Side track buffer stage device and semiconductor process apparatus equipped therewith

Abstract

By detecting the temperature of the inert gas discharged from semiconductor process equipment and the humidity of the semiconductor process equipment, the inflow and outflow rates of the inert gas can be individually adjusted in accordance with the temperature and humidity in multiple semiconductor process equipment, thereby improving the production performance and process performance of the semiconductor process equipment. [Solution] The side track buffer stage device for flowing inert gas through semiconductor process equipment is provided on one side of the first base 110 of the first module section 100 and includes a supply section 120 for supplying inert gas, a first flow rate control section 130 for adjusting the amount of inert gas flowing, and a discharge section 170 for discharging inert gas.

Description

Technical Field

[0001] The present invention relates to a stage device for a side track buffer and a semiconductor process device including the same, and more particularly, to a stage device for a side track buffer that allows an inert gas to flow through the side track buffer and a semiconductor process device including the same.

Background Art

[0002] During the progress of semiconductor manufacturing processes such as wafer manufacturing processes and exposure, deposition, and etching for device integration, the surface of a silicon wafer may be contaminated by various contaminants. To prevent such contamination and improve the process speed, multiple silicon wafers are moved during the wafer manufacturing process or semiconductor manufacturing process while stacked in a wafer cassette (Wafer Cassette), or are packaged and shipped while stacked in the cassette. Generally, a wafer, which is widely used as a material for manufacturing semiconductor devices, refers to a single crystal silicon thin plate made from polycrystalline silicon as a raw material.

[0003] Semiconductor devices are manufactured by sequentially applying a plurality of unit processes to a wafer as a target substrate. At this time, in order to prevent contamination by external particles, the wafer is stored in a Front Opening Unified Pod (hereinafter referred to as 'FOUP'), and then is transported by a transport system that connects manufacturing equipment for each unit process.

[0004] Particularly, as a transport system, a ceiling transport system that is arranged on the ceiling of a semiconductor fab (FAB), which is a clean room for manufacturing semiconductor devices, and automatically transfers FOUPs is widely used.

[0005] Once the processing is complete in the equipment that performs the unit processes for manufacturing semiconductor devices, the substrates are placed in a FOUP (Floor Up Unit) and discharged to the load port (LP) adjacent to each piece of equipment. An overhead transport device located above each piece of equipment then picks up the FOUP and sends it to the subsequent processing equipment where the next unit process is performed.

[0006] Such an overhead transport system consists of transport rails installed on the ceiling of a semiconductor fab, a transport vehicle that moves along the transport rails while protecting the FOUP from the outside, and a station for the object to be transferred.

[0007] Such a station includes a load port attached to a unit process equipment for manufacturing semiconductor devices, and side track buffers (STBs) and under track buffers (UTBs) provided on the sides and bottom of the transport rails to house the FOUPs.

[0008] In recent years, as semiconductor device structures have become more miniaturized, the effects of moisture, oxygen, and chemical components have become a greater concern. To address these issues, it has been proposed to replace the inside of the transport chamber with an inert gas, N2 (nitrogen), and transport wafers under an N2 gas atmosphere.

[0009] In that case, in order to reduce running costs by decreasing the consumption of N2 gas, it is necessary to maintain internal cleanliness while reducing the supply of fresh N2 gas, which means circulating the N2 gas while passing it through a filter.

[0010] For example, it can be used to store semiconductor substrates, such as substrates without containers or substrates placed in containers like FOUPs. However, in order to maintain cleanliness inside the stocker and prevent contamination, it is necessary to supply purge gas into the stocker and improve the cleanliness of the container and stocker. Conventional FOUPs have the problem that they cannot control the flow rate and, through that, humidity, and therefore cannot monitor and control humidity.

