Wafer storage container cleaning device

Abstract

To provide a wafer storage container cleaning apparatus that efficiently cleans wafer storage containers. [Solution] In a wafer storage container cleaning apparatus, the cleaning tank 5 comprises a first cleaning tank 51 for cleaning the wafer storage container body of a wafer storage container having a door and a wafer storage container body, and a second cleaning tank 52 located above the first cleaning tank for cleaning the door.

Description

Technical Field

[0001] Embodiments of the present invention relate to a wafer storage container cleaning device.

Background Art

[0002] A FOUP (Front Opening Unified Pod) is used when moving a wafer on which a semiconductor element is formed through various processing steps (for example, resist coating, exposure / development, etching (film formation), resist stripping, cleaning, etc.) between the processing steps. That is, the wafer is transported while being stored in the FOUP when moving between the processing steps. The FOUP includes a FOUP main body (shell) having an opening and a door capable of opening and closing the opening of the FOUP main body.

[0003] There is also a FOUP cleaning device for cleaning the FOUP. The FOUP cleaning device includes a cleaning tank for cleaning the FOUP. This cleaning tank includes a box-shaped cleaning tank main body having an opening and a lid capable of opening and closing the opening of the cleaning tank main body. Such a cleaning tank, for example, holds both the FOUP main body and the door of the FOUP in the cleaning tank and cleans them in the same space. More specifically, the cleaning tank supplies a cleaning liquid to both the FOUP main body and the door of the FOUP in the same space with the door holding portion provided inside the lid holding the door of the FOUP and the FOUP main body installed in the cleaning tank main body, thereby cleaning both the FOUP main body and the door of the FOUP.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] However, in such cleaning tanks, foreign matter that was attached to the door and removed by the cleaning solution may adhere to the FOUP body itself. In this case, the foreign matter attached to the FOUP body must be removed from the FOUP body with the cleaning solution, which increases the cleaning time. Therefore, in the cases described above, there is a problem in that the cleaning efficiency is not good. Thus, there is a need to improve the cleaning efficiency. The same applies to wafer storage container cleaning equipment that cleans wafer storage containers other than FOUPs (for example, FOSB (Front Opening Shipping Box), etc.).

[0006] The present invention was made to solve the above-mentioned problems, and its objective is to provide a wafer storage container cleaning apparatus that can perform cleaning efficiently. [Means for solving the problem]

[0007] To solve the above-mentioned problems and achieve the objective, a wafer storage container cleaning apparatus according to one aspect of the present invention comprises a first cleaning tank for cleaning the wafer storage container body of a wafer storage container having a door and a wafer storage container body, and a second cleaning tank located above the first cleaning tank for cleaning the door. [Effects of the Invention]

[0008] According to one aspect of the present invention, a wafer storage container cleaning apparatus that can perform cleaning efficiently can be provided. [Brief explanation of the drawing]

[0009] [Figure 1] Figure 1 is a plan view showing an example of a schematic configuration of a wafer storage container cleaning apparatus according to an embodiment. [Figure 2] Figure 2 is a bottom view of the bottom of the container body according to the embodiment. [Figure 3] Figure 3 is a bottom view of the bottom of the container body according to the modified example. [Figure 4] Figure 4 is a front view of the washing tank according to the embodiment. [Figure 5] Figure 5 is a side view of the washing tank according to the embodiment. [Figure 6] Figure 6 shows an example of the configuration of the first washing tank according to the embodiment. [Figure 7] Figure 7 is a top view of a lifting stage according to an embodiment. [Figure 8] Figure 8 is an enlarged view of the location where the positioning pin according to the embodiment is provided. [Figure 9] Figure 9 shows a part of the side view of the rotary table according to the embodiment. [Figure 10] Figure 10 shows the state at the time when the container body is transported to the first washing tank by the robot according to the embodiment. [Figure 11] Figure 11 shows the state in which the lifting stage according to the embodiment moves from the first position to the height position of the rotating table while holding the container body, transfers the container body to the rotating table, and then stops at the second position. [Figure 12] Figure 12 shows the process of cleaning the container body in the first cleaning tank according to the embodiment. [Figure 13] Figure 13 shows how the container body is dried in the first washing tank according to the embodiment. [Figure 14] Figure 14 shows an example of the configuration of a second washing tank according to this embodiment. [Modes for carrying out the invention]

[0010] The embodiments of the wafer storage container cleaning apparatus disclosed in this application will be described in detail below with reference to the attached drawings. However, the wafer storage container cleaning apparatus disclosed in this application is not limited to the following embodiments.

[0011] (Embodiment) Figure 1 is a plan view showing an example of the schematic configuration of a wafer storage container cleaning apparatus 1 according to an embodiment. The wafer storage container cleaning apparatus 1 is installed, for example, in a factory that manufactures semiconductor wafers, and cleans wafer storage containers 20 and dries the cleaned wafer storage containers 20.

[0012] As shown in Figure 1, the wafer storage container 20 to be processed in this embodiment is, for example, a FOUP or FOSB, and comprises a container body (shell) 201 and a door 202. The container body 201 has a hexahedral shape. The container body 201 has a rectangular opening on one of its faces. The container body 201 also has a storage space for storing semiconductor wafers. The storage space is located inside the opening and communicates with the opening. The container body 201 is, for example, an example of a wafer storage container body. The door 202 can be locked (connected) and unlocked (separated) from the container body 201, and when connected to the container body 201, it closes the opening. The container body 201 is also provided with a flange (not shown in Figure 1). The flange is the part that is gripped (held) when the wafer storage container 20 is transported by an OHT (Overhead Hoist Transport) or a robot 3, and is formed in the shape of a rectangular plate.

