Mounting device and mounting method

Abstract

To provide a mounting device that can mount multiple chip components onto a substrate simultaneously under mounting conditions suitable for each chip component. [Solution] A mounting apparatus 10 for mounting chip components 8 onto a substrate 7, comprising a bonding head 11 that irradiates a plurality of chip components 8 with a laser to mount these plurality of chip components 8 onto the substrate 7, wherein the bonding head 11 is configured to vary the laser beam profile so that regions with different irradiation intensities are formed within the laser irradiation area for the plurality of chip components 8 based on predetermined mounting conditions for each chip component 8.

Description

Technical Field

[0001] The present invention relates to a mounting device and a mounting method, and more particularly to a mounting device and a mounting method for mounting chip components on a substrate.

Background Art

[0002] As a mounting device for mounting chip components such as semiconductor chips on a substrate, a thermal compression bonding (TCB) device, a laser assisted bonding (LAB) device, etc. have been conventionally used.

[0003] FIG. 13 is a diagram showing a configuration example of a conventional thermal compression bonding device (see Patent Document 1). A mounting device 100 as a thermal compression bonding device includes a bonding unit 101, a bonding head 102 attached to the bonding unit 101, and a substrate stage 104 disposed opposite to the bonding head 102. An attachment tool 103 is provided at the lower end (tip) of the bonding head 102 via a heater not shown, and one chip component 106 is held on the lower surface of the attachment tool 103.

[0004] In the mounting apparatus 100, the chip component 106 is held by the attachment tool 103 of the bonding head 102 by a chip component transfer mechanism (not shown). Subsequently, the alignment marks (not shown) provided on the substrate 107 held on the substrate stage 104 and the alignment marks (not shown) provided on the chip component 106 are recognized by the image recognition means 105, and alignment is performed. After alignment, the chip component 106 held by the attachment tool 103 is heated by the heater, and the bonding unit 101 is driven to lower the bonding head 102 and press it against the substrate 107, thereby joining the electrodes (not shown) of the chip component 106 to the electrodes (not shown) of the substrate 107. Once the joining is complete, the bond head 102 releases its hold on the chip component 106, and the bond unit 101 is driven to raise the bonding head 102. Subsequently, the next chip component 106 to be installed is held in the attachment tool 103, and the aforementioned operation is repeated.

[0005] Figure 14 shows an example of the configuration of a conventional laser-assisted bonding apparatus (see Patent Document 2). The bonding apparatus 200, as a laser-assisted bonding apparatus, comprises a laser head 204 which serves as a bonding head for joining a semiconductor chip 201 to a substrate 202, a chip tray 220, and a table 222 on which a substrate mounting stage 221 is arranged. The substrate mounting stage 221 constitutes a bonding stage for performing bonding. The laser head 204 has a bonding tool 203 at its tip for adsorbing and holding a semiconductor chip 201, and is movable by a lifting mechanism 231 and a horizontal movement mechanism 232. A laser oscillator 214 and a control device 216 are connected to the laser head 204 via an optical fiber 209, and a focusing lens and other components (not shown) are arranged inside the laser head 204.

[0006] The bonding apparatus 200 moves the laser head 204 to the chip tray 220, which is the chip supply position, and uses the bonding tool 203 to adsorb and hold the semiconductor chip 201. Then, the bonding apparatus 200 moves the laser head 204 to the substrate mounting stage 221, which is the bonding position, and further lowers the laser head 204 to place the semiconductor chip 201 on the substrate 202. The semiconductor chip 201 is heated by laser irradiation and bonded to the substrate 202. After bonding is complete, the bonding apparatus 200 raises the laser head 204 and repeats the operation of returning to the chip supply position. [Problems the invention aims to solve]

[0007] In recent years, as semiconductor microfabrication technology has advanced, the frequency of defects during manufacturing has increased. As a result, the yield rate during manufacturing has decreased, and the manufacturing cost of semiconductor chips has tended to increase. Therefore, in order to improve manufacturing yield and reduce manufacturing costs, a technology called chiplet integration technology is attracting attention. This technology involves dividing large circuits that were previously integrated on a single chip into multiple chips, and then mounting these individual chips, or chiplets, onto a sub-substrate called an interposer to create a large-scale package that fits into a single package.

[0008] Figure 15 is a perspective view showing an example of a semiconductor (IC) package configuration using chiplet integration technology. IC package 1 is a two-dimensional (2xD) mounting package. A sub-sub

[0009] IC package 1 has a configuration in which multiple chiplets 5 are mounted on a single substrate. These multiple chiplets 5 include chips with different functions. Therefore, each type of chiplet 5 differs in size, shape, structure, etc., and the thermal properties such as thermal conductivity and heat capacity of the chiplets 5 themselves differ, resulting in different mounting conditions such as heating temperature for each chiplet 5.

[0010] In the thermocompression type mounting apparatus 100 shown in Figure 13, the attachment tool 103 is uniformly heated to a temperature suitable for the mounting conditions of each chip component 106 by a heater provided on the bonding head 102. Furthermore, in the laser-assisted bonding apparatus 200 shown in Figure 14, the laser is irradiated onto the semiconductor chip 201 held in the bonding tool 203, and, similar to the thermocompression bonding mounting apparatus 100 described above, the individual semiconductor chips 201 are uniformly heated to a temperature suitable for the mounting conditions of each chip.

[0011] Therefore, with conventional mounting equipment 100 and bonding equipment 200, it is difficult to mount multiple chip components with different mounting conditions together. In cases where it is necessary to mount multiple chiplets 5, as in the IC package 1 described above, there is a problem in that proper mounting can only be performed for each chiplet 5, i.e., each chip component. [Prior art documents] [Patent Documents]

[0012] [Patent Document 1] Japanese Patent Publication No. 2019-110227 [Patent Document 2] Japanese Patent Publication No. 2009-182162 [Overview of the project] Means for solving the problem and their effects

[0013] The present invention has been made in view of the above problems, and aims to provide a mounting apparatus and mounting method that can mount multiple chip components on a substrate simultaneously under mounting conditions suitable for each chip component.

[0014] To achieve the above objective, the mounting device (1) according to the present invention is: A mounting device for mounting chip components onto a circuit board, The system includes a bonding head that irradiates multiple chip components with a laser to mount these multiple chip components onto the substrate, The bonding head, The present invention is characterized by having a configuration that allows the laser beam profile to be varied so that regions with different irradiation intensities are formed within the laser irradiation area for the plurality of chip components based on predetermined mounting conditions for each chip component.

[0015] According to the above mounting device (1), the beam profile of the laser is made variable so that regions with different irradiation intensities are formed within the irradiation area of ​​the laser for the plurality of chip components based on predetermined mounting conditions for each chip component, and the laser with the variable beam profile is irradiated onto the plurality of chip components. Therefore, the plurality of chip components can be mounted on the substrate simultaneously under mounting conditions suitable for each chip component.

[0016] Furthermore, the mounting device (2) according to the present invention is provided in the above mounting device (1), The bonding head, The laser includes a laser output unit that outputs a first laser having a first beam profile, The device is characterized by comprising a beam profile variable unit that changes the first laser to a second laser having a second beam profile based on predetermined mounting conditions.

[0017] According to the above mounting device (2), the first laser having the first beam profile is output from the laser output unit, and the beam profile variable unit makes the first laser variable into the second laser having the second beam profile based on the predetermined mounting conditions, and the second laser is irradiated onto the plurality of chip components. Therefore, the beam profile variable unit can be made to function as a configuration for varying the beam profile of the laser, and the plurality of chip components can be simultaneously mounted on the substrate under mounting conditions suitable for each chip component, and the plurality of chip components can be efficiently mounted on the substrate.

