Film deposition apparatus, film deposition method, and method for manufacturing electronic devices
The film forming apparatus addresses non-uniform film thickness by using multiple sources with independent control and measurement, ensuring consistent thickness across substrates, enhancing panel quality and yield.
JP2026046838APending Publication Date: 2026-03-13CANON TOKKI CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2026-03-13
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Figure 2026046838000001_ABST
Abstract
The present invention provides a film deposition apparatus, a film deposition method, and a method for manufacturing electronic devices that can achieve a desired film thickness for the entire thin film formed on a substrate. [Solution] A film deposition apparatus comprising at least one evaporation source unit 203, which continuously forms thin films on multiple substrates S by injecting a film deposition material from a plurality of openings provided in the evaporation source unit 203, wherein the apparatus has a plurality of heaters for adjusting the injection amount of the film deposition material, and the amount of current supplied to each heater is individually controlled so that the injection amount of the film deposition material injected from the plurality of openings can be independently controlled, and the apparatus is further equipped with a film thickness measuring unit 310 for measuring the film thickness distribution of the thin films formed on the substrates S after film deposition by the evaporation source unit 203, and is characterized by performing feedback control or feedforward control based on the measurement results of the film thickness measuring unit 310.
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Citation Information
Patent Citations
Film deposition device, and electron device manufacturing method
JP2021161490A