[0013] FIG. 2 is a bottom view of the bottom 203 of the container body 201 according to the embodiment, and shows the state of the bottom 203 as viewed from the side when the wafer storage container 20 is placed on a horizontal plane with the door 202 facing downward. As will be described later, the wafer storage container cleaning device 1 supplies an inert gas such as N2 to the storage space for storing the wafers in the container body 201 with the door 202 attached thereto, thereby replacing (purging) the gas in the storage space. For this reason, a supply port 204 for supplying the inert gas and a discharge port 205 for discharging the gas in the storage space are provided in the bottom 203 as shown in FIG. 2. The supply port 204 is a port for supplying an inert gas for purging into the interior of the container body 201. In the example of FIG. 2, three supply ports 204 and one discharge port 205 are provided, but the number and arrangement of the supply ports 204 and the number and arrangement of the discharge port 205 are not limited thereto. FIG. 3 is a bottom view of the bottom 203 of the container body 201 according to a modification. For example, as shown in the example of FIG. 3, the supply port 204 and the discharge port 205 may be provided side by side. The supply port 204 and the discharge port 205 each have a predetermined filter. The inert gas is, for example, an example of a second gas. Also, the supply port 204 is, for example, an example of a purge port.

[0014] As shown in FIG. 1, the wafer storage container cleaning device 1 includes a load port 2, a robot 3, a lock / unlock stage (temporary stage) 4, a plurality of cleaning tanks 5, a plurality of drying tanks 6, an inspection unit 7, an unload port 8, and a control unit 9.

[0015] The robot 3, the lock / unlock stage 4, the cleaning tank 5, the drying tank 6, the inspection unit 7, and the control unit 9 are provided inside the casing 11 of the wafer storage container cleaning device 1. On the other hand, the load port 2 and the unload port 8 are provided straddling the inside and outside of the casing 11 of the wafer storage container cleaning device 1.

[0016] The load port 2 loads the wafer storage container 20, which is to be cleaned and dried, into the casing 11, which is placed on the external part of the load port 2's casing 11. For example, the wafer storage container 20 transported by the OHT is placed on the external part of the load port 2's casing 11. For example, as shown in Figure 1, the wafer storage container 20 is placed so that its door 202 faces the shutter 21 provided at the opening 12 of the casing 11. Once the wafer storage container 20 is placed in the load port 2 in this way, the shutter 21 rises. This makes it possible to load the wafer storage container 20 into the casing 11 through the opening 12. Then, the slide device of the load port 2 slides the wafer storage container 20 in the direction toward the inside of the casing 11 (direction of arrow 22). This loads the wafer storage container 20 into the casing 11.

[0017] Robot 3 transports the wafer storage container 20 to various parts while gripping the flange of the wafer storage container 20. Robot 3 is equipped with a robot arm 31 and a robot hand 32. With the flange gripped by the robot hand 32, Robot 3 transports the wafer storage container 20 to various parts by extending and retracting and rotating the robot arm 31. When transporting the door 202 separated from the container body 201, Robot 3 transports it by gripping both sides of the door 202.

[0018] For example, robot 3 transports the wafer storage container 20, which has been brought into the casing 11, to the lock / unlock stage 4. Then, robot 3 transports the container body 201 and door 202, which have been separated by the lock / unlock stage 4, separately to the cleaning tank 5. Then, robot 3 transports the container body 201 and door 202, which have been cleaned and partially dried in the cleaning tank 5, to the drying tank 6. Then, robot 3 transports the container body 201, which has been dried in the drying tank 6, to the inspection unit 7. Robot 3 also places the door 202, which has been dried in the drying tank 6, onto the lock / unlock stage 4. Then, robot 3 places the container body 201, which has been inspected by the inspection unit 7, onto the lock / unlock stage 4. Finally, robot 3 transports the wafer storage container 20, which has been connected (locked) and purged in the lock / unlock stage 4, to the unload port 8.

[0019] The lock / unlock stage 4 is a platform on which the wafer storage container 20 is placed. It separates (unlocks) the wafer storage container 20 into the container body 201 and the door 202, and connects (locks) the container body 201 and the door 202. The lock / unlock stage 4 closes the opening of the wafer storage container 20 by connecting the door 202 to the container body 201. A latch key (not shown) is provided on the lock / unlock stage 4. When the latch key is inserted into a keyhole formed in the door 202 of the wafer storage container 20 and rotated, the door 202 is separated from the container body 201, or the door 202 is connected to the container body 201. The wafer storage container 20, which has been brought into the casing 11, is placed on the lock / unlock stage 4, and the wafer storage container 20 is separated into the container body 201 and the door 202.

[0020] In this embodiment, the lock / unlock stage 4 includes an inert gas supply nozzle 41 and a suction nozzle 42. The inert gas supply nozzle 41 supplies an inert gas such as N2 to the supply port 204 of the wafer storage container 20, thereby supplying an inert gas such as N2 to the storage space in the wafer storage container 20 where the wafers are stored. This replaces (purges) the gas in the storage space. The suction nozzle 42 is for efficiently discharging the gas in the storage space, and it sucks the gas in the storage space when pressed against the discharge port 205. Alternatively, the suction nozzle 42 may be omitted, and exhaust may be performed by pushing the gas in the storage space out of the discharge port 205 with the inert gas supplied from the supply port 204.

[0021] The cleaning tank 5 is a tank for cleaning the wafer storage container 20. Figure 4 is a front view of the cleaning tank 5 according to the embodiment. Figure 5 is a side view of the cleaning tank 5 according to the embodiment. Specifically, Figure 5 is a view of the cleaning tank 5 from the direction of arrow 53 in Figure 4. In this embodiment, the cleaning tank 5 comprises a first cleaning tank 51 and a second cleaning tank 52. The first cleaning tank 51 and the second cleaning tank 52 are arranged side by side in the vertical direction, with the second cleaning tank 52 positioned above the first cleaning tank 51. Note that in Figure 5, the lifting stage 535, which will be described later, is omitted from the image.

