Three-dimensional stacked arrangement of nanoscopic devices, manufacturing method thereof, and use thereof

Abstract

This invention provides a three-dimensional arrangement of nanoscopic devices that form optimal thermal contact with an external heat bath, a method for manufacturing the same, and a method for using the same. [Solution] A three-dimensional arrangement (100) of nanoscopic devices (10), the arrangement (100) comprising a scaffold element (11) in the form of a fiber, a plurality of nanoscopic devices (10) electrically in contact via contact ends (2), and two electrical contacts (12) attached to the upper and lower parts of the fiber, respectively. The nanoscopic devices (10) are configured to exhibit a non-reciprocal transmission probability of an electron quantum wave packet, the nanoscopic devices (10) are attached to the scaffold element (11), and the majority of the nanoscopic devices (10) are oriented in one of the same transmission directions with a higher transmission probability of the electron quantum wave packet.

Description

Technical Field

[0001] This disclosure describes the three-dimensional arrangement of nanoscopic devices, their manufacturing methods, and their use. In this arrangement, a large number of nanoscopic devices are assembled together, each of which generates a small voltage or current by thermal driving to form a composite structure, and the electrical output of the entire structure is approximately proportional to the sum of the outputs of individual nanoscopic devices.

Background Art

[0002] In the following description, the following documents are referred to. [Mannhart, 2018a] J. Mannhart, Journal of Superconductivity and Novel Magnetism 31, 1649 (2018) [Mannhart, 2018b] J. Mannhart and D. Braak, Journal of Superconductivity and Novel Magnetism 31, 1649 (2018) [Bredol, 2019] P. Bredol et al., arXiv:1912.11948v1 (2019) [Mannhart, 2019] J. Mannhart et al., Physica E 109, 198-200 (2019) [Mannhart, 2020] J. Mannhart, Journal of Superconductivity and Novel Magnetism 33, 249 (2020) [Lettiere, 2020] B.R. Lettiere et al., ACS Appl. Nano Mater. 3, 77 2020 [Mannhart, 2021] J. Mannhart, H. Boschker, and P. Bredol, Nano Express 2, 014998 (2021) [Bredol, 2021] P. Bredol et al., Phys. Rev. B 104, 115413 (2021) [Mannhart_001] Patent application published as WO2019 / 166187 [Mannhart_002] Patent application published as WO2020 / 001822 [Mannhart_003] Patent application published as WO2020 / 053333 [Mannhart_004] Patent application published as WO2021 / 018515

[0003] Publications [Mannhart, 2018a, b; 2019; 2020; 2021; Bredol, 2019] and patent applications [Mannhart_001] to [Mannhart_004] disclose nanodevices and molecules, hereafter referred to as nanoelements or nanoscopic devices, that convert heat into the difference in electrochemical potentials at two junctions of a nanoelement by non-reciprocal transmission of an electron quantum wave packet and an inelastic scattering process. Heat is used to generate thermoelectric noise (Nyquist-Johnson noise) at the junctions of the nanoelement, which is on the order of kT, where k is Boltzmann's constant and T is temperature. The resulting difference in electrochemical potentials is several orders of magnitude smaller than that of the thermal noise.

[0004] Therefore, to generate a macroscopic electrical output, a large number (preferably 10) are needed. 20 The nanoelements (more than 100) need to be electrically connected. The publication [Bredol 2019] shows, for example, the corresponding two-dimensional arrangement of such nanoelements.

[0005] The three-dimensional arrangement of nanodevices has been discussed in the specific case where the nanodevices form unit cells of a natural three-dimensional crystal [Bredol 2019]. However, for nanodevices that do not form natural crystals, or when the optimal structure cannot be obtained from natural crystals, for example, when the optimal circuit connections of the nanodevices cannot be obtained from such crystals, or when the optimal thermal connection to an external heat bath cannot be obtained from such crystals, further methods for forming such arrangements are needed.

[0006] Those skilled in the art will recognize additional features and advantages by reading the following detailed description and considering the attached drawings.

