Planarization process, planarization system, and method for manufacturing articles

Abstract

This invention provides a planarization system and method that prevents the drawbacks of conventional methods. [Solution] A method for planarizing a substrate includes distributing a formable material onto the substrate; bringing a superstraight held by a superstraight chuck into contact with the formable material on the substrate at a planarization station at a first position, thereby forming a multilayer structure including the superstraight, a film of the formable material, and the substrate; releasing the superstraight from the superstraight chuck; moving the multilayer structure from the first position to a curing station located at a second position away from the first position, which includes an array of light-emitting diodes; and curing the film of the multilayer structure by exposing it to light emitted from the array of light-emitting diodes.

Description

Technical Field

[0001] The present disclosure relates to substrate processing, and more particularly to surface planarization in semiconductor manufacturing.

Background Art

[0002] Planarization techniques are useful in the manufacture of semiconductor devices. For example, the process for fabricating a semiconductor device includes repeated addition of materials to a substrate and removal of materials from the substrate. This process can produce a layered substrate with irregular height variations (i.e., topography), and as more layers are added, the height variations of the substrate can increase. The height changes adversely affect the ability to add additional layers to the layered substrate. Separately, a semiconductor substrate (e.g., a silicon wafer) itself is not necessarily completely flat and can include initial surface height variations (i.e., topography). One way to address this problem is to planarize the substrate between stacking steps. Various lithographic patterning methods benefit from planarization on a plane. In ArFi laser-based lithography, planarization improves the depth of focus (DOF), critical dimension (CD), and critical dimension uniformity. In extreme ultraviolet lithography (EUV), planarization improves the feature placement and DOF. In nanoimprint lithography (NIL), planarization improves the feature filling and CD control after pattern transfer.

[0003] A planarization technique, sometimes called inkjet-based adaptive planarization (IAP), involves dispensing a variable droplet pattern of a polymeric material between a substrate and a superstrate, the droplet pattern varying according to the substrate topography. The superstrate is then contacted with the polymeric material, and then the material is polymerized on the substrate and the superstrate is removed. Improvements to planarization techniques, including the IAP technique, are desired, for example, to improve wafer-level processing and the manufacture of semiconductor devices.

[0004] In some known imprint / planarization systems and methods, the curing step is performed by transmitting UV light radiation through a transparent superstraight chuck. Curing through a transparent superstraight chuck can result in uneven transmission of UV light radiation to the formable material located between the superstraight and the substrate, due to the structure of the superstraight chuck. Uneven transmission can lead to unsatisfactory curing performance. Furthermore, in systems where UV light radiation is transmitted through a transparent superstraight chuck, numerous optical components (e.g., dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.) are used to direct the UV light radiation. This results in large, high-profile systems that are quite costly. Therefore, there is a need in the art for planarization systems and methods that prevent these drawbacks. [Overview of the project]

[0005] A method for planarizing a substrate involves distributing a formable material onto the substrate, bringing a superstraight held by a superstraight chuck into contact with the formable material on the substrate at a first position planarization station, thereby forming a multilayer structure including the superstraight, a film of the formable material, and the substrate, and releasing the superstraight from the superstraight chuck. The process includes moving the multilayer structure from the first position to a curing station which includes an array of light-emitting diodes located at a second position away from the first position, and curing the film of the multilayer structure by exposing it to light emitted from the array of light-emitting diodes.

[0006] The planarization system comprises a substrate chuck configured to hold a substrate, a superstraight chuck configured to hold a superstraight, a positioning stage, a distribution system configured to distribute a formable material onto the substrate, a planarization station configured to bring the formable material distributed onto the substrate into contact with the superstraight at a first position to form a multilayer structure including the superstraight, a film of the formable material, and the substrate, and a curing station located at a second position away from the first position, including an array of light-emitting diodes, wherein the superstraight chuck is further configured to release the superstraight, the positioning stage is configured to move the multilayer structure from the planarization station to the curing station after the superstraight has been released, and when the multilayer structure is placed in the curing station, the curing station is configured to cure the film of the multilayer structure by exposing it to light emitted from the array of light-emitting diodes.

