Processing liquid supply device, substrate processing system, processing liquid supply method, and substrate processing method

Abstract

The present invention provides a processing liquid supply device, a substrate processing system, a processing liquid supply method, and a substrate processing method that can reduce the particle content of the processing liquid. [Solution] The substrate processing apparatus 200 selectively transitions between a preparation state in which no processing liquid is introduced into the processing unit 260 that processes the substrate, and an execution state in which substrate processing can be performed by introducing the processing liquid into the processing unit 260. In the processing liquid supply device 100, the processing liquid is circulated by the circulation pipe 40. When the substrate processing apparatus 200 is in the execution state, the operating mode of the valve unit 120 is switched to a fine adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe 40 with relatively high precision. After the substrate processing apparatus 200 transitions to the preparation state, the operating mode of the valve unit 120 is switched to a coarse adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe 40 with relatively low precision.

Description

Technical Field

[0001] The present invention relates to a processing liquid supply device for supplying a processing liquid, a substrate processing system, a processing liquid supply method, and a substrate processing method.

Background Art

[0002] In order to perform various processes on substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, or solar cell substrates, a substrate processing apparatus is used. The substrate processing apparatus processes the substrate using the processing liquid supplied by the processing liquid supply device.

[0003] For example, in the substrate processing apparatus described in Patent Document 1, the processing liquid stored in the storage unit is supplied through the processing liquid pipe. A part of the processing liquid supplied through the processing liquid pipe is returned to the storage unit through the first return pipe. Another part of the processing liquid supplied through the processing liquid pipe is returned to the storage unit through the second return pipe. A part of the processing liquid flowing through the second return pipe is supplied to the processing unit through the branch supply pipe. In the processing unit, the substrate is processed with the processing liquid.

[0004] The processing liquid used for substrate processing is required to have a low particle content. Therefore, in the above-described substrate processing apparatus, a filter and a first flow meter are arranged in the processing liquid pipe. Also, a relief valve whose opening degree can be controlled by air pressure is arranged in the first return pipe. Based on the flow rate or pressure of the processing liquid measured by the first flow meter, the opening degree of the relief valve is controlled so that the filter exhibits a predetermined capture ability. Thereby, a processing liquid with a low particle content can be supplied to the processing unit.

Prior Art Documents

Patent Documents

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-145539 [Overview of the project] [Problems that the invention aims to solve]

[0006] In recent years, semiconductor devices have become smaller. Therefore, it is expected that further reductions in the particle content of processing solutions will be required in the future.

[0007] The object of the present invention is to provide a processing liquid supply device, a substrate processing system, a processing liquid supply method, and a substrate processing method that can reduce the particle content of the processing liquid. [Means for solving the problem]

[0008] A processing liquid supply device according to one aspect of the present invention is a processing liquid supply device that supplies a processing liquid to a substrate processing device that processes a substrate using a processing liquid, wherein the substrate processing device selectively transitions between a preparation state in which no processing liquid is introduced into a processing unit for processing the substrate and an execution state in which substrate processing can be performed by introducing a processing liquid into the processing unit, and the processing liquid supply device comprises a circulation pipe for circulating the processing liquid, a valve unit that selectively operates in a fine adjustment mode for adjusting the flow rate of the processing liquid flowing through the circulation pipe with a first precision and a coarse adjustment mode for adjusting the flow rate of the processing liquid flowing through the circulation pipe with a second precision lower than the first precision, and a control unit that controls the valve unit to operate in the fine adjustment mode when the substrate processing device is in the execution state and to operate in the coarse adjustment mode at a point after the substrate processing device has transitioned to the preparation state.

[0009] A substrate processing method according to another aspect of the present invention is a method for supplying a processing liquid to a substrate processing apparatus that processes a substrate using a processing liquid, wherein the substrate processing apparatus selectively transitions between a preparation state in which no processing liquid is introduced into a processing unit for processing the substrate and an execution state in which substrate processing can be performed by introducing a processing liquid into the processing unit, and the processing liquid supply method includes circulating the processing liquid through a circulation pipe, switching the operating mode of a valve unit to a fine adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe with a first precision when the substrate processing apparatus is in the execution state, and switching the operating mode of the valve unit to a coarse adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe with a second precision lower than the first precision at a point after the substrate processing apparatus has transitioned to the preparation state. [Effects of the Invention]

[0010] According to the present invention, it becomes possible to reduce the particle content of the processing liquid. [Brief explanation of the drawing]

[0011] [Figure 1] This figure shows the configuration of a substrate processing system according to the first embodiment of the present invention. [Figure 2] Figure 1 is a side view showing the internal configuration of the processing chamber. [Figure 3] This is a block diagram of a substrate processing system illustrating the configuration of the processing liquid supply device shown in Figure 1. [Figure 4] Figure 3 is a block diagram showing the configuration of the valve unit. [Figure 5] Figure 4 is a time chart showing an example of the operation of the valve unit. [Figure 6] This diagram shows the configuration of the control device shown in Figure 3. [Figure 7] Figure 6 is a flowchart showing the algorithm for substrate processing using the control device. [Figure 8] This is a block diagram of a substrate processing system illustrating the configuration of a processing liquid supply device in a second embodiment of the present invention. [Figure 9] Figure 8 is a block diagram showing the configuration of the valve unit. [Figure 10] Figure 9 is a time chart showing an example of the operation of the valve unit. [Figure 11] This diagram shows the configuration of the control device shown in Figure 9. [Figure 12] Figure 11 shows a flowchart of the substrate processing algorithm by the control device. [Modes for carrying out the invention]

[0012] 1. First Embodiment (1) Substrate processing system Hereinafter, a processing liquid supply device, a substrate processing system, a processing liquid supply method, and a substrate processing method according to one embodiment of the present invention will be described with reference to the drawings. In the following description, "substrate" refers to a substrate for a Flat Panel Display (FPD), semiconductor substrate, optical disk substrate, magnetic disk substrate, magneto-optical disk substrate, photomask substrate, ceramic substrate, or solar cell substrate used in liquid crystal display devices or organic EL (Electro Luminescence) display devices, etc.

[0013] Figure 1 is a diagram showing the configuration of a substrate processing system according to the first embodiment of the present invention. In Figure 1 and Figure 2, which will be described later, arrows indicating the mutually orthogonal X, Y, and Z directions are added to clarify the positional relationships. The X and Y directions are mutually orthogonal in the horizontal plane, and the Z direction corresponds to the vertical direction. As shown in Figure 1, the substrate processing system 300 comprises a processing liquid supply device 100, a substrate processing device 200, a control device 310, a processing liquid source 320, a gas source 330, and a waste liquid device 340. Figure 1 mainly shows a schematic plan view of the substrate processing device 200.

[0014] In the present embodiment, the substrate processing apparatus 200 is a substrate cleaning apparatus that performs a cleaning process on a substrate W to be processed by supplying a processing liquid to the substrate W, and operates according to a predetermined schedule. As the processing liquid, for example, a cleaning liquid such as IPA (isopropyl alcohol) or thinner is used. The processing liquid supply apparatus 100 prepares the processing liquid supplied by the processing liquid source 320 and supplies it to the substrate processing apparatus 200. Details of the processing liquid supply apparatus 100 will be described later.

[0015] The control device 310 includes, for example, a CPU (Central Processing Unit) and a memory. A substrate processing program for controlling the operation of the substrate processing system 300 is stored in the memory of the control device 310. The CPU of the control device 310 controls the operations of the processing liquid supply apparatus 100 and the substrate processing apparatus 200. Instead of the control device 310, a control device for controlling the operations of the respective components of the processing liquid supply apparatus 100 may be provided in the processing liquid supply apparatus 100. Also, instead of the control device 310, a control device for controlling the operations of the respective components of the substrate processing apparatus 200 may be provided in the substrate processing apparatus 200.

[0016] The processing liquid source 320, the gas source 330, and the waste liquid device 340 are facilities (utilization facilities) in the factory where the substrate processing system 300 is installed. The processing liquid source 320 supplies the processing liquid to the processing liquid supply apparatus 100. The gas source 330 supplies a gas such as nitrogen gas or clean dry air to the processing liquid supply apparatus 100. The used processing liquid in the processing liquid supply apparatus 100 or the substrate processing apparatus 200 is discarded in the waste liquid device 340.

[0017] The substrate processing apparatus 200 comprises an indexer block 210, a first processing block 220, a transport block 230, a second processing block 240, and a third processing block 250. The indexer block 210, the first processing block 220, the transport block 230, the second processing block 240, and the third processing block 250 are arranged in this order in the X direction. The indexer block 210 includes a plurality of carrier mounting sections 211 and a transport chamber 212. A carrier 213 for storing a plurality of substrates W in multiple stages is mounted on each carrier mounting section 211. A transport mechanism 214 is provided in the transport chamber 212. The transport mechanism 214 is, for example, a transport robot, which transports the substrates W while holding them.

[0018] The first processing block 220 includes processing chambers 221, 222 and a transfer section 223. Processing chambers 221 and 222 are arranged to face each other in the Y direction, with the transfer section 223 in between. Each processing chamber 221, 222 is provided with a plurality of processing units 260 for processing the substrate W. The transfer section 223 temporarily holds the substrate W to be transferred between the transport mechanism 214 and the transport mechanism 232, which will be described later. Multiple substrates W may be placed on the transfer section 223. The transport block 230 includes a transport chamber 231. The transport chamber 231 is provided with a transport mechanism 232. The transport mechanism 232 is, for example, a transport robot, which transports the substrate W while holding it.