[0022] In this embodiment, the first cleaning tank 51 cleans the container body 201 of the wafer storage container 20, and the second cleaning tank 52 cleans the door 202 of the wafer storage container 20. Since the first cleaning tank 51 for cleaning the container body 201 and the second cleaning tank 52 for cleaning the door 202 are provided separately, it is possible to suppress the adhesion of foreign matter that was attached to the door 202 and removed by the cleaning solution to the container body 201, and vice versa. As a result, it is not necessary to extend the cleaning time, and cleaning can be completed in a relatively short time. Therefore, according to the wafer storage container cleaning apparatus 1 of this embodiment, cleaning can be performed efficiently.

[0023] As shown in Figures 4 and 5, the first cleaning tank 51 comprises a first cleaning tank body 531 and a first lid 532. The first cleaning tank body 531 is, for example, box-shaped and has an opening and a storage space inside the opening that communicates with the opening. The first cleaning tank body 531 houses the container body 201 to be cleaned in the storage space. The first lid 532 is attached to the first cleaning tank body 531 via a hinge 533. That is, the opening of the first cleaning tank body 531 can be opened and closed by the first lid 532. The first cleaning tank 51 cleans the container body 201 when the first lid 532 is closed and the container body 201 is housed inside the first cleaning tank body 531.

[0024] In this embodiment, since the wafer storage container cleaning apparatus 1 is provided with two cleaning tanks 5, there are also two first cleaning tanks 51. These two first cleaning tanks 51 are arranged so that the direction in which the first lid 532 opens is different from that of the other. Specifically, in each of the two first cleaning tanks 51, the first lid 532 is attached to the first cleaning tank body 531 via a hinge 533 so that the robot 3 side of the first lid 532 opens and closes. In other words, the hinge 533 is provided on the side of the opening of the first cleaning tank body 531 that is opposite to the robot 3 side. For example, in Figure 4, the robot 3 is positioned to the right of the first cleaning tank 51. With this configuration, the robot 3 can easily place the container body 201 onto the lifting stage 535, which will be described later. Note that the number of cleaning tanks 5 is not limited to two; there may be one or three or more cleaning tanks 5.

[0025] The second cleaning tank 52 comprises a second cleaning tank body 521 and a second lid 522. The second cleaning tank body 521 is, for example, box-shaped and has an opening. The second lid 522 is attached to the second cleaning tank body 521 via a hinge 523. That is, the opening of the second cleaning tank body 521 can be opened and closed by the second lid 522. In the second cleaning tank 52, a door holding part 525, which will be described later, provided on the inner surface of the second lid 522 holds the door 202, and the door 202 is cleaned when the second lid 522 is closed.

[0026] In this embodiment, the two second cleaning tanks 52 are arranged such that the direction in which the second lids 522 open differs from that of the two first cleaning tanks 51. Specifically, in each of the two second cleaning tanks 52, the second lid 522 is attached to the second cleaning tank body 521 via a hinge 523 such that the robot 3 side of the second lid 522 opens and closes. In other words, the hinge 523 is provided on the side of the opening of the second cleaning tank body 521 that is opposite to the robot side. For example, the robot 3 is positioned to the right of the second cleaning tank 52 in Figure 4. With this configuration, the robot 3 can easily hold the door 202 in the door holding part 525, which will be described later.

[0027] Below, we will first describe the details of the first cleaning tank 51, and then describe the details of the second cleaning tank 52.

[0028] Figure 6 shows an example of the configuration of the first washing tank 51 according to this embodiment. Figure 6 shows the state before the container body 201 is transported to the first washing tank 51 by the robot 3.

[0029] As shown in Figure 6, the first cleaning tank 51 includes, in addition to the first cleaning tank body 531 and the first lid 532 described above, a lifting mechanism 534, a lifting stage 535, a rotary table 536, cleaning nozzles 537 and 538, drying nozzles (air nozzles) 539 and 540, an inert gas supply nozzle (air nozzle) 541, and a suction nozzle (not shown).

[0030] The lifting mechanism 534 is a mechanism for raising and lowering the lifting stage 535, that is, a mechanism for moving the lifting stage 535 in the vertical direction. The lifting mechanism 534 comprises a lifting cylinder 5341 equipped with an operating rod 5342, a plate-shaped connecting plate 5343, and a lifting shaft 5344. The lifting cylinder 5341 is installed such that the direction in which the operating rod 5342 moves coincides with the vertical direction. The lifting shaft 5344 is installed so as to be movable in the vertical direction such that the direction in which the lifting shaft 5344 extends coincides with the vertical direction. The upper end portion of the operating rod 5342 and the upper end of the lifting shaft 5344 are connected via the connecting plate 5343. Therefore, when the operating rod 5342 of the lifting cylinder 5341 moves in the vertical direction, the lifting shaft 5344 also moves in the vertical direction in conjunction. Here, one end of the lifting stage 535 in the horizontal direction is connected to the lower end of the lifting shaft 5344. Therefore, as the lifting shaft 5344 moves vertically, the lifting stage 535 also moves vertically in conjunction. In this way, the lifting mechanism 534 can move the lifting stage 535 vertically. The lifting mechanism 534 is, for example, an example of a moving mechanism.

[0031] The lifting stage 535 is a stage on which the container body 201, transported by the robot 3, is placed, and is a stage that holds the container body 201. The lifting stage 535 operates as described below, enabling the transfer of the container body 201 between it and the rotary table 536. The lifting stage 535 is, for example, an example of a container body holding mechanism. Details of the operation of the lifting stage 535 will be described later.