[0007] A method for manufacturing an article includes distributing a moldable material onto a substrate; bringing a superstraight held by a superstraight chuck into contact with the moldable material on the substrate at a planarization station at a first position, thereby forming a multilayer structure comprising the superstraight, a film of the moldable material, and the substrate; releasing the superstraight from the superstraight chuck; moving the multilayer structure from the first position to a curing station located at a second position away from the first position, which includes an array of light-emitting diodes; curing the film of the multilayer structure by exposing it to light emitted from the array of light-emitting diodes; and processing the cured film to produce the article.

[0008] These and other purposes, features, and advantages of this disclosure will become apparent upon reading the following detailed description of exemplary embodiments of this disclosure in conjunction with the accompanying drawings and the claims provided. [Brief explanation of the drawing]

[0009] To allow for a more detailed understanding of the features and advantages of this disclosure, a more specific description of embodiments of this disclosure can be obtained by referring to the embodiments shown in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate typical embodiments of this disclosure and should not be considered to limit the scope of this disclosure, and this disclosure may allow for other equally valid embodiments. [Figure 1] This is a schematic diagram of an example of a planarization system according to one aspect of the present disclosure. [Figure 2] This is a flowchart illustrating an exemplary method of planarization according to one aspect of the present disclosure. [Figure 3A] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3B] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3C] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3D] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3E] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3F] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3G] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3H] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3I] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3J] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 3K] Figure 2 is a schematic cross-sectional view showing the planarization method. [Figure 4]This is a schematic cross-sectional view showing a part of a planarization system according to another aspect of the present disclosure. Herein, the present disclosure will be described in detail with reference to the drawings, so in relation to exemplary embodiments. It is intended that changes and modifications can be made to the exemplary embodiments described without departing from the true scope and spirit of the disclosure of subject matter as defined by the appended claims. [Modes for carrying out the invention]

[0010] Flattening system Figure 1 shows an exemplary system for planarization according to one aspect of the present disclosure. The planarization system 100 is used to planarize a film on a substrate 102. The substrate 102 may be coupled to a substrate chuck 104. The substrate chuck 104 may be, but is not limited to, a vacuum chuck, a pin chuck, a groove chuck, an electrostatic chuck, an electromagnetic chuck, and the like.

[0011] The substrate 102 and substrate chuck 104 may be further supported by a substrate positioning stage 106. The substrate positioning stage 106 can provide translational and / or rotational motion along one or more of the x, y, z, θ, ψ, and φ axes. The substrate positioning stage 106, substrate 102, and substrate chuck 104 may also be positioned on a base (not shown). The substrate positioning stage 106 may be part of a positioning system.

[0012] As shown in Figure 1, in an exemplary embodiment, the planarization system 100 may include three separate stations, namely a distribution station 103, a planarization station 105, and a curing station 107. The three stations may be located in different positions. A stage 106 can move along a rail 109 (Figures 3B, 3E-3J) to transport the substrate 102 to each of the three stations. In another exemplary embodiment, the substrate 102 and substrate chuck 104 may be transported to the various stations via a robotic arm. In the exemplary embodiment described below in more detail with respect to Figures 3A-3J, the planarization station 105 is located in a first position and the curing station 107 is located in a second position different from the first position, although the two positions may be contained within a common housing 114 (Figures 3B, 3E-3J).

[0013] The distribution station 103 of the planarization system 100 may be equipped with a fluid dispenser 122. The fluid dispenser 122 may be used to deposit droplets of liquid moldable material 124 (e.g., photocurable polymerizable material) onto the substrate 102, the volume of material deposited varying over the region of the substrate 102 based at least partially on its topographic profile. Various fluid dispensers 122 can be used for various techniques to distribute the moldable material 124. If the moldable material 124 is jettable, an inkjet-type dispenser may be used to eject the moldable material. For example, thermal inkjet, micro-electromechanical system (MEMS) based inkjet, valve jet, and piezoelectric inkjet are common techniques for distributing jettable liquids. In the illustrated exemplary embodiment, the fluid dispenser 122 may be stationary because the substrate 102 is transported to the distribution station 103, and the distribution station 103 is located separately from the planarization station 105 and the curing station 107.

