Light-emitting drive package and method for manufacturing the same

Abstract

To provide a light-emitting drive package and a method for manufacturing the same that can improve light efficiency. [Solution] The present invention relates to a light-emitting drive package and a method for manufacturing the same that can improve light efficiency while integrally packaging a light-emitting element and a drive element, and may include: a substrate on which a first pad portion and a second pad portion are formed; a drive element mounted on the first pad portion of the substrate; a light-emitting element mounted on the second pad portion of the substrate and emitting light when a drive signal is applied from the drive element; a first encapsulant formed on the substrate and molded into a wall shape; a second encapsulant that covers and protects at least a portion of the drive element; and a third encapsulant that covers and protects at least a portion of the light-emitting element.

Description

Technical Field

[0001] The present invention relates to a light-emitting driving package and a method for manufacturing the same, and more particularly, to a light-emitting driving package and a method for manufacturing the same that can improve light efficiency while integrally packaging a light-emitting element and a driving element.

Background Art

[0002] [[ID=,12]]Generally, a conventional light-emitting driving package has a configuration in which a substrate and a light-emitting element, or a substrate and a driving element, or the driving element and the light-emitting element must be wired in a complex path so that they can be electrically connected. This results in an increase in unit price, a decrease in quality, and many problems in the process.

[0003] In addition, in a conventional light-emitting driving package, since the driving element is directly exposed on the optical path, part of the light generated from the light-emitting element is absorbed by the driving element, greatly reducing the light efficiency. Also, since the heat generated from the light-emitting element and the driving element is not easily released, there is a problem that the durability and reliability are greatly reduced.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention is for solving various problems including the above problems. It separately partitions a portion for accommodating a driving element of a substrate and a portion for accommodating a light-emitting element, separates and seals each using various sealing materials, reduces the unit price and process of a product using a flip-chip type driving element and light-emitting element, greatly improves quality, durability and reliability, and aims to provide a light-emitting driving package and a method for manufacturing the same that can increase light efficiency. However, such problems are exemplary and do not limit the scope of the present invention.

Means for Solving the Problems

[0005] A light-emitting drive package according to the concept of the present invention for solving the above problems includes: a substrate on which a first pad portion and a second pad portion are formed; a drive element mounted on the first pad portion of the substrate; a light-emitting element mounted on the second pad portion of the substrate and emitting light when a drive signal is applied from the drive element; a first encapsulant formed on the substrate and molded into a wall shape; a second encapsulant covering and protecting at least a portion of the drive element; and a third encapsulant covering and protecting at least a portion of the light-emitting element.

[0006] Furthermore, according to the present invention, the substrate may be a lead frame made of a conductive material.

[0007] Furthermore, according to the present invention, the driving element is a flip-chip type driver IC (Display Driver Integrated Circuit), and the light-emitting element can include a flip-chip type red LED (Light Emitting Diode), a green LED, and a blue LED.

[0008] Furthermore, according to the present invention, the first sealing material may include an outer wall portion formed on the edge of the substrate and molded into a shape that is open at the top.

[0009] Furthermore, according to the present invention, the first sealing material may further include an inner wall portion that is molded between the first pad portion and the second pad portion of the substrate so as to separate the first cup portion that houses the drive element from the second cup portion that houses the light-emitting element.

[0010] Furthermore, according to the present invention, the second sealing material may be a light-blocking material or a reflective material that is molded or dispensed in a manner that surrounds at least a portion of the drive element, so as to prevent light generated from the light-emitting element from being absorbed by the drive element.

[0011] Furthermore, according to the present invention, the second sealing material may have a reflective surface formed in a portion of it, which is selected from at least one of the following: an inclined surface tilted in the direction of the light-emitting element, a flat surface, a concave surface, an asymmetrical convex surface, a symmetrical convex surface, and an inclined-concave-convex composite surface, so as to reflect the light generated from the light-emitting element upward.

[0012] Furthermore, according to the present invention, the third sealing material may be a translucent material that is molded or dispensed in a manner that surrounds at least a portion of the light-emitting element so that light generated from the light-emitting element can be emitted to the outside.

[0013] Furthermore, according to the present invention, the first sealing material may be a first resin material having a melting point at a first temperature, the second sealing material may be the first or second resin material having a melting point at a second temperature lower than or equal to the first temperature, and the third sealing material may be a third resin material having a melting point at a third temperature lower than or equal to the second temperature.

[0014] Furthermore, according to the present invention, the first encapsulant is selected from at least one or more of EMC (Epoxy Molding Compound), white EMC (WEMC, White Epoxy Molding Compound), PCT (Polycyclohexylene Terephthalate), PPA (Polyphthalamide), and combinations thereof; the second encapsulant is selected from at least one or more of white EMC (WEMC, White Epoxy Molding Compound), glass, quartz, ceramic, PMMA (PolyMethyl Methacrylate), polycarbonate, silicone resin, and combinations thereof; and the third encapsulant may be selected from at least one or more of transparent EMC, CMC (Clear Molding Compound Epoxy), silicone, epoxy, silicon oxide, and combinations thereof.

