Light emitting module and method of manufacturing the same

Abstract

To provide a light-emitting module in which the bonding strength between a wiring board and a light-emitting element is less likely to decrease even if the position of the light-emitting element with respect to the wiring board is displaced, and to provide a method of manufacturing the same.SOLUTION: A method of manufacturing a light-emitting module includes the steps of: preparing a light-emitting element including a semiconductor stack, a first electrode portion, a plurality of second electrode portions, and an insulating portion disposed between at least some of the plurality of second electrode portions and between the plurality of second electrode portions, the insulating portion protruding from the first electrode portion and the plurality of second electrode portions; preparing an intermediate body including a wiring substrate, a first conductive portion, a plurality of second conductive portions, and a holding portion; and disposing the light-emitting element on the intermediate body by bringing the insulating portion into contact with the holding portion.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] FIELD Embodiments of the present invention relate to a light emitting module and a method for manufacturing the same. [Background technology]

[0002] Light-emitting modules have been developed that mount a large number of light-emitting elements on a wiring board. When manufacturing such a light-emitting module, a large number of light-emitting elements are arranged on a single wiring board, and then the wiring board and the light-emitting elements are bonded together. However, if the position of the light-emitting elements is misaligned with respect to the wiring board, the bonding strength between the wiring board and the light-emitting elements decreases. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 033557 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the embodiments of the present invention is to provide a light-emitting module in which the bonding strength between the wiring board and the light-emitting element is not likely to decrease even if the position of the light-emitting element relative to the wiring board is misaligned, and a method for manufacturing the same. [Means for solving the problem]

[0005] A method for manufacturing a light emitting module according to an embodiment of the present invention includes the steps of preparing a light emitting element including a semiconductor laminate having a first surface, a first electrode portion disposed on the first surface, a plurality of second electrode portions disposed on the first surface at a distance from the first electrode portion, and insulating portions disposed on the first surface between the first electrode portion and the plurality of second electrode portions and at least in part between the plurality of second electrode portions, and protruding in a direction away from the first surface beyond the first electrode portion and the plurality of second electrode portions; The method includes the steps of: preparing an intermediate body having a first conductive portion, a plurality of second conductive portions arranged on the second surface at a distance from the first conductive portion, and a holding portion arranged at least partially between the first conductive portion and the plurality of second conductive portions on the second surface and between the plurality of second conductive portions; placing the light-emitting element on the intermediate body by contacting the insulating portion with the holding portion; and forming a first joint portion in contact with the first electrode portion and the first conductive portion, and forming a second joint portion in contact with the second electrode portion and the second conductive portion.

[0006] An optical emitting module according to an embodiment of the present invention comprises a light emitting element having a semiconductor laminate having a first surface, a first electrode portion arranged on the first surface, a plurality of second electrode portions arranged on the first surface at a distance from the first electrode portion, and an insulating portion arranged on the first surface between the first electrode portion and the plurality of second electrode portions and at least a portion between the plurality of second electrode portions, the insulating portion protruding in a direction away from the first surface beyond the first electrode portion and the plurality of second electrode portions; a wiring substrate having a second surface, a first conductive portion arranged on the second surface, a plurality of second conductive portions arranged on the second surface at a distance from the first conductive portion, a first junction portion in contact with the entire surface of the first electrode portion facing the second surface and with the first conductive portion, and a second junction portion in contact with the entire surface of the second electrode portion facing the second surface and with the second conductive portion. [Effects of the Invention]

[0007] According to the embodiments of the present invention, it is possible to realize a light-emitting module and a method for manufacturing the same in which the bonding strength between the wiring board and the light-emitting element is not easily reduced even if the position of the light-emitting element is misaligned with respect to the wiring board. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a bottom view showing a light emitting device according to an embodiment. [Figure 2] FIG. 2 is an end view taken along line II-II shown in FIG. [Figure 3] FIG. 3 is a top view showing an intermediate body in the embodiment. [Figure 4] FIG. 4 is a top view showing a portion of the intermediate body in the embodiment excluding the holding portion. [Figure 5] FIG. 5 is an end view taken along line VV shown in FIG. [Figure 6] FIG. 6 is a top view showing a state in which a plurality of light emitting elements are arranged on an intermediate body. [Figure 7] FIG. 7 is an end view taken along line VII-VII shown in FIG. [Figure 8] FIG. 8 is a top view showing a step of forming the first bonding portion and the second bonding portion. [Figure 9] FIG. 9 is an end view taken along line IX-IX shown in FIG. [Figure 10] FIG. 10 is a top view showing a step of forming the first bonding portion and the second bonding portion. [Figure 11] FIG. 11 is an end view taken along line XI-XI shown in FIG. [Figure 12] FIG. 12 is a top view showing a step of removing the holding portion. [Figure 13] FIG. 13 is an end view taken along line XIII-XIII shown in FIG. [Figure 14] FIG. 14 is a top view showing a step of forming a light-shielding portion. [Figure 15] FIG. 15 is an end view taken along line XV-XV shown in FIG. [Figure 16] FIG. 16 is an end view showing the effect of the embodiment. [Figure 17] FIG. 17 is an end view showing a method for manufacturing a light emitting module according to a comparative example, in which the positional deviation of the light emitting element relative to the wiring board is small. [Figure 18] FIG. 18 is an end view showing a method for manufacturing a light emitting module according to a comparative example, and shows a case where there is a large amount of positional deviation of the light emitting element relative to the wiring board. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that each drawing is a schematic view, and is appropriately emphasized or simplified. Furthermore, the dimensional ratios of the components in the drawings do not necessarily match.