[0019] The second processing block 240 includes processing chambers 241 and 242 and a transfer section 243. Processing chambers 241 and 242 are arranged to face each other in the Y direction, with the transfer section 243 in between. Each processing chamber 241 and 242 is provided with a plurality of processing units 260. The transfer section 243 temporarily holds substrates W to be transferred between the transport mechanism 232 and the transport mechanism 254, which will be described later. Multiple substrates W may be placed on the transfer section 243. In this example, the transfer section 243 can transport (shuttle transport) a predetermined distance in the X direction while holding the substrates W.

[0020] The third processing block 250 includes processing chambers 251, 252 and a transport chamber 253. Processing chambers 251 and 252 are arranged to face each other in the Y direction, with the transport chamber 253 in between. Each processing chamber 251, 252 is provided with a plurality of processing units 260. The transport chamber 253 is provided with a transport mechanism 254. The transport mechanism 254 is, for example, a transport robot, which transports the substrate W while holding it.

[0021] Figure 2 is a side view showing the internal configuration of processing chambers 221, 241, and 251 in Figure 1. As shown in Figure 2, multiple (four in this example) processing units 260 are arranged in each processing chamber 221, 241, and 251 so as to be stacked in the Z direction. Similarly, multiple (four in this example) processing units 260 are also arranged in each processing chamber 222, 242, and 252 in Figure 1 so as to be stacked in the Z direction.

[0022] Each processing unit 260 includes a spin chuck 261, a nozzle 262, a cup 263, and an on / off valve 264 (see Figure 3, described later). During the cleaning process of the substrate W, the spin chuck 261 is rotated by a drive device (not shown) (e.g., an electric motor) while holding the substrate W. The nozzle 262 is provided to be movable between a processing position above the substrate W and a standby position outside the substrate W, and is in the standby position when not cleaning the substrate W.

[0023] During the cleaning process of the substrate W, the nozzle 262 moves to the processing position and discharges the processing liquid supplied by the processing liquid supply device 100 shown in Figure 1. In this case, the processing liquid is supplied to the substrate W, which is rotated by the spin chuck 261. This performs the cleaning process on the substrate W. The cup 263 is positioned to surround the spin chuck 261 and receives the processing liquid that is shaken off the substrate W during the cleaning process. The processing liquid received by the cup 263 is guided to the waste liquid device 340 shown in Figure 1 and discarded.

[0024] The operation of the substrate processing apparatus 200 will be explained with reference to Figures 1 and 2. A carrier 213 containing unprocessed substrates W is placed on the carrier mounting section 211 of the indexer block 210. The transport mechanism 214 transports the unprocessed substrates W from the carrier 213 to the transfer section 223 of the first processing block 220. The transport mechanism 214 also transports the washed substrates W placed on the transfer section 223 to the carrier 213.

[0025] The transport mechanism 232 of the transport block 230 transports the unprocessed substrate W placed on the transfer section 223 to either the processing section 260 in the processing chambers 221 and 222 of the first processing block 220 or to the transfer section 243 of the second processing block 240. The substrate W transported to either the processing section 260 in the processing chambers 221 and 222 undergoes a cleaning process. The transport mechanism 232 then transports the cleaned substrate W, which has been placed in either the processing section 260 in the processing chambers 221 and 222 or to the transfer section 243, back to the transfer section 223.

[0026] The transport mechanism 254 of the third processing block 250 transports the unprocessed substrate W placed on the transfer section 243 to one of the processing chambers 241, 242 of the second processing block 240 or processing chambers 251, 252 of the third processing block 250 to one of the processing units 260. The substrate W transported to one of the processing units 260 in processing chambers 241, 242, 251, or 252 undergoes a cleaning process. The transport mechanism 254 then transports the cleaned substrate W, which has been placed in one of the processing units 260 in processing chambers 241, 242, 251, or 252, back to the transfer section 243.

[0027] (2) Processing liquid supply device Figure 3 is a block diagram of the substrate processing system 300 to illustrate the configuration of the processing liquid supply device 100 shown in Figure 1. As shown in Figure 3, the processing liquid supply device 100 includes a storage unit 110 and various elements such as a pump, flow sensor, heater, filter, and on / off valve. The processing liquid supply device 100 also includes piping such as a drain pipe 10, a supply pipe 20, circulation pipes 30, 40, a replenishment pipe 50, and multiple branch pipes 60. In the following description, the direction in which the processing liquid flows in each pipe is defined as the downstream direction, and the opposite direction is defined as the upstream direction.

[0028] The storage unit 110 is, for example, a tank that stores the processing liquid. The storage unit 110 has discharge units 111, 112 and inlet units 113, 114, 115. The processing liquid stored in the storage unit 110 is discharged from each of the discharge units 111, 112. The processing liquid is supplied to the storage unit 110 from each of the inlet units 113 to 115. Primarily, the processing liquid discharged from the discharge unit 112 is supplied to the storage unit 110 from the inlet unit 113 or inlet unit 114. The processing liquid supplied from the processing liquid source 320 is supplied to the storage unit 110 from the inlet unit 115.

[0029] The storage section 110 is equipped with four liquid level sensors 116, 117, 118, and 119. Liquid level sensors 116 to 119 detect the first to fourth liquid levels of the processed liquid stored in the storage section 110, respectively. The detection results from liquid level sensors 116 to 119 are provided to the control device 310. The first to fourth liquid levels are surfaces located from bottom to top in this order. Specifically, the first liquid level is the surface slightly above the bottom surface of the storage section 110. The second liquid level is the surface a predetermined height above the first liquid level. The third liquid level is the surface a predetermined height below the fourth liquid level. The fourth liquid level is the surface slightly below the top surface of the storage section 110.

[0030] The drainage pipe 10 connects the discharge section 111 of the storage section 110 to the waste liquid device 340. The drainage pipe 10 is equipped with an on / off valve 11. The on / off valve 11 is switched between an open state and a closed state by the control device 310. When the on / off valve 11 is in the open state, the processed liquid stored in the storage section 110 is discharged through the discharge section 111 and drained to the waste liquid device 340 through the drainage pipe 10.

[0031] The supply piping 20 is connected to the discharge section 112 of the storage section 110. The supply piping 20 is equipped with a pump 21, a flow sensor 22, a heater 23, and a filter 24. In this example, the pump 21, flow sensor 22, heater 23, and filter 24 are arranged from upstream to downstream, but the order in which the pump 21, flow sensor 22, heater 23, and filter 24 are arranged is not limited.

[0032] Pump 21 discharges the processed liquid stored in the storage unit 110 from the discharge unit 112 to the supply pipe 20. Flow sensor 22 detects the flow rate of the processed liquid flowing through the supply pipe 20. The detection result from flow sensor 22 is provided to control device 310. Heater 23 heats the processed liquid flowing through the supply pipe 20. Filter 24 removes foreign matter from the processed liquid flowing through the supply pipe 20.

[0033] The circulation pipe 30 connects the downstream end of the supply pipe 20 to the inlet 113 of the storage unit 110. As a result, a portion of the processed liquid supplied by the supply pipe 20 is circulated to the storage unit 110 through the circulation pipe 30. A flow sensor 31 is provided near the upstream end of the circulation pipe 30. The flow sensor 31 detects the flow rate of the processed liquid flowing through the circulation pipe 30. The detection result from the flow sensor 31 is provided to the control device 310.

[0034] The circulation piping 40 connects the downstream end of the supply piping 20 to the inlet 114 of the storage unit 110. Near the upstream end of the circulation piping 40, an on / off valve 41 and a flow sensor 42 are provided. In this example, the on / off valve 41 is located downstream of the flow sensor 42, but it may also be located upstream of the flow sensor 42. The on / off valve 41 is switched between an open state and a closed state by the control device 310. When the on / off valve 41 is in the open state, a portion of the processed liquid supplied by the supply piping 20 circulates to the storage unit 110 through the circulation piping 40. The flow sensor 42 detects the flow rate of the processed liquid flowing through the circulation piping 40. The detection result from the flow sensor 42 is provided to the control device 310.

[0035] A valve unit 120 is provided near the downstream end of the circulation piping 40. In this example, the portion of the circulation piping 40 downstream of the section where the on / off valve 41 and flow sensor 42 are provided, and upstream of the section where the valve unit 120 is provided, is housed in the substrate processing device 200.

[0036] The valve unit 120 adjusts the flow rate of the treatment liquid circulating through the circulation pipe 40 by receiving gas from the gas source 330. The valve unit 120 can operate selectively in fine adjustment mode and coarse adjustment mode. In fine adjustment mode, the flow rate of the treatment liquid flowing through the circulation pipe 40 is adjusted with relatively high precision. In this example, in fine adjustment mode, the flow rate of the treatment liquid flowing through the circulation pipe 40 is adjusted to be constant. In coarse adjustment mode, the flow rate of the treatment liquid flowing through the circulation pipe 40 is adjusted with lower precision than in fine adjustment mode. Details of the valve unit 120 will be described later.

[0037] The replenishment pipe 50 connects the inlet 115 of the storage unit 110 to the processing liquid source 320. The replenishment pipe 50 is equipped with an on / off valve 51. The on / off valve 51 is switched between an open state and a closed state by the control device 310. During substrate processing, the processing liquid is used, causing the liquid level of the processing liquid stored in the storage unit 110 to drop. When the liquid level sensor 117 detects a second liquid level, the control device 310 opens the on / off valve 51. With the on / off valve 51 open, processing liquid is supplied from the processing liquid source 320 to the storage unit 110 through the replenishment pipe 50. This starts the replenishment of processing liquid to the storage unit 110.