[0015] Furthermore, according to the present invention, the first sealing material and the second sealing material may be a white EMC (WEMC, White Epoxy Molding Compound) made of the same material and molded together as a single unit.

[0016] Furthermore, according to the present invention, the drive element is at least a portion of white EMC, and the second and third encapsulants are made of the same material and may be transparent EMC or CMC (Clear Molding Compound Epoxy) which are molded or dispensed together as a single unit.

[0017] On the other hand, a method for manufacturing a light-emitting drive package according to the concept of the present invention for solving the above problems may include: (a1) preparing a substrate on which a first pad portion and a second pad portion are formed; (b1) forming a wall-shaped first encapsulant on the substrate; (c1) mounting a drive element on the first pad portion of the substrate and mounting a light-emitting element that emits light when a drive signal is applied from the drive element on the second pad portion of the substrate; (d1) forming a second encapsulant that covers and protects at least a portion of the drive element; and (e1) forming a third encapsulant that covers and protects at least a portion of the light-emitting element.

[0018] Furthermore, according to the present invention, step (b1) involves molding the outer wall portion of the substrate in a shape that is open at the top, and simultaneously molding the inner wall portion between the first pad portion and the second pad portion of the substrate so as to separate the first cup portion for housing the drive element and the second cup portion for housing the light-emitting element.

[0019] Furthermore, according to the present invention, step (d1) can be performed by primary dispensing the second sealing material into the first cup portion housing the drive element, or by molding it.

[0020] Furthermore, according to the present invention, step (e1) can be performed by secondary dispensing or molding the third sealing material into the second cup portion that houses the light-emitting element.

[0021] Furthermore, according to the present invention, in steps (d1) and (e1), the second sealing material and the third sealing material are made of the same light-transmitting material, and the light-transmitting material can be used to cover and protect at least a portion of the driving element and at least a portion of the light-emitting element.

[0022] Furthermore, according to the present invention, in steps (d1) and (e1), the driving element may have at least a portion of white EMC.

[0023] On the other hand, a method for manufacturing a light-emitting drive package according to the concept of the present invention for solving the above problems may include: (a2) preparing a substrate on which a first pad portion and a second pad portion are formed; (b2) mounting a drive element on the first pad portion of the substrate; (c2) forming a wall-shaped first encapsulant and a second encapsulant that covers and protects at least a portion of the drive element on the substrate; (d2) mounting a light-emitting element that emits light when a drive signal is applied from the drive element on the second pad portion of the substrate; and (e2) forming a third encapsulant that covers and protects at least a portion of the light-emitting element.

[0024] Furthermore, according to the present invention, in step (c2), the first sealing material and the second sealing material may be a white EMC (WEMC, White Epoxy Molding Compound) made of the same material and molded together as a single unit. [Effects of the Invention]

[0025] According to an embodiment of the present invention made as described above, a portion for accommodating a driving element of a substrate and a portion for accommodating a light-emitting element are separately partitioned to prevent light generated from the light-emitting element from being absorbed by the driving element, thereby greatly increasing the light efficiency. By using a first sealing material, a second sealing material, and a third sealing material having different melting points to separately seal the light-emitting element and the driving element, and by improving the heat dissipation performance using flip-chip type driving elements and light-emitting elements, it is possible to reduce the unit price and manufacturing process of the product, and of course, to greatly improve the quality, durability, and reliability. Of course, the scope of the present invention is not limited by such effects.