[0014] As shown in Figure 1, the planarization station 105 of the planarization system 100 may include a superstraight 108 having a work surface 112 facing and spaced apart from the substrate 102. The superstraight 108 can be formed from materials including, but are not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, and hardened sapphire. In one embodiment, the superstraight 108 is readily transparent to UV light radiation. The surface 112 is generally the same area size as, or slightly larger than, the surface of, the substrate 102.

[0015] The planarization station 105 may further include a superstraight chuck 118 and a planarization head 120, which is part of a positioning system. The superstraight 108 may be coupled to or held by the superstraight chuck 118. The superstraight chuck 118 may be coupled to the planarization head 120. The planarization head 120 may be movably coupled to a bridge. The planarization head 120 may include one or more actuators such as a voice coil motor, a piezoelectric motor, a linear motor, a nut and screw motor, which are configured to move the superstraight chuck 118 relative to the substrate 102 at least in the z-axis direction and potentially in other directions (e.g., x-axis, y-axis, θ-axis, ψ-axis, and φ-axis). During operation, either or both of the planarization head 120 and the substrate positioning stage 106 vary the distance between the superstraight 108 and the substrate 102 to define a desired space (a bounded physical area in three dimensions) to be filled with the moldable material 124. For example, the planarizing head 120 can be moved toward the substrate, and force can be applied to the superstraight 108 so that the superstraight comes into contact with a droplet of the moldable material 124, as further detailed herein, and spreads it out.

[0016] The planarization station 105 can further include a camera 136 arranged to observe the spread of the formable material 124 when the superstrate 108 contacts the formable material 124 during the planarization process. The camera 136 can include one or more of a CCD, a sensor array, a line camera, and a photodetector, which are configured to collect light of a wavelength indicating the contrast between the area in contact with the formable material 124 under the superstrate 108 and the area not in contact with the formable material 124 under the superstrate 108. The camera 136 can be configured to provide an image of the spread of the formable material 124 under the superstrate 108 and / or an image of the separation of the superstrate 108 from the cured formable material 124. Also, the camera 136 may be configured to measure interference fringes that change as the formable material 124 spreads between the gap between the surface 112 and the substrate surface.

[0017] In another exemplary embodiment, the dispensing station 103 and the planarization station 105 may be integrated into a single station. In such an embodiment, the fluid dispenser 122 can be movably coupled to the bridge. In one embodiment, the fluid dispenser 122 and the planarization head 120 share one or more of all the positioning components. In an alternative embodiment, the fluid dispenser 122 and the planarization head move independently of each other. When the dispensing station 103 and the planarization station 105 are integrated into a single station, the fluid dispenser 122 and the planarization head 120 are movable such that each can perform its respective function without interfering with each other.

[0018] As described above, the curing station 107 can be arranged at a position different from the flattening station 105. As will be described in more detail below, following the shaping of the formable material film 144 at the flattening station 105, the substrate 102 having the formable material film 144 and the superstrate 108 thereon is moved to the curing station 107. The curing station 107 includes a radiation source 126 that directs chemical energy, such as UV light radiation, along the exposure path 128. In an exemplary embodiment, the radiation source 126 comprises an array of light emitting diodes (LEDs) 127 and a diffuser 129. The array of LEDs 127 and diffuser 129 can be configured such that the emitted light is distributed over the substrate 102 with a uniformity of 80% or more. The diffuser 129 may be arranged in proximity to the light output of the LEDs to help achieve the target uniformity. The wavelength of the emitted light may be between 300 and 400 nm. The stage 106 and rails 109 may be configured to position the substrate 102 and the superstrate 108 by sandwiching the formable material film 144 and overlapping it with the exposure path 128. The array of LEDs 127, in combination with the diffuser 129, transmits actinic energy along the exposure path 128. In this way, the chemical energy is uniformly applied to the formable material film 144. In particular, the curing station 107 does not (does not) include additional optical components (such as dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.). That is, the array of LEDs 127 and diffuser 129 is all that is required to uniformly direct sufficient chemical energy over the surface area of the formable material film. The curing station 107 can further include a camera 137 for data collection and monitoring regarding the curing process. For example, the camera 137 can image incomplete local curing, such as when one or more of the LEDs in the array of LEDs 127 fail.