[0007] The output power of nanoelements is small, and their energy scale is much smaller than kT. For example, to obtain a device output with practical energies such as mW or W, a large number of nanoelements must be electrically connected and arranged, paying attention to the correct polarity of the nanoelements. Here, 10 6 Connecting a macroscopic number of nanoelements (one or more) is most useful. For the device's functionality, it is also crucial that each nanoelement is well thermally connected to a heat bath located outside the device. Therefore, a method is needed to assemble nanoelements in a three-dimensional arrangement, connect them as described, and couple them to an external heat bath. [Overview of the project]

[0008] According to a first aspect of this disclosure, a three-dimensional arrangement of nanoscopic devices comprises a scaffold structure and a plurality of nanoscopic devices, configured to exhibit a non-reciprocal transmission probability of an electron quantum wave packet, particularly in conjunction with an inelastic scattering process, wherein the nanoscopic devices are attached to the scaffold structure, and the majority of the nanoscopic devices are oriented in one same transmission direction of the electron quantum wave packet. In technical terms, the majority usually means 50% or more, but in certain situations it may be necessary to aim for 70%, 80%, or 90% or more.

[0009] More specifically, non-reciprocal transmission probability means that a nanoscopic device includes a transmission direction in which the transmission probability of particles such as electrons is higher than the transmission probability in the reverse transmission direction. The nanoscopic device is oriented, at least primarily, along one of the same transmission directions with a higher transmission probability, i.e., along the direction in which the particles of the device have a higher transmission probability.

[0010] Therefore, this problem is solved by locally and microscopically assembling nanoelements on a microscopic scale on the surface of a second material that functions as a scaffolding element. These scaffolding elements are combined to form a scaffold, which is a macroscopic three-dimensional object optimized for the desired arrangement of nanoelements. In some implementations, this scaffold itself may also act as a heat conductor. In other implementations, another three-dimensional structure of the third material may perform this function.

[0011] Therefore, the overall arrangement includes a composite structure comprising numerous nanoscopic devices or nanoelements attached to a small number of scaffolding elements forming a scaffold, objects providing external electrical contacts, and optionally heat conduction paths.

[0012] According to the three-dimensional arrangement embodiment of the first aspect, the scaffolding structure includes at least one scaffolding element.

[0013] According to the three-dimensional arrangement embodiment of the first aspect, each nanoscopic device comprises at least two contacts and a non-reciprocal transmission probability of an electron quantum wave packet between the two contacts.

[0014] According to the three-dimensional arrangement embodiment of the first aspect, the occurrence of non-reciprocal transmission through a two-terminal device is subject to the following two conditions: a) When a wave packet is inserted into a nanodevice by one contact point, it remains in the device for a longer time compared to when it is inserted by another contact point. b) The wave packet is more likely to pass through the nanodevice in one direction. In a situation characterized by thermal equilibrium, the behavior of this device is comparable to that of Maxwell's demon. Condition (b) works if the device conforms to (a) and also has inelastic scattering in the device as shown in patent applications [Mannhart_001] to [Mannhart_004] and [Bredol, 2021].

[0015] According to the three-dimensional arrangement embodiment of the first aspect, substantially each nanoscopic device is connected between two other nanoscopic devices.

[0016] According to the three-dimensional arrangement embodiment of the first aspect, each nanoscopic device is further configured to convert ambient heat into the difference in electrochemical potential between two junctions.

[0017] According to an embodiment of the three-dimensional arrangement of the first aspect, the two contacts include a first contact and a second contact, and the three-dimensional arrangement further comprises a non-reciprocating transmission structure connected between the two contacts and configured to transmit an electron quantum wave packet from the first contact to the second contact, and possibly from the second contact to the first contact, in a manner that is at least partially phase-coherent.

[0018] According to the three-dimensional arrangement embodiment of the first aspect, the time-reversal symmetry of the transmission of the electron quantum wave packet is broken with respect to at least a portion of the transmission structure.

[0019] According to the embodiment of the three-dimensional arrangement of the first aspect, time-reversal symmetry is broken such that the transmission structure has a transmission probability that is higher for particles moving in a first direction from the first terminal to the second terminal than for particles moving in a second direction from the second terminal to the first terminal.

[0020] According to the three-dimensional arrangement embodiment of the first aspect, non-reciprocal transmission exists even without applying an external voltage or current to one or both of the first and second terminals.

[0021] According to an embodiment of the three-dimensional arrangement of the first aspect, the three-dimensional arrangement further includes at least two electrical contacts connected to the sides of the scaffold structures on opposite sides of each other.

[0022] According to an embodiment of the three-dimensional arrangement of the first aspect, the arrangement is such that 10 or more, preferably 1000 or more, nanoscopic devices are attached to the scaffold structure, preferably including 10 9 or more of a possible ensemble of the scaffold structure.