Brief Description of the Drawings

[0026] [Figure 1] It is a perspective view showing a light-emitting driving package according to some embodiments of the present invention. [Figure 2] It is a cross-sectional view of the light-emitting driving package of FIG. 1. [Figure 3] It is a plan view of the light-emitting driving package of FIG. 1. [Figure 4] It is a cross-sectional view showing various embodiments of the second sealing material of the light-emitting driving package of FIG. 1. [Figure 5] It is a cross-sectional view showing the manufacturing process of the light-emitting driving package of FIG. 1 step by step. [Figure 6] It is a cross-sectional view showing the manufacturing process of the light-emitting driving package of FIG. 1 step by step. [Figure 7] It is a cross-sectional view showing the manufacturing process of the light-emitting driving package of FIG. 1 step by step. [Figure 8] It is a cross-sectional view showing the manufacturing process of the light-emitting driving package of FIG. 1 step by step. [Figure 9] It is a cross-sectional view showing the manufacturing process of the light-emitting driving package of FIG. 1 step by step. [Figure 10] It is a cross-sectional view showing a light-emitting driving package according to some other embodiments of the present invention. [Figure 11] It is a cross-sectional view showing the manufacturing process of the light-emitting driving package of FIG. 10 step by step. [Figure 12]Figure 10 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 13] Figure 10 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 14] Figure 10 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 15] Figure 10 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 16] A cross-sectional view showing a light-emitting drive package according to some yet other embodiments of the present invention. [Figure 17] Figure 16 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 18] Figure 16 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 19] Figure 16 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 20] Figure 16 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 21] Figure 16 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 22] Figure 16 is a cross-sectional view showing various embodiments of the second encapsulant of the light-emitting drive package. [Figure 23] A cross-sectional view showing a light-emitting drive package according to some yet other embodiments of the present invention. [Figure 24] Figure 23 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 25] Figure 23 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 26] Figure 23 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 27] Figure 23 is a cross-sectional view showing the manufacturing process of the light-emitting drive package in steps. [Figure 28] This flowchart shows a method for manufacturing a light-emitting drive package according to some embodiments of the present invention. [Figure 29] This flowchart shows a method for manufacturing a light-emitting drive package according to some other embodiments of the present invention. [Modes for carrying out the invention]

[0027] Hereinafter, various preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0028] The embodiments of the present invention are provided to further and completely illustrate the invention to those who are ordinary skill in the art, and the embodiments described below can be modified in various other forms, and the scope of the invention is not limited to the embodiments described below. Rather, these embodiments are provided to further enrich and complete the disclosure and to fully convey the idea of ​​the invention to those skilled in the art. Also, the thickness and size of each layer in the drawings are exaggerated for the sake of clarity and ease of explanation.

[0029] Throughout this specification, where it is stated that one component, such as a film, region, or substrate, is located "on top of," "connected to," "stacked on," or "coupled to" another component, it may be interpreted that the one component is in direct contact with, or interposed between, another component. Conversely, where it is stated that one component is located "directly on," "directly connected to," or "directly coupled to" another component, it is interpreted that there is no other component interposed between them. The same reference numerals refer to the same element. As used herein, the term "and / or" includes any one and all combinations of the items enumerated.

[0030] In this specification, terms such as “first,” “second,” etc., are used to describe various members, parts, regions, layers, and / or parts, but it is obvious that these members, parts, regions, layers, and / or parts should not be limited by these terms. These terms are used solely to distinguish one member, part, region, layer, or part from another region, layer, or part. Accordingly, the first member, part, region, layer, or part detailed below may refer to the second member, part, region, layer, or part without departing from the teachings of the present invention.

[0031] Figure 1 is a perspective view showing a light-emitting drive package 100 according to several embodiments of the present invention, Figure 2 is a cross-sectional view of the light-emitting drive package 100 of Figure 1, and Figure 3 is a plan view of the light-emitting drive package 100 of Figure 1.

[0032] First, as shown in Figures 1 to 3, the light-emitting drive package 100 according to some embodiments of the present invention can be broadly classified to include a substrate 10, a drive element 20, a light-emitting element 30, and a encapsulating material 40.

[0033] The substrate 10 has, for example, a first pad portion 10a corresponding to the terminals of the driving element 20 and a second pad portion 10b corresponding to the terminals of the light-emitting element 30. More specifically, the substrate 10 may be a lead frame formed by cutting a strip made of a conductive material.

[0034] However, the substrate 10 is not necessarily limited to this, and a wide variety of substrates, such as metal substrates, ceramic substrates, and printed circuit boards, can all be used.

[0035] The driving element 20 is, for example, mounted on the first pad portion 10a of the substrate 10, and more specifically, it may be a flip-chip type driver IC (Display Driver Integrated Circuit).

[0036] The driving element 20 may be, for example, a driver IC with one or more channels that drives at least one light-emitting element 30, and may include at least one display driving integrated circuit (DDIC).

[0037] In other words, the driving element 20 may be, for example, a driving component such as a driver IC with one or more channels that is electrically connected to the light-emitting element 30 via the substrate 10 and drives the light-emitting element 30.

[0038] The driving element 20 may include, for example, a driving chip containing a driving circuit manufactured using a semiconductor process, and a packaging member (molding material) that covers and protects the driving chip. The driving circuit may have various forms of circuits that supply power to the light-emitting element 30, control the driving voltage, process feedback signals, control the driving brightness of the light-emitting element 30, and correct the light intensity of the light-emitting element 30 to match the reference light intensity of other light-emitting elements.

[0039] However, such drive elements 20 are not necessarily limited to those shown in the drawings, and may be formed into a wide variety of three-dimensional shapes depending on the package specifications, type, and shape.

[0040] The light-emitting element 30 is, for example, mounted on the second pad portion 10b of the substrate 10 and emits light when a drive signal is applied from the drive element 20. More specifically, the light-emitting element 30 may include flip-chip type red LEDs (R-LEDs) (Light Emitting Diodes), green LEDs (G-LEDs), and blue LEDs (B-LEDs).