[0038] As processing liquid is replenished in the storage section 110, the liquid level of the processing liquid stored in the storage section 110 rises. When the liquid level sensor 118 detects a third liquid level, the control device 310 closes the on / off valve 51. When the on / off valve 51 is closed, the replenishment of processing liquid to the storage section 110 stops. According to this control, a certain range of processing liquid is stored in the storage section 110 so that the liquid level of the processing liquid is located between the second liquid level and the third liquid level. If the liquid level sensor 116 detects a first liquid level, or if the liquid level sensor 119 detects a fourth liquid level, the operation of the processing liquid supply device 100 may be stopped, as this indicates an abnormality in the processing liquid supply device 100.

[0039] The multiple branch pipes 60 correspond to the multiple processing units 260 of the substrate processing apparatus 200. In this example, the multiple branch pipes 60 are located in the substrate processing apparatus 200. Figure 3 shows four branch pipes 60, each corresponding to one of the four processing units 260 stacked in one of the processing chambers 221, 222, 241, 242, 251, or 252 of Figure 1. Each branch pipe 60 is provided to branch off from the portion of the circulation pipe 40 that is housed in the substrate processing apparatus 200.

[0040] Each branch pipe 60 is provided with a flow rate adjustment unit 270, along with a nozzle 262 and an on / off valve 264 of the corresponding processing unit 260. The on / off valve 264 is located downstream of the flow rate adjustment unit 270, and the nozzle 262 is connected to the downstream end of the branch pipe 60. The flow rate adjustment unit 270 is composed of, for example, a flow sensor, a relief valve, and an on / off valve. The flow rate adjustment unit 270 detects the flow rate of the processing liquid flowing through the branch pipe 60. The detection result from the flow rate adjustment unit 270 is provided to the control device 310. The flow rate adjustment unit 270 also adjusts the flow rate of the processing liquid flowing through the branch pipe 60 based on the control by the control device 310.

[0041] Furthermore, the flow rate adjustment unit 270 can be switched between an open state and a closed state by the control device 310. When the flow rate adjustment unit 270 is in the open state, the processing liquid flowing through the circulation pipe 40 is introduced to the processing unit 260 through the branch pipe 60. Hereinafter, the state of the substrate processing device 200 when the flow rate adjustment unit 270 is in the closed state will be referred to as the preparation state, and the state of the substrate processing device 200 when the flow rate adjustment unit 270 is in the open state will be referred to as the execution state.

[0042] The on / off valve 264 is switched between an open state and a closed state by the control device 310. When the substrate processing apparatus 200 is in operation, opening the on / off valve 264 causes the processing liquid introduced into the processing unit 260 to be discharged from the nozzle 262. The processing liquid discharged from the nozzle 262 is supplied to the substrate W, which is held and rotated by the spin chuck 261, thereby processing the substrate W. Hereinafter, when the substrate processing apparatus 200 is in operation, the state of the substrate processing apparatus 200 when the on / off valve 264 is in the closed state will be referred to as the stopped state, and the state of the substrate processing apparatus 200 when the on / off valve 264 is in the open state will be referred to as the discharge state.

[0043] (3) Valve Unit Figure 4 is a block diagram showing the configuration of the valve unit 120 in Figure 3. As shown in Figure 4, the valve unit 120 includes a relief valve 121, a gas supply unit 122, a gas supply pipe 123, a bypass pipe 124, an auxiliary valve 125, a drive unit 126, and on / off valves 127, 128, and 129. The relief valve 121 is provided in the circulation pipe 40 and adjusts the flow rate of the processed liquid flowing through the circulation pipe 40 by opening and closing it.

[0044] The gas supply unit 122 includes, for example, an electro-pneumatic regulator and is connected to the gas source 330 through the gas supply pipe 123. The gas supply unit 122 supplies gas from the gas source 330 to the relief valve 121 at a desired pressure, according to the control of the control device 310. The opening degree of the relief valve 121 changes according to the pressure of the gas supplied by the gas supply unit 122.

[0045] The bypass pipe 124 is connected to the circulation pipe 40 so as to bypass the relief valve 121. In this example, one end of the bypass pipe 124 is connected to the portion of the circulation pipe 40 upstream of the relief valve 121, and the other end of the bypass pipe 124 is connected to the portion of the circulation pipe 40 downstream of the relief valve 121. The other end of the bypass pipe 124 may be connected to the storage section 110 instead of the circulation pipe 40.

[0046] The auxiliary valve 125 is provided in the bypass piping 124. In this embodiment, the auxiliary valve 125 is a manually operated needle valve and operates at a constant opening. The auxiliary valve 125 may also be a motor-driven needle valve, or it may be an orifice or the like that restricts the flow rate of the processing liquid flowing through the bypass piping 124. The opening of the auxiliary valve 125 is set so that the processing liquid flows through the circulation piping 40 at an appropriate flow rate when the substrate processing apparatus 200 is in a ready state.

[0047] The drive unit 126 includes, for example, a solenoid and switches each of the on-off valves 127 to 129 between an open state and a closed state according to the control of the control device 310. On-off valve 127 is provided in the gas supply pipe 123. On-off valve 128 is provided in the circulation pipe 40 upstream of the relief valve 121 and downstream of the part to which one end of the bypass pipe 124 is connected. On-off valve 129 is provided in the bypass pipe 124 upstream of the auxiliary valve 125.

[0048] When the on / off valve 127 is opened, gas from the gas source 330 is supplied to the gas supply unit 122 through the gas supply pipe 123. In fine adjustment mode, the on / off valve 128 is opened and the on / off valve 129 is closed. In this case, the processing liquid flowing through the circulation pipe 40 is introduced into the relief valve 121. This allows the flow rate of the processing liquid flowing through the circulation pipe 40 to be adjusted with relatively high precision. In coarse adjustment mode, the on / off valve 128 is closed and the on / off valve 129 is opened. In this case, the processing liquid flowing through the circulation pipe 40 is introduced into the auxiliary valve 125. This allows the flow rate of the processing liquid flowing through the circulation pipe 40 to be adjusted with relatively low precision.

[0049] Figure 5 is a time chart showing an example of the operation of the valve unit 120 in Figure 4. As shown in Figure 5, in the initial state, the substrate processing apparatus 200 is in a ready state. Therefore, the substrate processing apparatus 200 is in a stopped state. Also, in the initial state, the on / off valve 128 is in a closed state, and the on / off valve 129 is in an open state. In this case, the valve unit 120 operates in coarse adjustment mode. Therefore, the flow rate of the processing liquid flowing through the circulation pipe 40 is adjusted with relatively low precision.

[0050] Subsequently, at time t1, the substrate processing device 200 transitions to the execution state. As a result, the on / off valve 128 opens and the on / off valve 129 closes. In this case, the valve unit 120 operates in fine adjustment mode. Therefore, the flow rate of the processing liquid flowing through the circulation pipe 40 is adjusted with relatively high precision. After time T2 has elapsed from time t1, at time t2 or later, the substrate processing device 200 enters the discharge state. In this case, the substrate W is processed by supplying the processing liquid to the substrate W. Time T2 is, for example, several minutes.

[0051] Subsequently, at time t3, the substrate processing device 200 transitions to a ready state. As a result, the substrate processing device 200 stops, and the substrate processing is completed. Meanwhile, the states of the on / off valves 128 and 129 are maintained from time t3 until time t4, which is after time T1 has elapsed. At time t4, on / off valve 128 becomes closed, and on / off valve 129 becomes open. As a result, the valve unit 120 operates in coarse adjustment mode, similar to the initial state. Thereafter, the same operation is repeated.

[0052] In the operation of the valve unit 120 described above, when the on / off valve 128 is in the closed state, gas does not need to be supplied to the relief valve 121 by the gas supply unit 122. Also, in this embodiment, the valve unit 120 includes the on / off valve 128, but the embodiment is not limited thereto. If the relief valve 121 becomes fully closed when gas is not supplied to the relief valve 121, the processing liquid is not introduced into the relief valve 121, so the valve unit 120 does not need to include the on / off valve 128.

[0053] In this example, the relief valve 121 is installed downstream of the point where the branch pipe 60 branches off from the circulation pipe 40. If multiple branch pipes 60 branch off from the circulation pipe 40, the relief valve 121 is installed downstream of the point where the furthest downstream branch pipe 60 branches off from the circulation pipe 40. This allows for stable adjustment of the flow rate of the processing liquid flowing through the circulation pipe 40, regardless of whether the substrate processing device 200 is stopped or discharging.

[0054] (4) Substrate processing Figure 6 shows the configuration of the control device 310 shown in Figure 3. As shown in Figure 6, the control device 310 includes a state control unit 311, a discharge control unit 312, a mode control unit 313, and a gas control unit 314 as functional units. The functional units of the control device 310 are realized by the CPU of the control device 310 executing a board processing program stored in memory. Some or all of the functional units of the control device 310 may be realized by hardware such as electronic circuits. In addition, the board processing program may be stored in a storage medium different from the memory of the control device 310.

[0055] The state control unit 311 switches the state of the substrate processing apparatus 200 between a ready state and an execution state by controlling the flow rate adjustment unit 270 based on a predetermined schedule. When the flow rate adjustment unit 270 is closed, the substrate processing apparatus 200 is switched to the ready state. When the flow rate adjustment unit 270 is opened, the substrate processing apparatus 200 is switched to the execution state.