[0010] First, a method for manufacturing the light emitting module according to this embodiment will be described. The method for manufacturing a light-emitting module according to this embodiment includes the steps of preparing a light-emitting element 10, preparing an intermediate body 30, placing the light-emitting element 10 on the intermediate body 30, and forming a first bonding portion 41 and a second bonding portion 42. The light-emitting element 10 includes a semiconductor laminate 20 having a first surface 26, a first electrode portion 11 disposed on the first surface 26, a plurality of second electrode portions 12 disposed on the first surface 26 and spaced apart from the first electrode portion 11, and an insulating portion 13. The insulating portion 13 is disposed on the first surface 26 at least partially between the first electrode portion 11 and the plurality of second electrode portions 12 and between the plurality of second electrode portions 12, and protrudes in a direction away from the first surface 26 beyond the first electrode portion 11 and the plurality of second electrode portions 12. The intermediate body 30 has a wiring board 35 having a second surface 36, a first conductive portion 31 arranged on the second surface 36, a plurality of second conductive portions 32 arranged on the second surface 36 at a distance from the first conductive portion 31, and a holding portion 33. The holding portion 33 is arranged at least partially between the first conductive portion 31 and the plurality of second conductive portions 32 on the second surface 36 and between the plurality of second conductive portions 32. In the step of placing the light-emitting element 10 on the intermediate body 30, the insulating portion 13 is brought into contact with the holding portion 33. The first bonding portion 41 contacts the first electrode portion 11 and the first conductive portion 31. The second bonding portion 42 contacts the second electrode portion 12 and the second conductive portion 32. Each step will be described in detail below.

[0011] <Step of Preparing Light-Emitting Element> First, the light emitting element 10 is prepared. FIG. 1 is a bottom view showing the light emitting device of this embodiment. FIG. 2 is an end view taken along line II-II shown in FIG. Although Figure 1 shows four light-emitting elements 10, the insulating portion 13, first contact 14, second contact 15, and second semiconductor layer 22 are omitted from the light-emitting element 10 at the bottom right in order to make the other components easier to see.

[0012] 1 and 2, the light-emitting element 10 includes a semiconductor laminate 20, a first electrode unit 11, a plurality of second electrode units 12, and an insulating unit 13. The light-emitting element 10 may further include a first contact 14, a plurality of second contacts 15, an insulating film 16, and a light-transmitting member 17.

[0013] The semiconductor laminate 20 has a first semiconductor layer 21 of a first conductivity type, a plurality of active layers 23, and a plurality of second semiconductor layers 22 of a second conductivity type. For example, the first conductivity type is n-type and the second conductivity type is p-type. However, the first conductivity type may be p-type and the second conductivity type may be n-type. The first semiconductor layer 21, the plurality of active layers 23, and the plurality of second semiconductor layers 22 are arranged in this order.

[0014] In this embodiment, four active layers 23 are in contact with one first semiconductor layer 21, and four second semiconductor layers 22 are in contact with these four active layers 23. Four partial stacks, each of which has one active layer 23 and one second semiconductor layer 22 stacked on top of each other, are provided, and these four partial stacks are arranged in a matrix of two rows and two columns along a first direction D1 and a second direction D2 perpendicular to the first direction D1.

[0015] The semiconductor laminate 20 has a first surface 26 which is the lower surface, an upper surface 27 located on the opposite side of the first surface 26, and a plurality of side surfaces 28 connecting the first surface 26 and the upper surface 27. The shape of the semiconductor laminate 20 is, for example, a quadrangular pyramid truncated shape. In this case, the first surface 26 and the upper surface 27 are rectangular, and the upper surface 27 is larger than the first surface 26 which is the lower surface. In addition, four side surfaces 28 are provided.

[0016] The first electrode unit 11 is disposed on the first surface 26 of the semiconductor laminate 20. The multiple second electrode units 12 are disposed on the first surface 26 at a distance from the first electrode unit 11. The multiple second electrode units 12 are also spaced apart from one another. In this embodiment, the first electrode unit 11 is disposed, for example, in the center of the first surface 26. The first electrode unit 11 has a rectangular shape, for example, and its length in the first direction D1 is longer than its length in the second direction D2.

[0017] Four second electrode units 12 are provided, and are arranged in a matrix of two rows and two columns along the first direction D1 and the second direction D2. Each second electrode unit 12 is arranged at a position corresponding to each second semiconductor layer 22 of the semiconductor laminate 20, for example, at each corner of the first surface 26. Each second electrode unit 12 is, for example, rectangular in shape, and its length in the first direction D1 is longer than its length in the second direction D2. The second electrode units 12 have substantially the same shape and are smaller than the first electrode units 11. The first electrode unit 11 is not arranged between two second electrode units 12 arranged along the first direction D1, but is arranged partially between two second electrode units 12 arranged along the second direction D2.

[0018] The first electrode unit 11 is connected to the first semiconductor layer 21 via a first contact 14. In this specification, "connection" means electrical connection. The multiple second electrode units 12 are connected to the multiple second semiconductor layers 22 via multiple second contacts 15. More specifically, each second electrode unit 12 is connected to each second semiconductor layer 22 via each second contact 15. When the first semiconductor layer 21 is an n-type layer and the second semiconductor layer 22 is a p-type layer, the first electrode unit 11 is a common cathode electrode and the second electrode unit 12 is an anode electrode.

[0019] The insulating film 16 covers the first surface 26 and the side surface 28 of the semiconductor laminate 20. The first electrode unit 11 is separated from the first semiconductor layer 21 via the insulating film 16, and the second electrode unit 12 is separated from the second semiconductor layer 22 via the insulating film 16. The first contact 14 and the second contact 15 penetrate the insulating film 16. The light-transmitting member 17 covers the upper surface 27 of the semiconductor laminate 20. The upper surface of the light-transmitting member 17 is the light-emitting surface of the light-emitting element 10. The upper surface of the light-transmitting member 17 may have fine irregularities formed thereon. This improves the light extraction efficiency from the light-transmitting member 17.

[0020] The insulating portion 13 is disposed between the first electrode portion 11 and the plurality of second electrode portions 12 on the first surface 26 of the semiconductor laminate 20, and at least partially between the plurality of second electrode portions 12. The insulating portion 13 does not cover the first electrode portion 11 and the second electrode portion 12.

[0021] In this embodiment, for example, the insulating portion 13 has a first portion 13a extending in the second direction D2 and a second portion 13b extending in the first direction D1. The first portion 13a is disposed between two second electrode portions 12 arranged along the first direction D1. The second portion 13b is disposed between the first electrode portion 11 and each second electrode portion 12 in the second direction D2. A central portion of the second portion 13b in the first direction D1 is connected to an end portion of the first portion 13a on the first electrode portion 11 side.