[0041] The light-emitting element 30 is, for example, a light output element arranged on one side of the substrate 10, and more specifically, it may be an LED, micro-LED, or mini-LED capable of forming a single display pixel.

[0042] The light-emitting element 30 may be, for example, a flip-chip LED (Light Emitting Diode) with terminals formed on its lower surface.

[0043] The sealing material 40 may be, for example, a type of packaging member (molding member) that can cover and protect at least a portion of the substrate 10, the driving element 20, and the light-emitting element 30.

[0044] More specifically, the encapsulant 40 may include a first encapsulant 41 formed on the substrate 10 and shaped into a wall, a second encapsulant 42 that covers and protects at least a portion of the drive element 20, and a third encapsulant 43 that covers and protects at least a portion of the light-emitting element 30.

[0045] The first encapsulant 41 may include, for example, an outer wall portion 411 formed in a square ring shape on the edge of the substrate 10 and molded to have an open top and bottom, as shown in Figures 1 and 2, and an inner wall portion 412 molded between the first pad portion 10a and the second pad portion 10b of the substrate 10 so as to separate the first cup portion A that houses the drive element 20 and the second cup portion B that houses the light-emitting element 30.

[0046] More specifically, the first encapsulant 41 is a first resin material having a melting point at a first temperature, and may consist of at least one or more of the following: EMC (Epoxy Molding Compound), White EMC (WEMC, White Epoxy Molding Compound), PCT (Polycyclohexylene Terephthalate), PPA (Polyphthalamide), and combinations thereof.

[0047] However, the first sealing material 41 is not necessarily limited to this, and a wide variety of resin materials of many different forms and types can all be applied.

[0048] The second sealing material 42 may be a light-blocking or reflective material, which is molded or dispensed in a manner that surrounds at least a portion of the drive element 20, for example, as shown in Figure 2, so as to prevent light generated from the light-emitting element 30 from being absorbed by the drive element 20.

[0049] More specifically, the second sealing material 42 may be a first or second resin material having a melting point at a second temperature lower than or equal to the first temperature, and may consist of at least one or more of the following: white EMC (WEMC, White Epoxy Molding Compound), glass, quartz, ceramic, PMMA (PolyMethyl Methacrylate), polycarbonate, silicone resin, and combinations thereof.

[0050] However, the second sealing material 42 is not necessarily limited to this, and a wide variety of resin materials of many different forms and types can all be applied.

[0051] The third sealing material 43 may be a translucent material that is molded or dispensed in a manner that surrounds at least a portion of the light-emitting element 30 so that light generated from the light-emitting element 30 can be emitted to the outside.

[0052] More specifically, the third encapsulant 43 may be a third resin material having a melting point at a third temperature lower than or equal to the second temperature, and may consist of at least one of the following: transparent EMC, CMC (Clear Molding Compound Epoxy), silicon, epoxy, silicon oxide, and combinations thereof.

[0053] Here, when the second sealant 42 is molded or dispensed, the first temperature, which is the melting point of the first sealant 41, is the highest, and the second temperature, which is the melting point of the second sealant 42, is lower than the first temperature, so that the first sealant 41 does not melt. When the third sealant 43 is molded or dispensed, the third temperature, which is the melting point of the third sealant 43, may be lower than the second temperature so that the second sealant 42 does not melt.

[0054] Figure 4 is a cross-sectional view showing various embodiments of the second encapsulant 42 of the light-emitting drive package 100 shown in Figure 1.

[0055] As shown in Figure 4, the second sealing material 42 of the light-emitting drive package 100 according to some embodiments of the present invention can be formed in various forms, and of course, it can include a reflective surface in which an inclined surface 421 is formed in part on a part of it that is inclined toward the direction of the light-emitting element 30, as shown in Figure 4(d), so as to reflect the light generated from the light-emitting element 30 upward, but in addition, a wide variety of reflective surface forms are applicable, such as a reflective surface in which a flat surface 422 is formed, as shown in Figure 4(a), a reflective surface in which a concave surface 423 is formed, as shown in Figure 4(b), a reflective surface in which an asymmetrical convex surface 424 is formed, one side being higher and the other lower, as shown in Figure 4(c), a reflective surface in which symmetrical convex surfaces 425 are formed on both sides that are the same height, as shown in Figure 4(e), and a reflective surface in which a three-dimensional inclined-concave-convex composite surface 426 is formed, as shown in Figure 4(f).

