 608, and the fourth ILD layer 609 each comprise silicon dioxide. In the illustrated implementation, the fourth ILD layer 609 has multiple layers including a silicon dioxide layer 610, a silicon oxynitride layer 612, and a silicon nitride layer 614. A fifth metal layer including an upper metal plate 616 is formed on the fourth ILD layer 609. In the illustrated implementation, a capacitor ILD 611 disposed between the lower metal plate 604 and the upper metal plate 616 is approximately 9.7 μm thick.

[0026] An isolation trench 618 is formed through the silicon nitride layer 614 and the silicon oxynitride layer 612. The isolation trench 618 surrounds the upper metal plate 616 and protects it from leakage current through the interface of the silicon oxynitride layer 612 and the silicon nitride layer 614. The maximum operating voltage of the baseline isolation capacitor 600 is improved by reducing or eliminating this lateral breakdown failure mode. A protective overcoat 619 includes a silicon dioxide layer 620 and a silicon oxynitride layer 622, and a polyimide layer 624 is formed over the protective overcoat 619.

[0027] In one example, a protective overcoat 619 is formed on the fifth metallization layer, including the upper metal plate 616, followed by patterning and etching the protective overcoat 619 to form contact openings 623. A polyimide layer 624 is then formed on the protective overcoat 619 and exposed, developed, and cured to create openings 626 over the contact openings 623, exposing at least some portions of the upper metal plate 616.

[0028] FIG. 6B illustrates a multi-chip module (MCM) 600B that can use the baseline isolation capacitor 600. In the MCM 600B, a first die 630 includes a first high-voltage capacitor 632, and a second die 634 includes a second high-voltage capacitor 636. The first die 630 is mounted on a first die attach pad (DAP) 638 and operates at a first voltage. The second die 634 is mounted on a second DAP 640 and operates at a second voltage. The potential difference between the first and second voltages can be greater than 500 volts, for example, 1000-1500 volts. In one implementation, the first high-voltage capacitor 632 has a lower metal plate coupled to a circuit (not specifically shown) operating at an operating voltage of 1000 volts, and the second high-voltage capacitor 636 has a lower metal plate coupled to a circuit (not specifically shown) operating at an operating voltage of approximately 5 volts. The first high-voltage capacitor 632 and the second high-voltage capacitor 636 are connected in series via an inter-die connection 642 that joins the upper metal plate of the first high-voltage capacitor 632 to the upper metal plate of the second high-voltage capacitor 636, allowing communication between the two dies.

[0029] FIG. 1 shows a multi-chip module (MCM) 100 including a first die 102, a second die 104, and a third die 106. The first die 102 includes a first integrated circuit 108, represented in the MCM 100 by a transmitter. The first integrated circuit 108 operates at a first voltage level, e.g., a high voltage of greater than 500 V. The second die 104 includes a second integrated circuit 110, represented in the MCM 100 by a receiver. The second integrated circuit 110 operates at a second voltage level, e.g., a low voltage of approximately 5 V or less. The third die 106 is a stand-alone galvanically isolated capacitor device and includes a first capacitor C1 and a second capacitor C2 that share a lower metal plate 112. The first capacitor C1 has a first upper metal plate 114, and the second capacitor C2 has a second upper metal plate 116. The first die 102 is coupled to a first upper metal plate 114 via a first die-to-die connector 118, and the second die 104 is coupled to a second upper metal plate 116 via a second die-to-die connector 120. In the MCM 100, the first die 102 and the third die 106 are attached to a first die attach pad (DAP) 122, and the second die 104 is attached to a second DAP 124.

[0030] U.S. Patent Application Publication No. 2020 / 0168534-A1 (hereinafter the '534 Application), published May 28, 2020, by the same applicant as the present application and incorporated herein by reference, discloses a stand-alone galvanically isolated capacitor device that can be used in an MCM. The '534 Application discloses that, in the implementation shown in MCM 100, capacitive coupling with the high-voltage first DAP 122 prevents the lower metal plate 112 from floating with respect to the midpoint voltage between the first DAP 122 and the second DAP 124. Furthermore, if the first capacitor C1 and the second capacitor C2 are constructed with symmetrical areas, the capacitive coupling creates an asymmetric electric field between the first capacitor C1 and the second capacitor C2. In this case, the first capacitor C1, which carries the highest electric field, is at a higher risk of premature breakdown failure. Therefore, in some instances, stand-alone galvanic isolation capacitors, such as first capacitor C1 and second capacitor C2, need to have asymmetric areas to achieve symmetric capacitance. Because asymmetric areas may be necessary, further investigation into optimal area ratios was performed.