[0018] Moreover, the mounting device (3) according to the present invention is the mounting device (2) in which the laser output unit outputs, as the first laser, a first area laser shaped such that the beam profile of an area including the plurality of chip components becomes uniform, and the beam profile variable unit is characterized in that it makes the first area laser variable into a second area laser having the second beam profile as the second laser.

[0019] According to the above mounting device (3), the first area laser is output from the laser output unit, and the beam profile variable unit makes the first area laser variable into the second area laser having the second beam profile, and the second area laser is irradiated onto the plurality of chip components. Therefore, the plurality of chip components can be collectively mounted on the substrate under mounting conditions suitable for each chip component within the area including the plurality of chip components, and the mounting efficiency can be improved.

[0020] Moreover, the mounting device (4) according to the present invention is the mounting device (2) in which the laser output unit As the first laser, it outputs a first line laser formed in a line shape having a uniform beam profile across the plurality of chip components. The beam profile variable part As the second laser, it makes the first line laser variable to a second line laser having the second beam profile. The bonding head It is characterized by further comprising a scanning part that scans the second line laser with respect to the plurality of chip components.

[0021] According to the above mounting device (4), the first line laser is output from the laser output part, and the beam profile variable part makes the first line laser variable to the second line laser having the second beam profile, and the scanning part scans the second line laser with respect to the plurality of chip components. Therefore, it is possible to irradiate the plurality of chip components while scanning with the second line laser having the second beam profile based on the predetermined mounting conditions, and it is possible to mount the plurality of chip components on the substrate simultaneously under mounting conditions suitable for each chip component, and also to enhance the effect of suppressing thermal damage to each chip component by scanning irradiation.

[0022] Also, the mounting device (5) according to the present invention is any one of the above mounting devices (2) to (4), The beam profile variable part It is characterized by being configured to include an optical device that makes the first beam profile variable to the second beam profile.

[0023] According to the above-described implementation device (5), since the beam profile variable unit is configured to include the optical device, the optical device is arranged in the optical path of the first laser output from the laser output unit, thereby allowing the optical device to appropriately change the first beam profile of the first laser to the second beam profile.

[0024] Furthermore, in the above-mentioned mounting device (5), the optical device may be configured to include an optical modulation device. According to this configuration, the optical modulation device can change the first laser having the first beam profile to the second beam profile and irradiate the plurality of chip components with the second laser, and it is also possible to precisely control the variation of these beam profiles. The optical modulation device can be configured to include, for example, a spatial light modulation device such as a digital micromirror device or a liquid crystal device.

[0025] Furthermore, in the above-mentioned mounting device (5), the optical device may be configured to include a light-reflecting device. According to this configuration, the light reflection device can change the first laser having the first beam profile to the second beam profile and irradiate the plurality of chip components with the second laser. The light-reflecting device can be configured, for example, by including one or more mirrors, and can be configured by mirrors that have regions with different reflectances and transmittances in their surface based on the predetermined mounting conditions.

[0026] Furthermore, in the above-described mounting device (5), the optical device may be configured to include a light transmission adjustment device.

[0027] According to this configuration, the light transmission adjustment device can change the first laser having the first beam profile to the second beam profile and irradiate the plurality of chip components with the second laser. The aforementioned light transmission adjustment device may include, for example, an optical mask or an optical filter. These optical masks and optical filters may have a fixed or variable light-transmitting portion.

[0028] Furthermore, the mounting apparatus (6) according to the present invention is, in the above mounting apparatus (5), The bonding head includes an attachment tool for holding the plurality of chip components, The attachment tool is composed of a laser-transmitting member, The optical device is disposed on the laser-transmitting member.

[0029] According to the above-described mounting device (6), since the optical device is disposed on the laser-transmitting member that constitutes the attachment tool, the attachment tool equipped with the optical device can be easily replaced with one that corresponds to the arrangement pattern of the plurality of chip components.

[0030] Furthermore, the mounting device (7) according to the present invention is, in the above mounting device (1), The bonding head, The laser includes a multi-laser output unit that outputs multi-beam lasers arranged in one or two dimensions. The multi-laser output unit is The multi-beam laser is characterized by being configured to output with variable intensity for each beam constituting the multi-beam laser so as to have a beam profile based on the predetermined implementation conditions.

[0031] According to the above-described mounting device (7), the multi-laser output unit is configured to output the multi-beam laser with variable intensity for each beam constituting the multi-beam laser so that it has a beam profile based on predetermined mounting conditions. Therefore, the multi-laser output unit can be made to function with a configuration that allows for variable beam profile of the laser, and the multiple chip components can be mounted on the substrate simultaneously under mounting conditions suitable for each chip component, and the multiple chip components can be mounted on the substrate efficiently.

[0032] Furthermore, the mounting device (8) according to the present invention, in the above mounting device (7), The bonding head, The system is further characterized by comprising a scanning unit that scans the multi-beam laser, which is output from the multi-laser output unit with varying intensity for each beam, over the plurality of chip components.

[0033] According to the above mounting apparatus (8), the scanning unit can irradiate the plurality of chip components with the multi-beam laser, which is output from the multi-laser output unit with the intensity of each beam varied so as to have a beam profile based on predetermined mounting conditions, while scanning. Therefore, the plurality of chip components can be mounted on the substrate simultaneously under mounting conditions suitable for each chip component, and the effect of suppressing thermal damage to each chip component by scanning irradiation can be enhanced.

[0034] Furthermore, in the above-mentioned mounting device (7) or (8), the multi-laser output unit may be configured to include a surface-emitting laser module. According to this configuration, since the multi-laser output unit includes the surface-emitting laser module, each beam constituting the multi-beam laser can be densely two-dimensionalized and output, and by controlling the intensity of each beam, the multi-beam laser having a beam profile based on predetermined mounting conditions can be output with high precision.

[0035] Furthermore, in the above-mentioned mounting device (7) or (8), the multi-laser output unit may be configured to include a fiber laser module. With this configuration, since the multi-laser output unit includes the fiber laser module, each beam constituting the multi-beam laser can be densely two-dimensionalized and output, and by controlling the intensity of each beam, the multi-beam laser having a beam profile based on the predetermined mounting conditions can be output with high precision.

[0036] Furthermore, in any of the above mounting devices (1) to (5), (7), and (8), the bonding head may be equipped with an attachment tool for holding the plurality of chip components, and the attachment tool may be made of a laser-transmitting member.

[0037] With this configuration, since the attachment tool is configured to hold the multiple chip components, it becomes easy to irradiate the multiple chip components with a laser whose beam profile is variable, or a multi-beam laser whose intensity of each beam is variable, with high positional accuracy.

[0038] Furthermore, the mounting method (1) according to the present invention is a mounting method for mounting chip components onto a substrate, The process includes a mounting step in which a laser is irradiated onto these multiple chip components using a bonding head to mount these multiple chip components onto the substrate, The implementation process is, The present invention is characterized by including a step of irradiating the plurality of chip components with a variable laser beam profile so that regions with different irradiation intensities are formed within the laser irradiation area of ​​each chip component based on predetermined mounting conditions for each chip component.