[0056] Therefore, according to the present invention, by separately partitioning the first cup portion A that houses the drive element 20 of the substrate 10 and the second cup portion B that houses the light-emitting element 30, it is possible to prevent light generated from the light-emitting element 30 from being absorbed by the drive element 20, thereby greatly increasing the light efficiency. Furthermore, by using first sealing material 41, second sealing material 42, and third sealing material 43, which have different melting points, to seal the light-emitting element 30 and the drive element 20 respectively, and by using a flip-chip type drive element 20 and light-emitting element 30 to improve heat dissipation performance, it is possible to reduce the unit cost and process of the product, as well as greatly improve quality, durability, and reliability.

[0057] Figures 5 to 9 are cross-sectional views showing the manufacturing process of the light-emitting drive package 100 of Figure 1 in steps.

[0058] As shown in Figures 5 to 9, the manufacturing process of a light-emitting drive package 100 according to some embodiments of the present invention can be described as follows: First, as shown in Figure 5, a substrate 10 on which a first pad portion 10a and a second pad portion 10b are formed can be prepared.

[0059] In this case, the substrate 10 may be formed in the form of an uncut lead frame strip, but is not necessarily limited to this, and a wide variety of substrate forms are all applicable.

[0060] Next, as shown in Figure 6, a wall-shaped first encapsulant 41 can be formed on the substrate 10.

[0061] At this time, using a mold or the like, the outer wall portion 411 can be molded into an open shape at the edge of the substrate 10, and at the same time, the inner wall portion 412 can be molded between the first pad portion 10a and the second pad portion 10b of the substrate 10 so as to separate the first cup portion A that houses the drive element 20 from the second cup portion B that houses the light-emitting element 30.

[0062] Next, as shown in Figure 7, solder paste can be printed onto the first pad portion 10a and the second pad portion 10b of the substrate 10, the drive element 20 can be mounted on the first pad portion 10a, and the light-emitting element 30, which emits light when a drive signal is applied from the drive element 20, can be mounted on the second pad portion 10b.

[0063] In this case, the solder paste can be printed onto the first pad portion 10a and the second pad portion 10b using a 3D printer. However, it is not necessarily limited to this, and the solder paste can be applied or dispensed in a wide variety of ways.

[0064] Next, as shown in Figure 8, a second sealing material 42 can be formed to cover and protect at least a portion of the drive element 20.

[0065] At this time, the second sealing material 42 can be either primary-dispensed into the first cup portion A that houses the drive element 20, or molded into place.

[0066] Next, as shown in Figure 9, a third sealing material 43 can be formed to cover and protect at least a portion of the light-emitting element 30.

[0067] At this time, the third sealing material 43 can be secondarily dispensed into the second cup portion B that houses the light-emitting element 30, or it can be molded.

[0068] Subsequently, the substrate 10 in the form of a lead frame strip can be cut and individualized.

[0069] Figure 10 is a cross-sectional view showing a light-emitting drive package 200 according to some other embodiments of the present invention.

[0070] As shown in Figure 10, the first encapsulant 41 and the second encapsulant 42 of the light-emitting drive package 200 according to some other embodiments of the present invention may be made of the same material as each other and molded together as a single unit, and may be white Epoxy Molding Compound (WEMC).

[0071] Figures 11 to 15 are cross-sectional views showing the manufacturing process of the light-emitting drive package 200 of Figure 10 in steps.

[0072] As shown in Figures 11 to 15, the manufacturing process of a light-emitting drive package 200 according to some other embodiments of the present invention will be described as follows: First, as shown in Figure 11, a substrate 10 on which a first pad portion 10a and a second pad portion 10b are formed is prepared, and as shown in Figure 12, solder paste is printed onto the first pad portion 10a of the substrate 10, and the drive element 20 can be mounted.

[0073] Next, as shown in Figure 13, a wall-shaped first encapsulant 41 and a second encapsulant 42 that covers and protects at least a portion of the drive element 20 can be simultaneously molded onto the substrate 10.

[0074] In this case, the first sealing material 41 and the second sealing material 42 may be made of the same material and molded together as a single unit, and may be white EMC (WEMC, White Epoxy Molding Compound).

[0075] Next, as shown in Figure 14, solder paste is printed onto the second pad portion 10b of the substrate 10, and a light-emitting element 30 that emits light when a drive signal is applied from the drive element 20 is mounted. Then, as shown in Figure 15, a third encapsulating material 43 that covers and protects at least a portion of the light-emitting element 30 can be molded or dispensed.

[0076] Therefore, by using the first encapsulating material 41 and the second encapsulating material 42 made of the same material, it is possible to prevent the light generated from the light-emitting element 30 from being absorbed by the driving element 20, thereby greatly increasing the light efficiency.

[0077] Figure 16 is a cross-sectional view showing a light-emitting drive package 300 according to some yet other embodiments of the present invention.

[0078] As shown in Figure 16, some yet other embodiments of the present invention may be light-emitting drive packages 300 in which the inner wall portion 411 (see Figure 2) of the first sealing material 41 described above is omitted.