[0031] 1A provides a graph showing the results of ramp-to-breakdown (RTB) testing of different implementations of a stand-alone galvanically isolated capacitor device having several different capacitor area ratios between the first capacitor C1 and the second capacitor C2, such as ratios of 1, 3.6, 6.5, and 9.3. Also, because the lower metal plate 112 of the capacitor is electrically floating in the third die 106, breakdown between the lower metal plate 112 and the substrate (not specifically shown) may limit high-voltage performance. Therefore, three different thicknesses of the pre-metal dielectric were tested with PMD / ILD ratios of 0.91, 1.45, and 1.55 to determine the optimal combination of capacitor ratio and PMD / ILD thickness ratio. Experimental data indicates that increased breakdown strength can be achieved by co-optimizing the PMD / ILD thickness ratio and capacitor area ratio. If the ILD thickness is greater than the PMD thickness, a premature dielectric breakdown failure mode between the bottom plate and the substrate becomes dominant, resulting in a lack of robust insulation capability. In addition to adjusting the asymmetric capacitor area ratio, it may be advantageous to increase the PMD thickness relative to the ILD thickness to enhance the device's insulation capability. Based on these results, a PMD / ILD ratio greater than 1 and a capacitor area ratio greater than 5 provide the maximum insulation capability. In one example, the optimal combination consisted of a capacitor area ratio of 6.5 and a PMD / ILD ratio of 1.55. The total thickness of the PMD and ILD is limited by manufacturing considerations. A thick dielectric layer increases the stress on the substrate to the point where the device cannot be easily processed in a typical manufacturing environment. Furthermore, as the dielectric thickness increases, the dielectric becomes increasingly susceptible to cracking. Therefore, excessive wafer bow and dielectric cracking limit the total dielectric thickness, which in turn limits the PMD / ILD ratio that can be achieved in a typical manufacturing environment.

[0032] An example of electric field modeling for a first stand-alone galvanic isolation capacitor device formed using symmetric capacitors versus a second stand-alone galvanic isolation capacitor device formed using asymmetric capacitors is shown below in Table 1. Table 1 shows the electric field imbalance that the asymmetric capacitor area compensates for. TIFF2026035926000002.tif2984

[0033] In the first stand-alone galvanically isolated capacitor device using symmetrical capacitors, the PMD thickness below the lower metal plate is 10 μm, and the ILD thickness between the upper and lower metal plates is 10.9 μm. The average electric field of the second capacitor C2 is modeled at 5 kV rms, 93.7 V rms / μm, while the average electric field of the first capacitor C1 is modeled at 5 kV rms, 372 V rms / μm. This large electric field difference results in a ratio of the average electric field of C1 to the average electric field of C2 of 3.81, which is unacceptably high because it limits the high-voltage capability of the stand-alone galvanic isolator.

[0034] In contrast, in a second stand-alone galvanic isolation capacitor device using asymmetric capacitors, the area ratio of the first capacitor C1 to the second capacitor C2 was 9.1, and the PMD thickness under the lower metal plate was 15 μm, while the ILD thickness between the upper and lower metal plates remained at 10.9 μm. In this implementation, the average electric field of the second capacitor C2 was at 5 kV rms, 226 Vrms / μm, and the average electric field of the first capacitor C1 was at 5 kV rms, 244 Vrms / μm. The ratio between the average electric fields of C1 and C2 for this asymmetric implementation was 1.08, a much more balanced condition.

[0035] FIG. 2A shows a top view illustrating the metal plates forming the capacitors in one implementation of a stand-alone galvanic isolation device 200A, and FIG. 2B shows a cross-section 200B through a portion of the stand-alone galvanic isolation capacitor device shown in FIG. 2A. Similar numbering is maintained between FIGS. 2A and 2B, and FIGS. 2A and 2B will be described together. The stand-alone galvanic isolation capacitor device 200 includes a lower metal plate 202 formed in contact with a thick PMD layer 208 (only a portion of which is shown in FIG. 2B). The lower metal plate 202 is shared by both a first capacitor formed between a first upper metal plate 204A and the lower metal plate 202, and a second capacitor formed between a second upper metal plate 204B and the lower metal plate 202. In one implementation, the first upper metal plate 204A, the second upper metal plate 204B, and the lower metal plate 202 are formed from aluminum, and the area ratio of the first capacitor to the second capacitor is 5.0 or greater, for example, 6.5.