[0011] Furthermore, during inert gas purging, the internal humidity level of the FOUP took a very long time to decrease, and the maximum possible decrease in humidity was only around 5%, resulting in insufficient humidity control. Additionally, the leakage of inert gas to the outside when the FOUP door is opened led to problems with compliance with environmental safety standards.

[0012] Equipment used for semiconductor wafer processing consists of a processing module and a transport module for transporting the wafers. Transport modules include stockers, OHS (Overhead Shuttle), OHT (Overhead Hoist Transport), AGV (Automated Guided Vehicle), and RGV (Rail Guided Vehicle).

[0013] All of these transport modules aim to reduce the user's initial investment costs, lower operating costs to improve price competitiveness, prevent contamination during wafer transport, and improve product yield rates.

[0014] In particular, the side track buffer (STB) is a storage space located on the side of the OHT running rail that houses FOUPs that have completed their processing. Such FOUPs are storage containers that store and transport wafers, and they also play a role in improving the wafer yield rate by blocking contact with the outside air.

[0015] However, if process gases used during the wafer processing process remain on the wafer surface and are loaded into the FOUP (Floating Open Up Unit), precision processing becomes difficult, leading to secondary contamination between wafers. This can cause problems such as the wafer transport module being contaminated by fumes from the process gases remaining inside the FOUP, resulting in a decrease in the performance of the equipment.

[0016] As a result, a purging device was developed to remove process gases from inside the FOUP. However, typical conventional purging devices had the problem of adding an extra step to the process by adding a separate configuration between the movable module and the transport module in order to remove process gases from inside the FOUP.

[0017] In particular, if process gases remain inside the FOUP during multiple wafer processing steps, it creates the inconvenience of having to continuously remove the process gases using conventional purging equipment. Furthermore, as additional steps are added to remove process gases, the production time required to manufacture semiconductor devices increases.

[0018] To address these issues, a semiconductor wafer manufacturing system has been proposed that supplies inert gas to a FOUP attached to a side track buffer. However, this system lacks a specific configuration for removing or exhausting process gases from inside the FOUP.

[0019] In particular, such FOUPs and side track buffers are components that transport and temporarily store wafers, and they also play a role in improving wafer yield by blocking contact with the outside air.

[0020] However, if process gases used during the wafer processing process remain on the wafer surface and are loaded into the FOUP (Floating Up Unit), precision processing becomes difficult, leading to secondary contamination between wafers. Furthermore, the wafer transport module can become contaminated by fumes from the process gases remaining inside the FOUP, resulting in a decrease in the performance of the equipment.

[0021] As a result, a purging device has been developed to remove process gases from inside the FOUP. However, this device is an additional component added between the movable module and the transport module to remove process gases from inside the FOUP, which has the problem of adding an extra step to the process.

[0022] On the one hand, after the process is completed, humidity becomes an important factor during storage. In particular, as semiconductor devices become more advanced, humidity has a significant impact on defect induction in high-quality product production.

[0023] For these reasons, controlling humidity, which affects the occurrence of defects in semiconductor devices, is important. However, since it is not easy to control the humidity of the entire semiconductor FAB, it is necessary to adjust the humidity even inside the FOUP (Front Opening Unified Pod) in which wafers are stored in units of 25 to 26 pieces.

[0024] However, such a conventional technique only uses nitrogen for purging and does not include any configuration for adjusting humidity related to the occurrence of defects in semiconductor devices, so there was a need to improve this.

Prior Art Documents

Patent Documents

[0025]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0026] [[ID=CO8]] An object of the present invention was devised to solve the above-mentioned conventional problems. By detecting the temperature of the inert gas discharged from the semiconductor process equipment and the humidity of the semiconductor process facility, the inflow and outflow amounts of the inert gas are individually adjusted according to the temperature and humidity in a plurality of semiconductor process equipment, and a side track buffer stage device capable of improving the production performance and process performance of the semiconductor process equipment and a semiconductor process equipment equipped with the same are provided.