[0019] The planarization system 100 may further include a detector 139 configured to detect one or more, or all, of the following after the planarization step is completed at the planarization station 105: a) particles placed between the superstraight 108 and the substrate 102, b) incomplete spreading of the formable material 124, c) particles placed on the upper surface 141 of the superstraight 108 (i.e., on the surface opposite to the surface facing the formable material film 144), and d) scratches placed on the upper surface 141 of the superstraight 108.

[0020] With regard to detecting particles between the superstraight 108 and the substrate 102, or detecting imperfect spreading of the moldable material 124, if such defects are detected before curing, curing can be stopped and the substrate can be recovered by removing the moldable material. Otherwise, if curing is performed with these defects, the substrate 102 may potentially need to be discarded. To detect particles between the superstraight 108 and the substrate 102, the detector 139 can use, for example, optical imaging via a line scan camera, scatometer, or microscope. With regard to detecting imperfect spreading of the moldable material 124, the detector 139 can use optical imaging via a line scan camera, microscope, or interference fringe detection. The detector 139 can be used to determine whether the size and / or amount of particles exceeds a predetermined threshold. The predetermined threshold can be selected based on the specifications of a particular manufacture. If the threshold is exceeded, curing can be stopped. Furthermore, in most cases, if the detector 139 detects any amount of imperfect spreading, curing can be stopped. However, in some cases, the detector 139 can have sufficiently high resolution to detect a degree of imperfection that is within an acceptable tolerance range for a particular manufacturing. In such cases, a predetermined threshold can be used to determine when to interrupt the curing process.

[0021] With regard to detecting particles and scratches on the upper surface 141 of the superstraight 108, the detector can similarly be a line scan camera, a scantrometer, or a microscope. Particles placed on the upper surface 141 of the superstraight 108 may adversely affect the flatness of the superstraight chucking, and the particles may also move to the substrate 102 or substrate chuck 104, adversely affecting the resulting planarization of the moldable material. Scratches on the upper surface 141 of the superstraight 108 may indicate wear and / or particle generation, indicate that the superstraight 108 needs to be replaced, and / or adversely affect the curing of the moldable material 124. If scratches are detected on the upper surface 141 of the superstraight 108, the superstraight 108 can be replaced if the amount and / or size of the scratches exceeds a predetermined threshold. The detector 139 may be used to determine whether the size and / or amount of scratches exceeds a predetermined threshold. The predetermined threshold can be selected based on the specifications of a particular manufacture. If the predetermined threshold is exceeded, the superstraight 108 can be replaced. If particles are detected on the upper surface 141 of the superstraight 108, the planarization system 100 may further include a particle removal device 143. The particle removal device 143 may be, for example, a vacuum or an electrostatic tool. The particle removal device 143 may operate to remove the detected particles. The detector 139 may be used to determine whether the size and / or quantity of particles exceeds a predetermined threshold. The predetermined value can be selected based on the specifications of a particular manufacture. If the threshold is exceeded, the particles can be removed using the particle removal device 144. In another embodiment, the particle removal device 143 may be operated without first determining whether particles are present or regardless of whether particles exceeding a predetermined threshold are detected.

