Electronic structures, inertial measuring devices, electronic equipment, and mobile bodies
By connecting circuit and functional elements with protrusions and gaps, the design addresses heat transfer issues in silicon MEMS sensors, enhancing thermal insulation and reducing temperature-induced signal fluctuations.
JP2026052931APending Publication Date: 2026-03-25SEIKO EPSON CORP
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-12
- Publication Date
- 2026-03-25
Smart Images
Figure 2026052931000001_ABST
Abstract
The present invention provides an electronic structure that can improve the thermal insulation effect between circuit elements and functional elements. [Solution] An electronic structure comprising a circuit element and a functional element positioned to overlap with the circuit element in a plan view from the Z-axis direction along the Z-axis, with the three mutually orthogonal axes being the X-axis, Y-axis, and Z-axis, wherein a first group of protrusions consisting of a plurality of first protrusions arranged in the X-axis direction along the X-axis and a second group of protrusions consisting of a plurality of second protrusions arranged in the X-axis direction are provided between the circuit element and the functional element, the circuit element and the functional element are connected via the first group of protrusions and the second group of protrusions, and a gap is provided between the first group of protrusions and the second group of protrusions, the gap includes a first space provided from the negative end of the X-axis of the circuit element to the positive end of the X-axis.
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Physical quantity sensor, composite sensor, inertia measurement unit, portable electronic apparatus, electronic apparatus, and movable body
JP2019039885A