[0023] According to an embodiment of the three-dimensional arrangement of the first aspect, the scaffold structure includes one or more of a plurality of fibers or nanotubes, a plurality of sheets or foils, a plurality of graphene layers, or a plurality of semiconductor carriers.

[0024] The mechanism for attaching the nanoscopic device to the scaffold structure, particularly to the scaffold elements of the scaffold structure, may be different. The scaffold elements should always ensure that the nanoscopic device is connected to the docking site in a specific direction of the external contact so that they function properly as the docking site of the nanoscopic device, and the desired high-transmission direction of the nanoscopic device is directed and aligned in a controllable direction. Alternatively, the mechanism may be of a mechanical nature, for example, by means of a suitable adhesive coating, or it may also utilize electrical conductivity, magnetic or thermal properties. Below, for example, how the chemical bond between a specific side chain of the nanoscopic device and the docking site of the scaffold structure can be used for targeted docking will be described in more detail.

[0025] According to an embodiment of the three-dimensional arrangement of the first aspect, the scaffold structure includes an electrical connection structure.

[0026] According to a second aspect of the present disclosure, a method for manufacturing a three-dimensional arrangement of nanoscopic devices comprises providing a scaffold structure and attaching a plurality of nanoscopic devices to the scaffold structure, wherein the nanoscopic devices are configured to exhibit non-reciprocal transmission probabilities of an electron quantum wave packet, the attachment of the nanoscopic devices to the scaffold structure is performed such that most of the nanoscopic devices are connected between two other nanoscopic devices, and all nanoscopic devices are oriented in one same transmission direction of the electron quantum wave packet.

[0027] According to an embodiment of a method for manufacturing a three-dimensional arrangement of a nanoscopic device according to a second embodiment, the scaffold structure includes one or more of a plurality of fibers or nanotubes, a plurality of sheets or foils, a plurality of graphene layers, or a plurality of semiconductor carriers.

[0028] According to an embodiment of the method for manufacturing a three-dimensional arrangement of nanoscopic devices, a plurality of nanoscopic devices are attached to each other so as to be oriented along the same transmission direction of an electron quantum wave packet by applying a symmetry-breaking process.

[0029] According to an embodiment of the method for manufacturing a three-dimensional arrangement of nanoscopic devices according to a second embodiment, the method further includes applying electrical contacts to a scaffold structure.

[0030] Further embodiments of the method for manufacturing a three-dimensional arrangement of a nanoscopic device according to the second embodiment can be formed by combining it with any embodiment or feature described in relation to the three-dimensional arrangement of a nanoscopic device according to the first embodiment.

[0031] According to a third aspect of this disclosure, the use of the three-dimensional arrangement of nanoscopic devices according to the first aspect is, - A device to achieve a deviation from the 0th or 2nd law of thermodynamics. - Shifting the system from a state of thermal equilibrium, - The process of generating a temperature difference or voltage difference within one object or between multiple objects. - Transporting particles, information, momentum, angular momentum, electric charge, magnetic moment, or energy. - One or more of the following are provided: generating electric current and / or power.

[0032] Further embodiments of the use of three-dimensional arrangements of nanoscopic devices can be formed by combining them with any embodiments or features described in relation to the three-dimensional arrangements of nanoscopic devices of the first embodiment.

[0033] The attached drawings are included to provide a further understanding of the examples and are incorporated into this specification, forming part of it. The drawings illustrate the examples and, together with the explanation, serve to illustrate the principles of the examples. Many of the other examples and the intended benefits of the examples will be better understood and readily apparent by referring to the detailed explanation below. [Brief explanation of the drawing]

[0034] [Figure 1a] Figure 1a shows a sketch of the nanoelement. [Figure 1b] Figure 1b shows sketches of various implementation forms of nanoelements. [Figure 1c] Figure 1c shows sketches of various mounting configurations for nanoelements. [Figure 1d] Figure 1d shows sketches of various mounting configurations for nanoelements. [Figure 1e] Figure 1e shows sketches of various mounting configurations for nanoelements. [Figure 1f] Figure 1f shows sketches of various mounting configurations for nanoelements. [Figure 1g] Figure 1g shows sketches of various mounting configurations for nanoelements. [Figure 2] This diagram shows a schematic perspective view of the arrangement, including fibers as scaffolding elements and molecules attached to the fibers as nanoelements. [Figure 3]This diagram shows a schematic perspective view of the arrangement, which includes fibers as scaffolding elements and several molecules attached to the fibers as nanoelements. [Figure 4] This diagram shows a schematic perspective view of the arrangement, which includes fibers as scaffolding elements and multiple molecules attached to the fibers as nanoelements. [Figure 5a] Figure 5a shows the arrangement of several scaffold elements to which molecules are attached. [Figure 5b] Figure 5b shows a perspective view representing the arrangement in which the scaffolding structure is formed by the electrical connection structure. [Figure 5c] Figure 5c shows a perspective view representing the arrangement in which the scaffolding structure is formed by the electrical connection structure. [Figure 5d] Figure 5d shows a perspective view representing the arrangement in which the scaffolding structure is formed by the electrical connection structure. [Figure 6] A sketch illustrating a composite structure including a heat conductor that provides thermal coupling with an external heat bath is shown. [Modes for carrying out the invention]