[0022] The planarization system 100 may be coordinated, controlled, and / or directed by one or more processors 140 (controllers) that communicate with one or more components and / or subsystems such as a substrate chuck 104, a substrate positioning stage 106, a superstraight chuck 118, a fluid dispenser 122, a planarization head 120, a camera 136, a detector 139, a particle removal device 143, a radiation source 126, and / or a camera 137. The processors 140 may operate based on instructions in a computer-readable program stored in non-temporary computer memory 142. The processors 140 may be one or more of a CPU, MPU, GPU, ASIC, FPGA, DSP, and general-purpose computer, or may include them. The processors 140 may be dedicated controllers or general-purpose computing devices adapted to be controllers. Examples of non-temporary computer-readable memory include, but are not limited to, RAM, ROM, CDs, DVDs, Blu-rays, hard drives, network-attached storage (NAS), intranet-attached non-temporary computer-readable storage devices, and internet-attached non-temporary computer-readable storage devices. All method steps described herein may be performed by processor 140. Flattening method Figure 2 shows a flowchart of the planarization method 200 according to an exemplary embodiment. Figures 3A to 3K show schematic cross-sections of the operation of the planarization system 100 when performing method 200. Planarization method 200 can be initiated in step S202, where the moldable material 124 is distributed onto the substrate 102 in the form of droplets. As described above, the surface of the substrate 102 has some topography, which may be known based on previous processing operations or measured using an optical surface profiler based on optical interference effects such as a profiler, AFM, SEM, or Zygo NewView 8200. The local volume density of the deposited moldable material 124 varies depending on the substrate topography. Also, as described above, step S202 may be performed at a distribution station 103, which may be located in a different location from either the planarization station 105 or the curing station 107. Figure 3A shows a schematic cross-section of the substrate 102 after the moldable material 124 has been distributed, i.e., after the completion of step S202.

[0023] Next, the planarization method 200 proceeds to step S204, in which the substrate 102 having the moldable material 124 is planarized using the planarization station 105 to form the multilayer structure 111. In exemplary embodiments where the planarization station 105 is located separately from the distribution station 103, the substrate 102 having the moldable material 124 is first transported to the planarization station 105. Figure 3B shows a schematic cross-section of part of the planarization system 100 after the substrate 102 having the moldable material 124 has been placed in the planarization station 105, but before planarization. As shown in Figure 3B, in exemplary embodiments, the planarization station 105 and the curing station 107 may be oriented side by side within a common housing 114. As also shown in Figure 3B, the rail 109 on which the stage 106 moves may be coupled inside the housing 114 and may extend from the planarization station 105 to the curing station 107. As a result of this structural arrangement, the stage 106 can move along the rail 109 to reach the planarization station 105 and the curing station 107. The detector 139 and particle removal device 143 can also be located in the housing 114 between the planarization station 105 and the curing station 107. At the moment shown in Figure 3B, the superstraight 108 is held by the superstraight chuck 118 and is not yet in contact with the moldable material 124.

[0024] Figures 3C and 3D show more detailed schematic cross-sectional views of the interaction between the superstraight 108 and the moldable material 124 that occurs during step S204. Figure 3C shows the moment immediately before the superstraight 108 contacts the moldable material 124 on the substrate 102. As described above, the planarizing head 120 can be moved toward the substrate 102, and force can be applied to the superstraight 108 to cause it to contact and spread out onto droplets of the moldable material 124. Figure 3D shows the post-contact process after the superstraight 108 has made full contact with the moldable material 124. When the superstraight 108 contacts the moldable material 124, the droplets fuse to form a moldable material film 144 that fills the space between the superstraight 108 and the substrate 102. Preferably, the filling process is carried out in a uniform manner without any bubbles or bubbles being trapped between the superstraight 108 and the substrate 102 in order to minimize unfilled defects. Step S204 is completed at the moment shown in Figure 3D. Furthermore, at this point, the multilayer structure 111 is formed while the superstraight 108 is still in contact with the moldable material 124. In particular, the multilayer structure includes, or consists of, the superstraight 108, the moldable material film 144, and the substrate 102 in that order. In another embodiment, the multilayer structure can be considered to include, or consist of, the superstraight 108, the moldable material film 144, the substrate 102, and the substrate chuck 104 in that order. In either case, as shown in Figure 3D, in the multilayer structure, the lower surface 112 of the superstraight 108 is in direct contact with the upper surface of the moldable material film 144, while the lower surface of the moldable material film 144 is in direct contact with the upper surface of the substrate 102.