[0032] Figure 7 is a top view of the lifting stage 535 according to the embodiment. In addition to the lifting stage 535, a rotary table 536 is also shown in Figure 7. Furthermore, in Figure 7, the outer shape of the container body 201 when it is held by the lifting stage 535 and the rotary table 536 (i.e., when the height positions of the lifting stage 535 and the rotary table 536 coincide) is shown by a dashed line.

[0033] As shown in Figure 7, a through-hole 542 is formed in the lifting stage 535. The outer shape of the through-hole 542 is larger than the outer shape of the rotary table 536. Because such a through-hole 542 is formed in the lifting stage 535, when the rotary table 536 is in a predetermined rotation position (when it is in the stopped position), as shown in Figure 7, the lifting stage 535 can move vertically between a position above the rotary table 536 and a position below the rotary table 536, and pass through the rotary table 536 without interfering with it. In other words, the lifting stage 535 has a through-hole 542 through which the rotary table 536 can pass.

[0034] Figure 8 is an enlarged view of the location where the positioning pins 543 according to the embodiment are provided. In Figure 8, as in Figure 7, the case where the height positions of the lifting stage 535 and the rotary table 536 are the same is shown. As shown in Figure 7, the lifting stage 535 is equipped with a plurality (8) of positioning pins (positioning members) 543. When the lifting stage 535 holds the container body 201, two positioning pins 543 are provided to correspond to each of the four corners of the container body 201. The positioning pins 543 are attached to a plate-shaped member 544 that extends horizontally. The edge portion of the container body 201 is placed on the plate-shaped member 544, and the lifting stage 535 holds the container body 201 by supporting the side surface of the container body 201 with the positioning pins 543. The horizontal movement of the container body 201 is restricted when the side surface of the edge portion of the container body 201 abuts against the positioning pins 543. In this way, the positioning pin 543 positions the container body 201 which is placed on the lifting stage 535. The lifting stage 535 holds the container body 201 so that its opening faces downwards. The support of the container body 201 by the positioning pin 543 is the same as that provided by the positioning pin 550 (see Figure 9) on the rotary table 536, which will be described later.

[0035] Furthermore, as shown in Figure 8, the positioning pin 543 is provided with a screw 545 for adjusting the vertical position (height direction) of the positioning pin 543, and a screw 546 for adjusting the horizontal position (direction indicated by double arrows 547 and 548) of the positioning pin 543. By turning screw 545 clockwise or counterclockwise, the vertical position of the positioning pin 543, which moves in conjunction with the movement of screw 545, is changed. Similarly, by turning screw 546 clockwise or counterclockwise, the horizontal position of the positioning pin 543, which moves in conjunction with the movement of screw 546, is changed. Thus, screws 545 and 546 are adjustment mechanisms for adjusting the position of the positioning pin 543.

[0036] Returning to Figure 7, the rotary table 536 rotates the container body 201, which is placed on the rotary table 536, by rotating around a vertically extending rotation axis 549 while holding the container body 201. The rotary table 536 is rotated by a rotary drive mechanism (not shown).

[0037] As shown in Figure 7, the rotary table 536 is equipped with a plurality (eight) of positioning pins (positioning members) 550. Figure 9 is a diagram showing a part of the side view of the rotary table 536 according to the embodiment. When the rotary table 536 holds the container body 201, two positioning pins 550 are provided to correspond to each of the four corners of the container body 201. As shown in Figures 7 and 9, a convex-shaped frame 551 is provided on the outer circumference of the rotary table 536, and a plate-shaped member 552 is provided that extends horizontally to match the convex shape of the frame 551. The positioning pins 550 are provided on the plate-shaped member 552. The edge portion of the container body 201 is placed on the plate-shaped member 552, and the side surfaces of the edge portion of the container body 201 come into contact with the positioning pins 550, thereby allowing the rotary table 536 to hold the container body 201. In addition, the horizontal movement of the container body 201 is restricted when the positioning pins 550 come into contact with the side surfaces of the edge portion of the container body 201. In this way, the positioning pin 550 positions the container body 201 which is placed on the rotary table 536. The container body 201 is placed on the rotary table 536 so that its opening faces downwards.

[0038] Furthermore, as shown in Figure 7, multiple drain ports 554 are formed on the surface 553 of the rotary table 536 in a circular shape centered on the rotation axis 549. When the cleaning liquid supplied to the inside of the container body 201 reaches the drain ports 554, the cleaning liquid is discharged from the drain ports 554. Also, as shown in Figure 9, the frame 551 has an inclined surface 555 that slopes downward toward the surface 553. This makes it easier for the cleaning liquid supplied to the inside of the container body 201 to flow toward the drain ports 554.

[0039] Returning to the explanation of Figure 6, the cleaning nozzle 537 cleans the outer surface of the container body 201 by supplying (discharging) cleaning fluid (e.g., pure water) to the outer surface of the container body 201, which is held and rotated by the rotary table 536. The cleaning nozzle 537 is positioned so as to be able to clean the outer surface of the container body 201, which is held and rotated by the rotary table 536. Cleaning fluid is supplied to the cleaning nozzle 537 from a cleaning fluid supply source. When the container body 201 is not being cleaned, the cleaning nozzle 537 retracts to the position of the cleaning nozzle 537 shown in Figure 6 (first retracted position). When the cleaning nozzle 537 is in the first retracted position, it does not interfere with the lifting stage 535 and the container body 201 even if the lifting stage 535 moves vertically while holding the container body 201. On the other hand, when the container body 201 is being cleaned, the cleaning nozzle 537 moves to the position of the cleaning nozzle 537 shown in Figure 12 (cleaning position). When the cleaning nozzle 537 is in the cleaning position, it becomes possible to clean the outer surface of the container body 201. The cleaning nozzle 537 is, for example, an example of a cleaning fluid supply unit.