[0079] Here, the second sealing material 42 may be formed in a shape resembling a water droplet, covering and protecting the drive element 20.

[0080] Figures 17 to 21 are cross-sectional views showing the manufacturing process of the light-emitting drive package 300 shown in Figure 16 in steps.

[0081] As shown in Figures 17 to 21, the manufacturing process of a light-emitting drive package 300 according to some further embodiments of the present invention can be described as follows: First, as shown in Figure 17, a substrate 10 on which a first pad portion 10a and a second pad portion 10b are formed can be prepared.

[0082] Next, as shown in Figure 18, a wall-shaped first encapsulant 41 can be formed on the substrate 10.

[0083] At this time, using a mold or the like, only the outer wall portion 411 of the substrate 10 can be molded into a shape with the top open.

[0084] Next, as shown in Figure 19, solder paste can be printed onto the first pad portion 10a and the second pad portion 10b of the substrate 10, the drive element 20 can be mounted on the first pad portion 10a, and the light-emitting element 30, which emits light when a drive signal is applied from the drive element 20, can be mounted on the second pad portion 10b.

[0085] In this case, the solder paste can be printed onto the first pad portion 10a and the second pad portion 10b using a 3D printer. However, it is not necessarily limited to this, and the solder paste can be applied or dispensed in a wide variety of ways.

[0086] Next, as shown in Figure 20, a second sealing material 42 can be formed to cover and protect at least a portion of the drive element 20.

[0087] Next, as shown in Figure 21, a third sealing material 43 can be formed to cover and protect at least a portion of the light-emitting element 30.

[0088] Therefore, by using the second sealing material 42, it is possible to prevent the light generated from the light-emitting element 30 from being absorbed by the driving element 20, thereby greatly increasing the light efficiency.

[0089] Figure 22 is a cross-sectional view showing various embodiments of the second encapsulant 42 of the light-emitting drive package 300 shown in Figure 16.

[0090] As shown in Figure 22(a), the second sealing material 42 may be formed in a shape that resembles a lens, covering and protecting the drive element 20, or as shown in Figure 18(b), the second sealing material 42 may be formed in a shape that resembles an inclined surface, covering and protecting the drive element 20.

[0091] However, such a second sealing material 42 is not limited to the drawings and may be formed in a wide variety of other forms.

[0092] Figure 23 is a cross-sectional view showing a light-emitting drive package 400 according to some yet other embodiments of the present invention.

[0093] As shown in Figure 23, in some yet other embodiments of the present invention, the drive element 20 of the light-emitting drive package 400 may be packaged in white EMC in at least a portion of the molding material surrounding the drive chip, and the second encapsulant 42 and the third encapsulant 43 may be made of the same material as each other and molded or dispensed together as a single unit, and may be made of clear EMC or CMC (Clear Molding Compound Epoxy).

[0094] Therefore, by using a drive element 20 packaged in a white EMC material molding material, it is possible to prevent light generated from the light-emitting element 30 from being absorbed by the drive element 20, thereby greatly increasing the light efficiency.

[0095] Figures 24 to 27 are cross-sectional views showing the manufacturing process of the light-emitting drive package 400 shown in Figure 23 in steps.

[0096] As shown in Figures 24 to 27, the manufacturing process of a light-emitting drive package 400 according to some further embodiments of the present invention can be described as follows: First, as shown in Figure 24, a substrate 10 on which a first pad portion 10a and a second pad portion 10b are formed can be prepared.

[0097] Next, as shown in Figure 25, a wall-shaped first encapsulant 41 can be formed on the substrate 10.

[0098] At this time, using a mold or the like, only the outer wall portion 411 of the substrate 10 can be molded into a shape with the top open.

[0099] Next, as shown in Figure 26, solder paste can be printed onto the first pad portion 10a and the second pad portion 10b of the substrate 10, a drive element 20 packaged in a white EMC material molding material can be mounted on the first pad portion 10a, and a light-emitting element 30 that emits light when a drive signal is applied from the drive element 20 can be mounted on the second pad portion 10b.

[0100] In this case, the solder paste can be printed onto the first pad portion 10a and the second pad portion 10b using a 3D printer. However, it is not necessarily limited to this, and the solder paste can be applied or dispensed in a wide variety of ways.

[0101] Next, as shown in Figure 27, a second sealing material 42 that covers and protects at least a portion of the drive element 20 and a third sealing material 43 that covers and protects at least a portion of the light-emitting element 30 can be formed simultaneously.

[0102] Therefore, by using a drive element 20 packaged in a white EMC material molding material, it is possible to prevent light generated from the light-emitting element 30 from being absorbed by the drive element 20, thereby greatly increasing the light efficiency.

[0103] Figure 28 is a flowchart showing the manufacturing method of several embodiments of the present invention of light-emitting drive packages 100, 300, and 400.