[0025] Next, the method proceeds to step S206, in which the superstraight 108 is released from the superstraight chuck 118 while the superstraight 108 is still in contact with the moldable material film 144. Figure 3E shows a schematic cross-sectional view of the planarization unit 105 and curing unit 107 within the housing 114 immediately after delamination of the substrate 108. This action of releasing the superstraight 108 from the superstraight chuck 118 releases the multilayer structure 111 from the planarization head 120. The release of the superstraight 108 from the superstraight chuck 118 may also be referred to as dechucking. Thus, as a result of releasing the superstraight 108 from the superstraight chuck 118, the multilayer structure 111 (i.e., the superstraight 108, the moldable material film 144, and the substrate 102 in that order) is movable along the rail 109 via the stage 106. As shown in Figure 3E, immediately after the release of the super straight 108, the stage 106 holding the multilayer structure 111 is still located in the planarization unit 105.

[0026] Next, the method proceeds to step S208, in which the multilayer structure 111 is transferred from the planarization station 105 to the curing station 107. The transfer of the multilayer structure 111 may be performed by operating the stage 106 to move linearly along the rail 109 from the planarization station 105 to the curing station 107. Since the stage 106 holds the multilayer structure 111 (via the substrate chuck 104), the movement of the stage 106 along the rail 109 also moves the multilayer structure 111. Thus, in step S208, the multilayer structure 111 moves from a first location where the planarization station 105 is located to a second location where the curing station 107 is located.

[0027] In one exemplary embodiment, as the multilayer structure 111 moves along the rail 109, the multilayer structure may pass under the detector 139 and be followed by the particle removal device 143 before reaching the curing station 107. Figure 3F shows a schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 at the moment the multilayer structure 111 is passing under the detector 139 and the particle removal device 143. As shown in Figure 3F, the detector 139 and the particle removal device 143 may be positioned at an intermediate position between the first position of the planarization station 105 and the second position of the curing station 107. When the multilayer structure 111 passes under the detector 139, the detector 139 may detect one, more, or all of the conditions described above. In other words, the detector 139 can detect one or more, or all of the following: a) particles located between the superstraight 108 and the substrate 102, b) incomplete spreading of the moldable material, c) particles located on the upper surface 141 of the superstraight 108 (i.e., on the surface opposite to the surface facing the moldable material film 144), and d) scratches located on the upper surface 141 of the superstraight 108. Also, as described above, if situation a) or b) is actually detected by the detector 139 before the multilayer structure 111 reaches the curing station 107, the process may be stopped and the substrate 102 may be regenerated by removing the moldable material film 144. More specifically, if the detector 139 detects either situation a) and / or b) exceeding a predetermined threshold, the process may be stopped and the substrate 102 may be recovered. In this case, the above steps may be repeated with a fresh substrate having the moldable material, which proceeds to curing only if conditions a) and b) are not detected. If situation c) is actually detected by the detector 139 before the multilayer structure 111 reaches the curing station 107, the particle removal device 143 is activated to remove the detected particles as the multilayer structure 111 passes under the particle removal device 143. More specifically, the particle removal device 143 can be activated if the detector 139 detects situation c) which exceeds a predetermined threshold.In another exemplary embodiment, the particle removal device 143 may operate in all cases, with or without performing detection, regardless of whether particles are detected and whether the detected particles exceed a predetermined threshold. Furthermore, a second pass under the detector may be performed to confirm that particles have been removed, such as when the cured multilayer structure moves back to the planarization station 105 after curing (see below). Alternatively, this can be done by reversing the direction of travel of the multilayer structure before the second pass proceeds to the curing station 107. If particles are still present, the particle removal device 143 may operate again. The detection and removal steps can be repeated until the detector 139 no longer detects particles exceeding a predetermined threshold. If situation d) is actually detected by the detector 139 before the multilayer structure 111 reaches the curing station 107, the process is stopped and the superstraight is replaced with a new one. More specifically, if the detector 139 detects situation d) exceeding a predetermined threshold, the process can be stopped and the superstraight can be replaced. The above steps may then be repeated using a fresh Super Straight and a fresh substrate having the moldable material thereon, and curing will proceed only if condition d) is not detected.