[0056] The discharge control unit 312 switches the state of the substrate processing apparatus 200 between a stopped state and a discharge state by controlling the on / off valve 264 when the substrate processing apparatus 200 is in operation. When the on / off valve 264 is closed, the substrate processing apparatus 200 is switched to the stopped state. When the on / off valve 264 is opened, the substrate processing apparatus 200 is switched to the discharge state.

[0057] The mode control unit 313 switches the operating mode of the valve unit 120 between fine adjustment mode and coarse adjustment mode by controlling the drive unit 126 based on the state of the substrate processing device 200. The valve unit 120 is switched to fine adjustment mode when the drive unit 126 is controlled so that the on / off valve 128 is opened and the on / off valve 129 is closed. The valve unit 120 is switched to coarse adjustment mode when the drive unit 126 is controlled so that the on / off valve 128 is closed and the on / off valve 129 is opened.

[0058] When the valve unit 120 is operating in fine adjustment mode, the gas control unit 314 controls the drive unit 126 to open the on-off valve 127. This allows gas to be supplied from the gas source 330 to the relief valve 121 through the gas supply unit 122. Here, the gas control unit 314 controls the gas supply unit 122 to dynamically vary the pressure of the gas supplied to the relief valve 121 so that the flow rate of the processed liquid detected by the flow sensors 22 and 42 remains constant. On the other hand, when the valve unit 120 is operating in coarse adjustment mode, the gas control unit 314 controls the drive unit 126 to close the on-off valve 127. This stops the supply of gas to the relief valve 121.

[0059] Figure 7 is a flowchart showing the substrate processing algorithm by the control device 310 in Figure 6. Hereinafter, the substrate processing will be explained using the substrate processing system 300 in Figure 3, the valve unit 120 in Figure 4, the time chart in Figure 5, and the control device 310 in Figure 6. In the initial state of substrate processing, the substrate processing device 200 is in a ready state, the on / off valve 127 is in a closed state, the on / off valve 128 is in a closed state, and the on / off valve 129 is in an open state. First, the state control unit 311 opens the flow rate adjustment unit 270 (step S1). This causes the substrate processing device 200 to transition to the execution state.

[0060] Next, the mode control unit 313 opens the on-off valve 128 (step S2). The mode control unit 313 closes the on-off valve 129 (step S3). The gas control unit 314 opens the on-off valve 127 (step S4). Based on the detection results from the flow sensors 22 and 42, the gas control unit 314 supplies gas with fluctuating pressure to the relief valve 121 via the gas supply unit 122 (step S5). Steps S2 to S5 are executed almost simultaneously. As a result, the processing liquid flowing through the circulation pipe 40 is introduced into the relief valve 121, and the valve unit 120 operates in fine-tuning mode so that the flow rate of the processing liquid is controlled with relatively high precision.

[0061] Next, the discharge control unit 312 determines whether time T2 has elapsed since steps S2 to S5 were executed (step S6). If time T2 has not elapsed, the discharge control unit 312 waits until time T2 has elapsed. If time T2 has elapsed, the discharge control unit 312 opens the on / off valve 264 (step S7). As a result, the substrate processing device 200 enters the discharge state, and the processing unit 260 performs substrate processing.

[0062] Subsequently, the discharge control unit 312 closes the on / off valve 264 (step S8). This causes the substrate processing device 200 to stop, and the substrate processing is completed. Also, the state control unit 311 closes the flow rate adjustment unit 270 (step S9). This causes the substrate processing device 200 to transition to the ready state. Steps S8 and S9 are executed almost simultaneously. Next, the mode control unit 313 determines whether time T1 has elapsed since steps S8 and S9 were executed (step S10). If time T1 has not elapsed, the process proceeds to step S14.

[0063] When time T1 has elapsed, the mode control unit 313 closes the on / off valve 128 (step S11). The mode control unit 313 opens the on / off valve 129 (step S12). The gas control unit 314 closes the on / off valve 127 (step S13). Steps S11 to S13 are executed almost simultaneously. As a result, the processing liquid flowing through the circulation pipe 40 is introduced into the auxiliary valve 125, and the valve unit 120 operates in coarse mode so that the flow rate of the processing liquid is controlled with relatively low precision.

[0064] Next, the state control unit 311 determines whether or not to transition the substrate processing device 200 to the execution state (step S14). If the substrate processing device 200 is not to transition to the execution state, the process returns to step S10. If the substrate processing device 200 is to transition to the execution state, the process returns to step S1. As a result, if the substrate processing device 200 transitions to the execution state before time T1 has elapsed from the time steps S8 and S9 are executed, the valve unit 120 is maintained in fine adjustment mode.

[0065] (5) Effects In the processing liquid supply device 100 according to this embodiment, the processing liquid is circulated through the circulation pipe 40. The flow rate of the processing liquid flowing through the circulation pipe 40 is adjusted by the valve unit 120. The processing liquid circulated through the circulation pipe 40 is supplied to the substrate processing device 200. The substrate processing device 200 selectively transitions between a ready state and an execution state. When the substrate processing device 200 is in the execution state, the substrate W is processed by supplying the processing liquid to the substrate W by the processing unit 260.

[0066] Conventionally, in configurations using valves to adjust the flow rate of the processing liquid, no difference in the amount of particles generated in the processing liquid was observed between cases where the flow rate of the processing liquid was adjusted with high precision and cases where it was adjusted with low precision. However, the inventors of the present invention, by using an observation device to magnify and observe the particles generated in the processing liquid, found that when the flow rate of the processing liquid was adjusted with high precision, relatively small particles increased significantly compared to when the flow rate of the processing liquid was adjusted with low precision. Therefore, the inventors of the present invention came up with the following configuration.

[0067] When the substrate processing apparatus 200 is in an operational state capable of performing substrate processing, the flow rate of the processing liquid needs to be adjusted with relatively high precision. Therefore, the valve unit 120 is controlled to operate in a fine-tuning mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe 40 with relatively high precision. On the other hand, after the substrate processing apparatus 200 transitions to a preparation state where it does not perform substrate processing, it is no longer necessary to adjust the flow rate of the processing liquid with such high precision. Therefore, the valve unit 120 is controlled to operate in a coarse-tuning mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe 40 with relatively low precision.

[0068] With this configuration, during the period when the valve unit 120 operates in coarse mode, the flow rate of the processing liquid is not adjusted with very high precision, thus reducing the amount of relatively small particles generated in the processing liquid. This reduces the particle content of the processing liquid. Furthermore, because the particle content of the processing liquid is reduced, clogging of the filter 24 is prevented. Therefore, the lifespan of the filter 24 can be extended.

[0069] The valve unit 120 includes a relief valve 121, a gas supply unit 122, a bypass pipe 124, an auxiliary valve 125, and on / off valves 128 and 129. The relief valve 121 is installed in the circulation pipe 40. The gas supply unit 122 supplies gas to the relief valve 121 so that its opening degree varies. The bypass pipe 124 is connected to the circulation pipe 40 so as to bypass the relief valve 121. The auxiliary valve 125 is installed in the bypass pipe 124. The opening degree of the auxiliary valve 125 is constant. By opening and closing the on / off valves 128 and 129, the destination of the processed liquid flowing through the circulation pipe 40 is switched to either the relief valve 121 or the auxiliary valve 125.

[0070] As a result of various experiments and considerations, the inventors found that when the flow rate of the processing liquid is adjusted with high precision using the relief valve 121, dust is generated due to the frequent opening and closing of the relief valve 121, and relatively small particles in the processing liquid increase significantly. Therefore, the inventors further conceived of a configuration in which, when the valve unit 120 operates in fine adjustment mode, the processing liquid is introduced into the relief valve 121, and when the valve unit 120 operates in coarse adjustment mode, the processing liquid is introduced into the auxiliary valve 125, as a result of opening and closing the on / off valves 128 and 129.

[0071] In this case, during the period when the valve unit 120 operates in fine adjustment mode, the processing liquid is introduced into the relief valve 121, thereby adjusting the flow rate of the processing liquid with relatively high precision. On the other hand, during the period when the valve unit 120 operates in coarse adjustment mode, the processing liquid is not introduced into the relief valve 121 but into the auxiliary valve 125, thereby adjusting the flow rate of the processing liquid with relatively low precision. Here, since it is not necessary to operate the relief valve 121 during the period when the valve unit 120 operates in coarse adjustment mode, it is possible to prevent dust generation from the relief valve 121. This makes it possible to reduce the particle content of the processing liquid with simple control. In addition, in this example, since it is not necessary to vary the opening degree of the auxiliary valve 125, the control of the valve unit 120 can be further simplified.

[0072] The valve unit 120 operates in coarse mode when time T1 has elapsed from the moment the substrate processing device 200 transitions to the ready state. In this case, until time T1 has elapsed from the moment the substrate processing device 200 transitions to the ready state, the valve unit 120 operates in fine mode without operating in coarse mode. Therefore, if the substrate processing device 200 repeatedly transitions between the execution state and the ready state in a relatively short period of time, the operating mode of the valve unit 120 does not switch frequently and is maintained in fine mode. In addition, in a relatively short period of time, even if the valve unit 120 is operated in fine mode, almost no particles are generated in the processing liquid. Therefore, the control of the valve unit 120 can be simplified while reducing the particle content of the processing liquid.