[0040] The cleaning nozzle 537 may also be provided on the first lid 532. That is, a nozzle capable of supplying cleaning liquid downwards may be provided on the inner surface of the first cleaning tank body 531 of the first lid 532, thereby cleaning the outer surface of the container body 201. When the cleaning nozzle 537 is provided on the first lid 532 in this way, the movement of the cleaning nozzle 537 between the cleaning position and the first retracted position as described above becomes unnecessary.

[0041] The cleaning nozzle 538 cleans the inner surface of the container body 201, which is held and rotated by the rotary table 536, by supplying cleaning fluid to the inner surface of the container body 201. The cleaning nozzle 538 is positioned to be able to clean the inner surface of the container body 201, which is held and rotated by the rotary table 536. Cleaning fluid is supplied to the cleaning nozzle 538 from a cleaning fluid supply source. The cleaning nozzle 538 is, for example, an example of a cleaning fluid supply unit.

[0042] The drying nozzle 539 dries the outer surface of the container body 201, which is held and rotated by the rotary table 536, by blowing clean dry air (CDA) onto its outer surface. The drying nozzle 539 is positioned to be able to dry the outer surface of the container body 201, which is held and rotated by the rotary table 536. Clean dry air is supplied to the drying nozzle 539 from a clean dry air supply source. When the container body 201 is not being dried, the drying nozzle 539 retracts to the position of the drying nozzle 539 shown in Figure 6 (second retracted position). When the drying nozzle 539 is in the second retracted position, it does not interfere with the lifting stage 535 and the container body 201 even if the lifting stage 535 moves vertically while holding the container body 201. On the other hand, when the container body 201 is being dried, the drying nozzle 539 moves to the position of the drying nozzle 539 shown in Figure 13 (drying position). When the drying nozzle 539 is in the drying position, it becomes possible to dry the outer surface of the container body 201.

[0043] The drying nozzle 539 may also be provided on the first lid 532, similar to the washing nozzle 537. That is, a nozzle capable of supplying clean dry air downwards may be provided on the inner surface of the first washing tank body 531 of the first lid 532, thereby removing the washing liquid adhering to the outer surface of the container body 201. When the drying nozzle 539 is provided on the first lid 532 in this way, the movement of the drying nozzle 539 between the drying position and the second retracted position as described above becomes unnecessary.

[0044] The drying nozzle 540 dries the inner surface of the container body 201, which is held and rotated by the rotary table 536, by supplying clean dry air to the inner surface of the container body 201. The drying nozzle 540 is positioned to be able to dry the inner surface of the container body 201, which is held and rotated by the rotary table 536. Clean dry air is supplied to the drying nozzle 540 from a clean dry air supply source.

[0045] In other words, the drying nozzles 539 and 540 dry the container body 201 by supplying clean dry air to the container body 201 to remove the cleaning liquid adhering to the container body 201. The drying nozzles 539 and 540 are, for example, an example of a first gas supply unit. The clean dry air is, for example, an example of a first gas.

[0046] Here, simply supplying clean dry air to the container body 201 while rotating it makes it difficult to remove the cleaning solution and foreign matter adhering to the predetermined filter of the supply port 204 from the predetermined filter. The cleaning solution that remains and cannot be completely removed contains dirt, and there is a risk that contaminants may be supplied into the wafer storage container 20 by purging with the lock / unlock stage 4. The same applies to the cleaning solution and foreign matter adhering to the predetermined filter of the discharge port 205 if a discharge port 205 is provided at the bottom 203 of the container body 201.

[0047] Therefore, the inert gas supply nozzle 541 removes cleaning liquid and foreign matter adhering to a predetermined filter in the supply port 204 by supplying an inert gas such as N2 to the supply port 204 of the container body 201. The inert gas supply nozzle 541 is provided on the wall surface of the first cleaning tank body 531 (see Figure 6).

[0048] When the rotary table 536 holding the container body 201 stops at a position where the bottom 203 of the container body 201 faces the lifting mechanism 534, the inert gas supply nozzle 541 and the supply port 204 provided on the bottom 203 are positioned facing each other. The inert gas supply nozzle 541 is moved toward the supply port 204 by an inert gas supply nozzle moving mechanism (not shown) and pressed against the supply port 204. Then, with the inert gas supply nozzle 541 pressed against the supply port 204, inert gas is supplied to the supply port 204. This makes it possible to remove cleaning liquid and foreign matter adhering to a predetermined filter of the supply port 204 from the predetermined filter. As a result, it is possible to suppress the adhesion of cleaning liquid and foreign matter adhering to the predetermined filter of the supply port 204 to the container body 201 during drying. The inert gas supply nozzle 541 is supplied with inert gas from an inert gas supply source. The inert gas supply nozzle 541 is, for example, an example of a second gas supply unit.

[0049] Furthermore, as shown in Figure 2, a suction nozzle (not shown) may draw gas from inside the container body 201 through the discharge port 205 at the bottom 203 of the container body 201. This removes cleaning solution and foreign matter adhering to a predetermined filter in the discharge port 205. When the rotary table 536 holding the container body 201 stops at a position where the bottom 203 of the container body 201 faces the lifting mechanism 534, similar to when gas is supplied by the inert gas supply nozzle 541 described above, the suction nozzle and the discharge port 205 provided in the bottom 203 are positioned facing each other. The suction nozzle moves toward the discharge port 205 by a suction nozzle moving mechanism (not shown) and is pressed against the discharge port 205. Then, suction is performed with the suction nozzle pressed against the discharge port 205. This removes cleaning solution and foreign matter adhering to a predetermined filter in the discharge port 205. As a result, it is possible to suppress the adhesion of cleaning solution and foreign matter adhering to the predetermined filter of the discharge port 205 to the container body 201 during drying.

