Photoelectric conversion module

Abstract

This invention provides a photoelectric conversion module that can prevent performance degradation caused by the effects of oxygen and moisture during the busbar connection process. [Solution] The photoelectric conversion module 10 includes a first sealing portion 29 that seals the inside of the upper and lower electrode busbars 25 and 27, which include the photoelectric conversion element 12, and second sealing portions 32a and 32b that seal the region including the upper and lower electrode busbars 25 and 27.

Description

Technical Field

[0001] The present disclosure relates to a photoelectric conversion module.

Background Art

[0002] In recent years, photoelectric conversion modules using perovskite compounds have been studied from the perspective of higher efficiency. Such a photoelectric conversion module is disclosed in, for example, WO2023 / 132136A1 (Patent Document 1). FIG. 8 is a diagram showing the photoelectric conversion module 100 disclosed in Patent Document 1. Referring to FIG. 8, the photoelectric conversion module 100 includes a substrate 111, a photoelectric conversion element 110 formed on the substrate 111, and a sealing member (not shown). The photoelectric conversion element 110 is sealed by the substrate 111 and a sealing member (not shown). The sealing member includes a first sealing portion made of a first sealing material. The first sealing material includes at least one selected from the group consisting of polyvinyl alcohol, ethylene-vinyl alcohol copolymer, and butanediol-vinyl alcohol copolymer.

[0003] The photoelectric conversion element 110 includes a first electrode 121 formed on the substrate 111, an electron transport layer 122 formed on the first electrode 121, a photoelectric conversion layer 123 formed on the electron transport layer 122, a hole transport layer 124 formed on the photoelectric conversion layer 123, and a second electrode 125 formed on the hole transport layer 124. The photoelectric conversion element 110 may contain a perovskite compound.

[0004] A terminal 113 is provided at the left end of the electron transport layer 122, and a lead 115 connected to the first electrode 121 is provided via the terminal 113. The second electrode 125 has a portion formed on the substrate 111 along the right end of the photoelectric conversion layer 123 at the right end, and is connected to a lead 116 via a terminal 114 formed at the right end thereof.

[0005] Here, the photoelectric conversion module 100 includes a portion that includes a photoelectric conversion element 110, a lead 115 formed to the left of a terminal 113 formed on its left side, and a portion that includes a lead 116 formed to the right of a terminal 114 formed on the right side of the photoelectric conversion element 110. [Prior art documents] [Patent Documents]

[0006] [Patent Document 1] WO2023 / 132136A1 [Overview of the project] [Problems that the invention aims to solve]

[0007] In conventional photoelectric conversion modules 100, terminals 113 and 114 and the photoelectric conversion element 110 are sealed with a sealing material (not shown). Therefore, sealing is performed after connecting leads 115 and 116 as busbars (busbars are also called lead wires or leads, and in this disclosure, busbars include lead wires or leads). In such conventional structures, the photoelectric conversion element 110 is exposed when the busbars are connected, and it is necessary to perform the busbar connection in a low-humidity controlled environment to prevent the effects of oxygen and moisture. However, busbar connection in such an environment is not easy.

[0008] This disclosure is made to resolve the above-mentioned problems and aims to provide a photoelectric conversion module and a method for manufacturing the same that can suppress the effects of moisture and oxygen on the photoelectric conversion element during the busbar connection process and mitigate the working environment. [Means for solving the problem]

[0009] The photoelectric conversion module according to this disclosure comprises a first busbar and a second busbar, which are a pair of busbars spaced apart from each other so as to include at least a portion of a photoelectric conversion element between them; a first sealing portion that seals at least a portion of the photoelectric conversion element between the first busbar and the second busbar; and a second sealing portion that seals the regions including the regions of the first busbar and the second busbar, respectively.

[0010] Preferably, the first sealing portion includes an adhesive sealing material, and the second sealing portion includes a high water vapor barrier sealing material.

[0011] The photoelectric conversion element includes an upper electrode and a lower electrode, the lower electrode having one side and the other side, the lower electrode being connected from one side to one side of the busbar, and the upper electrode being connected from the other side of the lower electrode to the other side of the busbar.