[0104] As shown in Figures 1 to 28, a method for manufacturing light-emitting drive packages 100, 300, 400 according to some embodiments of the present invention may include: (a1) preparing a substrate 10 on which a first pad portion 10a and a second pad portion 10b are formed; (b1) forming a wall-shaped first encapsulant 41 on the substrate 10; (c1) printing solder paste on the first pad portion 10a and the second pad portion 10b of the substrate 10, mounting a drive element 20 on the first pad portion 10a, and mounting a light-emitting element 30 that emits light when a drive signal is applied from the drive element 20 on the second pad portion 10b; (d1) forming a second encapsulant 42 that covers and protects at least a portion of the drive element 20; and (e1) forming a third encapsulant 43 that covers and protects at least a portion of the light-emitting element 30.

[0105] Here, step (b1) involves molding the outer wall portion 411 of the substrate 10 in a shape that is open at the top, and simultaneously molding the inner wall portion 412 between the first pad portion 10a and the second pad portion 10b of the substrate 10 so as to separate the first cup portion A that houses the drive element 20 from the second cup portion B that houses the light-emitting element 30.

[0106] Furthermore, step (d1) can involve primary dispensing or molding the second sealing material 42 into the first cup portion A that houses the drive element 20.

[0107] Furthermore, step (e1) can involve secondary dispensing or molding the third sealing material 43 into the second cup portion B that houses the light-emitting element 30.

[0108] On the other hand, in steps (d1) and (e1), the second sealing material 42 and the third sealing material 43 are made of the same light-transmitting material, and the light-transmitting material can be used to cover and protect at least a portion of the drive element 20 and at least a portion of the light-emitting element 30.

[0109] Furthermore, in steps (d1) and (e1), at least a portion of the drive element 20 may be white EMC.

[0110] Figure 29 is a flowchart showing a method for manufacturing a light-emitting drive package 200 according to some other embodiments of the present invention.

[0111] As shown in Figures 1 to 29, a method for manufacturing a light-emitting drive package 200 according to some other embodiments of the present invention may include: (a2) preparing a substrate 10 on which a first pad portion 10a and a second pad portion 10b are formed; (b2) printing solder paste onto the first pad portion 10a of the substrate 10 and mounting the drive element 20; (c2) forming a wall-shaped first encapsulant 41 and a second encapsulant 42 that covers and protects at least a portion of the drive element 20 on the substrate 10; (d2) printing solder paste onto the second pad portion 10b of the substrate 10 and mounting a light-emitting element 30 that emits light when a drive signal is applied from the drive element 20; and (e2) forming a third encapsulant 43 that covers and protects at least a portion of the light-emitting element 30.

[0112] Here, in step (c2), the first encapsulant 41 and the second encapsulant 42 may be a white Epoxy Molding Compound (WEMC) made of the same material and molded together as a single unit.

[0113] Although the present invention has been described with reference to the embodiments shown in the drawings, these are merely illustrative, and a person with ordinary skill in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention must be determined by the technical idea of ​​the appended claims. [Explanation of symbols]

[0114] 10 circuit boards 10a First pad section 10b Second pad section 20 Driving element 30 light-emitting elements R-LED Red LED G-LED Green LED B-LED Blue LED 40 Sealing material 41. First sealing material 411 Outer wall 412 Inner wall A. First Cup Section B. Second Cup Section 42. Second sealing material 421 Slope 422 plane 423 Concave 424 Asymmetrical convex surface 425 Symmetrical convex surface 426. Composite surface with inclination, concave, and convex shapes. 43 Third sealing material 100, 200, 300, 400 luminescence drive package

Claims

1. A substrate on which the first pad portion and the second pad portion are formed, A drive element mounted on the first pad portion of the substrate, A light-emitting element is mounted on the second pad portion of the substrate and emits light when a drive signal is applied from the drive element, A first encapsulant is formed on the substrate and shaped into a wall-like structure, A second sealing material that covers and protects at least a portion of the drive element, A light-emitting drive package comprising a third sealing material that covers and protects at least a portion of the light-emitting element.

2. The light-emitting drive package according to claim 1, wherein the substrate is a lead frame made of a conductive material.

3. The aforementioned driving element is a flip-chip type driver integrated circuit (IC). The light-emitting element of the light-emitting element includes a flip-chip type red LED (Light Emitting Diode), a green LED, and a blue LED, as described in claim 1, for the light-emitting drive package.

4. The first sealing material is, The light-emitting drive package according to claim 1, comprising an outer wall portion formed on the edge of the substrate and molded into a shape with an open top.

5. The first sealing material is, The light-emitting drive package according to claim 4, further comprising an inner wall portion molded between the first pad portion and the second pad portion of the substrate so as to separate the first cup portion for housing the drive element and the second cup portion for housing the light-emitting element.