[0050] Next, the operation of the first washing tank 51 will be described. Figure 10 shows the state when the container body 201 is transported to the first washing tank 51 by the robot 3 according to the embodiment. The flange of the container body 201 is gripped by the robot 3 and the container body 201 is transported to the first washing tank 51. As shown in Figure 10, the robot 3 holds the container body 201 on the lifting stage 535 of the first washing tank 51 so that the opening of the container body 201 is facing downwards. At this time, the orientation of the container body 201 is such that the bottom surface (the surface of the bottom portion 203) of the six surfaces of the container body 201 is in a position facing the lifting mechanism 534 (i.e., the surface on which the flange is provided is in a position opposite to the lifting mechanism 534). The position of the lifting stage 535 shown in Figure 10 is referred to as the first position. The first position is the position of the lifting stage 535 when the container body 201 is transported to the first washing tank 51 by the robot 3, and is above the position of the rotary table 536.

[0051] The lifting mechanism 534 then moves the lifting stage 535 downward from the first position to a predetermined position below the rotary table 536 (the second position (the position of the lifting stage 535 shown in Figure 11)). Figure 11 shows the state in which the lifting stage 535 according to the embodiment moves from the first position to the height of the rotary table 536 while holding the container body 201, transfers the container body 201 to the rotary table 536, and stops at the second position. When the lifting stage 535 moves from the first position to the second position, the container body 201 that was held by the lifting stage 535 is transferred to the rotary table 536 when the height of the mounting surface on the lifting stage 535 on which the container body 201 is placed matches the height of the mounting surface on the rotary table 536 on which the container body 201 is placed. As a result, as shown in Figure 11, the container body 201 is placed on the rotary table 536, and the rotary table 536 holds the container body 201. In the second position, the lifting stage 535 does not interfere with the rotary table 536 and the container body 201.

[0052] In this way, the lifting mechanism 534 moves the lifting stage 535, with the container body 201 on it, from a first position where the container body 201 transported by the robot 3 is placed on the lifting stage 535, to a second position below the rotary table 536. In this manner, the lifting mechanism 534 transfers the container body 201 from the lifting stage 535 to the rotary table 536, placing the container body 201 on the rotary table 536.

[0053] Figure 12 shows how the container body 201 is cleaned in the first cleaning tank 51 according to the embodiment. As shown in Figure 12, when the first lid 532 is closed, the cleaning nozzle 537 moves to the cleaning position and the container body 201 is rotated by the rotary table 536, the cleaning nozzle 537 cleans the outer surface of the container body 201 and the cleaning nozzle 538 cleans the inner surface of the container body 201.

[0054] Once cleaning by the cleaning nozzles 537 and 538 is complete, the cleaning nozzle 537 retracts to the first retracted position described above. Also, the rotation of the rotary table 536 stops at the stop position described above. This control is performed by the control unit 9.

[0055] Then, the inert gas supply nozzle moving mechanism (not shown) moves the inert gas supply nozzle 541 toward the supply port 204 and presses it against the supply port 204. With the inert gas supply nozzle 541 pressed against the supply port 204, inert gas is supplied to the supply port 204. In this way, the inert gas supply nozzle 541 supplies inert gas to the supply port 204 while pressed against the supply port 204, after the cleaning liquid has been supplied to the container body 201 by the cleaning nozzles 537 and 538, and before clean dry air has been supplied to the container body 201 by the drying nozzles 539 and 540.

[0056] Furthermore, if a discharge port 205 is provided at the bottom 203 of the container body 201, a suction nozzle moving mechanism (not shown) moves the suction nozzle toward the discharge port 205 and presses it against the discharge port 205. Then, suction is performed with the suction nozzle pressed against the discharge port 205.

[0057] Furthermore, the positions of the supply port 204 and discharge port 205 at the bottom 203 of the container body 201 may differ depending on the manufacturer of the wafer storage container 20. Also, the positions of the supply port 204 and discharge port 205 may differ depending on the type of wafer storage container 20. For this reason, even when the rotary table 536 stops at a predetermined stopping position, the positions of the supply port 204 and discharge port 205 may differ depending on the manufacturer or type. Therefore, the control unit 9 may use a table stored in the memory of the control unit 9 that stores information indicating the position of the supply port 204 and the discharge port 205 for each type of manufacturer, or a table that stores information indicating the position of the supply port 204 and the discharge port 205 for each type of wafer storage container 20, to determine the positions of the supply port 204 and the discharge port 205 at the bottom 203 of the container body 201 to be processed. The control unit 9 may also control the inert gas supply nozzle moving mechanism to move the inert gas supply nozzle 541 to the position of the identified supply port 204. Alternatively, the control unit 9 may also control the suction nozzle moving mechanism to move the suction nozzle to the position of the identified discharge port 205.

[0058] When the supply of inert gas by the inert gas supply nozzle 541 is complete, the inert gas supply nozzle moving mechanism detaches the inert gas supply nozzle 541 from the supply port 204 and moves the inert gas supply nozzle 541 away from the supply port 204 to return it to its original position. Similarly, when suction by the suction nozzle is complete, the suction nozzle moving mechanism detaches the suction nozzle from the discharge port 205 and moves the suction nozzle away from the discharge port 205 to return it to its original position.

[0059] Figure 13 shows the drying of the container body 201 in the first washing tank 51 according to the embodiment. As shown in Figure 13, when the drying nozzle 539 moves to the drying position and the rotation of the container body 201 by the rotary table 536 starts again, the drying nozzle 539 dries the outer surface of the container body 201, and the drying nozzle 540 dries the inner surface of the container body 201.