[0036] A thick ILD layer 210 is formed on the lower metal plate 202, and the first and second upper metal plates 204A and 204B are formed on the ILD layer 210. Both the PMD layer 208 and the ILD layer 210 may be formed from a multi-layer dielectric, the exact composition of which is not relevant to this description. In one implementation, both the PMD layer 208 and the ILD layer 210 are formed from multiple layers of dielectric material, which may include silicon dioxide, silicon oxynitride, and / or silicon nitride. In the implementation shown in cross section 200B, the ILD layer 210 includes one or more thick layers 211 of silicon dioxide, upon which a silicon oxynitride layer 212 (e.g., 100 nm to 700 nm) and a silicon nitride layer 214 (e.g., 300 nm to 1000 nm) are formed prior to the formation of the first and second upper metal plates 204A and 204B. After the formation of the first and second metal plates 204A, 204B, an isolation trench 216 is formed around the first and second upper metal plates 204A, 204B. The isolation trench 216 extends through the silicon nitride layer 214 and the silicon oxynitride layer 212, but may optionally extend only partially through the silicon nitride layer 214 and the silicon oxynitride layer 212.

[0037] A first protective overcoat layer 218 is formed over the first upper metal plate 204A, the second upper metal plate 204B, and the exposed portions of the ILD layer 210. A second protective overcoat layer 220 is formed over the first protective overcoat layer 218. In one implementation, the first protective overcoat layer 218 is silicon dioxide, and the second protective overcoat layer 220 is silicon oxynitride. First and second contact openings 206A and 206B are simultaneously formed to expose portions of the first and second metal plates 204A and 204B to provide contact. The first and second contact openings 206A and 206B are shown in FIG. 2A . The minimum dimensions of the contact openings are a lower bound on the dimensions of the smaller second upper metal plate 204B. Finally, a polyimide layer 222 is formed over the second protective overcoat layer 220. First and second access openings 207B (not specifically shown) are formed in polyimide layer 222 to expose first and second contact openings 206A and 206B.

[0038] 2C shows a single die 200C including first and second galvanic isolation devices 201A and 201B, primarily illustrating the placement of an isolation trench, such as isolation trench 216, through a silicon nitride / silicon oxynitride layer on the die. First galvanic isolation device 201A includes a lower metal plate 202A separated from first and second upper metal plates 204A1 and 204A2 by an ILD layer (not specifically shown). First contact opening 206A1 exposes a portion of first upper metal plate 204A1, and second contact opening 206A2 exposes a portion of second upper metal plate 204A2. Similarly, second galvanic isolation device 201B includes lower metal plate 202B, which is separated from first upper metal plate 204B1 and second upper metal plate 204B2 by an ILD layer (not specifically shown). A first contact opening 206B1 exposes a portion of first upper metal plate 204B1, and a second contact opening 206B2 exposes a portion of second upper metal plate 204B2. Isolation trenches 216 formed through a silicon nitride / silicon oxynitride layer (not specifically shown) on the die extend around each of first galvanic isolation device 201A and second galvanic isolation device 201B, as well as between first upper metal plate 204A1 and second upper metal plate 204A2 and between first upper metal plate 204B1 and second upper metal plate 204B2. In one embodiment, an additional stand-alone galvanic isolation device (not specifically shown) is formed on die 200C.

[0039] FIG. 3A illustrates a galvanic isolation device 300 that occupies a smaller area than galvanic isolation device 200A while providing the same area ratio. Galvanic isolation device 300 includes a lower metal plate 302, a first upper metal plate 304A, a second upper metal plate 304B, a first contact opening 306A, and a second contact opening 306B. As previously mentioned, the size of the contact openings is one factor that limits the size of a galvanic isolation device. In this implementation, the size of contact opening 306B, and therefore the size of second upper metal plate 304B, could not be further reduced. Therefore, applicant resorted to using capacitance-reducing openings in lower metal plate 302 to reduce the effective size of the second capacitor.