[0027] Another object of the present invention is to provide a side track buffer stage device and a semiconductor process apparatus equipped therewith, which can improve the yield rate of semiconductor production by providing a variable discharge module in which an inert gas injected into the inside of a FOUP through a supply nozzle of a semiconductor process apparatus such as an STB is attached to a first module, and the exhaust volume is adjusted for each of the multiple FOUPs.

[0028] Another object of the present invention is to provide a side track buffer stage device and a semiconductor process apparatus equipped therewith, which includes a second base, a second flow rate control unit and a second discharge control unit as a second module unit, thereby enabling the second module unit of the variable discharge module to be detachably attached to the first module unit, allowing the discharge amount to be adjusted in accordance with the amount of inert gas injected in the second module unit, and enabling the discharge amount to be individually adjusted by receiving an electronic signal when different amounts of inert gas are injected for every 5 to 50 slm FOUP.

[0029] Another object of the present invention is to provide a side track buffer stage device and a semiconductor process apparatus equipped therewith, which include a connecting piece, a connecting groove, a connecting projection, and a fixing piece as connecting parts, thereby enabling the variable discharge module to be attached and detached using the connecting parts of a joint block and allowing the gas flow rate of multiple FOUPs to be adjusted individually. [Means for solving the problem]

[0030] To achieve the above-mentioned objectives, the present invention provides a side track buffer stage device for flowing an inert gas through a side track buffer, characterized by comprising: a supply unit provided on one side of the first base of the first module unit for supplying the inert gas; a first flow rate control unit provided on one side of the supply unit for adjusting the flow rate of the inert gas; a filter unit connected to the first flow rate control unit for filtering the inert gas; and a discharge unit provided on the other side of the first base of the first module unit for discharging the inert gas.

[0031] Furthermore, the present invention is characterized by further comprising a second module that is detachably attached to one of the first module and controls the discharge of inert gas.

[0032] The second module of the present invention is characterized by including: a second base coupled to one end of the first base of the first module; a second flow control unit provided on one side of the second base for adjusting the discharge amount of inert gas; and a second discharge control unit provided on the other side of the second base for controlling whether or not inert gas is discharged.

[0033] Furthermore, the present invention is characterized by further including a connecting portion provided between the first module portion and the second module portion, which connects the first base and the second base in a manner that allows them to be attached and detached.

[0034] The connecting portion of the present invention is characterized by including: a connecting piece that connects the first base and the second base; a first connecting groove formed as a recess at one end of the connecting piece to which the first base is connected; a second connecting groove formed as a recess at the other end of the connecting piece to which the second base is connected; a first connecting projection formed as a projection at one end of the connecting piece to which the first base is connected; and a second connecting projection formed as a projection at the other end of the connecting piece to which the second base is connected.

[0035] The connecting portion of the present invention is characterized by further comprising: a first fixing piece provided to connect to the first connecting projection and fixing the first base and the connecting piece; and a second fixing piece provided to connect to the second connecting projection and fixing the second base and the connecting piece.

[0036] Alternatively, the present invention is a semiconductor process apparatus characterized by comprising a stage device for the side track buffer. [Effects of the Invention]

[0037] As described above, the present invention provides the effect of improving the production performance and process performance of semiconductor process equipment by detecting the temperature of the inert gas discharged from the semiconductor process equipment and the humidity of the semiconductor process equipment, thereby individually adjusting the inlet and outlet amounts of inert gas in multiple semiconductor process equipment according to the temperature and humidity.

[0038] Furthermore, by providing a variable discharge module in which an inert gas injected into the FOUP through a supply nozzle of a semiconductor process equipment such as an STB is attached to the first module, and the second module is detachably attached to the first module, the exhaust volume can be adjusted for each of the multiple FOUPs, thereby providing the effect of improving the semiconductor production yield rate.