[0073] Thus, in the substrate processing system 300, the processing liquid is supplied to the substrate processing apparatus 200 by the processing liquid supply device 100. Therefore, the substrate W is processed in the substrate processing apparatus 200 using a processing liquid with reduced particle content. This prevents defects from occurring in the substrate W. Furthermore, the processing unit 260 processes the substrate W by supplying the processing liquid to the substrate W after time T2 has elapsed from the time the substrate processing apparatus 200 transitions to the execution state. In this case, it is possible to perform substrate processing after the pressure of the processing liquid flowing through the circulation pipe 40 has stabilized sufficiently. This improves the reproducibility of the processing conditions for the substrate W.

[0074] 2. Second Embodiment (1) Valve unit The following describes the differences between the substrate processing system 300 according to the second embodiment and the substrate processing system 300 according to the first embodiment. Figure 8 is a block diagram of the substrate processing system 300 for illustrating the configuration of the processing liquid supply device 100 in the second embodiment of the present invention. As shown in Figure 8, in this embodiment, a valve unit 130 is provided near the downstream end of the circulation piping 40 in place of a valve unit 120.

[0075] The valve unit 130 can be selectively operated in fine adjustment mode and coarse adjustment mode. In fine adjustment mode, the flow rate of the treatment fluid flowing through the circulation pipe 40 is adjusted with relatively high precision. In this example, in fine adjustment mode, the flow rate of the treatment fluid flowing through the circulation pipe 40 is adjusted to be constant. In coarse adjustment mode, the flow rate of the treatment fluid flowing through the circulation pipe 40 is adjusted with lower precision than in fine adjustment mode.

[0076] Figure 9 is a block diagram showing the configuration of the valve unit 130 in Figure 8. As shown in Figure 9, the valve unit 130 includes a relief valve 131, a gas supply unit 132, gas supply pipes 133 and 134, a drive unit 135, and on / off valves 136 and 137. The relief valve 131 is provided in the circulation piping 40 and adjusts the flow rate of the processed liquid flowing through the circulation piping 40 by opening and closing it.

[0077] The gas supply unit 132 includes, for example, an electro-pneumatic regulator and is connected to the gas source 330 through a gas supply pipe 133 and also through a gas supply pipe 134. The gas supply unit 132 supplies gas from the gas source 330 to the relief valve 131 at an arbitrary pressure, according to the control of the control device 310. The opening degree of the relief valve 131 changes according to the pressure of the gas supplied by the gas supply unit 132. The drive unit 135 includes, for example, a solenoid and switches each on / off valve 136, 137 between an open state and a closed state, according to the control of the control device 310. The on / off valves 136, 137 are provided in the gas supply pipes 133, 134, respectively.

[0078] In fine adjustment mode, the on / off valve 136 is opened and the on / off valve 137 is closed. In addition, a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid is supplied from the gas supply unit 132 to the relief valve 131. This allows the flow rate of the processing liquid flowing through the circulation piping 40 to be adjusted with relatively high precision. In other words, in fine adjustment mode, feedback control is performed to fluctuate the pressure of the gas supplied to the relief valve 131 in response to fluctuations in the flow rate of the processing liquid.

[0079] In coarse adjustment mode, the on / off valve 136 is closed and the on / off valve 137 is open. In addition, a gas at a constant pressure is supplied from the gas supply unit 132 to the relief valve 131. This adjusts the flow rate of the processed liquid flowing through the circulation pipe 40 with relatively low precision. That is, in fine adjustment mode, feedforward control (open control) is performed to keep the pressure of the gas supplied to the relief valve 131 constant, regardless of fluctuations in the flow rate of the processed liquid.

[0080] Figure 10 is a time chart showing an example of the operation of the valve unit 130 in Figure 9. As shown in Figure 10, in the initial state, the substrate processing apparatus 200 is in a ready state. Therefore, the substrate processing apparatus 200 is in a stopped state. Also, in the initial state, the on / off valve 136 is in a closed state, and the on / off valve 137 is in an open state. In this case, the valve unit 130 operates in coarse adjustment mode. Therefore, the flow rate of the processing liquid flowing through the circulation pipe 40 is adjusted with relatively low precision.

[0081] Subsequently, at time t11, the substrate processing device 200 transitions to the execution state. As a result, the on / off valve 136 opens and the on / off valve 137 closes. In this case, the valve unit 130 operates in fine adjustment mode. Therefore, the flow rate of the processing liquid flowing through the circulation pipe 40 is adjusted with relatively high precision. After time T2 has elapsed from time t11, at time t12 or later, the substrate processing device 200 enters the discharge state. In this case, the substrate W is processed by supplying the processing liquid to the substrate W.

[0082] Subsequently, at time t13, the substrate processing device 200 transitions to a ready state. As a result, the substrate processing device 200 stops, and the substrate processing is completed. Meanwhile, the states of the on / off valves 136 and 137 are maintained from time t13 until time t14, which is after time T1 has elapsed. At time t14, on / off valve 136 becomes closed, and on / off valve 137 becomes open. As a result, the valve unit 130 operates in coarse adjustment mode, similar to the initial state. Thereafter, the same operation is repeated.

[0083] (2) Substrate processing Figure 11 shows the configuration of the control device 310 in Figure 9. As shown in Figure 11, the control device 310 in Figure 9 includes a state control unit 311, a discharge control unit 312, a mode control unit 313, and a gas control unit 314, similar to the control device 310 in Figure 6. The operation of the state control unit 311 and the discharge control unit 312 in Figure 11 is the same as the operation of the state control unit 311 and the discharge control unit 312 in Figure 6, respectively.

[0084] The mode control unit 313 switches the operating mode of the valve unit 130 between fine adjustment mode and coarse adjustment mode by controlling the drive unit 135 based on the state of the substrate processing device 200. The valve unit 130 is switched to fine adjustment mode when the drive unit 135 is controlled so that the on / off valve 136 is opened and the on / off valve 137 is closed. The valve unit 130 is switched to coarse adjustment mode when the drive unit 135 is controlled so that the on / off valve 136 is closed and the on / off valve 137 is opened.

[0085] When the valve unit 130 is operating in fine adjustment mode, the gas control unit 314 controls the gas supply unit 132 to dynamically vary the pressure of the gas supplied to the relief valve 121 so that the flow rate of the processed liquid detected by the flow sensors 22 and 42 remains constant. On the other hand, when the valve unit 130 is operating in coarse adjustment mode, the gas control unit 314 controls the drive unit 135 to keep the pressure of the gas supplied to the relief valve 121 constant.

[0086] Figure 12 is a flowchart of the substrate processing algorithm by the control device 310 in Figure 11. The substrate processing will be explained below using the substrate processing system 300 in Figure 8, the valve unit 130 in Figure 9, the time chart in Figure 10, and the control device 310 in Figure 11. In the initial state of substrate processing, the substrate processing device 200 is in a ready state, the on / off valve 136 is in a closed state, and the on / off valve 137 is in an open state. Also, a gas at a constant pressure is supplied to the relief valve 131 by the gas supply unit 132. First, the state control unit 311 opens the flow rate adjustment unit 270 (step S21). This causes the substrate processing device 200 to transition to the execution state.

[0087] Next, the mode control unit 313 opens the on / off valve 136 (step S22). The mode control unit 313 closes the on / off valve 137 (step S23). Based on the detection results from the flow sensors 22 and 42, the gas control unit 314 supplies gas with fluctuating pressure to the relief valve 131 via the gas supply unit 132 (step S24). Steps S22 to S24 are performed almost simultaneously. As a result, the opening degree of the relief valve 131 fluctuates in accordance with the fluctuations in the flow rate of the processed liquid flowing through the circulation pipe 40, and the valve unit 130 operates in fine-tuning mode so that the flow rate of the processed liquid is controlled with relatively high precision.

[0088] Next, the discharge control unit 312 determines whether time T2 has elapsed since steps S22 to S24 were executed (step S25). If time T2 has not elapsed, the discharge control unit 312 waits until time T2 has elapsed. If time T2 has elapsed, the discharge control unit 312 opens the on / off valve 264 (step S26). As a result, the substrate processing apparatus 200 enters the discharge state, and the processing unit 260 performs substrate processing.

[0089] Subsequently, the discharge control unit 312 closes the on / off valve 264 (step S27). This causes the substrate processing device 200 to stop, and the substrate processing is completed. Also, the state control unit 311 closes the flow rate adjustment unit 270 (step S28). This causes the substrate processing device 200 to transition to the ready state. Steps S27 and S28 are executed almost simultaneously. Next, the mode control unit 313 determines whether or not time T1 has elapsed since steps S27 and S28 were executed (step S29). If time T1 has not elapsed, the process proceeds to step S33.

[0090] When time T1 has elapsed, the mode control unit 313 closes the on / off valve 136 (step S30). The mode control unit 313 opens the on / off valve 137 (step S31). The gas control unit 314 supplies a gas at a constant pressure to the relief valve 131 via the gas supply unit 132 (step S32). Steps S30 to S32 are performed almost simultaneously. As a result, the opening degree of the relief valve 131 is maintained constant, and the valve unit 130 operates in coarse mode so that the flow rate of the processing liquid is controlled with relatively low precision.

[0091] Next, the state control unit 311 determines whether or not to transition the substrate processing device 200 to the execution state (step S33). If the substrate processing device 200 is not to transition to the execution state, the process returns to step S29. If the substrate processing device 200 is to transition to the execution state, the process returns to step S21. As a result, if the substrate processing device 200 transitions to the execution state before time T1 has elapsed from the time steps S27 and S28 are executed, the valve unit 130 is maintained in fine adjustment mode.