[0012] A third sealing portion with high water vapor barrier properties may be provided above the first sealing portion.

[0013] A fourth sealing portion with high water vapor barrier properties may be provided on the outside or above the first sealing portion.

[0014] The second sealing portion may be configured to cover the outside and top of the first sealing portion.

[0015] In other aspects of this disclosure, a method for manufacturing a photoelectric conversion module includes a first sealing step of sealing inside the busbars, a step of connecting the busbars, and a second sealing step of sealing the busbars. [Effects of the Invention]

[0016] According to this disclosure, by sealing the photoelectric conversion element inside the busbar before connecting the busbar, it is possible to provide a photoelectric conversion module that suppresses the effects of moisture and oxygen on the photoelectric conversion element during the busbar connection process and also mitigates the working environment.

[0017] The above objects, other objects, features, and advantages of the present disclosure will become more apparent from the following detailed description of the embodiments made with reference to the drawings.

Brief Description of the Drawings

[0018] [Figure 1] It is a cross-sectional view showing a photoelectric conversion module including a photoelectric conversion element according to an embodiment of the present disclosure, an upper electrode lead wiring from the upper electrode of the photoelectric conversion element, and a lower electrode lead wiring from the lower electrode. [Figure 2] It is a diagram showing a cross-sectional configuration of a photoelectric conversion element for explaining a method of manufacturing a planar-structured photoelectric conversion element. [Figure 3] It is a diagram showing a cross-sectional configuration of a photoelectric conversion element for explaining a method of manufacturing a photoelectric conversion element having an MPLE structure. [Figure 4] It is a cross-sectional view of a photoelectric conversion module showing a sealing structure with a photoelectric conversion element schematically. [Figure 5] It is a diagram showing a sealing structure of a second embodiment of the photoelectric conversion module. [Figure 6] It is a diagram showing a sealing structure of a third embodiment of the photoelectric conversion module. [Figure 7] It is a diagram showing a sealing structure of a fourth embodiment of the photoelectric conversion module. [Figure 8] It is a diagram showing a photoelectric conversion element disclosed in Patent Document 1.

Embodiments for Carrying Out the Invention

[0019] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. Figure 1 is a cross-sectional view showing a photoelectric conversion module 10 including a photoelectric conversion element 12 according to an embodiment of the present disclosure, an upper electrode lead wiring (busbar) 27 from the upper electrode 18 of the photoelectric conversion element 12, and a lower electrode lead wiring (busbar) 25 from the lower electrode 13. Referring to Figure 1, the photoelectric conversion element 12 includes a substrate 11, a lower electrode 13 formed on a part of the substrate 11, an electron transport layer 14 formed in the central part of the lower electrode 13, a perovskite film 15 formed on the electron transport layer 14, a hole transport layer 17 formed on the perovskite film 15, and an upper electrode 18 formed on the hole transport layer 17.

[0020] A first scribe 20 is provided at the right end of the perovskite film 15 formed on the lower electrode 13 via an electron transport layer 14, and a second scribe 21 is provided to the right of the first scribe 20 with a gap between them. The perovskite film 15 extending into and inserted on the first scribe 20 separates and insulates the upper electrode 18 and the lower electrode 13, and the upper electrode 18 extending into and inserted on the second scribe 21 connects the upper electrode 18 to the right end of the lower electrode 13. Similarly, in the case of a photoelectric conversion module in which the same photoelectric conversion elements are provided adjacent to each other and connected in series, the upper electrode 18 extending into and inserted on the second scribe 21 connects the upper electrode 18 to the lower electrode 13 extending from the element to its right. Although this disclosure does not illustrate structures in which the same photoelectric conversion elements are arranged adjacently, even in the case of a photoelectric conversion module consisting of adjacent and continuous photoelectric conversion elements as described above, it can be understood by considering that the photoelectric conversion elements at the left and right ends of the photoelectric conversion module are described as a single photoelectric conversion element.