[0028] After stage 106 transports the multilayer structure 111 to curing station 107, the method proceeds to step S210, where the formed film layer 144 is cured. Figure 3G shows a schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 at the moment the multilayer structure 111 is under the radiation source 126 and the curing process has begun. The polymerization process or curing of the moldable material 124 may be initiated with chemical radiation (e.g., UV light). For example, the radiation source 126 provides chemical radiation to cure, solidify, and / or crosslink the moldable material film 144, defining a cured layer 146 on the substrate 102. More specifically, as shown in Figure 3G, UV light radiation is emitted from an array of LEDs 127 directed towards the multilayer structure 111. A diffuser 129 spreads the UV light radiation emitted from the array of LEDs 127 uniformly across the surface of the multilayer structure 111 along the exposure path 128. The Super Straight 108 is configured to be transparent to UV light radiation emitted from the array of LEDs 127, so that the UV light radiation passes through the Super Straight 108 and acts on the moldable material film 144, curing the moldable material film 144 and resulting in a cured layer 146. Furthermore, since the curing step is performed at a location separate from the planarization step, the UV light radiation does not pass through the Super Straight Chuck 118. Therefore, by preventing the UV light radiation from passing through the Super Straight Chuck 118, the aforementioned uneven transmission of UV light generated in other systems is avoided. Thus, the Super Straight Chuck 118 does not need to be transparent to UV light radiation.

[0029] Figure 3H shows a schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 at the moment the curing process is completed. As shown in Figure 3H, once the curing process is complete, the moldable material film 144 has become a cured layer 146. Similarly, the multilayer structure 111 has become a cured multilayer structure 113. The cured multilayer structure 113 differs from the multilayer structure 111 in that the multilayer structure 111 includes a moldable material film 144 between the superstraight 108 and the substrate 102, whereas the cured multilayer structure 113 includes a cured layer 146 between the superstraight 108 and the substrate 102. In other words, the cured multilayer structure 113 includes, or consists of, the superstraight 108, the cured layer 146, and the substrate 102 in that order. In another embodiment, the cured multilayer structure 113 may also be considered to include, or consist of, the superstraight 108, the cured layer 146, the substrate 102, and the substrate chuck 104 in that order.

[0030] Next, the planarization method 200 proceeds to step S212, in which the cured multilayer structure 113 is returned to the planarization station 105. The cured multilayer structure may also be returned to the planarization station 105 in step S208 by controlling the stage 106 to move linearly along the rail 109 in the opposite direction to the direction of movement. That is, the transfer of the cured multilayer structure 113 can be performed by operating the stage 106 to move linearly along the rail 109 from the curing station 107 to the planarization station 105. Since the stage 106 holds the cured multilayer structure 113 (via the substrate chuck 104), the movement of the stage 106 along the rail 109 also moves the cured multilayer structure 113. Thus, in step S212, the cured multilayer structure 113 moves from the second position where the curing station 107 is located to the first position where the planarization station 105 is located. As described above, when the multilayer structure 113 passes under the detector 139, during the return trip to the planarization station 105, the detector can operate again to detect particles located on the upper surface 141 of the superstraight 108. The detected particles (new or previously unremoved) can then be removed using the particle removal device 143.

[0031] Figure 3I shows a schematic cross-sectional view of the planar station 105 and curing station 107 within the housing 114 at the moment the cured multilayer structure 113 is returned to the planar station 105. As shown in Figure 3I, at this point the cured multilayer structure 113 is again under the superstraight chuck 118 and planar head 120. The planar method 200 then proceeds to step S214, where the superstraight 108 is separated from the cured layer 146. In order to remove the superstraight 108 from the cured layer 146, the superstraight chuck 118 can be re-coupled to the superstraight 108 via the operation of the planar head 120 while the superstraight 108 is still in contact with the cured layer 146 (i.e., re-chucking the superstraight 108). Once the superstraight 108 is coupled to the superstraight chuck 108, the superstraight chuck 118 can begin to lift upward away from the substrate 102 via the operation of the planar head 120. Since the super straight 108 is coupled to the super straight chuck 118, the lifting force separates the super straight 108 from the cured layer 146. The separating force may be applied in several different ways. For example, the separating force may be applied by a pin that pushes up the super straight 108, by vacuum pulling up the top surface 141 of the super straight 108, and / or by applying a high-pressure air jet to the intersection of the cured layer 146 and the super straight 108.