6. The second sealing material is, The light-emitting drive package according to claim 1, wherein the light-emitting element is molded or dispensed in a manner that surrounds at least a portion of the drive element, so as to prevent light generated from the light-emitting element from being absorbed by the drive element, and is made of a light-blocking or reflective material.

7. The second sealing material is, The light-emitting drive package according to claim 6, wherein a reflective surface is formed in a portion of it, selected from at least one of the following: an inclined surface tilted in the direction of the light-emitting element, a flat surface, a concave surface, an asymmetrical convex surface, a symmetrical convex surface, and an inclined-concave-convex composite surface, so that the light generated from the light-emitting element can be reflected upward.

8. The third sealing material is, The light-emitting drive package according to claim 1, wherein the light-emitting material is a translucent material that is molded or dispensed in a manner that surrounds at least a portion of the light-emitting element so that light generated from the light-emitting element can be emitted to the outside.

9. The first sealing material is a first resin material having a melting point at a first temperature. The second sealing material is the first resin material or the second resin material having a melting point at a second temperature lower than or equal to the first temperature. The light-emitting drive package according to claim 1, wherein the third sealing material is a third resin material having a melting point at a third temperature lower than or equal to the second temperature.

10. The first encapsulant comprises at least one or more of the following: EMC (Epoxy Molding Compound), White EMC (WEMC, White Epoxy Molding Compound), PCT (Polycyclohexylene Terephalate), PPA (Polyphalamide), and combinations thereof. The second sealing material comprises at least one or more of the following: white EMC (WEMC, White Epoxy Molding Compound), glass, quartz, ceramic, PMMA (PolyMethyl Methacrylate), polycarbonate, silicone resin, and combinations thereof. The light-emitting drive package according to claim 9, wherein the third encapsulant is selected from at least one or more of transparent EMC, CMC (Clear Molding Compound Epoxy), silicon, epoxy, silicon oxide, and combinations thereof.

11. The light-emitting drive package according to claim 1, wherein the first encapsulant and the second encapsulant are made of the same material and are molded together as a single unit to form a white EMC (WEMC, White Epoxy Molding Compound).

12. The aforementioned driving element is at least partially white EMC, The light-emitting drive package according to claim 1, wherein the second and third encapsulating materials are made of the same material and are molded or dispensed together as a single unit, and are transparent EMC or CMC (Clear Molding Compound Epoxy).

13. (a1) A step of preparing a substrate on which the first pad portion and the second pad portion are formed, (b1) The step of forming a wall-shaped first encapsulant on the substrate, (c1) The steps of mounting a drive element on the first pad portion of the substrate and mounting a light-emitting element that emits light when a drive signal is applied from the drive element on the second pad portion of the substrate, (d1) The step of forming a second sealing material that covers and protects at least a portion of the drive element, A method for manufacturing a light-emitting drive package, comprising the step of (e1) forming a third sealing material that covers and protects at least a portion of the light-emitting element.

14. Step (b1) above is, A method for manufacturing a light-emitting drive package according to claim 13, wherein the outer wall portion of the substrate is molded to the edge of the substrate in a shape that is open at the top, and at the same time, the inner wall portion is molded between the first pad portion and the second pad portion of the substrate so as to separate the first cup portion for housing the drive element and the second cup portion for housing the light-emitting element.

15. The (d1) step is, A method for manufacturing a light-emitting drive package according to claim 14, wherein the second sealing material is primary dispensed into the first cup portion housing the drive element or molded.

16. Step (e1) above is, A method for manufacturing a light-emitting drive package according to claim 15, wherein the third sealing material is secondarily dispensed into the second cup portion that houses the light-emitting element, or molded.

17. In steps (d1) and (e1) above, The method for manufacturing a light-emitting drive package according to claim 13, wherein the second and third encapsulating materials are made of the same light-transmitting material, and the light-transmitting material is used to cover and protect at least a portion of the drive element and at least a portion of the light-emitting element.

18. In steps (d1) and (e1) above, The method for manufacturing a light-emitting drive package according to claim 17, wherein at least a portion of the drive element is white EMC.

19. (a2) A step of preparing a substrate on which the first pad portion and the second pad portion are formed, (b2) The step of mounting the drive element on the first pad portion of the substrate, (c2) The step of forming a wall-shaped first encapsulant on the substrate and a second encapsulant that covers and protects at least a portion of the drive element, (d2) The step of mounting a light-emitting element that emits light when a drive signal is applied from the drive element to the second pad portion of the substrate, A method for manufacturing a light-emitting drive package, comprising the step of (e) forming a third sealing material that covers and protects at least a portion of the light-emitting element.

20. In step (c2) above, A method for manufacturing a light-emitting drive package according to claim 19, wherein the first encapsulant and the second encapsulant are made of the same material and are molded together as a single unit to form a white EMC (WEMC, White Epoxy Molding Compound).

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