[0040] In some embodiments, it is necessary to reduce both the total die area of ​​the device and the total capacitance of the series capacitors. Therefore, the areas of the upper and lower metal plates can be reduced while also maintaining the required area ratio (>5) between the capacitors. In FIG. 3B , the area of ​​the second capacitor, represented by second upper metal plate 304B, is shown as two possible implementations of upper metal plate 307 and lower metal plate 309. The minimum area of ​​upper metal plate 307 is limited by the size of contact opening 306B, which is determined by wirebond manufacturing requirements. In the first implementation of lower metal plate 309, shown on the left, the capacitance-reducing opening is a trench 309A etched through the lower metal plate to isolate region 309B from the rest of lower metal plate 302. Region 309B is no longer connected to lower plate 302, effectively reducing the total area of ​​the capacitor formed by lower metal plate 309 and upper metal plate 307. Portion 307A of upper metal plate 307 does not match lower plate 309 and therefore does not add capacitance. Therefore, the effective dimensions of the capacitor are indicated by upper active area 307B and lower active area 309C. A similar result can be achieved if the capacitance-reducing opening is a circular opening 309D through lower metal plate 302 that removes all metal within the area, leaving only lower active area 309C. By reducing the effective area of ​​the smaller capacitor, the area of ​​the larger capacitor can also be reduced while maintaining the desired area ratio.

[0041] 4A-4E show cross sections of galvanically isolated capacitor device 400 at various stages in processing, and FIGS. 4A1-4E1 show corresponding top views of galvanically isolated capacitor device 400. In each case, FIG. 4X1, where X equals A, B, C, D, or E, is a plan view showing a cutting line through the corresponding cross section of FIG. 4X.

[0042] In FIG. 4A , a galvanically isolated capacitor device 400A includes a PMD layer 404 having a first thickness T1 formed on a semiconductor substrate 402. In one implementation, the semiconductor substrate 402 is silicon, although other substrates may be used. In one implementation, the PMD layer 404 includes a first oxide layer 406 formed on the substrate 402 and a first nitrogen-containing dielectric layer 409 formed on the first oxide layer 406. In one implementation, the first oxide layer 406 is a thick silicon dioxide layer, and the first nitrogen-containing dielectric layer 409 includes a first silicon oxynitride layer 408 on the first oxide layer 406 and a first silicon nitride layer 410 on the first silicon oxynitride layer 408. A first metal layer 412 is formed in contact with the PMD layer 404 to provide a lower metal plate 412A. A capacitance-reducing opening 414 is formed at the location of a smaller second capacitor. In this implementation, capacitance-reducing opening 414 is a trench that isolates region 412B from lower metal plate 412A. As shown in Figure 3B, capacitance-reducing opening 414 may be a circular or other shaped opening where all metal has been removed in the area currently shown as region 412B. In Figure 4A1, capacitance-reducing opening 414 is a circular trench 414 in lower metal plate 412A.

[0043] In galvanic isolation capacitor device 400B, an ILD layer 416 is formed on lower metal plate 412, with ILD layer 416 having a second thickness T2. In one implementation, the ratio of first thickness T1 to second thickness T2 is between about 1 and about 1.55. In one implementation, ILD layer 416 includes a second oxide layer 418 formed on lower metal plate 412 and a second nitrogen-containing dielectric layer 421 formed on second oxide layer 418. In one implementation, second oxide layer 418 is a thick silicon dioxide layer, and the second nitrogen-containing dielectric layer is a second silicon oxynitride layer 420 on second oxide layer 418 and a second silicon nitride layer 422 on second silicon oxynitride layer 420. In FIG. 4B1, the only visible feature is the surface of ILD layer 416, and capacitance-reducing opening 414 is indicated by a dotted line. 4B shows the ILD layer 416 planarized over the capacitance-reducing opening 414, in some embodiments, the ILD layer 416 is not planarized and some topography may be present in the dielectric stack above the capacitance-reducing opening 414. As the thickness of the ILD layer 416 increases, this topography decreases.