[0021] On the lower electrode 13, a terminal 23a is provided on one side of the perovskite film 15 (left side in Figure 1), spaced apart from the perovskite film 15, and the lower electrode busbar 25 is connected via terminal 23a. On the other side of the perovskite film 15 (right side in Figure 1), a terminal 23b is provided, spaced apart from the perovskite film 15, and the upper electrode busbar 27 is connected via terminal 23b.

[0022] The lower electrode busbar 25 is sealed by the second sealing portion 32a, and the upper electrode busbar 27 is sealed by the second sealing portion 32b. A mating base material 30 is formed on top of the second sealing portion 32a and the second sealing portion 32b, and the photoelectric conversion element 12 is sealed.

[0023] In Figure 1, the area enclosed by the arrow is sealed by the first sealing portion 29. Specifically, the left end of the area sealed by the first sealing portion 29 is located to the left of the perovskite film 15 and to the right of the lower electrode busbar 25, and the right end of the area sealed by the first sealing portion 29 is located to the right of the perovskite film 15 and the second scribe 21 and to the left of the upper electrode busbar 27. In other words, the area to the left of the perovskite film 15 and beyond the lower electrode busbar 25, and to the right of the perovskite film 15 and the second scribe 21 and beyond the upper electrode busbar 27, is the lower part of the bonded substrate 30 that is sealed by the first sealing portion 29.

[0024] Here, "sealed by the sealing portion 29" means, for example, in this embodiment, that the photoelectric conversion element's substrate 11 is sealed by the sealing portion 29. In other words, it is not explained that "sealed by the sealing member" can be used to describe a situation where sealing is completed solely by the sealing member, but rather that it can be described as "sealed by the sealing member" even when sealing is completed by other members and the sealing member.

[0025] However, in this embodiment, it is acceptable to understand that the transparent electrodes that protrude from the first sealing portion 29 (including the electron transport layer and other components that protrude) are not included in the sealed portion.

[0026] Furthermore, in the photoelectric conversion module 10 of this disclosure, the lower electrode 13 is led out as a lower electrode busbar 25 via a terminal 23a provided at the left end of the lower electrode 13, and the upper electrode 18 is connected to the right side of the lower electrode 13 separated by the first scribe 20 using a second scribe 21, and is led out as an upper electrode busbar 27 via a terminal 23b provided at the right end of the lower electrode 13 on the right side separated by the first scribe 20. In other words, only the lower electrode 13 is connected to the upper and lower electrode busbars 25 and 27 and sealed by the second sealing portions 32a and 32b. That is, the photoelectric conversion element includes an upper electrode and a lower electrode, the lower electrode has one side and the other side, the lower electrode is connected from one side of the lower electrode to one side of the busbar, and the upper electrode is connected from the other side of the lower electrode to the other side of the busbar.

[0027] In the conventional structure shown in Figure 8, if the first sealing portion as shown in the present invention is provided, the first sealing portion will be formed inside the terminal 114. In this case, a part of the second electrode 125 will not be covered by the first sealing material and will protrude from the first sealing portion. In this state, there is a possibility that moisture and oxygen may enter from the interface between the second electrode 125 and the substrate 111. On the other hand, the structure of the present invention has a high effect in suppressing the intrusion of moisture and oxygen, and can obtain higher sealing performance.

[0028] Next, the manufacturing method of the photoelectric conversion element 12 will be described. Figure 2 is a diagram showing the cross-sectional configuration of the photoelectric conversion element 12a for illustrating the manufacturing method of the Planar (planar multilayer) structure photoelectric conversion element 12a. First, the manufacturing method of the Planar structure photoelectric conversion element 12a will be described. Referring to Figure 2, an infrared (IR) laser is irradiated onto the ITO (indium tin oxide) coated glass substrate 11a to form first and second scribes 20 and 21 that electrically insulate the transparent conductive film that will become the lower electrode 13.

[0029] An electron transport layer 14 is formed on the ITO film of the lower electrode 13 by spin coating, and a perovskite film 15 is formed on the electron transport layer 14. Next, a hole transport layer 17 is formed on the perovskite film 15, and a gold deposited film is formed on the hole transport layer 17 by vacuum deposition to form the upper electrode 18.