[0022] On the other hand, no insulating portion 13 is arranged between the first electrode portion 11 and the edges on both sides of the light-emitting element 10 in the first direction D1. Furthermore, no insulating portion 13 is arranged between each second electrode portion 12 and the edge on one side of the light-emitting element 10 in the first direction D1, i.e., between this second electrode portion 12 and the edge closest to it in the first direction D1.

[0023] The insulating portion 13 protrudes in a third direction D3 away from the first surface 26 more than the first electrode portion 11 and the plurality of second electrode portions 12. The third direction D3 is perpendicular to the first direction D1 and the second direction D2. In the third direction D3, the protrusion amount h of the insulating portion 13 relative to the first electrode portion 11 is preferably 0.5 μm or more and 2.0 μm or less. The insulating portion 13 is formed of an insulating material such as silicon oxide (SiO2) or aluminum oxide (Al2O3).

[0024] <Step of preparing an intermediate> Next, an intermediate 30 is prepared. FIG. 3 is a top view showing an intermediate body in this embodiment. FIG. 4 is a top view showing a portion of the intermediate body in this embodiment excluding the holding portion. FIG. 5 is an end view taken along line VV shown in FIG. The step of preparing the light emitting element 10 and the step of preparing the intermediate 30 may be carried out in any order, or may be carried out simultaneously.

[0025] 3 to 5, intermediate body 30 has wiring board 35, a plurality of first conductive parts 31, a plurality of second conductive parts 32, and holding part 33. Wiring board 35 has a second surface 36 which is the upper surface. Wiring board 35 is, for example, an ASIC (Application Specific Integrated Circuit) board, and has an integrated circuit (not shown) formed therein.

[0026] The first conductive portion 31 is disposed on the second surface 36 of the wiring substrate 35. The second conductive portion 32 is disposed on the second surface 36 at a distance from the first conductive portion 31. A plurality of regions 37 are defined on the second surface 36, where the light emitting element 10 will be disposed in a later process. In this embodiment, the plurality of regions 37 are arranged in a matrix along the first direction D1 and the second direction D2 at a distance from one another, and each region 37 has a rectangular shape. The first direction D1 to the third direction D3 of the intermediate body 30 will coincide with the first direction D1 to the third direction D3 of the light emitting element 10 when the light emitting element 10 is disposed on the intermediate body 30 in a later process.

[0027] Each region 37 is provided with one first conductive portion 31 and multiple second conductive portions 32. The positions of the first conductive portion 31 and the multiple second conductive portions 32 in each region 37 correspond to the positions of the first electrode portion 11 and the multiple second electrode portions 12 in each light-emitting element 10. That is, the first conductive portion 31 is disposed in the center of the region 37, and the four second conductive portions 32 are disposed at each corner of the region 37. In one example, the shape of the first conductive portion 31 is a regular hexagon, and the shape of each second conductive portion 32 is a pentagon obtained by cutting off one corner of a square that faces the first conductive portion 31. The first conductive portion 31 and the multiple second conductive portions 32 are each connected to wiring (not shown) of the wiring substrate 35.

[0028] The holding portion 33 is formed, for example, from a resist material by lithography. The holding portion 33 is disposed between the first conductive portion 31 and the plurality of second conductive portions 32 on the second surface 36 of the wiring substrate 35, and at least partially between the plurality of second conductive portions 32. In this embodiment, a portion of the holding portion 33 is disposed at a position that overlaps with the insulating portion 13 when viewed from the third direction D3 when the light-emitting element 10 is disposed on the intermediate body 30 in a later process. The thickness of the holding portion 33, i.e., its length in the third direction D3, is greater than the thicknesses of the first conductive portion 31 and the second conductive portion 32. Therefore, the holding portion 33 protrudes in a direction away from the second surface 36 more than the first conductive portion 31 and the second conductive portion 32.

[0029] In this embodiment, the holding portion 33 has a trunk portion 33s, a first branch portion 33a, and a second branch portion 33b. The trunk portion 33s is disposed between adjacent regions 37 in the second direction D2 and extends in the first direction D1. Both widthwise ends of the trunk portion 33s are disposed within the regions 37 and cover portions of the second conductive portion 32.

[0030] The first branch portion 33a extends from the trunk portion 33s toward both sides in the second direction D2. The first branch portion 33a extends from the trunk portion 33s toward the first conductive portion 31 within the region 37. The second branch portion 33b extends from the tip of the first branch portion 33a, i.e., the end of the first branch portion 33a opposite the trunk portion 33s, toward both sides in the first direction D1. The second branch portion 33b is disposed within the region 37, and its central portion in the first direction D1 covers a portion of the first conductive portion 31, and its both end portions in the first direction D1 cover portions of the two second conductive portions 32. Note that the holding portion 33 does not necessarily have to cover the first conductive portion 31 and the second conductive portion 32.

[0031] A trunk portion 33s of the retaining portion 33 is disposed between adjacent regions 37 in the second direction D2. In each region 37, both ends in the second direction D2 are covered by the trunk portion 33s of the retaining portion 33. In each region 37, a first branch portion 33a of the retaining portion 33 is disposed between adjacent second conductive portions 32 in the first direction D1. In each region 37, a second branch portion 33b of the retaining portion 33 is disposed between the first conductive portion 31 and the second conductive portion 32.

[0032] On the other hand, no retaining portion 33 is arranged in most of the space between adjacent regions 37 in the first direction D1. No retaining portion 33 is arranged between the first conductive portion 31 and the edges on both sides of the region 37 in the first direction D1. No retaining portion 33 is arranged between each second conductive portion 32 and the edge of the region 37 that is closest to the second conductive portion 32 in the first direction D1.

[0033] <Step of disposing the light-emitting element on the intermediate> Next, the light emitting element 10 is placed on the intermediate body 30 . FIG. 6 is a top view showing a state in which a plurality of light emitting elements are arranged on an intermediate body. FIG. 7 is an end view taken along line VII-VII shown in FIG.