[0035] In the following explanation, the terms “joined” and “connected” and their derivatives may be used. Please understand that these terms may be used to indicate that two elements cooperate or interact with each other, regardless of whether they are in direct physical or electrical contact, or whether they are not in direct or physical or electrical contact with each other, i.e., whether there is one or more intermediate elements between the two elements.

[0036] It should be noted that when discussing nanoelements or nanoscopic devices below, these terms should be understood broadly and in a wide range of contexts. In terms of function, it essentially functions as a device involving the non-reciprocal transmission of electron quantum wave packets. In terms of structure, it can be understood as an artificial or man-made structure, such as an electric wire or transmission line, manufactured by various technical methods. However, it can also be understood as consisting of, or containing, chemical components such as molecules, molecular compounds, or molecular rings like benzene rings. Furthermore, it can also refer to solid compounds, such as crystalline structures, that exert the function of the device.

[0037] The term "nanoscopic" refers to the average size of devices used in three-dimensional arrangements, for example, in the range of 0.5 nm to 1000 nm. In particular, the average size of chemical components such as molecules, molecular compounds, and molecular rings like benzene rings can range from 0.5 nm to 50 nm or larger. On the other hand, the average size of technically fabricated quantum devices, such as wires or power lines, can range from 2 nm to 200 nm or larger.

[0038] It should be further emphasized that in the embodiments of the three-dimensional arrangement of nanoscopic devices shown and described below, it is not necessary to apply an external voltage or current to any one of the individual devices or to the entire arrangement. In such cases, the devices function themselves as conductors of current, particularly as sources of voltage, current, or alignment, or in a lossless and / or non-superconducting and / or non-Josephson conducting manner. More generally, in this case, no external force is required to push particles into the devices other than a heat bath at temperature T>0K. However, it is also possible to apply an external voltage, current, or temperature gradient to at least one of the devices.

[0039] Figure 1 includes Figures 1a to 1g, where Figure 1a shows a sketch of the nanoscopic device, and Figures 1b to 1g show sketches of different implementations of the nanoscopic device.

[0040] In particular, Figure 1a shows a schematic diagram of a nanoscopic device including an electrical conductor 1 and an electrical contact 2 connected to a port on the opposite side of electrical conductor 1. Electrical conductor 1 is characterized by the non-reciprocal transmission of an electron quantum wave packet, which is made possible by the arrow shape of the conductor. Electrical conductor 1 has a lower input port and an upper output, with a first electrical contact 2 connected to the lower input port and a second electrical contact 2 connected to the upper output port. The electron quantum wave packet is radiated in the direction from the first electrical contact 2 to the second electrical contact 2 and vice versa. The quantum device is constructed such that the net current of the electron wave packet is in the direction from the first electrical contact to the second electrical contact. The motion of the electron wave packet is produced by the extraction of thermal energy from an external heat bath.

[0041] In principle, a nanoscopic device can be any of the electronic devices described in one of the above patent applications [Mannhart_001] to [Mannhart_004]. Some further examples of nanoscopic devices are shown in Figures 1b to 1g below.

[0042] Figure 1b shows a nanoscopic device as a possible realization of the quantum device described in Figure 1a.

[0043] The quantum device shown in Figure 1b includes an electrical conductor 1, which is formed in a conical structure that includes an inelastic scattering center and tapers from the input port to the output port, and is fabricated on a semiconductor base such as silicon. In other words, the base of the cone is located at the first electrical contact. The cone can be pointed or taper into a frustoconical shape, but in either case, the tip of the cone is below the second electrical contact. The cone shown in Figure 1b is a circular cone. However, other geometric shapes such as pyramids, truncated pyramids, tetrahedrons, and obelisks are also possible.