[0030] Next, a method for manufacturing the MPLE (Multi-Porous Layered Electrode) structure photoelectric element 12b will be described. Figure 3 is a diagram showing the cross-sectional configuration of the photoelectric element 12b for illustrating the manufacturing method of the MPLE structure photoelectric element 12b. Referring to Figure 3, an infrared (IR) laser is irradiated onto the FTO (fluorine-doped tin oxide) coated glass substrate 11b to form first and second scribes 20 and 21 that electrically insulate the transparent conductive film that will become the lower electrode 13. An electron transport layer 14 (for example, a dense TiO2 layer and a porous TiO2 layer thereon) is formed on the FTO film of the lower electrode 13 by screen printing. A mesoporous insulating layer ZrO2 is formed on the electron transport layer 14 by screen printing, and a hole transport layer 17 is formed on the mesoporous insulating layer ZrO2 by screen printing. A carbon electrode that will become the upper electrode 18 is formed on the hole transport layer 17 by screen printing using printing carbon paste. A perovskite precursor solution 16 is dropped onto a region where there are no carbon electrodes and the porous insulating layer ZrO2 is exposed, forming a perovskite film 15 that will serve as a light-absorbing layer.

[0031] In this disclosure, "dense material" is also referred to as "dense," "compact," or "compact quality," and refers to the same thing, meaning the following: A dense material is one in which, in cross-sectional observation, there are no light-absorbing regions (in this embodiment, a perovskite compound, and hereinafter described as a perovsky compound) on one side in the thickness direction of the dense material (for example, the lower side). In other words, even if there is a perovskite compound on the upper side of the dense material, it is possible to prevent it from penetrating through to the lower side of the dense material. Preferably, the dense material has extremely small voids. Preferably, the dense material has a maximum void width of less than 5 nm. Even more preferably, the dense material is one in which the perovskite compound cannot be contained in the voids, or in which there are no regions in which the perovskite compound exists continuously throughout the thickness of the dense material. That is, the dense material is one in which, as can be seen by SEM and EDX observation, there are no regions in which the perovsky compound penetrates through the layer thickness. In this disclosure, unless otherwise specified, SEM observation is sufficient if it is observed and confirmed in a 400 nm wide cross-sectional SEM (or EDX) image. For example, if a single 400 nm wide cross-sectional SEM or EDX observation shows no areas where the perovskite compound penetrates the layer thickness, then that layer can be considered dense.

[0032] Furthermore, in this disclosure, "porous" is also called "porous" or "mesoporous," and refers to the same thing, meaning the following: Porous means a material that can contain perovskite compounds in its voids. However, porous is not limited to a material that can contain perovskite compounds in its voids; it may also contain other materials with photoelectric conversion capabilities in its voids. Furthermore, in this disclosure, unless otherwise contradictory, "voids of a certain member" means "a region in which a certain member is generally distributed dispersed or continuous, where a certain member is absent."

[0033] [First Embodiment] Next, a photoelectric conversion module 10 having a sealing structure including busbars from the upper and lower electrodes of the photoelectric conversion elements 12a and 12b will be described, with the photoelectric conversion elements 12a and 12b shown in Figures 2 and 3 as schematic diagrams. Figure 4 is a cross-sectional view of a photoelectric conversion module 10a showing a sealing structure with the photoelectric conversion elements 12a and 12b as schematic diagrams. Hereafter, it will be described as the photoelectric conversion element 12. Referring to Figure 4, the photoelectric conversion module 10a includes a first sealing portion 29 that seals the inside of a pair of upper and lower electrode busbars 25 and 27 that are spaced apart from each other to include the photoelectric conversion element 12, and second sealing portions 32a and 32b that seal the region including the pair of upper and lower electrode busbars 25 and 27.