[0092] (3) Effects In the substrate processing system 300 according to this embodiment, the valve unit 130 includes a relief valve 131 and a gas supply unit 132. The relief valve 131 is provided in the circulation piping 40. The gas supply unit 132 supplies gas to the relief valve 131 so that the opening degree varies.

[0093] As described above, the inventors have found that frequent opening and closing of the relief valve 131 generates dust, and that relatively small particles in the processing liquid increase significantly. Therefore, the inventors have further conceived of a configuration in which, by controlling the gas supply unit 132, in fine adjustment mode, a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid flowing through the circulation pipe 40 is supplied to the relief valve 131, and in coarse adjustment mode, a gas with a constant pressure is supplied to the relief valve 131.

[0094] In this case, during the period when the valve unit 130 is operating in fine adjustment mode, the flow rate of the processing liquid is adjusted with relatively high precision by introducing a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid into the relief valve 131, so that the relief valve 131 opens and closes appropriately. On the other hand, during the period when the valve unit 130 is operating in coarse adjustment mode, the flow rate of the processing liquid is adjusted with relatively low precision by introducing a gas with a constant pressure into the relief valve 131.

[0095] With this configuration, the opening degree of the relief valve 131 does not fluctuate significantly during the period when the valve unit 130 is operating in coarse mode, thus reducing dust generation from the relief valve 131. This allows for a reduction in the particle content of the processing liquid with simple control. Furthermore, in this example, there is no need to fluctuate the pressure of the gas supplied to the relief valve 131 during the period when the valve unit 130 is operating in coarse mode. This further simplifies the control of the valve unit 130.

[0096] 3. Other Embodiments (1) In the first embodiment, the opening of the auxiliary valve 125 is constant, but the embodiment is not limited thereto. The opening of the auxiliary valve 125 may vary as long as the bypass piping 124 operates at a lower frequency than the relief valve 131. Similarly, in the second embodiment, the pressure of the gas supplied to the relief valve 131 is constant in the coarse adjustment mode, but the embodiment is not limited thereto. The pressure of the gas supplied to the relief valve 131 may vary in the coarse adjustment mode as long as the frequency of pressure fluctuations is lower than in the fine adjustment mode.

[0097] (2) In the first embodiment, the valve unit 120 is provided in the circulation piping 40, but the embodiment is not limited thereto. The valve unit 120 may also be provided in the circulation piping 30. In this case, in fine adjustment mode, the opening degree of the relief valve 121 of the valve unit 120 is controlled based on the flow rate detected by the flow sensors 22 and 31. Alternatively, the valve unit 120 may be provided in each of the circulation piping 30 and 40. Or, the valve unit 120 may be provided in the circulation piping 40, and the valve unit 130 of the second embodiment may be provided in the circulation piping 30.

[0098] Similarly, in the second embodiment, the valve unit 130 is provided in the circulation piping 40, but the embodiment is not limited thereto. The valve unit 130 may also be provided in the circulation piping 30. In this case, in fine adjustment mode, the opening degree of the relief valve 131 of the valve unit 130 is controlled based on the flow rate detected by the flow sensors 22 and 31. Alternatively, the valve unit 130 may be provided in each of the circulation piping 30 and 40. Or, the valve unit 130 may be provided in the circulation piping 40, and the valve unit 120 of the first embodiment may be provided in the circulation piping 30.

[0099] (3) In the above embodiment, the valve units 120 and 130 adjust the flow rate of the processing liquid so that the flow rate of the processing liquid is constant in the fine adjustment mode, but the embodiment is not limited thereto. As long as the accuracy of flow rate adjustment in the fine adjustment mode is higher than in the coarse adjustment mode, the valve units 120 and 130 may adjust the flow rate of the processing liquid so that the flow rate of the processing liquid fluctuates in the fine adjustment mode.

[0100] (4) In the above embodiment, the valve units 120 and 130 operate in coarse mode when time T1 has elapsed from the time the substrate processing device 200 transitions to the preparation state, but the embodiment is not limited thereto. The valve units 120 and 130 may operate in coarse mode from the time the substrate processing device 200 transitions to the preparation state.

[0101] (5) In the above embodiment, the processing unit 260 transitions from a stopped state to an ejection state at a time T2 elapsed from the time the substrate processing device 200 transitions to an execution state, but the embodiment is not limited to this. The processing unit 260 may transition from a stopped state to an ejection state at the time the substrate processing device 200 transitions to an execution state.

[0102] 4. Correspondence between each component of the claim and each part of the embodiment The following describes examples of the correspondence between each component of the claims and each element of the embodiments, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0103] In the above embodiment, substrate W is an example of a substrate, substrate processing apparatus 200 is an example of a substrate processing apparatus, processing liquid supply device 100 is an example of a processing liquid supply device, processing unit 260 is an example of a processing unit, and circulation piping 30 or circulation piping 40 is an example of circulation piping. Valve unit 120 or valve unit 130 is an example of a valve unit, control device 310 is an example of a control unit, and relief valve 121 or relief valve 131 is an example of a relief valve. Gas supply unit 122 or gas supply unit 132 is an example of a gas supply unit, bypass piping 124 is an example of bypass piping, auxiliary valve 125 is an example of an auxiliary valve, on / off valves 128, 129 are examples of switching units, and substrate processing system 300 is an example of a substrate processing system.

[0104] 5. Summary of the Embodiments (Paragraph 1) The processing liquid supply device relating to Paragraph 1 is: A processing liquid supply device that supplies processing liquid to a substrate processing device that processes substrates using processing liquid, The substrate processing apparatus selectively transitions between a preparation state in which no processing liquid is introduced into the processing unit for processing the substrate, and an execution state in which substrate processing can be performed by introducing a processing liquid into the processing unit. The aforementioned processing liquid supply device is A circulation pipe for circulating the processing liquid, A valve unit that selectively operates in a fine adjustment mode for adjusting the flow rate of the processing liquid flowing through the circulation piping with a first precision, and a coarse adjustment mode for adjusting the flow rate of the processing liquid flowing through the circulation piping with a second precision lower than the first precision, The system includes a control unit that controls the valve unit so that it operates in the fine adjustment mode when the substrate processing apparatus is in the execution state, and operates in the coarse adjustment mode at a point after the substrate processing apparatus has transitioned to the preparation state.

[0105] In this processing fluid supply system, the processing fluid is circulated through circulation piping. The flow rate of the processing fluid through the circulation piping is adjusted by a valve unit. The processing fluid circulated through the circulation piping is supplied to the substrate processing device. The substrate processing device selectively transitions between a ready state and an execution state. When the substrate processing device is in the execution state, the substrate is processed by supplying the processing fluid to the substrate from the processing unit.

[0106] Conventionally, in configurations using valves to adjust the flow rate of the processing liquid, no difference in the amount of particles generated in the processing liquid was observed between cases where the flow rate of the processing liquid was adjusted with high precision and cases where it was adjusted with low precision. However, the inventors of the present invention, by using an observation device to magnify and observe the particles generated in the processing liquid, found that when the flow rate of the processing liquid was adjusted with high precision, relatively small particles increased significantly compared to when the flow rate of the processing liquid was adjusted with low precision. Therefore, the inventors of the present invention came up with the following configuration.

[0107] When the substrate processing apparatus is in an operational state capable of performing substrate processing, the flow rate of the processing fluid needs to be adjusted with relatively high precision. Therefore, the valve unit is controlled to operate in a fine-tuning mode that adjusts the flow rate of the processing fluid flowing through the circulation piping with a first level of precision. On the other hand, once the substrate processing apparatus transitions to a ready state where it does not perform substrate processing, it is no longer necessary to adjust the flow rate of the processing fluid with such high precision. Therefore, the valve unit is controlled to operate in a coarse-tuning mode that adjusts the flow rate of the processing fluid flowing through the circulation piping with a second level of precision, which is lower than the first level of precision.

[0108] With this configuration, during periods when the valve unit operates in coarse mode, the flow rate of the processing fluid is not adjusted with high precision, thus reducing the amount of relatively small particles generated in the processing fluid. This reduces the particle content of the processing fluid.

[0109] (Paragraph 2) In the processing liquid supply device described in Paragraph 1, The valve unit is A relief valve provided in the aforementioned circulation piping, A gas supply unit that supplies gas to the relief valve so that the opening degree varies, A bypass pipe connected to the circulation pipe so as to bypass the relief valve, An auxiliary valve is provided in the bypass piping, and its opening and closing frequency is less than that of the relief valve. The system includes a switching unit that switches the destination of the treatment liquid flowing through the circulation piping to either the relief valve or the auxiliary valve, The control unit may, by controlling the switching unit, introduce the processing liquid into the relief valve in the fine adjustment mode and introduce the processing liquid into the auxiliary valve in the coarse adjustment mode.

[0110] As a result of various experiments and considerations, the inventors found that when the flow rate of the processing liquid is adjusted with high precision using a relief valve, dust is generated due to the frequent opening and closing of the relief valve, and relatively small-sized particles in the processing liquid increase significantly. Therefore, the inventors further conceived the following configuration.

[0111] During the period when the valve unit operates in fine adjustment mode, the processing fluid is introduced into the relief valve, thereby adjusting the flow rate of the processing fluid with relatively high precision. On the other hand, during the period when the valve unit operates in coarse adjustment mode, the processing fluid is not introduced into the relief valve but into an auxiliary valve, thereby adjusting the flow rate of the processing fluid with relatively low precision. Here, since there is no need to operate the relief valve during the period when the valve unit operates in coarse adjustment mode, it is possible to prevent dust generation from the relief valve. As a result, the particle content of the processing fluid can be reduced with simple control.