[0060] Drying by the drying nozzles 539 and 540 is a process (preliminary drying) to remove the cleaning solution adhering to the container body 201. Once drying by the drying nozzles 539 and 540 is complete, the drying nozzle 539 retracts to the second retracted position described above. Also, the rotation of the rotary table 536 stops at the stop position described above. This control is performed by the control unit 9.

[0061] The lifting mechanism 534 then moves the lifting stage 535 upward from the second position to the first position. When the lifting stage 535 moves from the second position to the first position, the height of the mounting surface on the rotary table 536 on which the container body 201 is placed matches the height of the mounting surface on the lifting stage 535 on which the container body 201 is placed. At this point, the container body 201, which was held by the rotary table 536, is transferred to the lifting stage 535. As a result, the container body 201 is placed on the lifting stage 535, and the lifting stage 535 holds the container body 201.

[0062] In this way, the lifting mechanism 534 moves the lifting stage 535 from the second position to the first position while the container body 201 is placed on the rotary table 536. As a result, the lifting mechanism 534 transfers the container body 201, which is placed on the rotary table 536, to the lifting stage 535 and places the container body 201 on the lifting stage 535.

[0063] Then, as shown in Figure 6, when the lifting stage 535 moves to the first position, the robot 3 transports the container body 201 held by the lifting stage 535 to the drying tank 6. The first washing tank 51 then waits in the state shown in Figure 6 until the next container body 201 to be washed is transported by the robot 3.

[0064] The operation of the first cleaning tank 51 has been described. The first cleaning tank 51 according to this embodiment includes a lifting stage 535 that holds the container body 201 transported by the robot 3, and a lifting mechanism 534 that moves the lifting stage 535 vertically. This allows the robot 3 to place the container body 201 on the rotary table 536 without entering the first cleaning tank body 531. Therefore, it is not necessary to secure space in the first cleaning tank body 531 that the robot 3 needs to enter. This makes it possible to suppress an increase in the size of the first cleaning tank body 531. Consequently, it is possible to suppress an increase in the overall size of the wafer storage container cleaning apparatus 1.

[0065] Next, the second cleaning tank 52 will be described. Figure 14 is a diagram showing an example of the configuration of the second cleaning tank 52 according to the embodiment. As shown in Figure 14, in addition to the second cleaning tank body 521 and the second lid 522 described above, the second cleaning tank 52 includes a rotary drive mechanism 524, a door holding part (not shown), and a cleaning and drying nozzle (hereinafter simply referred to as a nozzle) 526.

[0066] The rotary drive mechanism 524 is provided on the outer surface of the second lid 522. The rotary drive mechanism 524 includes a rotating shaft 527. The rotary drive mechanism 524 is provided with the rotating shaft 527 inserted into a through hole formed from the outer surface to the inner surface of the second lid 522.

[0067] The door holder is mounted on the rotating shaft 527 and holds the door 202 that has been transported to the second washing tank 52 by the robot 3. Therefore, when the rotating shaft 527 rotates, the door holder also rotates in conjunction with it, and when the door holder rotates while holding the door 202, the door 202 also rotates.

[0068] When cleaning the door 202, the rotary drive mechanism 524 rotates the door 202 by rotating the door holding part while the door 202 is held in place by the door holding part and the second lid 522 is closed. Specifically, the door 202 rotates in a plane along the outer surface of the door 202.

[0069] When cleaning the door 202, the nozzle 526 cleans the door 202 by supplying cleaning fluid to the rotating door 202. When cleaning the door 202, the nozzle 526 is supplied with cleaning fluid from a cleaning fluid supply source. The nozzle 526 also dries the rotating door 202 by blowing clean dry air onto it. When drying the door 202, the nozzle 526 is supplied with clean dry air from a clean dry air supply source. The nozzle 526 is positioned to be able to both clean and dry the door 202.

[0070] The nozzle 526 dries the door 202 after cleaning is complete. Here, drying by the nozzle 526 is a process (preliminary drying) to remove any cleaning solution adhering to the door 202. Once drying of the door 202 by the nozzle 526 is complete, the second lid 522 is opened, and the door 202, which was held by the door holding part 525, is released from the door holding part by the robot 3 and transported to the drying tank 6.

[0071] Alternatively, the second cleaning tank 52 may be cleaned by supplying cleaning fluid to the second cleaning tank 52 so that the door 202 is immersed in the cleaning fluid while the door 202 is immersed in the cleaning fluid, and then applying ultrasonic waves to the cleaning fluid using an ultrasonic transducer (not shown).

[0072] Furthermore, the bottom (bottom surface) 528 of the second cleaning tank body 521 is sloped. At the lowest end of the bottom 528, there is a pipe connected to a recovery section for recovering the cleaning fluid used in the cleaning process. The cleaning fluid flows to the recovery section via the pipe. This allows the cleaning fluid used in the cleaning process to be recovered quickly.

[0073] Returning to the explanation of Figure 1, the drying tank 6 is a device that vacuum-dries (performs final drying) the container body 201 and the door 202 separately. Once the vacuum drying of the container body 201 is complete in the drying tank 6, the robot 3 transports the container body 201 from the drying tank 6 to the inspection unit 7. Also, once the vacuum drying of the door 202 is complete in the drying tank 6, the robot 3 transports the door 202 from the drying tank 6 to the lock / unlock stage 4 and places the door 202 on the lock / unlock stage 4.

[0074] The inspection unit 7 performs various inspections on the container body 201. For example, the inspection unit 7 checks for distortion in the shelf section (cassette) inside the container body 201. Once the inspection is complete in the inspection unit 7, the robot 3 transports the container body 201 from the inspection unit 7 to the lock / unlock stage 4 and places the container body 201 on the lock / unlock stage 4.