[0034] Referring to Figure 4, in the photoelectric conversion module 10a, the thickness of the first sealing portion 29 is greater than that of the busbars 25 and 27, and it is formed to cover the photoelectric conversion element 12 inside the upper and lower electrode busbars 25 and 27, with the sides and top being sealed by the second sealing portions 32a and 32b and the bonding substrate 30. By using an adhesive sealing material (for example, a pressure-sensitive water vapor barrier sheet is preferred) or a pressure-sensitive sealing material (which can expel internal air simply by pressing it; for example, a water vapor barrier pressure-sensitive sealing material is preferred) as the first sealing portion 29, the influence on the characteristics of the photoelectric conversion element 12 during sealing can be suppressed compared to a thermosetting sealing material. Furthermore, the second sealing portions 32a and 32b may contain a high water vapor barrier sealing material, or preferably a high water vapor barrier pressure-sensitive sealing material. The first sealing material 29 has a water vapor transmission rate of 10 g / m³. 2 From / day 2g / m³ 2 A water vapor transmission rate of 2 g / m³ is preferable. 2 A value lower than approximately / day is even preferable. Note that "approximately" refers to the range of manufacturing tolerance, and it is preferable to allow for a variation of plus 15% and minus 15% of that value.

[0035] Furthermore, the first sealing portion 29 is not limited to an adhesive sealing material or a pressure-sensitive sealing material.

[0036] Next, the manufacturing method of the photoelectric conversion module 10a shown in Figure 4 will be described. After manufacturing the photoelectric conversion elements 12a and 12b as shown in Figures 2 and 3, the encapsulation structure of the photoelectric conversion module 10a shown in Figure 4 is constructed.

[0037] As shown in Figures 2 and 3, a photoelectric conversion element 12 with a Planar structure or MPLE structure is fabricated on a glass substrate 11b with an FTO. Specifically, a first sealing portion 29 is formed by pressing a first sealing material (pressure-sensitive sealing material) with a roller so as to cover the photoelectric conversion element 12 inside the terminals 23a and 23b. Pressure sealing using a laminator is also possible. Upper and lower electrode busbars 25 and 27 are connected to the terminals 23a and 23b using conductive paste and then heat-cured.

[0038] The first sealing portion 29 is formed so as to cover the photoelectric conversion elements 12a and 12b, that is, inside the terminals 23a and 23b. It was formed by pressure sealing using a laminator. After that, the upper and lower electrode busbars 25 and 27 were connected to the terminals 23a and 23b. The busbars 25 and 27 were connected by heat curing with conductive adhesive, but connections using ultrasonic soldering or other methods may also be used.

[0039] The second sealing portions 32a and 32b were placed outside the first sealing portion 29 (the area including terminals 23a and 23b), and a laminated glass substrate which will become the base material 30 was placed on the upper surface. The product was then formed by pressing under vacuum at 0.1 MPa and heat curing.

[0040] The photoelectric conversion module 10a having the sealing structure according to this disclosure has the following advantages: By sealing the inside of terminals 23a and 23b (only the area including the photoelectric conversion element 12) first, external factors to the photoelectric conversion element 12 when the upper and lower electrode busbars 25 and 27 are connected are prevented. By using a pressure-sensitive sealing material in the first sealing portion 29, a temperature rise during sealing is prevented.

[0041] This suppresses the influence on the characteristics of the photoelectric conversion element 12 during sealing. Because the photoelectric conversion element 12 is sealed, the working environment can be made more comfortable after the connection of the upper and lower electrode busbars 25 and 27, and the thermal effects on the photoelectric conversion element 12 can be mitigated when the upper and lower electrode busbars 25 and 27 are connected using conductive adhesive. As a manufacturing method for the second sealing portion 32, sealing can be controlled by filling using a dispenser.

[0042] Because the photoelectric conversion element 12 is sealed, when sealing is performed by filling using a dispenser, the second sealing material is stopped by the side surface of the first sealing portion 29, preventing it from flowing towards the photoelectric conversion element 12. Also, because the second sealing material is stopped by the side surface of the first sealing portion 29, the width of the second sealing material is controlled to be uniform, so that stable second sealing portions 32a and 32b can be formed. Furthermore, since the second sealing material penetrates and fills the lower regions of the busbars 25 and 27 during filling, improved sealing performance is also possible.

[0043] As a result, the second sealing portions 32a and 32b do not affect the photoelectric conversion element 12 during the filling of the sealing material. The filling area is controlled by the first sealing portion 29. In other words, the filling of the second sealing portions 32a and 32b into the lower regions of the upper and lower electrode busbars 25 and 27 becomes easier.