[0039] Furthermore, by providing a second base, a second flow rate control unit, and a second discharge control unit as the second module section, the second module section of the variable discharge module can be attached to and detached from the first module section, allowing the discharge amount to be adjusted in accordance with the amount of inert gas injected in the second module section. This provides the effect of individually adjusting the discharge amount in response to an electronic signal when injecting different amounts of inert gas for every 5 to 50 slm FOUP.

[0040] Furthermore, by providing connecting pieces, connecting grooves, connecting projections, and fixing pieces as connecting parts, the variable discharge module can be attached and detached using the connecting parts of the joint block, and the gas flow rate of multiple FOUPs can be individually adjusted. [Brief explanation of the drawing]

[0041] [Figure 1] This is a diagram showing a typical semiconductor manufacturing process equipment setup. [Figure 2] This is a diagram showing a stage device for a side track buffer according to one embodiment of the present invention. [Figure 3] This is a perspective view showing a stage device for a side track buffer according to one embodiment of the present invention. [Figure 4] This is an exploded perspective view showing a stage device for a side track buffer according to one embodiment of the present invention. [Figure 5] This is a coupling state diagram showing the state after coupling of the side track buffer stage device according to one embodiment of the present invention. [Figure 6] This is a coupling state diagram showing the state of the side track buffer stage device before coupling according to one embodiment of the present invention. [Best Mode for Carrying Out the Invention]

[0042] A preferred embodiment of the present invention will be described in further detail below with reference to the attached drawings.

[0043] Figure 1 is a configuration diagram showing a typical semiconductor process apparatus, Figure 2 is a configuration diagram showing a side-track buffer stage apparatus according to one embodiment of the present invention, Figure 3 is a perspective view showing a side-track buffer stage apparatus according to one embodiment of the present invention, Figure 4 is an exploded perspective view showing a side-track buffer stage apparatus according to one embodiment of the present invention, Figure 5 is a coupling state diagram showing the state of the side-track buffer stage apparatus after coupling according to one embodiment of the present invention, and Figure 6 is a coupling state diagram showing the state of the side-track buffer stage apparatus before coupling according to one embodiment of the present invention.

[0044] As shown in Figures 1 to 4, the stage device of the side track buffer according to this embodiment consists of a first base 110, a supply unit 120, a first flow control unit 130, a filter unit 140, a supply piping unit 150, a first sensor unit 160, a discharge unit 170, a second sensor unit 180, and a detection unit 190, and is installed on a side track buffer (STB) 10 equipped with shelves that are attached to the rails of an OHT (Overhead Hoist Transport). The stage device of the side track buffer flows inert gas through the inlet and outlet of the stage that supports the FOUP 20.

[0045] The first base 110 is a base plate provided on semiconductor process equipment such as a side track buffer 10. Multiple guide protrusions are formed on the upper surface of such a first base 110, which guide the coupling position of the FOUP 20 when it is placed on the first base 110.

[0046] One end of the first base 110 is comprised of a first projection 111 which is detachably connected to the second base 210, a first mounting groove 112 which is recessed in the upper and lower parts of the first projection 111, and a first connecting hole 113 which is formed vertically through the first projection 111.

[0047] The supply unit 120 is provided on one side of the first base of the first module unit 100 and is a supply member that supplies inert gas, and is composed of an ON / OFF valve that opens and closes the flow path to supply inert gas.

[0048] The first flow control unit 130 is provided on one side of the supply unit 120 and is a flow control member that adjusts the flow rate of the inert gas. It consists of a flow meter that measures the flow rate to maintain a constant flow rate of the inert gas.

[0049] Such flow meters consist of an orifice and a diaphragm-type differential pressure gauge. In a diaphragm-type differential pressure gauge, there is no flow rate through the differential pressure gauge itself; instead, the flow rate is measured by detecting the change in the shape of the diaphragm caused by the change in differential pressure on both sides.

[0050] Such orifices and differential pressure gauges are designed to minimize the influence of process gases as nitrogen gas and process gases pass through them, ensuring long-term use.