[0039] According to the above implementation method (1), the beam profile of the laser is varied in the step of irradiating with a variable laser beam profile so that regions with different irradiation intensities are formed within the laser irradiation area for the plurality of chip components based on predetermined mounting conditions for each chip component, and the laser with the variable beam profile is irradiated onto the plurality of chip components. Therefore, the plurality of chip components can be mounted on the substrate simultaneously under mounting conditions suitable for each chip component. [Brief explanation of the drawing]

[0040] [Figure 1] This is a schematic diagram showing an example of the configuration of an mounting device according to Embodiment (1) of the present invention. [Figure 2] This is a cross-sectional view along line II-II in Figure 1, illustrating an example of the arrangement of a chip component held by an attachment tool. [Figure 3] This is a schematic diagram showing an example of the beam profile of the first laser output from the laser output unit. [Figure 4] This is a schematic diagram showing an example of the beam profile of the second laser after it has passed through the beam profile variable section. [Figure 5] This is a schematic diagram showing an example of the configuration of the mounting device according to Embodiment (2). [Figure 6] This is a schematic diagram showing an example of the configuration of the mounting device according to Embodiment (3). [Figure 7] This is a schematic diagram showing an example of the configuration of the mounting device according to embodiment (4). [Figure 8] This is a schematic diagram showing an example of the configuration of the mounting device according to Embodiment (5). [Figure 9] This is a schematic diagram showing an example of the beam profile of the first laser output from the laser output unit. [Figure 10] This is a schematic diagram showing an example of the beam profile of the second laser after it has passed through the beam profile variable section. [Figure 11] This is a schematic diagram showing an example of the configuration of the mounting device according to embodiment (6). [Figure 12] This is a schematic diagram showing an example of the beam profile of a multi-beam laser output from a multi-laser output unit. [Figure 13] This figure shows an example of the configuration of a conventional thermocompression bonding apparatus. [Figure 14] This figure shows an example of the configuration of a conventional laser-assisted bonding apparatus. [Figure 15] This is a perspective view showing an example of a semiconductor (IC) package configuration. [Modes for carrying out the invention]

[0041] Hereinafter, embodiments of the mounting apparatus and mounting method according to the present invention will be described with reference to the drawings. Note that the embodiments described below are preferred examples of the present invention, and the scope of the present invention is not limited to these forms. Figure 1 is a schematic diagram showing an example of the configuration of the mounting device according to embodiment (1). In the following description, one direction in the horizontal plane is defined as the X-axis direction, the direction perpendicular to this in the horizontal plane is defined as the Y-axis direction, and the direction perpendicular to the XY plane (horizontal plane), i.e., the vertical direction, is defined as the Z-axis direction.

[0042] The mounting device 10 is a device for mounting chip components 8 onto a substrate 7. The substrate 7 is, for example, a substrate for an IC package in which a sub-sub

[0043] The mounting apparatus 10 includes a bonding head 11, a lifting unit 30 for driving the bonding head 11 up and down, a substrate stage 40 positioned opposite the bonding head 11, and a control unit 50 for controlling the operation of each of these parts.

[0044] The bonding head 11 comprises a laser head body 12 and an attachment tool 13 disposed at the lower end (tip) of the laser head body 12. The bonding head 11 is a unit that holds multiple chip components 8 on an attachment tool 13, irradiates these multiple chip components 8 with a laser, converts the light energy of the irradiated laser into thermal energy, and melts the bumps 9 through thermal conduction to mount the multiple chip components 8 onto the substrate 7.

[0045] Figure 2 is a cross-sectional view taken along line II-II in Figure 1, and shows an example of the arrangement of multiple chip components 8 held by the attachment tool 13. As shown in Figure 2, the attachment tool 13 is designed to hold five chip components 8 of different sizes and functions, according to the mounting pattern on the substrate 7. Each of these chip components 8 has predetermined (unique) mounting conditions. These predetermined mounting conditions include heating temperature conditions (such as peak temperature and temperature profile) suitable for mounting each chip component 8.

[0046] The attachment tool 13 is made of a material with excellent laser transparency, such as a glass material like quartz glass or sapphire glass. Furthermore, a chip holding portion 13a is formed on the lower surface of the attachment tool 13, that is, the surface that holds the chip components 8, to correspond to the arrangement, shape, and size of the multiple chip components 8 to be mounted on the substrate 7. The chip holding portion 13a has a shape capable of holding chip components 8, such as an inverted concave shape in cross-section, and with the chip components 8 held in each portion, the lower surfaces of the multiple chip components 8, i.e., the bump 9 forming surfaces, are flat (horizontal) without any steps. In addition, each chip holding portion 13a has a suction passage (not shown) for adsorbing and holding each chip component 8, and these suction passages are connected to a suction device (not shown).

[0047] The laser head main body 12 functions as a hollow housing and includes a laser output unit 14 and a beam profile variable unit 16 inside. The laser output unit 14 outputs (emits) a first laser L1 having a first beam profile toward the beam profile variable unit 16, and is configured to include a laser oscillator 15. The beam profile represents the intensity distribution within a cross-section perpendicular to the optical axis of the laser, i.e., the cross-sectional intensity distribution.

[0048] Figure 3 is a schematic diagram showing an example of the first beam profile of the first laser L1 output from the laser output unit 14. The laser oscillator 15 is configured to output a first area laser as the first laser L1, which is shaped so that the beam profile (cross-sectional intensity distribution) of the area including the five chip components 8 shown in Figure 2 is uniform. In other words, the first laser L1 is a flat-top beam with a rectangular cross-section. Furthermore, the laser oscillator 15 is capable of changing (adjusting) the power of the output first laser L1 over time. The first laser L1 is, for example, an infrared (IR) CW (continuous wave) laser, but the type of the first laser L1 is not limited to this. In another configuration example, the first laser L1 may be a pulsed laser, and various lasers suitable for bonding chip components 8 can be used.

[0049] In another configuration example, a beam homogenizer may be provided between the laser oscillator 15 and the beam profile variable unit 16 to convert the laser beam to a top-hat type depending on the characteristics of the laser beam emitted from the laser oscillator 15, such as the beam diameter and width. Alternatively, optical components such as a beam expander may be provided to expand or contract the diameter of the laser beam emitted from the laser oscillator 15 or the beam homogenizer. The laser output unit 14 may be configured to include these optical components.

[0050] The beam profile variable unit 16 is an example of a configuration that varies the beam profile of the laser output from the laser output unit 14 so that regions with different irradiation intensities are formed within the laser irradiation area for each of the multiple chip components 8 based on predetermined mounting conditions for each chip component 8. The beam profile variable unit 16 is specifically configured to include an optical device 17 that varies the first laser L1 output from the laser oscillator 15 to a second laser L2 having a second beam profile based on predetermined mounting conditions for each chip component 8.

[0051] Figure 4 is a schematic diagram showing an example of the second beam profile of the second laser L2 after it has passed through the beam profile variable unit 16. In Figure 4, the difference in grayscale density indicates the difference in laser intensity. As shown in Figure 4, the second beam profile of the second laser L2 has a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8 held by the attachment tool 13 shown in Figure 2. Furthermore, the laser intensity in the areas other than each chip component 8 of the second laser L2 is lower than in the areas of each chip component 8, and it is preferable to avoid irradiating areas other than each chip component 8 with laser light as much as possible. In other words, the optical device 17 has the function of changing the first laser L1 (first area laser), which has a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3, to a second laser L2 (second area laser), which has a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0052] In another configuration example, depending on the characteristics of the optical device 17, optical components such as a beam expander capable of expanding or contracting the diameter and width of the laser light passing through the optical device 17, as well as an imaging lens, may be provided between the optical device 17 and the attachment tool 13. The beam profile variable unit 16 may be configured to include these optical components.

[0053] The optical device 17 is specifically configured to include a light transmission adjustment device 18. The light transmission adjustment device 18 is configured to include, for example, a fixed mask in which the size and position of the aperture that becomes the laser irradiation area, i.e., the aperture pattern, is fixed, or a variable mask in which the aperture pattern can be changed, so as to correspond to the arrangement of multiple chip components 8 held by the attachment tool 13.