[0034] 6 shows four light-emitting elements 10, but for ease of viewing, the first electrode portion 11 and the second electrode portion 12 are indicated by dashed lines in the light-emitting element 10 at the top left, and the first conductive portion 31 and the second conductive portion 32 are indicated by dashed lines in the region 37 corresponding to the light-emitting element 10 at the bottom right. However, the first electrode portion 11 and the second electrode portion 12 are provided in all light-emitting elements 10, and the first conductive portion 31 and the second conductive portion 32 are provided in all regions 37. The same applies to FIGS. 8, 10, and 12, which will be described later. In addition, in the description of the processes after this process, the third direction D3 is the direction from the first surface 26 toward the second surface 36.

[0035] As shown in FIGS. 6 and 7 , multiple light-emitting elements 10 are positioned on multiple regions 37 of the intermediate body 30, with the first surface 26 of the light-emitting element 10 facing the second surface 36 of the intermediate body 30. Then, the insulating portion 13 of the light-emitting element 10 is brought into contact with the holding portion 33 of the intermediate body 30. More specifically, the first portion 13a of the insulating portion 13 is brought into contact with the first branch portion 33a of the holding portion 33, and the second portion 13b of the insulating portion 13 is brought into contact with the second branch portion 33b of the holding portion 33. In this way, the multiple light-emitting elements 10 are arranged on the intermediate body 30. At this time, as shown in FIG. 7 , the width W1 of the insulating portion 13 in one cross section is smaller than the width W2 of the holding portion 33.

[0036] <Step of forming the first bonding portion and the second bonding portion> Next, a first joint 41 that connects the first electrode portion 11 to the first conductive portion 31 and a second joint 42 that connects the second electrode portion 12 to the second conductive portion 32 are formed. FIG. 8 is a top view showing a step of forming the first bonding portion and the second bonding portion. FIG. 9 is an end view taken along line IX-IX shown in FIG. FIG. 10 is a top view showing a step of forming the first bonding portion and the second bonding portion. FIG. 11 is an end view taken along line XI-XI shown in FIG.

[0037] 8 and 9, electrolytic plating solution 101 is supplied from the light-emitting element 10 side, and electrolytic plating is initiated. As a result, a metal film grows starting from the first electrode portion 11 of the light-emitting element 10 and the first conductive portion 31 of the intermediate body 30, and also grows starting from the second electrode portion 12 of the light-emitting element 10 and the second conductive portion 32 of the intermediate body 30. When the metal film grown from the first conductive portion 31 and the metal film grown from the first electrode portion 11 are sufficiently integrated, and when the metal film grown from the second conductive portion 32 and the metal film grown from the second electrode portion 12 are sufficiently integrated, electrolytic plating is terminated.

[0038] 10 and 11 , a first bonding portion 41 and a second bonding portion 42 are formed between the wiring substrate 35 and the light-emitting element 10. The first bonding portion 41 contacts the entire lower surface of the first electrode portion 11 of the light-emitting element 10 and a portion of the first conductive portion 31 of the intermediate body 30 that is not covered by the holding portion 33. The second bonding portion 42 contacts the entire lower surface of the second electrode portion 12 of the light-emitting element 10 and a portion of the second conductive portion 32 of the intermediate body 30 that is not covered by the holding portion 33.

[0039] The first bonding portion 41 and the second bonding portion 42 are separated from each other by the retaining portion 33 and the insulating portion 13. Therefore, the first bonding portion 41 and the second bonding portion 42 are insulated from each other. The first bonding portion 41 and the second bonding portion 42 may or may not be in contact with the retaining portion 33 and the insulating portion 13. When the first bonding portion 41 or the second bonding portion 42 is in contact with the retaining portion 33 and the insulating portion 13, a step 44 may be formed on the side surface 43 of the first bonding portion 41 or the second bonding portion 42 extending in the third direction D3 at a position corresponding to the boundary between the retaining portion 33 and the insulating portion 13.

[0040] <Step of removing the holding portion> Next, the holding portion 33 is removed. FIG. 12 is a top view showing a step of removing the holding portion. FIG. 13 is an end view taken along line XIII-XIII shown in FIG.

[0041] 12 and 13, for example, a chemical solution is brought into contact with the holding portions 33 through the gaps between the light emitting elements 10. This dissolves and removes the holding portions 33. At this time, the insulating portions 13 are not removed.

[0042] <Process for forming light-shielding portion> Next, the light-shielding portion 50 is formed. FIG. 14 is a top view showing a step of forming a light-shielding portion. FIG. 15 is an end view taken along line XV-XV shown in FIG.

[0043] 14 and 15, a light-shielding material, for example, a paste-like resin material containing a light-reflecting material, is poured between the wiring substrate 35 and the light-emitting elements 10 through the gaps between the light-emitting elements 10. Next, the resin material is heated and solidified. Next, the portion of the solidified resin material that was located on the upper surface of the light-emitting elements 10 is removed.

[0044] This forms a light-shielding portion 50 between the wiring substrate 35 and the light-emitting element 10. The light-shielding portion 50 covers the second surface 36 of the wiring substrate 35, the side surfaces of the first bonding portion 41, the side surfaces of the second bonding portion 42, and the bottom and side surfaces of the light-emitting element 10, but does not cover the top surface of the light-emitting element 10. Note that the upper portions of the side surfaces of the light-emitting element 10 do not have to be covered by the light-shielding portion 50.

[0045] The lower surface of the light-emitting element 10 includes the lower surface of the portion of the insulating film 16 that covers the first surface 26 of the semiconductor laminate 20, the lower surface and side surface of the first electrode unit 11, the lower surface and side surface of the second electrode unit 12, and the lower surface and side surface of the insulating unit 13. The side surface of the light-emitting element 10 includes the side surface of the portion of the insulating film 16 that covers the side surface 28 of the semiconductor laminate 20. The upper surface of the light-emitting element 10 includes the upper surface of the light-transmitting member 17. In this manner, the light-emitting module 1 according to this embodiment is manufactured.