[0044] 4C shows the galvanically isolated capacitor device 400C after the second metal layer 424 has been patterned to form a first upper metal plate 424A and a second upper metal plate 424B that contact the ILD layer 416. In the illustrated implementation, the first metal layer 412 used to form the lower metal plate 412A and the second metal layer 424 used to form the first upper metal plate 424A and the second upper metal plate 424B are formed from aluminum using subtractive etching. In other implementations, the metal layers 412, 424 may be formed from copper using a damascene process. After the formation of the first upper metal plate 424A and the second upper metal plate 424B, an isolation trench 425 is formed through the second nitrogen-containing dielectric layer 421. The isolation trench 425 surrounds each of the first upper metal plate 424A and the second upper metal plate 424B. 4C1 shows first upper metal plate 424A and second upper metal plate 424B in contact with ILD layer 416, with capacitance-reducing opening 414 again shown as a dotted line. If ILD layer 416 is not planarized over capacitance-reducing trench 414, upper metal plate 424B may have some topographical features.

[0045] FIG. 4D shows galvanic isolation capacitor device 400D after formation of protective overcoat layer 426, which in one implementation includes silicon dioxide layer 428 and silicon oxynitride layer 430. First and second contact openings 432A and 432B are formed to contact first and second upper metal plates 424A and 424B. FIG. 4D1 shows protective overcoat layer 426 and first and second contact openings 432A and 432B exposing first and second upper metal plates 424A and 424B, respectively. Although protective overcoat layer 426 is shown as planarized over features on the device, in some embodiments, layer 426 is not planarized.

[0046] Figure 4E shows the galvanically isolated capacitor device 400E after formation of a polyimide layer 434 on the protective overcoat layer 426. Access openings 436 are formed to expose contact openings 432 used to contact the capacitor. In Figure 4E1, the first upper metal plate 424A and the second upper metal plate 424B are exposed by the contact openings 432 and the access openings 436, respectively, through the polyimide layer 434.

[0047] FIG. 5 provides a flowchart illustrating a process 500 for forming an integrated circuit chip according to one implementation of the present disclosure, specifically, a process for forming an integrated circuit chip that forms a galvanic isolation capacitor device. Process 500 begins with forming a PMD layer on a semiconductor substrate (505). The PMD layer has a first thickness. A lower metal plate is formed on the PMD layer (510). An ILD layer is then formed on the lower metal plate (515). The ILD layer has a second thickness, and the ratio of the first thickness to the second thickness is between about 1.0 and about 1.55. A first upper metal plate and a second upper metal plate are then formed on the ILD layer (520). The first upper metal plate has a first area, and the second upper metal plate has a second area, and the ratio of the first area to the second area is greater than about 5.0. In one implementation, the ratio of the first area to the second area is less than about 10. In one implementation, the ratio of the first area to the second area is about 6.5.

[0048] 5A-5I each provide either further details of elements of process 500 or additional elements for process 500. In FIG. 5A, the process for forming a PMD layer is further defined for one implementation in which a first oxide layer is formed over a semiconductor substrate (525) and a first nitrogen-containing dielectric layer is formed over the first oxide layer (530). In one implementation, the first nitrogen-containing dielectric layer can include a first silicon oxynitride layer and a first silicon nitride layer. In FIG. 5B, the process for forming an ILD layer is further defined for one implementation in which a second oxide layer is formed over a lower metal plate (535) and a second nitrogen-containing dielectric layer is formed over the second oxide layer (540). Here, the second nitrogen-containing dielectric layer includes a second silicon oxynitride layer and a second silicon nitride layer.

[0049] After process 500 is performed, Figure 5C provides the additional element of forming an isolation trench 545 through the second nitrogen-containing dielectric layer, where the isolation trench surrounds the first and second upper metal plates. Figure 5D provides the additional element of forming a dielectric overcoat layer (550) over the first and second upper metal plates and a portion of the ILD layer, and forming first and second contact openings (555) through the dielectric overcoat layer. The first contact opening is over the first upper metal plate, and the second contact opening is over the second upper metal plate. In one implementation, the protective overcoat layer includes a silicon dioxide layer and a silicon oxynitride layer. Figure 5E shows the additional element of forming a polyimide layer (560) over the dielectric overcoat layer and forming first and second access openings (565) through the polyimide layer. The first access opening is over the first contact opening, and the second access opening is over the second contact opening.