[0054] The aforementioned fixed mask can be made up of, for example, a metal mask, a glass mask, a film mask, or a screen mask. The metal mask may be configured, for example, to have openings in the form of punching or mesh, where the opening ratio is adjusted according to the position of each of the multiple chip components 8. In addition, the metal mask may be made of metal, or it may be a hybrid structure mask combining metal and resin. Furthermore, the glass mask and the film mask may be constructed, for example, by forming an opening pattern corresponding to the respective positions of the multiple chip components 8 on a transparent substrate such as glass or resin using a metal film. Furthermore, the screen mask may be composed of a frame, a screen mesh, and an emulsion (or metal). For example, a metal mesh such as stainless steel may be used for the screen mesh, and the screen mask may be composed of a metal (foil) with opening patterns formed in the metal according to the respective positions of the multiple chip components 8. As described above, various types of fixed masks can be applied, and the transmittance of laser light can be adjusted by changing the material, aperture ratio, mesh wire diameter, or thickness.

[0055] The variable mask includes, for example, a plurality of movable masks that are slidably stacked on top of each other, and these movable masks can be slid to change the size and position of the openings that make up the opening pattern. Furthermore, the size of the openings provided in the fixed mask and the variable mask may be approximately the same as the area of ​​the corresponding chip component 8, or it may be smaller than the area of ​​the corresponding chip component 8, taking into consideration conditions such as the output power of the first laser L1. Furthermore, the fixing mask can be replaced as appropriate depending on the arrangement of the multiple chip components 8, that is, the type of substrate 7 on which it is mounted.

[0056] Furthermore, the light transmission adjustment device 18 may be configured to include a filter that can adjust the amount (transmittance) of laser light transmitted, instead of the fixed mask or variable mask described above. The filter is, for example, formed on a glass substrate with a light-reflecting film having light-reflecting properties or a light-absorbing film having light-absorbing properties, and the light-reflecting film or light-absorbing film is formed to correspond to the arrangement pattern of a plurality of chip components 8. The light-reflecting film of the filter may be, for example, composed of a dielectric multilayer film having light-reflecting properties, and the light-absorbing film may be, for example, composed of a metal film having light-absorbing properties. Furthermore, the filter may be a fixed filter with a fixed amount of laser light transmitted, or a variable filter that can change the amount of laser light transmitted.

[0057] Furthermore, by adjusting the characteristics of the optical reflective or optical absorbing film of the filter based on predetermined mounting conditions for each chip component 8, it is possible to change the incident laser, i.e., the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3, to a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0058] The light transmission adjustment device 18 may also be configured by combining the mask described above and the filter. That is, the filter may be placed at the position of the opening of the mask to adjust the amount of laser light transmitted to each chip component 8 so that predetermined mounting conditions are achieved.

[0059] Furthermore, the optical device 17 may be configured to include a spatial light modulation device 19 instead of the light transmission adjustment device 18 described above. The spatial light modulation device 19 may include, for example, a digital micromirror device (DMD), which is a type of reflective light modulator, or a liquid crystal device such as a reflective liquid crystal device (LCOS) or a transmissive liquid crystal device (LCD). When a reflective spatial light modulation device 19 such as the DMD or LCOS is used as the optical device 17, an optical element such as a mirror is equipped in the beam profile variable unit 16 to irradiate the second laser L2 reflected by the spatial light modulation device 19 onto the holding surfaces of the multiple chip components 8 of the attachment tool 13.

[0060] The DMD is a device in which a large number of movable, minute mirrors are arranged in a grid pattern on an integrated circuit substrate. In the DMD, by driving electrodes provided at the bottom of each mirror, the tilt of each mirror can be switched ON / OFF, creating areas on the holding surface of the multiple chip components 8 of the attachment tool 13 that are irradiated with a laser and areas that are not. Furthermore, the intensity of the irradiation can be controlled by the ON / OFF interval of each mirror, i.e., the time ratio of the ON state.

[0061] Therefore, by controlling the ON / OFF switching pattern and switching timing (time ratio of the ON state) of each mirror constituting the DMD, it is possible to change the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3 to a second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0062] The aforementioned LCOS has a structure in which a liquid crystal layer is sandwiched between a silicon substrate with pixel electrodes and a glass substrate with transparent electrodes, and a mirror is placed between the silicon substrate with pixel electrodes and the liquid crystal layer. Therefore, by controlling the movement (tilt) of the liquid crystal molecules in the liquid crystal layer with the pixel electrodes constituting the LCOS, it is possible to change the incident laser, i.e., the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3, to the second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0063] Furthermore, the LCD has a structure in which, for example, a liquid crystal layer is sandwiched between two glass substrates with transparent electrodes, and the two glass substrates are sandwiched between two polarizing plates. Therefore, by controlling the combination of the movement (tilt) of the liquid crystal molecules in the liquid crystal layer constituting the LCD and the polarization direction of the polarizer, it is possible to change the incident laser, i.e., the first laser L1 (first area laser) having a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3, to the second laser L2 (second area laser) having a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 4.

[0064] The lifting unit 30 is a device that has the function of raising and lowering the bonding head 11 vertically relative to the substrate stage 40, and the function of pressing the bonding head 11 against the substrate 7 held on the substrate stage 40, and is fixed to a gantry frame, for example (not shown). The lifting unit 30 is composed of a single-axis robot or the like, which is arranged in the Z-axis direction.

[0065] The substrate stage 40 comprises a stage mechanism 41 and a suction table 42 attached to the stage mechanism 41. The stage mechanism 41 is a device equipped with a mechanism for moving the suction table 42 in a horizontal plane (XY axis direction). The suction table 42 is a table on which the substrate 7 is placed and has the function of adsorbing and holding the substrate 7 on its upper surface. The suction table 42 is movable in the in-plane direction (XY axis direction) of the substrate 7 while the substrate 7 is held by the stage mechanism 41.

[0066] The control unit 50 is functionally configured to include a laser oscillator control unit 51, an optical device control unit 52, a lifting unit control unit 53, and a substrate stage control unit 54. The control unit 50 consists of one or more computer devices equipped with one or more central processing units (CPUs), memory, storage, and input / output interfaces (I / Fs) as its hardware configuration.

[0067] The memory consists of ROM (Read Only Memory), RAM (Random Access Memory), etc., and the storage consists of HDD (Hard Disk Drive), SSD (Solid State Drive), etc. The control unit 50 reads and expands the programs of each control unit stored in the memory or storage, and then interprets and executes the expanded programs of each control unit using the CPU, thereby performing operational control of the laser oscillator 15, optical device 17, lifting unit 30, and substrate stage 40.

[0068] The laser oscillator control unit 51 has functions for controlling the operation of the laser oscillator 15, such as controlling the output of a first laser L1 having a first beam profile from the laser oscillator 15, and controlling the power of the output first laser L1.

[0069] The optical device control unit 52 has functions for controlling the operation of the optical device 17, such as controlling the first laser L1 to change to a second laser L2 having a second beam profile based on predetermined mounting conditions for each chip component 8. In addition, depending on the type of optical device 17, it may not be necessary to provide the optical device control unit 52. For example, if the light transmission adjustment device 18 as the optical device 17 is composed of a fixed mask or fixed filter, the optical device control unit 52 may not be necessary.

[0070] The lifting unit control unit 53 has functions such as controlling the movement of the bonding head 11 up and down by the lifting unit 30, and controlling the application of a pressing force according to the setting when bonding the multiple chip components 8 held by the bonding head 11 to the substrate 7 held on the substrate stage 40.