[0046] <Light-emitting module> The configuration of the light-emitting module 1 according to this embodiment will be briefly described below. The light-emitting module 1 according to this embodiment includes a light-emitting element 10, a wiring substrate 35 having a second surface 36, a first conductive portion 31 disposed on the second surface 36, a plurality of second conductive portions 32 disposed on the second surface 36 at a distance from the first conductive portion 31, a first bonding portion 41, and a second bonding portion 42. The light-emitting element 10 includes a semiconductor laminate 20 having a first surface 26, a first electrode portion 11 disposed on the first surface 26, a plurality of second electrode portions 12 disposed on the first surface 26 at a distance from the first electrode portion 11, and an insulating portion 13. The insulating portion 13 is disposed on the first surface 26 at least partially between the first electrode portion 11 and the plurality of second electrode portions 12 and between the plurality of second electrode portions 12, and protrudes in a direction away from the first surface 26 beyond the first electrode portion 11 and the plurality of second electrode portions 12. The first bonding portion 41 contacts the entire surface of the first electrode portion 11 facing the second surface 36 and the first conductive portion 31. The second bonding portion 42 contacts the entire surface of the second electrode portion 12 facing the second surface 36 and the second conductive portion 32.

[0047] This will be explained in detail below. 14 and 15, the light-emitting module 1 includes a wiring substrate 35, a first conductive portion 31, a second conductive portion 32, a first bonding portion 41, a second bonding portion 42, and a light-emitting element 10. For example, a plurality of light-emitting elements 10 are arranged on the wiring substrate 35. The light-emitting elements 10 are arranged in a matrix along a first direction D1 and a second direction D2. The light-emitting module 1 may also include a light-shielding portion 50.

[0048] The wiring substrate 35 is, for example, an ASIC substrate, and has an integrated circuit (not shown) provided therein. The first conductive portion 31 and the second conductive portion 32 are arranged spaced apart from each other on a second surface 36, which is the upper surface of the wiring substrate 35. In this embodiment, one first conductive portion 31 and four second conductive portions 32 are arranged in each region 37 located directly below the light emitting element 10. The first conductive portion 31 is located in the center of the region 37, and the four second conductive portions 32 are located at the four corners of the region 37, respectively. The first conductive portion 31 and the second conductive portion 32 are each connected to wiring (not shown) of the wiring substrate 35.

[0049] A first joint 41 made of metal is disposed on the first conductive portion 31. The first joint 41 contacts at least a portion of the upper surface of the first conductive portion 31. Similarly, a second joint 42 made of metal is disposed on the second conductive portion 32. The second joint 42 contacts at least a portion of the upper surface of the second conductive portion 32. The multiple first joints 41 and the multiple second joints 42 are spaced apart from each other. At least one of the first joints 41 and the second joints 42 has a step 44 on a side surface 43 extending in the third direction D3.

[0050] The first bonding portion 41 contacts the entire lower surface of the first electrode portion 11 of the light-emitting element 10. The lower surface of the first electrode portion 11 is the surface facing the second surface 36 of the wiring substrate 35. The first bonding portion 41 may contact a side surface of the first electrode portion 11. The first bonding portion 41 connects the first conductive portion 31 to the first electrode portion 11. Similarly, the second bonding portion 42 contacts the entire lower surface of the second electrode portion 12 of the light-emitting element 10. The lower surface of the second electrode portion 12 is the surface facing the second surface 36 of the wiring substrate 35. The second bonding portion 42 may contact a side surface of the second electrode portion 12. The second bonding portion 42 connects the second conductive portion 32 to the second electrode portion 12.

[0051] In the third direction D3 from the first surface 26 toward the second surface 36, the protrusion amount h of the insulating portion 13 relative to the first electrode portion 11 is preferably 0.5 μm or more and 2.0 μm or less. The insulating portion 13 may or may not be in contact with the first bonding portion 41 and the second bonding portion 42. The other configuration of the light-emitting element 10 is as described above.

[0052] The light-shielding portion 50 is disposed between the wiring substrate 35 and the light-emitting element 10 and between the light-emitting elements 10. The light-shielding portion 50 is made of an opaque insulating material, such as a resin material containing a light-reflecting material. The light-shielding portion 50 covers the second surface 36 of the wiring substrate 35, the region of the first conductive portion 31 not in contact with the first bonding portion 41, the region of the second conductive portion 32 not in contact with the second bonding portion 42, the region of the side surface of the first bonding portion 41 not in contact with the insulating portion 13, the region of the side surface of the second bonding portion 42 not in contact with the insulating portion 13, the region of the lower surface of the light-emitting element 10 not in contact with the first bonding portion 41 and the second bonding portion 42, and the lower portion or the entire side surface of the light-emitting element 10. The light-shielding portion 50 does not cover the lower surface of the first electrode portion 11, the lower surface of the second electrode portion 12, or the upper surface of the light-emitting element 10.

[0053] <Effects> Next, the effects of this embodiment will be described. 1 and 2, an insulating portion 13 is provided on the light-emitting element 10, protruding in the third direction D3 beyond the first electrode portion 11 and the second electrode portion 12. As a result, in the step of placing the light-emitting element 10 on the intermediate body 30 shown in FIGS. 6 and 7, the insulating portion 13 is brought into contact with the holding portion 33.

[0054] Therefore, even if the position of the light emitting element 10 is shifted relative to the wiring substrate 35, the first electrode portion 11 and the second electrode portion 12 can be prevented from coming into contact with the holding portion 33. As a result, in the process of forming the first bonding portion 41 and the second bonding portion 42 shown in FIGS. 8 to 11, the contact area between the first electrode portion 11 and the first bonding portion 41 and the contact area between the second electrode portion 12 and the second bonding portion 42 are unlikely to decrease. This makes it difficult for the bonding strength between the wiring substrate 35 and the light emitting element 10 to decrease. In addition, the conductivity between the first electrode portion 11 and the first conductive portion 31 and the conductivity between the second electrode portion 12 and the second conductive portion 32 are also unlikely to decrease.