[0050] In Figure 5F, as part of forming the lower metal plate (510) in one implementation, a capacitance-reducing opening is formed (570) through the lower metal plate, the capacitance-reducing opening being disposed below a second upper metal plate. In one implementation shown in Figure 5G, forming the capacitance-reducing opening (570) includes forming a circular trench (575) that isolates a portion of the lower metal plate from the remainder of the lower metal plate. In one implementation shown in Figure 5H, forming the capacitance-reducing opening (570) includes forming a circular opening (580) through the lower metal plate.

[0051] 4A-4E and shown in FIG. 5I, forming the lower metal plate (510) includes patterning a first aluminum layer using subtractive etching (585), and forming the first and second upper metal plates (520) includes patterning a second aluminum layer using subtractive etching (590). In other implementations not specifically shown, forming the lower metal plate includes forming a first copper layer using a damascene process, and forming the first and second upper metal plates includes forming a second copper layer using a damascene process.

[0052] Applicant has described processes for fabricating stand-alone galvanically isolated capacitor devices, multi-chip modules including stand-alone galvanically isolated capacitor devices, and integrated circuits including stand-alone galvanically isolated capacitor devices. In the described implementations, the first capacitor has an area between about 5 times and about 10 times the area of ​​the second capacitor. The thickness of the PMD layer for the stand-alone galvanically isolated capacitor device is between about 1 and about 1.55 times the thickness of the ILD layer. In some embodiments to reduce both the total die area and the total capacitance, the effective size of the second capacitor can be reduced by etching a capacitance-reducing opening through the lower metal plate below the second upper metal plate.

[0053] Advantages of the described stand-alone galvanically isolated capacitor devices may include one or more of the following advantages. The fabrication process is low cost and simple, with only five pattern levels for metal-1, metal-2, isolation trench, contact opening through the protective overcoat layer, and access opening through the polyimide layer. · Die size and total series capacitance can be adjusted by simple layout changes. The Metal-1 layer is used only for capacitive coupling to the Metal-2 top plate, so no deep vias are required. · Can be integrated into MCMs to provide isolation for devices with many different functions.

[0054] Although various implementations have been shown and described in detail, the claims are not limited to any particular implementation or example. None of the above detailed description suggests that any particular component, element, step, operation, or function is essential for inclusion in the claims. References to elements in the singular do not mean "one and only," but rather "one or more," unless expressly stated otherwise. All structural and functional equivalents to the elements of the above-described implementations known to those skilled in the art are expressly incorporated herein by reference and are encompassed by the claims. Accordingly, those skilled in the art will recognize that the example implementations described herein can be practiced with various modifications and alterations within the spirit and scope of the claims appended hereto.

Claims

1. 1. A galvanic isolation capacitor device comprising: a pre-metal dielectric (PMD) layer having a first thickness over a semiconductor substrate; a lower metal plate disposed over the PMD layer; an interlevel dielectric (ILD) layer disposed over the lower metal plate and having a second thickness, wherein a ratio of the first thickness to the second thickness is between about 1 and about 1.55, inclusive; and a first upper metal plate disposed over the ILD layer and having a first area; a second upper metal plate disposed above the ILD layer and having a second area; Including, 10. A galvanically isolated capacitor device, wherein a ratio of the first area to the second area is greater than about 5 and less than about 10.

2. 10. The galvanically isolated capacitor device of claim 1, The PMD layer is a first oxide layer over the semiconductor substrate; a first nitrogen-containing dielectric layer overlying the first oxide layer and in contact with the lower metal plate; 1. A galvanic isolation capacitor device comprising:

3. 3. The galvanically isolated capacitor device of claim 2, the ILD layer comprises: a second oxide layer on the lower metal plate; a second nitrogen-containing dielectric layer overlying the second oxide layer and contacting the first metal plate and the second upper metal plate; 1. A galvanic isolation capacitor device comprising:

4. 10. The galvanically isolated capacitor device of claim 1, 1. A galvanically isolated capacitor device, wherein the lower metal plate includes a capacitance-reducing opening, the capacitance-reducing opening being located below the second upper metal plate.

5. 5. The galvanically isolated capacitor device of claim 4, 10. A galvanically isolated capacitor device, wherein the capacitance-reducing opening is a trench that isolates a portion of the lower metal plate from a remainder of the lower metal plate.

