Semiconductor chips and semiconductor packages containing them

Abstract

The present invention provides a semiconductor chip with improved adhesion to the molding layer and a semiconductor package containing the same. [Solution] The semiconductor substrate includes a first surface and a second surface facing it; a wiring structure disposed on the first surface of the semiconductor substrate; a plurality of through electrodes extending from the first surface to the second surface of the semiconductor substrate; a plurality of chip pads disposed on the second surface of the semiconductor substrate and electrically connected to the plurality of through electrodes; and a passivation layer disposed on the second surface of the semiconductor substrate, in contact with the sides of the plurality of chip pads, and including an insulating layer and an oxide layer disposed on the insulating layer, wherein the insulating layer of the passivation layer includes an insulating pattern having a first width in the horizontal direction, and the oxide layer of the passivation layer includes a first oxide pattern having a second width in the horizontal direction, the first width being greater than the second width.

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