[0055] FIG. 16 is an end view showing the effect of this embodiment. 16 shows a case where the position of the light emitting element 10 is shifted relative to the wiring board 35 in the process shown in FIG. 11. Even when the position of the light emitting element 10 is shifted, the holding portion 33 does not come into contact with the first electrode portion 11 and the second electrode portion 12, the first bonding portion 41 comes into contact with the entire lower surface of the first electrode portion 11, and the second bonding portion 42 comes into contact with the entire lower surface of the second electrode portion 12. Thus, according to this embodiment, even when the position of the light emitting element 10 is shifted relative to the wiring board 35, it is possible to realize a light emitting module 1 in which the bonding strength between the wiring board 35 and the light emitting element 10 is unlikely to decrease.

[0056] Furthermore, in the light-emitting module 1 according to this embodiment, a plurality of active layers 23 and a plurality of second semiconductor layers 22 are provided for one first semiconductor layer 21 in the light-emitting element 10. The plurality of second semiconductor layers 22 are connected to a plurality of second electrode portions 12. This allows the light-emitting element 10 to be divided into a plurality of light-emitting regions that can be controlled independently of one another. As a result, the light-emitting module 1 can achieve high pixel resolution.

[0057] Furthermore, in this embodiment, four second electrode portions 12 are provided in each light-emitting element 10, and are arranged along the first direction D1 and the second direction D2. The insulating portion 13 is provided with a first portion 13a extending in the second direction D2 and a second portion 13b extending in the first direction D1, and the holding portion 33 is provided with a first branch portion 33a extending in the second direction D2 and a second branch portion 33b extending in the first direction D1. In the step of placing the light-emitting element 10 on the intermediate body 30, the first portion 13a is brought into contact with the first branch portion 33a, and the second portion 13b is brought into contact with the second branch portion 33b. As a result, the light-emitting element 10 is supported by the second branch portions 33b and the second portion 13b extending in the first direction D1 and the first branch portions 33a and the first portion 13a extending in the second direction D2, thereby stabilizing the position of the light-emitting element 10.

[0058] Furthermore, no insulating portion 13 is disposed between the first electrode portion 11 and both edge portions of the light-emitting element 10 in the first direction D1. Furthermore, no insulating portion 13 is disposed between the second electrode portion 12 and one edge portion of the light-emitting element 10 in the first direction D1. This makes it easier for the electrolytic plating solution 101 to reach the first electrode portion 11, the second electrode portion 12, the first conductive portion 31, and the second conductive portion 32 in the steps shown in FIGS. 8 and 9 .

[0059] Furthermore, in this embodiment, as shown in FIG. 2 , the protrusion amount h of the insulating portion 13 relative to the first electrode portion 11 in the third direction D3 is set to 0.5 μm or more and 2.0 μm or less. By setting the protrusion amount h to 0.5 μm or more, even if the retaining portion 33 is crushed and the tip of the insulating portion 13 enters the retaining portion 33 when the insulating portion 13 is brought into contact with the retaining portion 33, a gap can be secured between the first electrode portion 11 and the retaining portion 33, and the retaining portion 33 can be prevented from contacting the first electrode portion 11. Similarly, the retaining portion 33 can be prevented from contacting the second electrode portion 12. This prevents the first electrode portion 11 and the second electrode portion 12 from being covered by the retaining portion 33, and allows the first bonding portion 41 and the second bonding portion 42 to be provided in contact with the entire lower surfaces of the first electrode portion 11 and the second electrode portion 12.

[0060] 7, in the present embodiment, in the step of placing the light emitting element 10 on the intermediate body 30, the width W1 of the insulating portion 13 in one cross section is smaller than the width W2 of the holding portion 33. This makes it easy to bring the insulating portion 13 into contact with the holding portion 33 even if the position of the light emitting element 10 is misaligned with respect to the wiring board 35. In other words, the tolerance for misalignment of the light emitting element 10 is improved.

[0061] Furthermore, in this embodiment, as shown in Figures 14 and 15, a light-shielding portion 50 is provided between the wiring board 35 and the light-emitting element 10. This increases the bonding strength between the wiring board 35 and the light-emitting element 10. It also reduces the diffuse reflection of light emitted from a certain light-emitting element 10 between the wiring board 35 and other light-emitting elements 10. As a result, in the light-emitting module 1, the contrast between the lit light-emitting elements 10 and the extinguished light-emitting elements 10 is improved, and the resolution of the light-emitting pattern is improved.

[0062] Furthermore, in this embodiment, at least one of the plurality of first bonding portions 41 and the plurality of second bonding portions 42 has a step 44 on a side surface 43 extending in the third direction D3. As a result, the anchor effect improves the adhesion between the first bonding portion 41 or the second bonding portion 42 having the step 44 and the light-shielding portion 50. This improves the bonding strength between the wiring substrate 35 and the light-emitting element 10.

[0063] Furthermore, in this embodiment, the first bonding portion 41 and the second bonding portion 42 are formed by electrolytic plating, which allows the first bonding portion 41 and the second bonding portion 42 to be formed efficiently.

[0064] <Comparative Example> FIG. 17 is an end view showing a method for manufacturing a light emitting module according to this comparative example, and shows a case where the positional deviation of the light emitting element relative to the wiring board is small. FIG. 18 is an end view showing a method for manufacturing a light emitting module according to this comparative example, and shows a case where there is a large amount of misalignment of the light emitting element relative to the wiring board.

[0065] 17 , in this comparative example, the light emitting element 110 is not provided with an insulating portion 13. In this comparative example, when the light emitting element 110 is placed on the wiring substrate 35, the holding portion 33 may come into contact with a part of the lower surface of the first electrode portion 11 and a part of the lower surface of the second electrode portion 12. In this case, the first bonding portion 41 and the second bonding portion 42 do not come into contact with the areas of the lower surfaces of the first electrode portion 11 and the second electrode portion 12 that are in contact with the holding portion 33, and therefore the bonding strength between the wiring substrate 35 and the light emitting element 110 may be reduced.

[0066] 18, the above tendency becomes more pronounced when there is a large amount of misalignment of the light emitting element 110 with respect to the wiring substrate 35. As described above, in this comparative example, since the insulating portion 13 is not provided, when the position of the light emitting element 110 with respect to the wiring substrate 35 is misaligned, the bonding strength between the wiring substrate 35 and the light emitting element 110 is likely to decrease.