[0112] (3) In the processing liquid supply device described in paragraph 2, The opening degree of the auxiliary valve may be constant.

[0113] In this case, there is no need to vary the opening of the auxiliary valve. This simplifies the control of the valve unit.

[0114] (Article 4) In the processing liquid supply device described in Article 1, The valve unit is A relief valve provided in the aforementioned circulation piping, The system includes a gas supply unit that supplies gas to the relief valve so that the opening degree varies, The control unit may, by controlling the gas supply unit, supply the relief valve with a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid flowing through the circulation piping in the fine adjustment mode, and supply the relief valve with a gas whose pressure fluctuation frequency is smaller than that in the coarse adjustment mode.

[0115] In this configuration, during periods when the valve unit operates in fine adjustment mode, a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid is introduced into the relief valve, ensuring that the relief valve opens and closes appropriately. This allows the flow rate of the processing liquid to be adjusted with relatively high precision. On the other hand, during periods when the valve unit operates in coarse adjustment mode, a gas with smaller pressure fluctuations than in fine adjustment mode is introduced into the relief valve, resulting in a relatively lower precision adjustment of the flow rate of the processing liquid. With this configuration, during periods when the valve unit operates in coarse adjustment mode, the opening degree of the relief valve does not fluctuate significantly, thus reducing dust generation from the relief valve. This allows for a reduction in the particle content of the processing liquid with simple control.

[0116] (Item 5) In the processing liquid supply device described in Item 4, The control unit may, by controlling the gas supply unit, supply gas at a constant pressure to the relief valve so that the opening degree does not fluctuate in the coarse adjustment mode.

[0117] In this case, during the period when the valve unit operates in coarse mode, there is no need to vary the pressure of the gas supplied to the relief valve. This simplifies the control of the valve unit.

[0118] (Item 6) In the processing liquid supply device described in any one of items 1 to 5, The time after the point in time when the substrate processing apparatus transitions to the preparation state may be the time when a first period of time has elapsed since the point in time when the substrate processing apparatus transitions to the preparation state.

[0119] In this case, the valve unit operates in fine adjustment mode without operating in coarse adjustment mode until a first time period has elapsed from the moment the substrate processing device transitions to the ready state. Therefore, if the substrate processing device repeatedly transitions between the running state and the ready state in a relatively short period of time, the operating mode of the valve unit does not switch frequently and is maintained in fine adjustment mode. Furthermore, in a relatively short period of time, even if the valve unit is operated in fine adjustment mode, very few particles are generated in the processing liquid. Thus, it is possible to simplify the control of the valve unit while reducing the particle content of the processing liquid.

[0120] (Paragraph 7) The substrate processing system relating to Paragraph 7 is: A processing liquid supply device as described in any one of paragraphs 1 to 6, The substrate processing apparatus includes a processing unit that processes a substrate by supplying a processing liquid supplied by the processing liquid supply device to the substrate, and selectively transitions between a preparation state in which no processing liquid is introduced to the processing unit and an execution state in which substrate processing can be performed by introducing a processing liquid to the processing unit.

[0121] In this substrate processing system, the processing liquid is supplied to the substrate processing apparatus by the processing liquid supply device described above. Therefore, the substrate is processed in the substrate processing apparatus using a processing liquid with a reduced particle content. This prevents defects from occurring in the substrate.

[0122] (Clause 8) In the substrate processing system described in paragraph 7, The processing unit may process the substrate by supplying a processing solution to the substrate after a second time has elapsed from the time the substrate processing unit transitions to the execution state.

[0123] In this case, it is possible to perform substrate processing after the pressure of the processing fluid flowing through the circulation piping has stabilized sufficiently. This improves the reproducibility of the substrate processing conditions.

[0124] (Paragraph 9) The method for supplying the processing liquid related to Paragraph 9 is: A method for supplying a processing liquid to a substrate processing apparatus that processes a substrate using a processing liquid, The substrate processing apparatus selectively transitions between a preparation state in which no processing liquid is introduced into the processing unit for processing the substrate, and an execution state in which substrate processing can be performed by introducing a processing liquid into the processing unit. The aforementioned processing liquid supply method is: The process involves circulating the treatment liquid through circulation piping, When the substrate processing apparatus is in the execution state, the operating mode of the valve unit is switched to a fine adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation piping with a first precision, This includes switching the operating mode of the valve unit to a coarse adjustment mode at a point after the substrate processing apparatus has transitioned to the preparation state, in which the flow rate of the processing liquid flowing through the circulation piping is adjusted to a second accuracy lower than the first accuracy.

[0125] In this processing fluid supply method, the processing fluid is circulated through a circulation pipe. The flow rate of the processing fluid through the circulation pipe is adjusted by a valve unit. The processing fluid circulated through the circulation pipe is supplied to the substrate processing device. The substrate processing device selectively transitions between a ready state and an execution state. When the substrate processing device is in the execution state, the substrate is processed by supplying the processing fluid to the substrate from the processing unit.

[0126] Here, when the substrate processing apparatus is in an operational state capable of performing substrate processing, it is necessary to adjust the flow rate of the processing liquid with relatively high precision. Therefore, the valve unit is controlled to operate in a fine-tuning mode that adjusts the flow rate of the processing liquid flowing through the circulation piping with a first level of precision. On the other hand, once the substrate processing apparatus transitions to a ready state where it is not performing substrate processing, it is no longer necessary to adjust the flow rate of the processing liquid with such high precision. Therefore, the valve unit is controlled to operate in a coarse-tuning mode that adjusts the flow rate of the processing liquid flowing through the circulation piping with a second level of precision, which is lower than the first level of precision.

[0127] According to this method, during periods when the valve unit operates in coarse mode, the flow rate of the processing fluid is not adjusted with high precision, thus reducing the amount of relatively small particles generated in the processing fluid. This reduces the particle content of the processing fluid.

[0128] (Item 10) In the processing liquid supply method described in Item 9, The valve unit is A relief valve provided in the aforementioned circulation piping, A gas supply unit that supplies gas to the relief valve so that the opening degree varies, A bypass pipe connected to the circulation pipe so as to bypass the relief valve, An auxiliary valve is provided in the bypass piping, and its opening and closing frequency is less than that of the relief valve. The system includes a switching unit that switches the destination of the treatment liquid flowing through the circulation piping to either the relief valve or the auxiliary valve, Switching the operating mode of the valve unit to the fine adjustment mode includes introducing the processing liquid flowing through the circulation piping into the relief valve via the switching unit. Switching the operating mode of the valve unit to the aforementioned coarse adjustment mode may include introducing the processing liquid flowing through the circulation piping to the auxiliary valve via the switching unit.

[0129] In this case, during the period when the valve unit operates in fine adjustment mode, the processing fluid is introduced into the relief valve, thereby adjusting the flow rate of the processing fluid with relatively high precision. On the other hand, during the period when the valve unit operates in coarse adjustment mode, the processing fluid is not introduced into the relief valve but into the auxiliary valve, thereby adjusting the flow rate of the processing fluid with relatively low precision. Here, since there is no need to operate the relief valve during the period when the valve unit operates in coarse adjustment mode, it is possible to prevent dust generation from the relief valve. As a result, the particle content of the processing fluid can be reduced with simple control.

[0130] (Item 11) In the processing liquid supply method described in Item 10, The opening degree of the auxiliary valve may be constant.

[0131] In this case, there is no need to vary the opening of the auxiliary valve. This simplifies the control of the valve unit.

[0132] (Item 12) In the processing liquid supply method described in Item 9, The valve unit is A relief valve provided in the aforementioned circulation piping, The system includes a gas supply unit that supplies gas to the relief valve so that the opening degree varies, Switching the operating mode of the valve unit to the fine adjustment mode includes supplying the relief valve with a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid flowing through the circulation piping, via the gas supply unit. Switching the operating mode of the valve unit to the coarse adjustment mode may include supplying the relief valve with a gas whose pressure fluctuation frequency is lower than that of the fine adjustment mode via the gas supply unit.

[0133] In this configuration, during periods when the valve unit operates in fine adjustment mode, a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid is introduced into the relief valve, ensuring that the relief valve opens and closes appropriately. This allows the flow rate of the processing liquid to be adjusted with relatively high precision. On the other hand, during periods when the valve unit operates in coarse adjustment mode, a gas with smaller pressure fluctuations than in fine adjustment mode is introduced into the relief valve, resulting in a relatively lower precision adjustment of the flow rate of the processing liquid. With this configuration, during periods when the valve unit operates in coarse adjustment mode, the opening degree of the relief valve does not fluctuate significantly, thus reducing dust generation from the relief valve. This allows for a reduction in the particle content of the processing liquid with simple control.

[0134] (Item 13) In the processing liquid supply method described in Item 12, Supplying the relief valve with a gas whose pressure fluctuation frequency is lower than that of the fine-tuning mode by the gas supply unit may also include supplying the relief valve with a gas whose pressure is constant so that the opening degree does not fluctuate.

[0135] In this case, during the period when the valve unit operates in coarse mode, there is no need to vary the pressure of the gas supplied to the relief valve. This simplifies the control of the valve unit.

[0136] (Paragraph 14) In the processing liquid supply method described in any one of paragraphs 9 to 13, The time after the point in time when the substrate processing apparatus transitions to the preparation state may be the time when a first period of time has elapsed since the point in time when the substrate processing apparatus transitions to the preparation state.