[0044] Figure 1c shows a sketch of a molecule used as a nanoelement.

[0045] The quantum device shown in Figure 1c includes a cyclic molecule 10, such as a benzene ring 10. As is well known, the basic structure of the benzene ring 10 consists of six carbon atoms bonded to each other in a ring. Each carbon atom has four valence electrons, two of which bond the atom to an adjacent carbon atom. The molecule 10 in Figure 1b includes two electrical junctions 2, two side chains 4 for attaching the molecule to a scaffolding element, and a side chain 3 that introduces symmetry breaking, instead of the hydrogen atoms of the benzene ring 10.

[0046] Symmetry breaking occurs as follows: As described by the Schrödinger equation, electrons in molecules or nanodevices form electron waves (s, p, d orbitals, etc., in the case of atoms). Electron waves propagate through all the places they can occupy, and therefore, if the corresponding energy levels are compatible, they also propagate through atoms or side chains added to the molecule. Thus, when electrons are supplied to an asymmetric molecule, in principle, the electronic states and the temporal changes in the wave packets formed from these states also become asymmetric. This is what is desired. Therefore, for illustrative purposes, as a simple example, we include side chain 3 in the essentially cyclic molecule of Figure 1c.

[0047] Other ways to realize asymmetric electronic states include, for example, giving the molecule itself an asymmetric shape such as a triangle, selecting a molecule with a symmetric shape but in which atomic sites are asymmetrically occupied by several types of atoms or ions, or, as already mentioned, using artificial nanoelements.

[0048] Figure 1d shows a sketch of a nanodevice consisting of a nanotube containing two different atoms and an inelastic scattering center.

[0049] The quantum device shown in Figure 1d comprises an electrical conductor 1 in the shape of a nanotube 5 and at least two different atoms or ions 6a, 6b attached to or embedded in the nanotube 5, the at least two different atoms 6a, 6b being used for symmetry breaking. The quantum device in Figure 1d further comprises two electrical contacts 2 in the form of magnetic, dielectric, or ferroelectric components 7 used to orient the nanoelements in the direction indicated by the arrows.

[0050] Figure 1e shows a sketch of a nanodevice with a nanotube shape similar to that of Figure 1d.

[0051] The quantum device shown in Figure 1e comprises an electrical conductor 1 in the form of a nanotube 5 containing an inelastic scattering center. Furthermore, in this implementation, ferroelectric particles 8 are attached to or embedded in the nanotube 5, simultaneously disrupting electron transport interoperability and providing a means to orient the nanotube 5 as indicated by the arrows.

[0052] Figure 1f shows a sketch of a nanodevice containing a graphene sheet.

[0053] The quantum device shown in Figure 1f comprises an electrical conductor 1 in the shape of a graphene sheet 1, and the electron transport reciprocity is broken by incorporating a triangular section 1A containing a double layer of graphene. Furthermore, there are inelastic scattering sites in the form of additional atoms 1A.1 added to the C atoms. The carbon atoms forming the triangular section 1A are drawn magnified, and the central C atom containing the additional atoms is drawn even slightly larger.

[0054] Figure 1g shows a sketch of a nanodevice containing a graphene sheet attached to an asymmetrically shaped carrier.

[0055] The quantum device shown in Figure 1g comprises the nanodevice shown in Figure 1f, with a graphene sheet 1 attached to an asymmetrically shaped carrier 9 and equipped with an electrical contact 2. The asymmetry is generated by the carrier 9 tapering towards the top of the quantum device.

[0056] The structure shown in Figure 1g is perhaps easiest to implement and explain in more specific terms. Similar structures are now routinely produced for so-called two-dimensional materials (such as graphene, as shown in Figure 1f). This is demonstrated, for example, in publications such as “Two-dimensional van der Waals materials” by P. Ajayan et al. in PHYSICS TODAY, September 2016, Pages 39-44, “Integration of bulk materials with two-dimensional materials for physical coupling and applications” by S.-H. Bae et al. in NATURE MATERIALS, Vol. 18, June 2019, Pages 550-560, and “Graphene and two-dimensional materials for silicon technology” by D. Akinwande et al. in NATURE, 26 September 2019, Vol. 573, Pages 507-518.

[0057] Figure 2 shows a schematic perspective view of the arrangement including fibers as scaffolding elements and molecules as nanoelements attached to the fibers.