[0067] The above-described embodiment is an example of realizing the present invention, and the present invention is not limited to this embodiment. For example, the present invention also includes any embodiment in which some components or steps are added, deleted, or modified in the above-described embodiment.

[0068] The present invention includes the following aspects.

[0069] (Appendix 1) a step of preparing a light emitting element including: a semiconductor laminate having a first surface; a first electrode portion disposed on the first surface; a plurality of second electrode portions disposed on the first surface and spaced apart from the first electrode portion; and an insulating portion disposed on the first surface between the first electrode portion and the plurality of second electrode portions and at least partially between the plurality of second electrode portions, the insulating portion protruding in a direction away from the first surface beyond the first electrode portion and the plurality of second electrode portions; a step of preparing an intermediate body including a wiring substrate having a second surface, a first conductive portion disposed on the second surface, a plurality of second conductive portions disposed on the second surface at a distance from the first conductive portion, and a holding portion disposed at least partially between the first conductive portion and the plurality of second conductive portions and between the plurality of second conductive portions on the second surface; placing the light emitting element on the intermediate body by bringing the insulating portion into contact with the holding portion; forming a first joint portion in contact with the first electrode portion and the first conductive portion, and forming a second joint portion in contact with the second electrode portion and the second conductive portion; A method for manufacturing a light emitting module comprising:

[0070] (Appendix 2) the semiconductor laminate includes a first semiconductor layer of a first conductivity type, a plurality of active layers, and a plurality of second semiconductor layers of a second conductivity type, the first semiconductor layer, the plurality of active layers, and the plurality of second semiconductor layers being arranged in this order; the first electrode portion is connected to the first semiconductor layer, The method for manufacturing a light-emitting module according to claim 1, wherein the plurality of second electrode portions are connected to the plurality of second semiconductor layers.

[0071] (Appendix 3) The method for manufacturing a light-emitting module according to claim 1 or 2, wherein four second electrode portions are provided and arranged along a first direction and a second direction intersecting the first direction.

[0072] (Appendix 4) The insulating portion is a first portion extending in the second direction; a second portion extending in the first direction; and The holding portion is a first branch portion extending in the second direction; a second branch portion extending in the first direction; and A method for manufacturing a light-emitting module as described in Appendix 3, wherein in the step of placing the light-emitting element on the intermediate body, the first portion contacts the first branch portion and the second portion contacts the second branch portion.

[0073] (Appendix 5) The insulating portion is the first electrode portion is not disposed between the first electrode portion and both edge portions of the light emitting element in the first direction, 4. The method for manufacturing a light-emitting module according to claim 3, wherein the second electrode portion is not disposed between the second electrode portion and an edge of the light-emitting element on one side in the first direction.

[0074] (Appendix 6) A method for manufacturing a light-emitting module described in any one of Appendices 1 to 5, wherein the amount of protrusion of the insulating portion relative to the first electrode portion in a third direction from the first surface toward the second surface is 0.5 μm or more and 2.0 μm or less.

[0075] (Appendix 7) 7. The method for manufacturing a light-emitting module according to claim 1, wherein in the step of arranging the light-emitting element on the intermediate body, the width of the insulating portion in one cross section is smaller than the width of the holding portion.

[0076] (Appendix 8) the light-emitting element has a lower surface including the first surface, an upper surface disposed on the opposite side of the lower surface, and a side surface disposed between the lower surface and the upper surface, removing the holding portion after the step of forming the first bonding portion and the second bonding portion; forming a light-shielding portion that covers the bottom surface and the side surface of the light-emitting element after the step of removing the holding portion; 8. The method for manufacturing a light-emitting module according to any one of claims 1 to 7, further comprising:

[0077] (Appendix 9) 9. The method for manufacturing a light-emitting module according to any one of claims 1 to 8, wherein the first bonding portion and the second bonding portion are formed by electrolytic plating.

[0078] (Appendix 10) a light emitting element including: a semiconductor laminate having a first surface; a first electrode portion disposed on the first surface; a plurality of second electrode portions disposed on the first surface and spaced apart from the first electrode portion; and an insulating portion disposed on the first surface between the first electrode portion and the plurality of second electrode portions and at least partially between the plurality of second electrode portions, the insulating portion protruding in a direction away from the first surface beyond the first electrode portion and the plurality of second electrode portions; a wiring substrate having a second surface; a first conductive portion disposed on the second surface; a plurality of second conductive portions disposed on the second surface and spaced apart from the first conductive portions; a first bonding portion in contact with the first conductive portion and the entire surface of the first electrode portion facing the second surface; a second bonding portion in contact with the second conductive portion and the entire surface of the second electrode portion facing the second surface; A light emitting module comprising:

[0079] (Appendix 11) The semiconductor laminate is a first semiconductor layer of a first conductivity type; a plurality of active layers; a plurality of second semiconductor layers of a second conductivity type; and the first semiconductor layer, the plurality of active layers, and the plurality of second semiconductor layers are arranged in this order; the first electrode portion is connected to the first semiconductor layer, 11. The light-emitting module according to claim 10, wherein the plurality of second electrode portions are connected to the plurality of second semiconductor layers.

[0080] (Appendix 12) 12. The light-emitting module according to claim 10, wherein four second electrode portions are provided and arranged along a first direction and a second direction intersecting the first direction.

[0081] (Appendix 13) An optical module described in any one of Appendices 10 to 12, wherein at least one of the first joint and the second joint has a step on a side extending in a third direction from the first surface toward the second surface.

[0082] (Appendix 14) 14. The light-emitting module according to claim 10, wherein the amount of protrusion of the insulating portion relative to the first electrode portion in a third direction from the first surface toward the second surface is 0.5 μm or more and 2.0 μm or less.