6. 5. The galvanically isolated capacitor device of claim 4, 10. A galvanically isolated capacitor device, wherein the capacitance-reducing opening is a circular opening through the lower metal plate.

7. 10. The galvanically isolated capacitor device of claim 1, the lower metal plate, the first upper metal plate, and the second upper metal plate comprise aluminum.

8. A multi-chip module (MCM), comprising: a first die having a first integrated circuit configured to operate at a first voltage level; a second die having a second integrated circuit configured to operate at a second voltage level, wherein a difference between the first voltage level and the second voltage level is greater than about 500V; and a third die including a first capacitor coupled in series with a second capacitor through a bottom metal plate; Including, the first capacitor includes a first upper metal plate having a first area, the first upper metal plate coupled to the first integrated circuit; the second capacitor includes a second upper metal plate having a second area, the second upper metal plate coupled to the second integrated circuit; and a ratio of the first area to the second area is 5.0 or greater.

9. 9. The MCM of claim 8, The MCM, wherein the first die and the third die are attached to a first die attach pad (DAP), and the second die is attached to a second DAP that is conductively isolated from the first DAP.

10. 9. The MCM of claim 8, the third die: a semiconductor substrate; a pre-metal dielectric (PMD) layer having a first thickness on the semiconductor substrate; a lower metal plate in contact with the PMD layer; an interlevel dielectric (ILD) layer having a second thickness on the lower metal plate, the ratio of the first thickness to the second thickness being between about 1 and about 1.55; and the first upper metal plate and the second upper metal plate in contact with the ILD layer; Including, MCM.

11. 11. The MCM of claim 10, The MCM, wherein the lower metal plate includes a capacitance-reducing opening located below the second upper metal plate.

12. 11. The MCM of claim 10, the lower metal plate, the first upper metal plate, and the second upper metal plate comprise aluminum.

13. 1. A process for forming an integrated circuit chip, comprising: forming a pre-metal dielectric (PMD) layer having a first thickness over a semiconductor substrate; forming a lower metal plate over the PMD layer; forming an interlevel dielectric (ILD) layer over the lower metal plate, the ILD layer having a second thickness, the ratio of the first thickness to the second thickness being between about 1.0 and about 1.55; forming a first upper metal plate and a second upper metal plate over the ILD layer; Including, wherein the first upper metal plate has a first area and the second upper metal plate has a second area, and the ratio of the first area to the second area is greater than 5.

0.

14. 14. The process of claim 13, forming the PMD layer forming a first oxide layer over the semiconductor substrate; forming a first nitrogen-containing dielectric layer on the first oxide layer; The process includes:

15. 15. The process of claim 14, forming the ILD layer forming a second oxide layer on the lower metal plate; forming a second nitrogen-containing dielectric layer on the second oxide layer; The process includes:

16. 16. The process of claim 15, forming an isolation trench through the second nitrogen-containing dielectric layer, the isolation trench surrounding the first upper metal plate and the second upper metal plate.

17. 17. The process of claim 16, forming a dielectric overcoat layer over the first upper metal plate, the second upper metal plate, and a portion of the ILD layer; forming a first contact opening and a second contact opening through the dielectric overcoat layer; Including, A process wherein the first contact opening is over the first upper metal plate and the second contact opening is over the second upper metal plate.

18. 18. The process of claim 17, forming a polyimide layer on the dielectric overcoat layer; forming a first access opening and a second access opening through the polyimide layer; Including, A process wherein the first access opening is over the first contact opening and the second access opening is over the second contact opening.

19. 14. The process of claim 13, The process wherein forming the lower metal plate includes forming a capacitance-reducing opening through the lower metal plate, the capacitance-reducing opening being located below the second upper metal plate.

20. 20. The process of claim 19, A process wherein forming the capacitance-reducing opening includes forming a circular trench that insulates a portion of the lower metal plate from a remainder of the lower metal plate.

21. 20. The process of claim 19, The process wherein forming the capacitance-reducing opening includes forming a circular opening through the lower metal plate.

22. 14. The process of claim 13, forming the lower metal plate includes patterning a first aluminum layer using subtractive etching; forming the first upper metal plate and the second upper metal plate includes patterning a second aluminum layer using subtractive etching; The process includes:

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