Ethylene-α-olefin copolymer and resin composition containing same

JP2026044334APending Publication Date: 2026-03-12TOSOH CORP
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-30
Publication Date
2026-03-12

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Abstract

The present invention provides a novel ethylene-α-olefin copolymer, which can be added to general-purpose resins to improve the mechanical strength of molded articles and can be kneaded without impairing the appearance, and is therefore expected to lead to thinner molded articles and longer life for molded articles, as well as a resin composition containing the copolymer. SOLUTION: An ethylene-α-olefin copolymer that satisfies the following properties (1) and (2): (1): HLMFR is 0.01 to 50 g / 10 min. (2) The dissolution curve is bimodal, and when the dissolution curve is divided into two peaks with normal distributions, the following (2-1) to (2-3) are satisfied. (2-1): The Mw of the high molecular weight peak is 900,000 to 5,000,000, and the Mw / Mn is 2.0 to 5.0. (2-2): The Mw of the low molecular weight peak is 10,000 to 500,000, and the Mw / Mn is 2.0 to 5.0. (2-3): The weight ratio of the high molecular weight peak to the weight ratio of the low molecular weight peak (wt %) is greater than 5 / 95 and smaller than 50 / 50.
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Citation Information

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