[0044] The second sealing portions 32a and 32b should preferably have a lower water vapor transmission rate than the first sealing portion 29. In other words, it is desirable that they have high water vapor barrier properties.

[0045] [Second Embodiment] Next, other sealing structures for the photoelectric conversion module 10 will be described. Figure 5 shows a sealing structure of a second embodiment of the photoelectric conversion module 10. Referring to Figure 5, the photoelectric conversion module 10b of the second embodiment includes a third sealing portion 33 with high water vapor barrier properties provided above the first sealing portion 29. Here, the first sealing portion 29 only needs to have a thickness that covers the photoelectric conversion element 12, and may be thinner than the upper and lower electrode busbars 25, 27.

[0046] The third sealing portion 33 is placed on the upper surface of the first sealing portion 29 with a width equal to that of the first sealing portion, and the total thickness of the third sealing portion 33 and the first sealing portion 29 is the same as the thickness of the second sealing portions 32a and 32b. The third sealing portion 33 may be made of a thermosetting sealant or a material such as glass.

[0047] Next, the manufacturing method of the photoelectric conversion module 10b shown in Figure 5 will be described. Referring to Figure 5, a photoelectric conversion element 12 with a Planar structure or MPLE structure is fabricated on a glass substrate 11b with an FTO. A first sealing portion 29 is formed by pressing a first sealing material (pressure-sensitive sealing material) with a roller so as to cover the photoelectric conversion element 12 inside terminals 23a and 23b. Pressure sealing using a laminator is also possible. Upper and lower electrode busbars 25 and 27 are connected to terminals 23a and 23b using conductive paste and then heat-cured.

[0048] The first sealing portion 29 is formed so as to cover the photoelectric conversion elements 12a and 12b, that is, inside the terminals 23a and 23b. It was formed by pressure sealing using a laminator. After that, the upper and lower electrode busbars 25 and 27 were connected to the terminals 23a and 23b. The busbars 25 and 27 were connected by heat curing with conductive adhesive, but connections using ultrasonic soldering or other methods may also be used.

[0049] Upper and lower electrode busbars 25 and 27 are connected to terminals 23a and 23b using conductive paste and then heat-cured. A third sealing portion 33 of the same size as the first sealing portion 29 is placed on the upper surface of the first sealing portion 29, and a second sealing material that forms the second sealing portions 32a and 32b is placed outside the first sealing portion 29 (the area including terminals 23a and 23b). A laminated glass substrate which will become the base material 30 is placed on the upper surface, and then the product is formed by pressing under vacuum at 0.1 MPa and heat-curing.

[0050] [Third Embodiment] Next, another sealing structure for the photoelectric conversion module 10 will be described. Figure 6 shows the sealing structure of a third embodiment of the photoelectric conversion module 10. Referring to Figure 6, the sealing structure of the photoelectric conversion module 10c of the third embodiment includes a high water vapor barrier fourth sealing portion 34 provided on the outside or above the first sealing portion 29. Here, the first sealing portion 29 only needs to have a thickness that covers the photoelectric conversion element 12, and may be thinner than the upper and lower electrode busbars 25, 27.

[0051] The fourth sealing portion 34 covers the upper surface and lower electrode 13, terminals 23a, 23b, and a portion of the upper and lower electrode busbars 25, 27 of the first sealing portion 29, and is positioned and sealed so that its total thickness with the first sealing portion 29 is the same as the thickness of the second sealing portions 32a, 32b. A thermosetting sealing material is used for the fourth sealing portion 34.

[0052] Next, the manufacturing method of the photoelectric conversion module 10c shown in Figure 6 will be described. First, a photoelectric conversion element 12 with a Planar structure or MPLE structure is fabricated on a glass substrate 11b with an FTO. A first sealing portion 29 is formed by pressing a first sealing material (pressure-sensitive sealing material) with a roller so as to cover the photoelectric conversion element 12 inside the terminals 23a and 23b. Pressure sealing using a laminator is also possible. Upper and lower electrode busbars 25 and 27 are connected to the terminals 23a and 23b using conductive paste and then heat-cured.

