Camera module

JP2026044355APending Publication Date: 2026-03-12MITSUMI ELECTRIC CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-08-30
Publication Date
2026-03-12

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  • Figure 2026044355000001_ABST
    Figure 2026044355000001_ABST
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Abstract

To provide a camera module having excellent heat dissipation properties. [Solution] The camera module 1 comprises a lens assembly 2, an image sensor 3 located on the imaging side of the lens assembly 2 in the optical axis direction and receiving light entering from the lens assembly 2, a first board 41 located on the imaging side of the image sensor 3 in the optical axis direction and with the image sensor 3 mounted on its front surface, a second board 42 having a processing circuit 420 for processing the output signal of the image sensor 3, a flexible wiring section 43 that electrically connects the first board 41 and the second board 42 and is flexible, a heat sink 5 mounted on the imaging side of the first board 41 in the optical axis direction, and a cover 6 that is connected to the heat sink 5 and has a lower cover 61 which is a heat dissipation section that dissipates heat from the image sensor 3 transmitted through the heat sink 5, and that houses the image sensor 3, the first board 41, the second board 42, the flexible wiring section 43 and the heat sink 5.
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Citation Information

Patent Citations

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