[0051] Furthermore, when an orifice is connected to the supply piping section 150, a pressure difference is generated between the front and rear ends of the orifice. This pressure difference changes with the flow rate, and by measuring this, the flow rates of nitrogen gas and process gas flowing through the supply piping section 150 can be measured.

[0052] The filter section 140 is connected to the first flow control unit 130 and is a filter member that filters inert gas. The flow path to the supply piping section 150 is composed of a filter that filters out foreign substances contained in inert gas such as nitrogen gas.

[0053] The supply piping section 150 is connected to the filter section 140 and is a piping component that supplies inert gas, supplying inert gas to flow to the inlet and outlet of the semiconductor process equipment.

[0054] The first sensor unit 160 is a sensor member provided on one side of the first base 110 of the first module unit 100 that detects the placement of the FOUP, and is composed of a detection sensor provided on one side of the upper surface of the first base 110 that detects when the FOUP 20 is stored inside the shelf.

[0055] The discharge section 170 is provided on the other side of the first base 110 of the first module section 100 and is a piping member for discharging inert gas, discharging inert gas so as to flow into the inlet and outlet of the semiconductor process equipment.

[0056] The second sensor unit 180 is provided on the other side of the first base 110 of the first module unit 100 and is a sensor member that detects the placement of the FOUP. It consists of a detection sensor provided on the other side of the upper surface of the first base 110 and detects that the FOUP 20 has been stored in the shelf.

[0057] The detection unit 190 is provided on one side of the discharge unit 170 and is a detection member that detects the temperature of the inert gas discharged from the process equipment and the humidity of the semiconductor process equipment. It consists of a sensor housing, an inlet, an outlet, a leak prevention ring, a sensor module, and a sensor cover.

[0058] The sensor housing is located upstream of the discharge section 170 and is a housing member through which the inert gas discharged from the process equipment passes. The housing is configured with a communication passage that allows detection to be performed while the inert gas discharged from the process equipment passes through.

[0059] The intake port is located on one side of the sensor housing and is the inlet where inert gas discharged from the process equipment is drawn in. It is formed at the entrance of the communication passage so that the inert gas discharged from the process equipment can be detected as it passes through.

[0060] The discharge port is located on the other side of the sensor housing and is the outlet where inert gas discharged from the process equipment passes through the sensor module before being discharged. It is formed at the outlet of the communication passage so that the inert gas discharged from the process equipment can be detected as it passes through.

[0061] The leak prevention ring is a leak prevention component located below the sensor housing that prevents inert gas discharged from the process equipment from leaking to the outside. It is installed at the bottom of the sensor housing to maintain airtightness and prevents inert gas discharged from the process equipment from leaking to the outside.

[0062] The sensor module is equipped with a temperature sensor and a humidity sensor that detect the temperature and humidity of the inert gas discharged to the discharge section 170 in real time, and is composed of a board-type sensor module to prevent leakage current from occurring in the temperature sensor and humidity sensor.

[0063] The sensor cover is located above the sensor housing and serves as a leak prevention means to prevent inert gas discharged from the process equipment from leaking to the outside while covering the sensor module, and covers the upper part of the sensor housing.

[0064] This detection unit 190 incorporates a humidity sensor produced on a semiconductor chip, which is mounted on a board to prevent leaks. This board is then housed in a leak-proof inert gas housing block. This leak-proof block accurately reads the humidity inside the pipe where the flow occurs in real time, and based on this data, it becomes possible to maintain a constant humidity level.

[0065] Furthermore, the side track buffer stage device of the present invention can also be configured to further include a second module 200 that is detachably provided on one side of the first module 100 and controls the discharge of inert gas.

[0066] The second module 200 is provided on one side of the first module 100 and is a module member that controls the discharge of inert gas, and is composed of a second base 210, a second flow control unit 220, and a second discharge control unit 230.