[0071] The substrate stage control unit 54 has functions to control the operation of the stage mechanism 41 and the suction table 42, such as the operation of adsorbing and holding the substrate 7 on the suction table 42, the operation of moving the suction table 42 horizontally (XY axis direction) to move the substrate 7 held on the suction table 42 directly below the bonding head 11, and the operation of moving the substrate 7 with multiple chip components 8 mounted on it to a predetermined handover position after mounting is complete.

[0072] The mounting process performed by the mounting apparatus 10 according to embodiment (1) first involves aligning the bonding position of the substrate 7 held on the suction table 42 of the substrate stage 40 with the multiple chip components 8 held on the attachment tool 13 of the bonding head 11. During the bonding alignment process, the substrate stage control unit 54 controls the operation of the stage mechanism 41 to adjust the position of the substrate 7 so that the bonding area of ​​the substrate 7 is positioned directly beneath the bumps 9 of each chip component 8 held by the attachment tool 13. In this process, position adjustment may also be performed using data such as images of the substrate 7 and each chip component 8 detected by sensors such as a camera (not shown).

[0073] After the bonding alignment is complete, the lifting unit control unit 53 controls the operation of the lifting unit 30 to lower the bonding head 11, bringing the multiple chip components 8 held by the attachment tool 13 into contact with the substrate 7 held on the suction table 42, and then pressing them with a predetermined pressing force.

[0074] Furthermore, the laser oscillator control unit 51 controls the operation of the laser oscillator 15 to emit the first laser L1 from the laser oscillator 15. The first laser L1 emitted from the laser oscillator 15 toward the optical device 17 is varied by the optical device 17 to become a second laser L2 having a second beam profile based on predetermined mounting conditions for each chip component 8, and the second laser L2 with the varied beam profile is irradiated simultaneously onto multiple chip components 8 held by the attachment tool 13.

[0075] The light energy from the second laser L2, which is irradiated onto multiple chip components 8, is converted into thermal energy. This thermal energy heats each chip component 8 to a predetermined temperature profile, causing the bumps 9 on each chip component 8 to melt, and the chip components 8 are mounted onto the substrate 7 all at once.

[0076] After implementation is complete, the laser oscillator control unit 51 controls the operation to stop the emission of the first laser L1 from the laser oscillator 15, and the lifting unit control unit 53 controls the operation of the lifting unit 30 to raise the bonding head 11.

[0077] After raising the bonding head 11, the substrate stage control unit 54 controls the operation of the stage mechanism 41 to move the substrate 7 on which the chip components 8 are mounted on the suction table 42 to a predetermined transfer position. Subsequently, the substrate 7 on which the chip components 8 are mounted on the suction table 42 is transferred by the transfer means, and the next mounting process is repeatedly executed.

[0078] According to the mounting apparatus 10 of the above embodiment (1), the bonding head 11 comprises a laser output unit 14 and a beam profile variable unit 16, the laser output unit 14 comprises a laser oscillator 15, and the beam profile variable unit 16 comprises an optical device 17. Then, a first area laser is emitted from the laser oscillator 15 as the first laser L1, which is shaped so that the beam profile (cross-sectional intensity distribution) of the area including the multiple chip components 8 held by the attachment tool 13 is uniform.

[0079] Furthermore, the optical device 17 changes the first beam profile of the first laser L1 shown in Figure 3 to the second beam profile shown in Figure 4, and the second laser L2, which has been changed to the second beam profile, is irradiated onto multiple chip components 8.

[0080] Therefore, by configuring the optical device 17 of the beam profile variable unit 16 to vary the laser beam profile, multiple chip components 8 can be mounted on the substrate 7 collectively under mounting conditions suitable for each chip component 8 within the area containing multiple chip components 8. Therefore, multiple chip components 8 can be efficiently mounted on the substrate 7, improving the efficiency of the mounting process for IC packages using chiplet integration technology.

[0081] Furthermore, according to the implementation device 10, the first beam profile of the first laser L1 shown in Figure 3 can be varied to the second beam profile shown in Figure 4 by the light transmission adjustment device 18 and the spatial light modulation device 19 that constitute the optical device 17, and it becomes possible to precisely control the variation of these beam profiles.

[0082] Next, the mounting device according to embodiment (2) will be described. Figure 5 is a schematic diagram showing an example of the configuration of the mounting device 10A according to embodiment (2). Components having the same function as those in the mounting device 10 according to embodiment (1) shown in Figure 1 are denoted by the same reference numerals, and their descriptions are omitted here.

[0083] The main difference between the mounting apparatus 10A according to embodiment (2) shown in Figure 5 and the mounting apparatus 10 shown in Figure 1 is the configuration of the laser head body 12A of the bonding head 11A. In the mounting device 10A, a fixed reflective mirror 21 is placed in the optical path of the first laser L1 (first area laser) between the laser oscillator 15 located in the laser head body 12A and the optical device 17. The first laser L1 emitted horizontally from the laser oscillator 15 is reflected vertically by the reflective mirror 21 and irradiated onto the optical device 17. The other configurations of the bonding head 11A and the functions of the control unit 50A are basically the same as those of the mounting device 10.

[0084] The mounting device 10A according to embodiment (2) can achieve the same effects as the mounting device 10 according to embodiment (1), and the height of the housing of the laser head body 12A of the bonding head 11A can be made lower and more compact.

[0085] Next, the mounting device according to embodiment (3) will be described. Figure 6 is a schematic diagram showing an example of the configuration of the mounting device 10B according to embodiment (3). Components having the same function as those in the mounting device 10 according to embodiment (1) shown in Figure 1 are denoted by the same reference numerals, and their descriptions are omitted here.

[0086] The main difference between the mounting apparatus 10B shown in Figure 6 (3) and the mounting apparatus 10 shown in Figure 1 is the configuration of the laser head body 12B of the bonding head 11B.

[0087] In the mounting device 10B, the optical device 17 of the beam profile variable unit 16, which is located in the laser head main body 12B, includes a light reflecting device 20. A first laser L1 (first area laser) emitted horizontally from the laser oscillator 15 is reflected vertically by the light reflection device 20, and the second laser L2 (second area laser), which is shaped into a second beam profile during reflection, passes through the attachment tool 13 and irradiates multiple chip components 8.

[0088] The light-reflecting device 20 is composed of, for example, one or more mirrors, and the mirrors are formed to have regions with different reflectivity and absorptivity of the mirror surface, i.e., regions with different reflection intensities, based on the arrangement pattern of the multiple chip components 8 and predetermined mounting conditions for each chip component 8.

[0089] The mirror constituting the light reflection device 20 comprises, for example, a substrate made of a rigid material such as glass or metal, and a reflective layer formed on the substrate. The reflective layer is made of a film such as metal or dielectric. A filter capable of adjusting the amount (transmittance) of laser light transmitted may be provided on the mirror surface of the mirror.

[0090] The optical reflection device 20 makes it possible to change the first laser L1 (first area laser), which has a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 3, to a second laser L2 (second area laser), which has a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​the chip component 8, as shown in Figure 4. Then, the second laser L2 formed by reflection from the light reflection device 20 is transmitted through the attachment tool 13 and irradiated onto the multiple chip components 8.

[0091] The other configurations of the mounting device 10B are basically the same as those of the mounting device 10. However, the control unit 50B of the mounting device 10B does not necessarily need to have the functions of the optical device control unit 52 that are included in the control unit 50 of the mounting device 10.