[0058] The arrangement shown in Figure 2 includes a scaffold element 11 in the form of a fiber 11 and a nanoelement 10 in the form of a molecule 10 attached to the fiber 11. The molecule 10 may be one of those shown and described above in relation to Figure 1c.

[0059] Figure 3 shows a schematic perspective view of an arrangement including fibers as scaffolding elements and several molecules attached to the fibers as nanoelements.

[0060] The arrangement shown in Figure 3 includes a scaffold element 11 in the form of a fiber 11 and several nanoelements 10 in the form of molecules 10 attached to the fiber 11. The orientation of the molecules 10 along the fiber axis is maintained and indicated by arrows. It is shown that the two molecules 10 on the right are in electrical contact via contact ends 2.

[0061] Figure 4 shows a schematic perspective view of the arrangement, which includes fibers as scaffolding elements and multiple molecules attached to the fibers as nanoelements.

[0062] The arrangement 100 shown in Figure 4 includes a scaffold element 11 in the form of a fiber 11 and a plurality of nanoelements 10 in the form of molecules 10 attached to the fiber 11. The orientation of the molecules 10 along the fiber axis is maintained and indicated by arrows. The arrangement 100 has two electrical contacts 12 attached to the top and bottom of the fiber, respectively. The bottommost molecule 10 is connected to the bottom electrical contact 12 via its respective bottom contact 2, and the topmost molecule 10 is connected to the top electrical contact 12 via its respective top contact 2 (not shown in this figure). All other molecules 10 are bonded between two other adjacent molecules.

[0063] Figure 5, including Figures 5a to 5d, shows sketches of different embodiments of the three-dimensional arrangement of nanoscopic devices.

[0064] Figure 5 includes Figures 5a to 5d, where Figure 5a shows the arrangement of several scaffold elements to which molecules are attached, and Figures 5b to 5d show perspective views of the arrangement in which the scaffold structure is formed by the electrical connection structure.

[0065] The arrangement 200 shown in Figure 5a represents a bundle of multiple scaffold elements 100 in the form of fibers to which nanoelements in the form of molecules are attached. The scaffold elements 100 can be constructed in the same manner as shown and described in relation to Figure 4. Electrical contacts in the form of plates 13 are used to provide parallel and series connections of the scaffold elements. The plates 13 consist of an uppermost plate 13, a lowermost plate 13, and two intermediate plates 13.

[0066] Figures 5b to 5d show representations of the arrangement in which the scaffolding structure is formed by the electrical connection structure.

[0067] The arrangement 300 shown in Figure 5b shows several nanoelements, as shown and described in relation to Figure 1g, namely, graphene layers 1 attached to an asymmetrically shaped carrier 9 and provided with electrical contacts 2. These nanoelements are directly connected to electrical contacts in the form of plates 13. Plate 13 consists of an uppermost plate 13, a lowermost plate 13, and two intermediate plates 13. Thus, in this embodiment, the electrical connection structure consisting of plates 13 itself functions as a scaffold structure.

[0068] The arrangement 400 shown in Figure 5c represents several nanoelements, i.e., nanotubes, as shown and described in relation to Figure 1d. These nanoelements are directly connected to the electrical contacts in the form of a plate 13. The plate 13 consists of an uppermost plate 13, a lowermost plate 13, and two intermediate plates 13. Thus, in this embodiment as well, the electrical connection structure consisting of the plate 13 itself functions as a scaffold structure. Of course, in this embodiment, nanotubes as shown and described in relation to Figure 1e can also be used.

[0069] The arrangement 500 shown in Figure 5d represents several nanoelements 10, i.e., cones, as shown and described in relation to Figure 1b. These nanoelements 10 are directly connected to electrical contacts in the form of plates 13. The plates 13 consist of an uppermost plate 13, a lowermost plate 13, and two intermediate plates 13. Thus, in this embodiment as well, the electrical connection structure consisting of plates 13 itself functions as a scaffolding structure.

[0070] Various methods can be considered for manufacturing the device shown in Figure 5. To create the layers of the structure in Figure 5, for example, a photolithography process can be considered in which holes are defined in the plate 13 on which the nanoelements 100 are then placed. The different layers can then be stacked manually or using appropriate known apparatus methods.

[0071] Figure 6 shows a sketch illustrating a composite structure that includes a heat conductor, which provides thermal coupling with the external heat bath.

[0072] The assembly shown in Figure 6 includes three three-dimensional arrangements 200, as shown and described in relation to Figure 5a. These arrangements 200 are connected to an electrical plate 13 and are grouped around a central heat conductor 14. The heat conductor 14 can be manufactured from a highly thermally conductive material such as metal and serves as a thermal coupling with the external heat bath.