[0083] (Appendix 15) the light-emitting element has a lower surface including the first surface, an upper surface disposed on the opposite side of the lower surface, and a side surface disposed between the lower surface and the upper surface, 15. The light-emitting module according to claim 10, further comprising a light-shielding portion that covers the bottom surface and the side surface of the light-emitting element. [Industrial Applicability]

[0084] The present invention can be used, for example, as a light source for an automobile headlight. [Explanation of symbols]

[0085] 1 Light-emitting module 10 Light-emitting element 11 First electrode part 12 Second electrode part 13 Insulation section 13a Part 1 13b Part 2 14 First Contact 15 Second Contact 16. Insulating film 17 Translucent material 20 Semiconductor laminate 21 First semiconductor layer 22 Second semiconductor layer 23 Active layer 26 Page 1 27 Top 28 Side 30 Intermediates 31 First conductive part 32 Second conductive part 33 Holding part 33s trunk part 33a 1st branch part 33b 2nd branch part 35 Wiring board 36 2nd page 37 areas 41 1st joint 42 Second joint 43 Side 44 steps 50 Light blocking section 101 Electroplating solution 110 Light-emitting element W1 Width of insulating part 13 W2 Width of the holding portion 33 h Protrusion amount

Claims

1. a step of preparing a light-emitting element including: a semiconductor laminate having a first surface; a first electrode portion disposed on the first surface; a plurality of second electrode portions disposed on the first surface and spaced apart from the first electrode portion; and insulating portions disposed on the first surface between the first electrode portion and the plurality of second electrode portions and at least in part between the plurality of second electrode portions, the insulating portions protruding in a direction away from the first surface beyond the first electrode portion and the plurality of second electrode portions; a step of preparing an intermediate body including a wiring substrate having a second surface, a first conductive portion disposed on the second surface, a plurality of second conductive portions disposed on the second surface at a distance from the first conductive portion, and a holding portion disposed at least partially between the first conductive portion and the plurality of second conductive portions and between the plurality of second conductive portions on the second surface; placing the light emitting element on the intermediate body by bringing the insulating portion into contact with the holding portion; forming a first joint portion in contact with the first electrode portion and the first conductive portion, and forming a second joint portion in contact with the second electrode portion and the second conductive portion; A method for manufacturing a light emitting module comprising:

2. the semiconductor laminate includes a first semiconductor layer of a first conductivity type, a plurality of active layers, and a plurality of second semiconductor layers of a second conductivity type, the first semiconductor layer, the plurality of active layers, and the plurality of second semiconductor layers being arranged in this order; the first electrode portion is connected to the first semiconductor layer, The method for manufacturing a light emitting module according to claim 1 , wherein the plurality of second electrode portions are connected to the plurality of second semiconductor layers.

3. The method for manufacturing a light-emitting module according to claim 1 , wherein four second electrode portions are provided and are arranged along a first direction and a second direction intersecting the first direction.

4. The insulating portion is a first portion extending in the second direction; a second portion extending in the first direction; and The holding portion is a first branch portion extending in the second direction; a second branch portion extending in the first direction; and The method for manufacturing a light-emitting module according to claim 3 , wherein in the step of arranging the light-emitting element on the intermediate body, the first portion contacts the first branch portion and the second portion contacts the second branch portion.

5. The insulating portion is the first electrode portion is not disposed between the first electrode portion and both edge portions of the light emitting element in the first direction, The method for manufacturing a light-emitting module according to claim 3 , wherein the second electrode portion is not disposed between the second electrode portion and an edge of the light-emitting element on one side in the first direction.

6. 3 . The method for manufacturing a light-emitting module according to claim 1 , wherein the amount of protrusion of the insulating portion relative to the first electrode portion in a third direction from the first surface toward the second surface is 0.5 μm or more and 2.0 μm or less.

7. 3. The method for manufacturing a light-emitting module according to claim 1, wherein in the step of arranging the light-emitting element on the intermediate body, a width of the insulating portion in one cross section is smaller than a width of the holding portion.

8. the light-emitting element has a lower surface including the first surface, an upper surface disposed on the opposite side of the lower surface, and a side surface disposed between the lower surface and the upper surface, removing the holding portion after the step of forming the first bonding portion and the second bonding portion; forming a light-shielding portion that covers the bottom surface and the side surface of the light-emitting element after the step of removing the holding portion; The method for manufacturing a light-emitting module according to claim 1 or 2, further comprising:

9. The method for manufacturing a light-emitting module according to claim 1 , wherein the first bonding portion and the second bonding portion are formed by electrolytic plating.

10. a light emitting element including: a semiconductor laminate having a first surface; a first electrode portion disposed on the first surface; a plurality of second electrode portions disposed on the first surface and spaced apart from the first electrode portion; and an insulating portion disposed on the first surface between the first electrode portion and the plurality of second electrode portions and at least partially between the plurality of second electrode portions, the insulating portion protruding in a direction away from the first surface beyond the first electrode portion and the plurality of second electrode portions; a wiring substrate having a second surface; a first conductive portion disposed on the second surface; a plurality of second conductive portions disposed on the second surface and spaced apart from the first conductive portions; a first bonding portion in contact with the first conductive portion and an entire surface of the first electrode portion facing the second surface; a second bonding portion in contact with the second conductive portion and the entire surface of the second electrode portion facing the second surface; A light emitting module comprising:

11. The semiconductor laminate is a first semiconductor layer of a first conductivity type; a plurality of active layers; a plurality of second semiconductor layers of a second conductivity type; and the first semiconductor layer, the plurality of active layers, and the plurality of second semiconductor layers are arranged in this order; the first electrode portion is connected to the first semiconductor layer, The light emitting module according to claim 10 , wherein the second electrode portions are connected to the second semiconductor layers.

12. The light emitting module according to claim 10 , wherein four second electrode portions are provided and are arranged along a first direction and a second direction intersecting the first direction.

13. The light emitting module according to claim 10 , wherein at least one of the first joint portion and the second joint portion has a step on a side surface extending in a third direction from the first surface toward the second surface.

14. The light emitting module according to claim 10 , wherein the amount of protrusion of the insulating portion relative to the first electrode portion in a third direction from the first surface toward the second surface is not less than 0.5 μm and not more than 2.0 μm.

15. the light-emitting element has a lower surface including the first surface, an upper surface disposed on the opposite side of the lower surface, and a side surface disposed between the lower surface and the upper surface, The light-emitting module according to claim 10 , further comprising a light-shielding portion that covers the bottom surface and the side surface of the light-emitting element.

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