[0092] According to the mounting apparatus 10B of embodiment (3), the light reflection device 20 can change the first laser L1 having a first beam profile to a second beam profile, and the second laser L2 having a second beam profile can be irradiated simultaneously onto a plurality of chip components 8 held by the attachment tool 13, thereby achieving the same effects as the mounting apparatus 10 of embodiment (1).

[0093] Next, the mounting device according to embodiment (4) will be described. Figure 7 is a schematic diagram showing an example configuration of the mounting device 10C according to embodiment (4). Components having the same function as those in the mounting device 10 according to embodiment (1) shown in Figure 1 are denoted by the same reference numerals, and their descriptions are omitted here.

[0094] The main difference between the mounting apparatus 10C according to embodiment (4) shown in Figure 7 and the mounting apparatus 10 shown in Figure 1 is the configuration of the laser head body 12C of the bonding head 11C and the attachment tool 13A. Furthermore, the control unit 50C is composed of a laser oscillator control unit 51, a lifting unit control unit 53, and a substrate stage control unit 54, and the function of the optical device control unit 52 included in the control unit 50 of the mounting apparatus 10 does not necessarily need to be provided.

[0095] In the mounting device 10C, the light transmission adjustment device 18, which is an optical device 17, is located on the attachment tool 13A rather than the laser head main body 12C. The light transmission adjustment device 18 can be, for example, a fixed mask, a fixed filter, or a combination thereof, and it is preferable to provide the light transmission adjustment device 18 for each region that holds the chip components 8. Such light transmission adjustment devices 18 may be stacked on the attachment tool 13A, or they may be formed by patterning a mask pattern corresponding to the arrangement pattern of the multiple chip components 8 within the laser-transmitting member that constitutes the attachment tool 13A. That is, it is preferable that the mask pattern is patterned to attenuate and absorb the laser light in areas other than the chip components 8 so that the laser light does not irradiate areas other than the chip components 8 on the substrate 7 as much as possible.

[0096] The mounting apparatus 10C according to embodiment (4) can achieve the same effects as the mounting apparatus 10 described above. Furthermore, since the attachment tool 13A is equipped with a light transmission adjustment device 18, it is possible to replace the attachment tool 13A equipped with the light transmission adjustment device 18 with one that corresponds to the arrangement pattern of multiple chip components 8, thereby realizing an apparatus that can simultaneously and appropriately mount multiple chip components 8 onto the substrate 7 in various arrangement patterns. Note that the optical device 17 equipped on the attachment tool 13A is not limited to the light transmission adjustment device 18, but may be composed of the spatial light modulation device 19 described above.

[0097] Next, the mounting device according to embodiment (5) will be described. Figure 8 is a schematic diagram showing an example configuration of the mounting device 10D according to embodiment (5). Components having the same function as those in the mounting device 10 according to embodiment (1) shown in Figure 1 are denoted by the same reference numerals, and their descriptions are omitted here.

[0098] The main difference between the mounting apparatus 10D shown in Figure 8 (5) and the mounting apparatus 10 shown in Figure 1 is the configuration of the laser head body 12D of the bonding head 11D.

[0099] The mounting device 10 shown in Figure 1 is configured to emit a first area laser as the first laser L1 from a laser oscillator 15, vary the beam profile of the first area laser with an optical device 17, and irradiate multiple chip components 8 held by an attachment tool 13 with the varied second area laser (second laser L2) all at once.

[0100] On the other hand, the mounting device 10D shown in Figure 8 emits a first line laser as the first laser L3 from the laser oscillator 15A, and after the beam profile of the first line laser is varied by the optical device 17A, the varied second line laser (second laser L4) is scanned and irradiated onto multiple chip components 8 held by the attachment tool 13 by the scanning mechanism 22.

[0101] The laser head body 12D, which constitutes the mounting device 10D, functions as a hollow housing and includes a laser output unit 14A, a beam profile variable unit 16A, and a scanning mechanism 22 inside.

[0102] The laser output unit 14A outputs a first laser L3 having a first beam profile toward the beam profile variable unit 16, and is configured to include a laser oscillator 15A.

[0103] Figure 9 is a schematic diagram showing an example of the first beam profile of the first laser L3 output from the laser output unit 14A. The laser oscillator 15A is configured to output a first line laser as the first laser L3, which is formed into a line shape having a uniform beam profile across multiple chip components 8 in the X-axis or Y-axis direction, held by the attachment tool 13 shown in Figure 2.

[0104] The beam profile variable unit 16A specifically includes an optical device 17A that varies the first laser L3 (first line laser) output from the laser oscillator 15A to a second laser L4 (second line laser) having a second beam profile based on predetermined mounting conditions for each chip component 8.

[0105] Figure 10 is a schematic diagram showing an example of the second beam profile of the second laser L4 after it has passed through the beam profile variable section 16A. As shown in Figure 10, the second beam profile of the second laser L4 has a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​each chip component 8 held by the attachment tool 13 shown in Figure 2. Furthermore, the laser intensity in the areas of the second laser L4 other than each chip component 8 is lower than in the areas of each chip component 8, and it is preferable to avoid irradiating areas other than each chip component 8 with laser light as much as possible. In other words, the optical device 17A has the function of changing the first laser L3 (first line laser), which has a first beam profile with a uniform cross-sectional intensity distribution as shown in Figure 9, to a second laser L4 (second line laser), which has a second beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​the chip component 8, as shown in Figure 10.

[0106] The optical device 17A is composed of the light transmission adjustment device 18 or the spatial light modulation device 19 described above. The light transmission adjustment device 18 can be composed of, for example, a fixed mask, a variable mask, a fixed filter, a variable filter, or a combination thereof. The spatial light modulation device 19 can be composed of the DMD, the LCOS, the LCD, etc.

[0107] The scanning mechanism 22 is a mechanism for scanning and irradiating a second laser L4 (second line laser) onto a plurality of chip components 8 held by the attachment tool 13. The scanning mechanism 22 includes a scanning mirror 23, a rotary motor (not shown) for rotating the scanning mirror 23, an f-θ lens, etc., and the driving of the scanning mirror 23 is controlled based on a control signal from the scanning mirror control unit 55 of the control unit 50D. The scanning mirror 23 is made of, for example, a galvanometer mirror.

[0108] The mounting device 10D uses a scanning mechanism 22 to scan and irradiate a line-shaped second laser L4 that has passed through the optical device 17A onto a plurality of chip components 8 held by the attachment tool 13. As the mounting device 10D moves the linear irradiation area of ​​the second laser L4 due to scanning irradiation, the optical device 17A is configured to change to a second laser L4 (second line laser) having a second beam profile based on the arrangement pattern of the multiple chip components 8 in the corresponding irradiation area and predetermined mounting conditions for these chip components 8, in accordance with the movement of this irradiation area (i.e., in accordance with the arrangement pattern of the multiple chip components 8 within the irradiation area).

[0109] Therefore, if the light transmission adjustment device 18 constituting the optical device 17A is the mask or filter, and these masks or filters are in a form that can cover all of the multiple chip components 8 held by the attachment tool 13, the optical device control unit 52 controls the position of the mask or filter through which the first laser L3 passes in accordance with the movement of the scanning mirror 23 (i.e., the movement of the irradiation range).

[0110] Furthermore, if the optical device 17A is a spatial light modulation device 19, the optical device control unit 52 is configured to change the arrangement pattern of multiple chip components 8 within the corresponding irradiation area and the second laser L4 (second line laser) having a second beam profile based on predetermined mounting conditions of these chip components 8, in accordance with the movement of the scanning mirror 23 (i.e., the movement of the irradiation range).