[0073] 1. Implementation method using fiber-based scaffolding elements In this implementation, fibers such as nanotubes are used as scaffolding elements. Three steps are required to manufacture the entire assembly. The order of the steps used in this description is not mandatory, and some or all of the steps can be performed in parallel, for example.

[0074] In the deposition step (a), the nanoelements are deposited directly onto the fibers or onto fibers coated with a functional buffer layer or buffer layer system. In the example obtained, the functionalized end groups of the nanoelements determine which side they bond to the fibers.

[0075] For the assembly to function, the nanoelements must be further oriented with the correct polarity along the fiber axis. This step must be performed so that the ends of the nanoelements are in electrical contact with other nanoelements or different conductors.

[0076] Therefore, when assembling nanoelements, it is necessary to apply a symmetry-breaking process to orient the molecules as nanoelements along the fiber axis. Applying a magnetic field, pressure gradient, electric field gradient, or particle impact when attaching nanoelements are examples of means of breaking this symmetry. Furthermore, an appropriate surface structure of the fiber or a buffer layer grown on the fiber can also function to achieve the same goal.

[0077] In assembly step (b), it is necessary to establish the three-dimensional arrangement of the fibers. For this purpose, known techniques for manufacturing nanotube forests (see, for example, [Lettiere 2020]) can be applied. Assembly can also be performed by mechanically aligning the fibers and assembling them into bundles, thereby maintaining the polarity of the fibers.

[0078] The fibers may be nanotubes (e.g., graphene), glass fibers, or polymer fibers, all of which may be coated with a buffer layer or buffer layer system. The fibers can be coated by deposition from a liquid phase (e.g., Langmuir-Bludget coating) or by deposition from a gas phase (e.g., MOCVD). If the bond between the nanoscopic device and the fibers is too weak, a coating layer can be selected to strengthen the bond between the side chains 4 of the nanoscopic device 10 and the fibers. This bonding layer may consist simply of an adhesive, or it may consist of molecules that strongly bond to the fibers and provide specific bonds, such as thiol bonds (SH), to the side chains 4.

[0079] The fibrous material is preferably selected to be insulating so as not to cause an electrical shunt between the electrical contacts 12. More preferably, the fibrous material is selected to be neither ferromagnetic, ferrimagnetic, nor antiferromagnetic, or to generate a magnetic field in another way, so as not to induce an undesirable phase shift of electrons passing through the nanodevice.

[0080] Furthermore, in applications requiring a constant temperature for the arrangement or a large heat flow through it, it is even more preferable to select fibers with high thermal conductivity.

[0081] In the steps of deposition, assembly, and contact, the use of patterned or structured coatings of fibers by the aforementioned buffer layer (system) may be beneficial.

[0082] 2. Mounting configuration using substrate carrier scaffolding elements In this implementation, illustrated in Figures 1f, 1g, and 5b, the nanoelements are deposited on or fixed to a carrier, such as an asymmetrically shaped ultrathin Si wafer, which functions as a scaffolding element. The assembly of the nanoelements on the carrier is then performed in the same manner as the assembly described for the device shown in Figure 6a.

[0083] The substrate carrier material is preferably selected to be insulating so as not to generate an electrical shunt. More preferably, the substrate carrier material is selected to be neither ferromagnetic, ferrimagnetic, nor antiferromagnetic, or to generate a magnetic field in another way, so as not to induce an undesirable phase shift of electrons passing through the nanodevice.

[0084] The substrate carrier can be formed from, for example, a self-supporting oxide, nitride, or carbide film, a thin semiconductor wafer, or a sheet or foil made of plastic foil patterned into a desired shape, for example by laser cutting. The adhesion of the nanoelement to the substrate carrier can be enhanced by a thin layer deposited on the substrate carrier, resulting in good chemical bonding with the nanodevice. Furthermore, the substrate carrier material is preferably selected to be insulating so as not to result in an electrical shunt.

[0085] It is even more preferable that the substrate carrier material is neither ferromagnetic, ferrimagnetic, nor antiferromagnetic, or otherwise generates a magnetic field, so as not to induce undesirable phase shifts of electrons passing through the nanodevice. Furthermore, in applications requiring a constant temperature for the arrangement or a large heat flow through it, it is even more preferable to select a substrate carrier material with high thermal conductivity.