[0067] The second base 210 is a base plate that is coupled to one end of the first base of the first module 100. Multiple guide protrusions are formed on the upper surface of the second base 210 to guide the coupling position when the FOUP 20 is placed on the second base 210.

[0068] One end of the second base 210 is comprised of a second projection 211 that is detachably connected to the first base 110, a second mounting groove 212 formed as a recess in the upper and lower parts of the second projection 211, and a second connecting hole 213 formed vertically through the second projection 211.

[0069] The second flow control unit 220 is provided on one side of the second base 210 and is a flow control member that adjusts the discharge amount of inert gas. It consists of a flow meter that measures the discharge amount in order to maintain a constant discharge amount of inert gas.

[0070] Such flow meters consist of an orifice and a diaphragm-type differential pressure gauge. In the diaphragm-type differential pressure gauge, there is no flow rate through the differential pressure gauge itself; instead, the flow rate is measured by detecting the change in the diaphragm shape due to the change in differential pressure on both sides. With such orifice and differential pressure gauges, the influence of nitrogen gas and process gases is extremely small as they pass through, ensuring long-term use.

[0071] Furthermore, when an orifice is connected to the discharge section 170, a differential pressure is generated at the front and rear ends of the orifice. This differential pressure changes with the flow rate, and by measuring this, the flow rates of nitrogen gas and process gas discharged through the discharge section 170 can be measured.

[0072] The second discharge control unit 230 is located on the other side of the second base 210 and is a discharge control member that controls whether or not to discharge inert gas. It consists of an ON / OFF valve that opens and closes the flow path to discharge inert gas.

[0073] Furthermore, the side track buffer stage device of the present invention may further include a connecting section 300 provided between the first module section 100 and the second module section 200, which connects the first base 110 and the second base 210.

[0074] The connecting portion 300 is provided between the first module portion 100 and the second module portion 200 and is a connecting member that connects the first base 110 and the second base 210 in a detachable manner. As shown in Figures 5 and 6, it is composed of a connecting piece 310, a first connecting groove 320, a second connecting groove 330, a first connecting projection 340, a second connecting projection 350, a first fixing piece 360, and a second fixing piece 370.

[0075] The connecting piece 310 is a connecting member that connects the first base 110 and the second base 210 in a manner that allows them to be attached to and detached from each other, and is composed of a connecting plate formed to be equal in thickness to the first base 110 and the second base 210.

[0076] The first connecting groove 320 is a groove member formed as a recess at one end of the connecting piece 310, to which the first base 110 is connected, and the first projection 111 of the first base 110 is fitted into it, allowing them to be attached to and detached from each other.

[0077] The second connecting groove 330 is a groove member formed as a recess at the other end of the connecting piece 310, to which the second base 210 is connected. The second projection 211 of the second base 210 is fitted into the groove, and the groove is designed to be detachable from each other.

[0078] The first connecting projection 340 is a projection member that protrudes above and below one end of the connecting piece 310, and is connected to the first base 110. It is fitted into the first mounting groove 112 of the first base 110 and is provided to be detachable from each other, and a first fixing hole 340a is formed through it in the vertical direction.

[0079] The second connecting projection 350 is a projection member that protrudes above and below the other end of the connecting piece 310, respectively, and is connected to the second base 210. It is fitted into the second mounting groove 212 of the second base 210 and is provided to be detachable from each other, with a second fixing hole 350a formed through it in the vertical direction.

[0080] The first fixing piece 360 ​​is provided to connect to the first fixing hole 340a of the first connecting projection 340 and is a fixing member that fixes the first base 110 and the connecting piece 310. It is composed of fastening and fixing members such as bolts and pieces that fix the first base 110 and the connecting piece 310 so that they can be attached to and detached from each other.