[0111] According to the implementation device 10D of embodiment (5), a first line laser (first laser L3) is output from the laser oscillator 15A, and the optical device 17A constituting the beam profile variable unit 16A makes the first line laser variable into a second line laser (second laser L4) having a second beam profile.

[0112] Then, the scanning mechanism 22 scans the multiple chip components 8 with the second line laser (second laser L4). Therefore, the second line laser, which has a second beam profile based on predetermined mounting conditions for each chip component 8, can be irradiated onto the multiple chip components 8 while scanning. Thus, multiple chip components 8 can be mounted on the substrate 7 simultaneously under mounting conditions suitable for each chip component 8, and the scanning irradiation enhances the effect of suppressing thermal damage to each chip component 8.

[0113] Next, the mounting device according to embodiment (6) will be described. Figure 11 is a schematic diagram showing an example configuration of the mounting device 10E according to embodiment (6). Components having the same function as those in the mounting device 10 according to embodiment (1) shown in Figure 1 are denoted by the same reference numerals, and their descriptions are omitted here.

[0114] The main difference between the mounting apparatus 10E according to embodiment (6) shown in Figure 11 and the mounting apparatus 10 shown in Figure 1 is the configuration of the laser head body 12E of the bonding head 11E. In the implementation device 10, the beam profile variable unit 16 functions to vary the laser beam profile, while in the implementation device 10E, the multi-laser output unit 24 functions to vary the laser beam profile.

[0115] In other words, the laser head body 12E of the bonding head 11E that constitutes the mounting device 10E is equipped with a multi-laser output unit 24 that outputs multi-beam lasers L5 arranged in two dimensions. The multi-laser output unit 24 includes a multi-laser oscillator 25, which has the function of outputting the intensity of each beam constituting the multi-beam laser L5 in a variable manner so that each beam has a beam profile based on the mounting conditions of the multiple chip components 8 held by the attachment tool 13.

[0116] The multi-laser oscillator 25 is configured to include, for example, a surface-emitting laser module 26. The surface-emitting laser module 26 is comprised of, for example, a vertical-cavity surface-emitting laser (VCSEL) module, which is positioned opposite the surface that holds the tip component 8 of the attachment tool 13.

[0117] The VCSEL module has a configuration in which surface-emitting lasers, which are light-emitting elements, are arranged in a two-dimensional array on a semiconductor substrate, and laser light is emitted from each surface-emitting laser in a direction perpendicular to the semiconductor substrate.

[0118] The operation of the multi-laser oscillator 25, which includes the surface-emitting laser module 26, is controlled by the multi-laser oscillator control unit 56 of the control unit 50E, and the multi-laser oscillator control unit 56 is capable of controlling the output intensity of each of the two-dimensionally arranged surface-emitting lasers of the VCSEL module.

[0119] Therefore, by controlling the output intensity of each of the two-dimensionally arranged surface-emitting lasers of the VCSEL module, it is possible to emit a multi-beam laser L5 from the multi-laser oscillator 25, which has a beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 12. Figure 12 schematically shows the state in which each beam is irradiating the region indicated by each grating of the multi-beam laser L5.

[0120] Furthermore, the multi-laser oscillator 25 may include a fiber laser (FBL) module 27 instead of the surface-emitting laser module 26. The FBL module 27 includes, for example, multiple FBL main units, optical fibers connected to each FBL main unit, and optical heads provided at the ends of each optical fiber. These multiple optical heads are arranged in a two-dimensional array, and laser light is emitted from each optical head. The multiple FBL main units may also be configured by stacking multiple semiconductor lasers. Furthermore, the multi-laser oscillator control unit 56 is capable of controlling the operation of the FBL module 27, for example, controlling the laser intensity output from each of the two-dimensionally arranged optical heads.

[0121] Therefore, by controlling the laser intensity output from each of the two-dimensionally arranged optical heads of the FBL module 27, it is possible to directly emit a multi-beam laser L5 from the multi-laser oscillator 25, which has a beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8, as shown in Figure 12.

[0122] Furthermore, depending on the characteristics of the multi-beam laser L5 emitted from the multi-laser oscillator 25, optical components such as a beam expander or imaging lens may be appropriately provided between the multi-laser oscillator 25 and the attachment tool 13.

[0123] The control unit 50E is functionally configured to include a multi-laser oscillator control unit 56, a lifting unit control unit 53, and a substrate stage control unit 54.

[0124] The multi-laser oscillator control unit 56 has functions to control the operation of the multi-laser oscillator 25, such as controlling the output of a multi-beam laser L5 from the surface-emitting laser module 26 or FBL module 27 described above, which has a beam profile with a cross-sectional intensity distribution where the irradiation intensity differs for each irradiation area of ​​each chip component 8.

[0125] The mounting process performed by the mounting apparatus 10E according to embodiment (6) is the same as the mounting process performed by the mounting apparatus 10 described above. First, the bonding position of the substrate 7 and the plurality of chip components 8 is aligned, then the plurality of chip components 8 are brought into contact with the substrate 7, and then pressed with a predetermined pressing force. Subsequently, the multi-laser oscillator control unit 56 controls the operation of the multi-laser oscillator 25, and the multi-beam laser L5 has a beam profile with a cross-sectional intensity distribution in which the irradiation intensity differs for each irradiation area of ​​the chip component 8. The emitted multi-beam laser L5 is simultaneously irradiated onto multiple chip components 8 held by the attachment tool 13.

[0126] The light energy from the multi-beam laser L5 irradiated onto multiple chip components 8 is converted into thermal energy. This thermal energy heats each chip component 8 to a predetermined temperature profile, causing the bumps 9 on each chip component 8 to melt, and the chip components 8 are mounted onto the substrate 7 all at once.

[0127] After implementation is complete, the multi-laser oscillator control unit 56 controls the operation to stop the emission of the multi-beam laser L5 from the multi-laser oscillator 25, and the lifting unit control unit 53 controls the operation of the lifting unit 30 to raise the bonding head 11.

[0128] According to the mounting apparatus 10E of embodiment (6), the multi-laser output unit 24, which includes a multi-laser oscillator 25, is configured to output the multi-beam laser L5 with variable intensity for each beam, such that it has a beam profile based on predetermined mounting conditions for each chip component 8. Therefore, the multi-laser output unit 24 can be made to function with a variable laser beam profile, allowing multiple chip components 8 to be mounted on the substrate 7 at once under mounting conditions suitable for each chip component 8, and enabling efficient mounting of multiple chip components 8 on the substrate 7.

[0129] Furthermore, according to the mounting device 10E, when the multi-laser oscillator 25 includes a surface-emitting laser module 26, each beam constituting the multi-beam laser L5 can be densely 2D-oriented and output from the surface-emitting laser module 26. In addition, by controlling the intensity of each beam, a multi-beam laser L5 having a beam profile based on the predetermined mounting conditions can be output with high precision. Moreover, the laser head body 12E can be made into a compact form.

[0130] Furthermore, according to the implementation device 10E, even when the multi-laser oscillator 25 is configured to include an FBL module 27, the same effects as when it includes a surface-emitting laser module 26 can be obtained.

[0131] In the mounting device 10E, the multi-laser output unit 24 and the attachment tool 13 are arranged facing each other. However, in another embodiment, a configuration like that of the mounting device 10A shown in Figure 5 may be adopted. That is, in the laser head body 12E, a reflective mirror 21 may be arranged between the laser optical paths of the multi-laser output unit 24 and the attachment tool 13.

[0132] Furthermore, in the mounting device 10E, a multi-beam laser L5 is emitted from the multi-laser oscillator 25, and the emitted multi-beam laser L5 is irradiated simultaneously to all the chip components 8 held by the attachment tool 13. However, in another embodiment, a configuration such as the mounting device 10D shown in Figure 8 may be adopted.