[0075] Then, the lock / unlock stage 4 connects the door 202 to the container body 201. The robot 3 then transports the wafer storage container 20 on the lock / unlock stage 4 to the unload port 8.

[0076] The unload port 8 unloads the cleaned, vacuum-dried, and inspected wafer storage container 20, which has been placed inside the casing 11 of the unload port 8 by the robot 3, to the outside of the casing 11.

[0077] For example, inspected wafer storage containers 20 are transported by robot 3 and placed inside the casing 11 of the unload port 8. Once the wafer storage containers 20 are placed in the unload port 8, a shutter 81 provided at the opening 13 of the casing 11 rises. Then, the wafer storage containers 20 are slid in the direction of arrow 82 by the sliding device of the unload port 8 (which has a mechanism similar to the sliding device of the load port 2), and the wafer storage containers 20 are transported out of the casing 11. Once the wafer storage containers 20 have been transported out of the casing 11, the shutter 81 descends, and the opening 13 of the casing 11 is closed.

[0078] The control unit 9 controls the operation of the entire wafer storage container cleaning apparatus 1. For example, the control unit 9 controls the load port 2, robot 3, lock / unlock stage 4, cleaning tank 5, drying tank 6, inspection unit 7, and unload port 8, thereby operating the load port 2, robot 3, lock / unlock stage 4, cleaning tank 5, drying tank 6, inspection unit 7, and unload port 8 as described above.

[0079] For example, the control unit 9 includes a CPU (Central Processing Unit), ROM (Read Only Memory), RAM (Random Access Memory), HDD (Hard Disk Drive), and a communication interface. These are connected via an internal bus.

[0080] The CPU executes various processes while using the RAM memory area as a temporary storage area for data used in various processes. The ROM and HDD store programs for executing the above-mentioned processes, as well as various databases and tables used when executing these processes. The communication interface communicates with the above-mentioned parts of the wafer storage container cleaning apparatus 1, and also communicates with external devices connected to the wafer storage container cleaning apparatus 1 via a network. For example, the communication interface is a network interface card.

[0081] The wafer storage container cleaning apparatus 1 according to the embodiment has been described above. As described above, the wafer storage container cleaning apparatus 1 cleans the container body 201 and the door 202 separately in separate cleaning tanks (first cleaning tank 51 and second cleaning tank 52), so cleaning can be performed efficiently. [Explanation of symbols]

[0082] 1. Wafer storage container cleaning device 5. Washing tank 51 First washing tank 52 Second washing tank

Claims

1. A first cleaning tank for cleaning the wafer storage container body of a wafer storage container having a door and a wafer storage container body, A second cleaning tank, located above the first cleaning tank, for cleaning the door, A wafer storage container cleaning apparatus equipped with [the following features].

2. The first washing tank is, A body holding mechanism for holding the wafer storage container body, A moving mechanism for moving the main body holding mechanism in the vertical direction, A wafer storage container cleaning apparatus according to claim 1, comprising:

3. The first washing tank is, The wafer storage container body is placed on a rotating table on which the placed wafer storage container body can be rotated, A cleaning liquid supply unit cleans the wafer storage container body by supplying cleaning liquid to the wafer storage container body while the wafer storage container body is rotated by the aforementioned rotating table, Equipped with, The main body holding mechanism has a through hole through which the rotary table can pass. The wafer storage container cleaning apparatus according to claim 2, wherein the moving mechanism moves the main body holding mechanism on which the wafer storage container body is placed from a first position which is above the rotating table to a second position which is below the rotating table, thereby transferring the wafer storage container body placed on the main body holding mechanism to the rotating table and placing the wafer storage container body on the rotating table.

4. The wafer storage container cleaning apparatus according to claim 3, wherein the moving mechanism moves the main body holding mechanism from the second position to the first position while the wafer storage container body is placed on the rotating table, thereby transferring the wafer storage container body placed on the rotating table to the main body holding mechanism.

5. The main body holding mechanism comprises a plurality of first positioning pins for positioning the wafer storage container body relative to the main body holding mechanism, The rotary table is provided with a plurality of second positioning pins for positioning the wafer storage container body relative to the rotary table. The second positioning pin contacts a position on the wafer storage container that is different from the position where the first positioning pin contacts, The wafer storage container cleaning apparatus according to claim 3, characterized in that when the mounting surface on the rotating table on which the wafer storage container body is placed and the mounting surface on the body holding mechanism on which the wafer storage container body is placed are at the same height, the wafer storage container body comes into contact with both the first positioning pin and the second positioning pin.

6. The first washing tank is, A cleaning liquid supply unit that cleans the wafer storage container body by supplying cleaning liquid to the wafer storage container body, A first gas supply unit dries the wafer storage container body by supplying a first gas to the wafer storage container body to remove the cleaning solution adhering to the wafer storage container body, After the cleaning solution is supplied to the wafer storage container body by the cleaning solution supply unit, and before the first gas is supplied to the wafer storage container body by the first gas supply unit, a second gas supply unit is provided on the wafer storage container body, connected to a purge port for purging the wafer storage container body, and supplies a second gas to the purge port. A wafer storage container cleaning apparatus according to claim 1, comprising:

7. Multiple of the aforementioned first washing tanks are provided. The system further includes a robot for transporting the wafer storage container body to each of the plurality of first cleaning tanks. Each of the first washing tanks is, A washing tank body having an opening, The cleaning tank body has a lid that can open and close the opening, Equipped with, The aforementioned lid is provided so that it can be opened and closed by the robot. A wafer storage container cleaning apparatus according to claim 1.

8. The wafer storage container cleaning apparatus according to claim 5, wherein the first positioning pin is provided with an adjustment mechanism for adjusting its own position in the main body holding mechanism.

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