[0086] 3. Implementation using sheet-based scaffolding elements In the deposition step (a), nanoelements are assembled into a sheet using standard deposition techniques such as Langmuir-Bludget deposition or growth by self-assembly. As with the fibers described above, the surface of the sheet may be pre-prepared by depositing a buffer layer. Also, as with the fibers described above, it is necessary to break the in-plane symmetry of the nanoelement deposition process on the sheet in order to provide the desired polarity of the attached nanoelements. Here, in addition to the application of magnetic fields, pressure gradients, electric field gradients, or particle impacts, surface orientation (proximity cutting) or the selection of materials with a crystalline structure that already has the desired symmetry breaking may be used.

[0087] The sheet or foil may consist of, for example, a film of a self-supporting oxide, nitride, or carbide, a van der Waals material such as graphene or a transition metal dichalcogenide or a stack thereof, or a polycarbonate foil. For example, surface structures resulting from step- or lithography-induced patterns of unit cells reflecting viscous cross-sections can be used for orienting nanodevices. The sheet material is preferably selected to be insulating so as not to result in an electrical shunt.

[0088] It is even more preferable that the sheet material is selected to generate a magnetic field in a manner that is neither ferromagnetic, ferrimagnetic, nor antiferromagnetic, or otherwise, so as not to induce an undesirable phase shift of electrons passing through the nanodevice.

[0089] Furthermore, for applications requiring a constant temperature for placement or a large heat flow through it, it is even more preferable to select a sheet material substrate with high thermal conductivity.

[0090] Advantages may be obtained by pre-equipping the sheet surface with patterned electrical conductors, and / or by providing the sheet with a thermal conductive structure, such as a thermal conductive layer attached to the sheet side or a thermal conductive layer embedded in the sheet.

[0091] In assembly step (b), the sheets to which the nanodevices are attached are formed into a bulk three-dimensional structure by, for example, folding, rolling, or stacking. Next, the sheets are brought into electrical contact (step (c)).

[0092] 4. Implementation form in which the scaffolding structure is provided by the electrical connection structure. In these implementations, the nanoelements are designed to also function as scaffolding elements. Two examples are presented to illustrate this. In the example illustrated in Figure 5c, the mechanical strength of individual nanotubes is utilized to assemble the structure shown in Figure 5c. In this case, it may be useful to add additional scaffolding elements as additional spacers between the contact elements 13. The example shown in Figure 5d is similar to the example in Figure 5c, except that the conical nanoelements shown in Figure 1b are used.

[0093] 5. Architecture of assembled structures The different assembly processes described above result in the optional integration of thermal conductors to transport thermal energy between the nanodevice and the external heat bath, as shown in Figure 6.

[0094] The architecture of the scaffold assembly can be chosen so that the nanodevices are first electrically connected to form modules. In the second step, these modules are electrically connected to each other, and the desired output impedance of the entire assembly is achieved.

[0095] The assembly process described above in relation to fibers or sheets results in the optional integration of a heat conductor to transport thermal energy between the nanodevice and the external heat bath.

[0099] Furthermore, the architecture of the scaffold assembly can be chosen so that the nanodevices are first electrically connected to form modules. In the second step, these modules are electrically connected to one another to achieve the desired output impedance of the entire assembly.

[0096] While this disclosure has illustrated and described one or more implementations, changes and / or modifications can be added to the examples shown without departing from the scope and spirit of the appended claims. In particular, with respect to the various functions performed by the components or structures (assemblies, devices, etc.) described above, the terms used to describe such components are intended, unless otherwise indicated, to correspond to any component or structure that performs a specified function of the described component (e.g., functionally equivalent), even if it is not structurally equivalent to a disclosed structure that performs that function in the exemplary implementations of the disclosure described herein, or even if it is not structurally equivalent to a disclosed structure that performs a particular function of the described component.

Claims

[Claim 1] A three-dimensional arrangement (100) of nanoscopic devices, - Scaffolding structure (11), and - A plurality of nanoscopic devices (10), each configured to exhibit the non-reciprocal transmission probability of an electron quantum wave packet, comprising: - The nanoscopic device (10) is attached to the scaffold structure (11), and the majority of the nanoscopic device (10) is oriented in one of the same transmission directions with a higher transmission probability of the electron quantum wave packet. The scaffold structure (11) includes one or more of the following: multiple fibers or nanotubes, multiple sheets or foils, multiple graphene layers, or multiple semiconductor carriers. Three-dimensional arrangement of nanoscopic devices (100).

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