[0133] In other words, the bonding head 11E may be further equipped with a scanning mechanism (similar to the scanning mechanism 22 in Figure 8) that scans the multi-beam laser L5, which is output from the multi-laser output unit 24 with the intensity of each beam variable, over multiple chip components 8. Furthermore, the multi-beam laser L5, which is arranged in one dimension from the multi-laser oscillator 25 and whose intensity of each beam is variable, may be emitted and scanned and irradiated onto the multiple chip components 8 held by the attachment tool 13 by the scanning mechanism.

[0134] With this configuration, the scanning mechanism can irradiate multiple chip components 8 with a line-shaped multi-beam laser L5, output from the multi-laser oscillator 25 with variable intensity for each beam to have a beam profile based on predetermined mounting conditions, while scanning. Therefore, multiple chip components 8 can be mounted on the substrate 7 simultaneously under mounting conditions suitable for each chip component 8, and the scanning irradiation enhances the effect of suppressing thermal damage to each chip component 8.

[0135] The present invention is not limited to the embodiments described above, and various modifications are possible, which are also included within the scope of the present invention. In the above embodiment (1), the bonding head 11 is moved in the Z-axis direction by the lifting unit 30 and the suction table 42 is moved in the XY plane by the stage mechanism 41, but the configuration for moving the bonding head 11 and the suction table 42 is not limited to this.

[0136] In another embodiment, the bonding head 11 may be configured to move in the XYZ axis direction, or the adsorption table 42 may be configured to move in the XYZ axis direction, or the bonding head 11 may move in the XY axis direction and the adsorption table 42 may move in the Z axis direction.

[0137] Furthermore, in the mounting apparatus 10 according to embodiment (1) above, the bonding head 11 is equipped with an attachment tool 13, and the attachment tool 13 is configured to hold a plurality of chip components 8. However, the bonding head 11 is not limited to this configuration. In another embodiment, the bonding head 11 may be configured without an attachment tool 13, or without a chip holding portion 13a. That is, in the mounting apparatus according to another embodiment, the lower surface (laser emission surface) of the bonding head 11 may be positioned opposite to the plurality of chip components 8 placed on the substrate 7, and a second laser L2, in which the first beam profile of the first laser L1 is varied to a second beam profile by an optical device 17, may be irradiated onto the plurality of chip components 8 placed on the substrate 7. This configuration is similarly applicable to the mounting apparatuses 10A, 10B, 10C, 10D, and 10E according to embodiments (2) to (6) above.

[0138] Furthermore, although the above embodiment described a case where the substrate 7 on which the multiple chip components 8 are mounted is a substrate for semiconductor packaging and the multiple chip components 8 are chiplets (IC dies), the types of substrate 7 and chip components 8 to which it can be applied are not limited to this. The substrate 7 may be various package substrates used for chiplet integration such as 2D mounting and 3D mounting, as well as substrates for mounting various electronic components, and the chip components 8 may be various electronic components in addition to chiplets. [Explanation of symbols]

[0139] 1. Semiconductor (IC) package 2 Main board 3 Sub-board 3a Through-hole 4 Bump 5 Chiplets 6 microbumps 7 circuit boards 8 chip components 9 Bump 10, 10A, 10B, 10C, 10D, 10E mounting equipment 11, 11A, 11B, 11C, 11D, 11E Bonding Heads 12, 12A, 12B, 12C, 12D, 12E Laser head main unit 13 Attachment Tools 13a Chip holding part 14, 14A laser output section 15, 15A laser oscillator 16, 16A Beam Profile Variable Section 17, 17A Optical Devices 18 Light transmission adjustment device 19. Spatial Light Modulation Devices 20 Light-reflecting devices 21 Reflective mirror 22 Scanning mechanism (scanning unit) 23 Scanning mirror 24 Multi-laser output section 25 Multi-Laser Oscillator 26-facet emitting laser module 27 Fiber laser module 30 Lifting Units 40 PCB stage 41 Stage mechanism 42 Adsorption Table 50, 50A, 50B, 50C, 50D, 50E Control Unit 51 Laser Oscillator Control Unit 52 Optical Device Control Unit 53 Lifting Unit Control Unit 54 Substrate Stage Control Unit 55 Scanning mirror control unit 56 Multi-laser oscillator control unit L1 First laser (first area laser) L3 First laser (first line laser) L2 Second laser (second area laser) L4 Second laser (second line laser) L5 Multibeam Laser 100 mounting device 101 Bonding Unit 102 Bonding Head 103 Attachment Tools 104 PCB Stage 105 Image recognition means 106 Chip components 107 circuit boards 200 Bonding equipment 201 Semiconductor Chips 202 circuit boards 203 Bonding Tools 204 Laser Head 231 Lifting mechanism 232 Horizontal movement mechanism 209 Optical Fiber 214 Laser Oscillator 216 Control device 220 Tip Tray 221 PCB mounting stage 222 Table

Claims

1. A mounting device for mounting chip components onto a substrate, The system includes a bonding head that irradiates multiple chip components with a laser to mount these multiple chip components onto the substrate, The bonding head, A mounting apparatus characterized by having a configuration that allows the beam profile of the laser to be varied so that regions with different irradiation intensities are formed within the irradiation area of ​​the laser for the plurality of chip components based on predetermined mounting conditions for each chip component.

2. The bonding head, The laser includes a laser output unit that outputs a first laser having a first beam profile, The mounting apparatus according to claim 1, further comprising a beam profile variable unit that varies the first laser to a second laser having a second beam profile based on predetermined mounting conditions.

3. The output unit of the laser, The first laser is a first area laser that is shaped so that the beam profile of the area including the plurality of chip components is uniform. The beam profile variable unit, The mounting apparatus according to claim 2, characterized in that the first area laser is variable to a second area laser having the second beam profile as the second laser.

4. The output unit of the laser, The first laser is a first line laser that is formed into a line shape having a uniform beam profile across the plurality of chip components, The beam profile variable unit, The second laser is a variable in which the first line laser is transformed into a second line laser having the second beam profile. The bonding head, The mounting apparatus according to claim 2, further comprising a scanning unit for scanning the second line laser over the plurality of chip components.

5. The beam profile variable unit, The mounting apparatus according to any one of claims 2 to 4, characterized in that it includes an optical device that varies the first beam profile to the second beam profile.

6. The bonding head includes an attachment tool for holding the plurality of chip components, The attachment tool is composed of a laser-transmitting member, The mounting apparatus according to claim 5, characterized in that the optical device is disposed on the laser-transmitting member.

7. The bonding head, The laser includes a multi-laser output unit that outputs multi-beam lasers arranged in one or two dimensions. The multi-laser output unit is The mounting device according to claim 1, characterized in that it is configured to output the intensity of each beam constituting the multi-beam laser in a variable manner so as to have a beam profile based on the predetermined mounting conditions.

8. The bonding head, The mounting apparatus according to claim 7, further comprising a scanning unit for scanning the multi-beam laser, which is output from the multi-laser output unit with the intensity of each beam variable, over the plurality of chip components.

9. A mounting method for mounting chip components onto a circuit board, The process includes a mounting step in which a laser is irradiated onto these multiple chip components using a bonding head to mount these multiple chip components onto the substrate, The implementation process is, A mounting method characterized by including a step of irradiating the plurality of chip components with a variable laser beam profile so that regions with different irradiation intensities are formed within the laser irradiation area of ​​the chip components based on predetermined mounting conditions for each chip component.

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