[0081] The second fixing piece 370 is provided to connect to the second fixing hole 350a of the second connecting projection 350 and is a fixing member that fixes the second base 210 and the connecting piece 310. It is composed of fastening and fixing members such as bolts and pieces that fix the second base 210 and the connecting piece 310 so that they can be attached to and detached from each other.

[0082] Furthermore, it is also possible that the present invention can be configured as semiconductor process equipment supporting a FOUP, such as a side track buffer (STB) equipped with a side track buffer stage device.

[0083] As described above, the present invention provides the effect of improving the production performance and process performance of semiconductor process equipment by detecting the temperature of the inert gas discharged from the semiconductor process equipment and the humidity of the semiconductor process equipment, thereby individually adjusting the inlet and outlet amounts of inert gas in multiple semiconductor process equipment according to the temperature and humidity.

[0084] Furthermore, by providing a variable discharge module in which an inert gas injected into the FOUP through a supply nozzle of a semiconductor process equipment such as an STB is attached to the first module, and the second module is detachably attached to the first module, the exhaust volume can be adjusted for each of the multiple FOUPs, thereby providing the effect of improving the semiconductor production yield rate.

[0085] Furthermore, by providing a second base, a second flow rate control unit, and a second discharge control unit as the second module section, the second module section of the variable discharge module can be attached to and detached from the first module section, allowing the discharge amount to be adjusted in accordance with the amount of inert gas injected in the second module section. This provides the effect of being able to individually adjust the discharge amount by receiving an electronic signal when injecting different amounts of inert gas for every 5 to 50 slm FOUP.

[0086] Furthermore, by providing connecting pieces, connecting grooves, connecting protrusions, and fixing pieces as connecting parts, the variable discharge module can be attached and detached using the connecting parts of the joint block, and the gas flow rate of multiple FOUPs can be individually adjusted.

[0087] The present invention, as described above, can be implemented in various other forms without departing from its technical idea or main features. Therefore, the embodiments described above are merely illustrative in all respects and should not be interpreted restrictively. [Explanation of symbols]

[0088] 100 First Module Section 200 Second Module Section 300 Connection part

Claims

1. A side track buffer stage device for flowing an inert gas through a side track buffer, A supply unit provided on one side of the first base of the first module section for supplying inert gas; A first flow control unit provided on one side of the supply unit for adjusting the flow rate of inert gas; A filter unit connected to the first flow control unit for filtering inert gas; and An exhaust unit provided on the other side of the first base of the first module section for discharging inert gas; A stage device for a side track buffer, characterized by including the following:

2. The side track buffer stage device according to claim 1, further comprising: a second module provided to be detachably attached to one of the first module portions for controlling the discharge of inert gas;

3. The second module section is, A second base coupled to one end of the first base of the first module; A second flow control unit provided on one side of the second base for adjusting the discharge amount of inert gas; and A second discharge control unit, provided on the other side of the second base, controls whether or not to discharge inert gas; The side track buffer stage device according to claim 2, characterized by including the following:

4. The side track buffer stage device according to claim 3, further comprising: a connecting portion provided between the first module portion and the second module portion, which connects the first base and the second base in a manner that allows them to be attached and detached;

5. The aforementioned connecting portion is A connecting piece that joins and connects the first base and the second base; A first connecting groove is formed as a recess at one end of the connecting piece, and the first base is joined to it; A second connecting groove is formed as a recess at the other end of the connecting piece, to which the second base is connected; A first connecting projection formed protruding from one end of the connecting piece and coupled to the first base; and A second connecting projection is formed protruding from the other end of the connecting piece and is connected to the second base; The side track buffer stage device according to claim 4, characterized by including the above.

6. The aforementioned connecting portion is A first fixing piece provided to connect to the first connecting projection and to fix the first base and the connecting piece; and A second fixing piece provided to connect to the second connecting projection, and for fixing the second base and the connecting piece; The side track buffer stage device according to claim 5, further comprising:

7. A semiconductor process apparatus characterized by comprising a side track buffer stage device as described in claim 1.

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