[0053] The first sealing portion 29 is formed so as to cover the photoelectric conversion elements 12a and 12b, that is, inside the terminals 23a and 23b. It was formed by pressure sealing using a laminator. After that, the upper and lower electrode busbars 25 and 27 were connected to the terminals 23a and 23b. The busbars 25 and 27 were connected by heat curing with conductive adhesive, but connections using ultrasonic soldering or other methods may also be used.

[0054] The upper and lower electrode busbars 25 and 27 are connected to terminals 23a and 23b using conductive paste and then heat-cured. The fourth sealing portion 34 is positioned to cover the first sealing portion 29 and terminals 23a and 23b, and the second sealing portions 32a and 32b are positioned outside the fourth sealing portion 34. A laminated glass substrate, which will become the base material 30, is placed on the top surface, and then the product is formed by pressing under vacuum at 0.1 MPa and heat-curing.

[0055] [Fourth Embodiment] Next, another sealing structure of the photoelectric conversion module 10 will be described. Figure 7 shows the sealing structure of the fourth embodiment of the photoelectric conversion module 10. Referring to Figure 7, in the sealing structure of the photoelectric conversion module 10d of the fourth embodiment, the second sealing portion 32c covers the outside and top of the first sealing portion 29. Here, the first sealing portion 29 only needs to have a thickness that covers the photoelectric conversion element 12, and may be thinner than the upper and lower electrode busbars 25, 27. The second sealing portion 32c is formed to cover the first sealing portion 29, the lower electrode 13, terminals 23a, 23b, and the upper and lower electrode busbars 25, 27.

[0056] Next, the manufacturing method of the photoelectric conversion module 10d shown in Figure 7 will be described. A photoelectric conversion element 12 with a Planar structure or MPLE structure is fabricated on a glass substrate 11b with FTO. A first sealing portion 29 is formed by pressing a first sealing material (pressure-sensitive sealing material) with a roller so as to cover the photoelectric conversion element 12 inside terminals 23a and 23b. Pressure sealing using a laminator is also possible. Upper and lower electrode busbars 25 and 27 are connected to terminals 23a and 23b using conductive paste and then heat-cured.

[0057] The first sealing portion 29 is formed so as to cover the photoelectric conversion elements 12a and 12b, that is, inside the terminals 23a and 23b. It was formed by pressure sealing using a laminator. After that, the upper and lower electrode busbars 25 and 27 were connected to the terminals 23a and 23b. The busbars 25 and 27 were connected by heat curing with conductive adhesive, but connections using ultrasonic soldering or other methods may also be used.

[0058] The upper and lower electrode busbars 25 and 27 are connected to terminals 23a and 23b using conductive paste and then heat-cured. The second sealing portion 32c is positioned to cover the upper surface of the first sealing portion 29 and the entire substrate 11 including terminals 23a and 23b. A laminated glass substrate, which will become the base material 30, is then placed on the upper surface, and the product is formed by pressing under vacuum at 0.1 MPa and heat-curing.

[0059] In this disclosure, a busbar means an electrode connected to the upper or lower electrode in a structure laminated with the light-absorbing layer of a photoelectric conversion element. A busbar has the function of drawing power generated by the photoelectric conversion element to the outside. However, any component can be considered a busbar as long as it has at least the configuration of an electrode as defined above.

[0060] Furthermore, it is preferable that the busbar is connected to at least two of the upper or lower electrodes of the photoelectric conversion element, so that power can be drawn from multiple photoelectric conversion elements. It is also desirable that the busbar has a portion extending along at least one side of the rectangle formed by the photoelectric conversion module, so that power can be drawn from the photoelectric conversion module. Additionally, it is preferable that the busbar has a length corresponding to at least one side of the rectangle formed by the photoelectric conversion module, so that power can be drawn from multiple photoelectric conversion modules.

[0061] This disclosure can be implemented in various other forms without departing from its spirit or main features. Therefore, the embodiments described above are illustrative and should not be constrained. Any modifications or changes within the equivalent scope of the claims of this disclosure are within the scope of this disclosure. [Industrial applicability]

[0062] According to this disclosure, it is possible to suppress the effects of moisture and oxygen on the photoelectric conversion element during operation and to mitigate the working environment, making it useful as a photoelectric conversion module.