[0137] In this case, the valve unit operates in fine adjustment mode without operating in coarse adjustment mode until a first time period has elapsed from the moment the substrate processing device transitions to the ready state. Therefore, if the substrate processing device repeatedly transitions between the running state and the ready state in a relatively short period of time, the operating mode of the valve unit does not switch frequently and is maintained in fine adjustment mode. Furthermore, in a relatively short period of time, even if the valve unit is operated in fine adjustment mode, very few particles are generated in the processing liquid. Thus, it is possible to simplify the control of the valve unit while reducing the particle content of the processing liquid.

[0138] (Paragraph 15) The substrate processing method relating to Paragraph 15 is: A method for supplying processing liquid to a substrate processing apparatus that selectively transitions between a preparation state in which no processing liquid is introduced into the processing unit and an execution state in which substrate processing can be performed by introducing processing liquid into the processing unit, as described in any one of paragraphs 9 to 14. This includes processing a substrate by supplying the supplied processing liquid to the substrate using the processing unit.

[0139] According to this substrate processing method, the processing liquid is supplied to the substrate processing apparatus by the processing liquid supply method described above. Therefore, the substrate is processed in the substrate processing apparatus using a processing liquid with a reduced particle content. This prevents defects from occurring in the substrate.

[0140] (Item 16) In the substrate processing method described in Item 15, Processing the substrate may also include processing the substrate by supplying a processing solution to the substrate after a second time has elapsed from the time the substrate processing apparatus transitions to the execution state.

[0141] In this case, it is possible to perform substrate processing after the pressure of the processing fluid flowing through the circulation piping has stabilized sufficiently. This improves the reproducibility of the substrate processing conditions. [Explanation of Symbols]

[0142] 10…Drainage piping, 11, 41, 51, 127~129, 136, 137, 264…On / off valves, 20…Supply piping, 21…Pump, 22, 31, 42…Flow sensors, 23…Heaters, 24…Filters, 30, 40…Circulation piping, 50…Replenishment piping, 60…Branch piping, 100…Processing liquid supply device, 110…Storage section, 111, 112…Discharge section, 113~115…Inlet section, 116~119…Liquid level sensors, 120, 130…Valve unit, 121, 131…Relief valve, 122, 132…Gas supply section, 123, 133, 134…Gas supply pipe, 124…Bypass piping, 125…Auxiliary valve, 126, 135…Drive unit, 200…Substrate processing device, 210…Index sub Lock, 211…Carrier mounting section, 212, 231, 253…Transport chamber, 213…Carrier, 214, 232, 254…Transport mechanism, 220…First processing block, 221, 222, 241, 242, 251, 252…Processing chamber, 223, 243…Transfer section, 230…Transport block, 240…Second processing block, 250…Third processing block, 260…Processing section, 261…Spin chuck, 262…Nozzle, 263…Cup, 270…Flow rate adjustment section, 300…Substrate processing system, 310…Control device, 311…State control section, 312…Discharge control section, 313…Mode control section, 314…Gas control section, 320…Processing liquid source, 330…Gas source, 340…Waste liquid device, W…Substrate

Claims

1. A processing liquid supply device that supplies processing liquid to a substrate processing device that processes substrates using processing liquid, The substrate processing apparatus selectively transitions between a preparation state in which no processing liquid is introduced into the processing unit for processing the substrate, and an execution state in which substrate processing can be performed by introducing a processing liquid into the processing unit. The aforementioned processing liquid supply device is A circulation pipe for circulating the processing liquid, A valve unit that selectively operates in a fine adjustment mode for adjusting the flow rate of the processing liquid flowing through the circulation piping with a first precision, and a coarse adjustment mode for adjusting the flow rate of the processing liquid flowing through the circulation piping with a second precision lower than the first precision, A processing liquid supply device comprising: a control unit that controls the valve unit so that it operates in the fine adjustment mode when the substrate processing device is in the execution state, and operates in the coarse adjustment mode at a point in time after the substrate processing device has transitioned to the preparation state.

2. The valve unit is A relief valve provided in the aforementioned circulation piping, A gas supply unit that supplies gas to the relief valve so that the opening degree varies, A bypass pipe connected to the circulation pipe so as to bypass the relief valve, An auxiliary valve is provided in the bypass piping, and its opening and closing frequency is less than that of the relief valve. The system includes a switching unit that switches the destination of the treatment liquid flowing through the circulation piping to either the relief valve or the auxiliary valve, The processing liquid supply device according to claim 1, wherein the control unit controls the switching unit to introduce the processing liquid into the relief valve in the fine adjustment mode and introduce the processing liquid into the auxiliary valve in the coarse adjustment mode.

3. The processing liquid supply device according to claim 2, wherein the opening degree of the auxiliary valve is constant.

4. The valve unit is A relief valve provided in the aforementioned circulation piping, The system includes a gas supply unit that supplies gas to the relief valve so that the opening degree varies, The processing liquid supply device according to claim 1, wherein the control unit controls the gas supply unit to supply to the relief valve a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid flowing through the circulation pipe in the fine adjustment mode, and to supply to the relief valve a gas whose pressure fluctuation frequency is smaller than that in the fine adjustment mode in the coarse adjustment mode.

5. The processing liquid supply device according to claim 4, wherein the control unit controls the gas supply unit to supply gas at a constant pressure to the relief valve so that the opening degree does not fluctuate in the coarse adjustment mode.

6. The processing liquid supply device according to any one of claims 1 to 5, wherein the time after the point in time when the substrate processing device transitions to the preparation state is the time when a first time has elapsed from the point in time when the substrate processing device transitions to the preparation state.

7. A processing liquid supply device according to any one of claims 1 to 5, A substrate processing system comprising a processing unit that processes a substrate by supplying a processing liquid supplied by the processing liquid supply device to the substrate, and a substrate processing device that selectively transitions between a preparation state in which no processing liquid is introduced to the processing unit and an execution state in which substrate processing can be performed by introducing a processing liquid to the processing unit.

8. The substrate processing system according to claim 7, wherein the processing unit processes the substrate by supplying a processing liquid to the substrate after a second time has elapsed from the time the substrate processing device transitions to the execution state.

9. A method for supplying a processing liquid to a substrate processing apparatus that processes a substrate using a processing liquid, The substrate processing apparatus selectively transitions between a preparation state in which no processing liquid is introduced into the processing unit for processing the substrate, and an execution state in which substrate processing can be performed by introducing a processing liquid into the processing unit. The aforementioned processing liquid supply method is: The process involves circulating the treatment liquid through circulation piping, When the substrate processing apparatus is in the execution state, the operating mode of the valve unit is switched to a fine adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation piping with a first precision, A method for supplying processing liquid, comprising switching the operating mode of the valve unit to a coarse adjustment mode that adjusts the flow rate of the processing liquid flowing through the circulation pipe to a second accuracy lower than the first accuracy, at a point after the substrate processing apparatus has transitioned to the preparation state.

10. The valve unit is A relief valve provided in the aforementioned circulation piping, A gas supply unit that supplies gas to the relief valve so that the opening degree varies, A bypass pipe connected to the circulation pipe so as to bypass the relief valve, An auxiliary valve is provided in the bypass piping, and its opening and closing frequency is less than that of the relief valve. The system includes a switching unit that switches the destination of the treatment liquid flowing through the circulation piping to either the relief valve or the auxiliary valve, Switching the operating mode of the valve unit to the fine adjustment mode includes introducing the processing liquid flowing through the circulation piping into the relief valve via the switching unit. The method for supplying a processing liquid according to claim 9, wherein switching the operating mode of the valve unit to the coarse adjustment mode includes introducing the processing liquid flowing through the circulation piping to the auxiliary valve by the switching unit.

11. The processing liquid supply method according to claim 10, wherein the opening degree of the auxiliary valve is constant.

12. The valve unit is A relief valve provided in the aforementioned circulation piping, The system includes a gas supply unit that supplies gas to the relief valve so that the opening degree varies, Switching the valve unit's operating mode to the fine adjustment mode includes supplying the relief valve with a gas whose pressure fluctuates in response to fluctuations in the flow rate of the processing liquid flowing through the circulation piping, via the gas supply unit. The method for supplying a processing liquid according to claim 9, wherein switching the operating mode of the valve unit to the coarse adjustment mode includes supplying the relief valve with a gas whose pressure fluctuation frequency is lower than that of the fine adjustment mode using the gas supply unit.

13. The method for supplying a processing liquid according to claim 12, wherein supplying a gas whose pressure fluctuation frequency is smaller than that of the fine-tuning mode to the relief valve by the gas supply unit includes supplying a gas with a constant pressure to the relief valve so that the opening degree does not fluctuate.

14. The processing liquid supply method according to any one of claims 9 to 13, wherein the time after the time when the substrate processing apparatus transitions to the preparation state is the time when a first time has elapsed from the time when the substrate processing apparatus transitions to the preparation state.

15. A method for supplying processing liquid according to any one of claims 9 to 13, wherein processing liquid is supplied to a substrate processing apparatus that selectively transitions between a preparation state in which processing liquid is not introduced to the processing unit and an execution state in which substrate processing can be performed by introducing processing liquid to the processing unit, A substrate processing method comprising processing a substrate by supplying a supplied processing liquid to the substrate using the processing unit.

16. The substrate processing method according to claim 15, wherein processing the substrate includes processing the substrate by supplying a processing liquid to the substrate after a second time has elapsed from the time the substrate processing apparatus transitions to the execution state.

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