[0063] (Aspect 1) A first busbar and a second busbar are a pair of busbars spaced apart from each other so as to include at least a portion of a photoelectric conversion element between them, A first sealing portion that seals at least a portion of the photoelectric conversion element between the first busbar and the second busbar, A photoelectric conversion module having a second sealing portion that seals a region including the regions of the first busbar and the second busbar, respectively. (Aspect 2) The photoelectric conversion module according to embodiment 1, wherein the first sealing portion includes an adhesive sealing material, and the second sealing portion includes a high water vapor barrier sealing material. (Aspect 3) The aforementioned photoelectric conversion element includes an upper electrode and a lower electrode, The aforementioned lower electrode has one side and the other side. The lower electrode is connected from one side of the lower electrode to one side of the busbar. The photoelectric conversion module according to embodiment 1 or 2, wherein the upper electrode is connected from the other side of the lower electrode to the other side of the busbar. (Aspect 4) A photoelectric conversion module according to any one of embodiments 1 to 3, wherein a third sealing portion with high water vapor barrier properties is provided above the first sealing portion. (Aspect 5) A photoelectric conversion module according to any one of embodiments 1 to 4, wherein a fourth sealing portion with high water vapor barrier properties is provided on the outside or above the first sealing portion. (Aspect 6) The photoelectric conversion module according to any one of embodiments 1 to 5, wherein the second sealing portion covers the outside and top of the first sealing portion. (Aspect 7) A first sealing step involves sealing inside a pair of busbars that are spaced apart from each other so as to include a photoelectric conversion element between them, The process of connecting the busbars, A method for manufacturing a photoelectric conversion module, comprising a second sealing step of sealing a busbar. [Explanation of symbols]

[0064] 10, 10a, 10b, 10c, 10d Photoelectric Conversion Module 11 circuit boards 11a ITO-coated glass substrate 11b FTO-equipped glass substrate 12 Photoelectric conversion element 13 Lower electrode 14 Electron transport layer 15 Perovskite membrane 16 Perovskite precursor solution 17 Hole transport layer 18 Upper electrode 20 1st Scribe 21. Second Scribe 23a,23b terminal 25 Lower electrode lead-out wiring (busbar) 27 Upper electrode lead-out wiring (busbar) 29. First sealing section 30 Combined base material 32a, 32b, 32c 2nd sealing part 33 Third sealing section 34. Fourth sealing section

Claims

1. A first busbar and a second busbar are a pair of busbars spaced apart from each other so as to include at least a portion of a photoelectric conversion element between them, A first sealing portion that seals at least a portion of the photoelectric conversion element between the first busbar and the second busbar, A photoelectric conversion module having a second sealing portion that seals a region including the regions of the first busbar and the second busbar, respectively.

2. The photoelectric conversion module according to claim 1, wherein the first sealing portion includes an adhesive sealing material, and the second sealing portion includes a high water vapor barrier sealing material.

3. The aforementioned photoelectric conversion element includes an upper electrode and a lower electrode, The aforementioned lower electrode has one side and the other side. The lower electrode is connected from one side of the lower electrode to one side of the busbar. The photoelectric conversion module according to claim 1 or 2, wherein the upper electrode is connected from the other side of the lower electrode to the other side of the busbar.

4. The photoelectric conversion module according to claim 1 or 2, wherein a third sealing portion with high water vapor barrier properties is provided above the first sealing portion.

5. The photoelectric conversion module according to claim 1 or 2, wherein a fourth sealing portion with high water vapor barrier properties is provided on the outside or above the first sealing portion.

6. The photoelectric conversion module according to claim 1 or 2, wherein the second sealing portion covers the outside and top of the first sealing portion.

7. A first sealing step involves sealing inside a pair of busbars that are spaced apart from each other so as to include a photoelectric conversion element in between, The process of connecting the busbars, A method for manufacturing a photoelectric conversion module, comprising a second sealing step of sealing the busbars.

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