[0032] Figure 3J shows a schematic cross-sectional view of the planarization station 105 and curing station 107 within the housing 114 at the moment after the superstraight 108 has separated from the cured layer 146. As shown in Figure 3J, at this point the superstraight 108 is again in the starting position shown in Figure 3A, and the cured layer 146 is exposed on the substrate 102. Figure 3K shows a more detailed schematic cross-sectional view of the substrate 102 after the superstraight 108 has been removed from the cured layer 146, i.e., after the completion of step S214. That is, Figure 3K shows the completed cured planarization layer 146 on the substrate 102. The substrate 102 and the cured layer 146 may then be subjected to additional known steps and processes for device (article) manufacturing, including, for example, patterning, curing, oxidation, layering, deposition, doping, planarization, etching, moldable material removal, dicing, bonding, and packaging. The substrate 102 may be processed to manufacture multiple articles (devices). These additional steps may be performed by removing the substrate 102 having the exposed cured layer 146 from the housing 114 to a separate location. Once the substrate 102 having the exposed cured layer 146 is removed from the housing 114, the planarization station 105 and the curing station 107 are ready to receive a new substrate having the moldable material and to repeat the process.

[0033] Figure 4 shows a schematic cross-sectional view of an exemplary embodiment in which the planarization system 100 includes two stacked housings 114, each housing 114 including a planarization station 105 and a curing station 107. As shown in Figure 4, each housing 114 has the same structure including stations 105 and 107. By having multiple stacked units of housings having stations, multiple substrates 102 having moldable material 124 can undergo the same process described above simultaneously. The structure described above with respect to the curing station 107 makes it possible to have stacked units physically. In particular, by using an array of LEDs 127 and diffusers 129 as a radiation source 126, the curing station 107 has a much smaller profile than other systems that are more structurally complex and require the optical components described above (e.g., dichroic mirrors, beam combiners, prisms, lenses, mirrors, etc.) that are not present in Figure 4. Although two stacked housings 114 are shown in Figure 4, the planarization system 100 can include more housings 114, each containing stations 105 and 107. This may be achieved by stacking additional housings 114, each containing stations 105, 107, and / or by arranging the stacked housings 114 side by side, with each housing having stations 105, 107. In an exemplary embodiment, the planarization system 100 may include 1 to 20 housings 114, each containing stations 105, 107. Other examples include 5 to 15 or 8 to 12 housings 114, each containing stations 105, 107. In an exemplary embodiment, the number of housings 114 that can be stacked in a single stack may be 2 to 10. Other examples include 3 to 8 or 5 to 7 housings 114 in a single stack. The compact structure that enables stacking significantly increases manufacturing throughput compared to other systems that require more physical space.

[0034] Further modifications and alternative embodiments of various aspects will become apparent to those skilled in the art by considering this description. Therefore, this description should be interpreted as illustrative only. It should be understood that the forms shown and described herein should be interpreted as examples of embodiments. Elements and data may be substituted with those illustrated and described herein, parts and processes may be reversed, and certain features may be used independently, all of which will become apparent to those skilled in the art after enjoying the benefits of this specification.

Claims

1. A method for planarizing a substrate, Distributing moldable material onto a substrate, In the planarization station at the first position, the superstraight held by the superstraight chuck is brought into contact with the moldable material on the substrate, thereby forming a multilayer structure including the superstraight, a film of the moldable material, and the substrate. To release the super straight from the super straight chuck, The multilayer structure is moved from the first position to a curing station containing an array of light-emitting diodes, which is located at a second position away from the first position, and The film is cured by exposing the multilayer film to light emitted from the array of light-emitting diodes. A method characterized by including the following.

2. The curing station includes a diffuser configured to diffuse the light emitted from the light-emitting diode, The planarization station and the curing station are housed in a common housing. The method according to feature 1.

3. Moving the multilayer structure from the planarization station to the curing station includes linearly translating the multilayer structure. The method according to feature 1.

4. The multilayer structure is linearly translated via rails extending from the planarization station to the hardening station. The method according to feature 3.

5. a) The presence of particles between the substrate and the superstraight of the multilayer structure, b) Incomplete spreading of the moldable material within the multilayer structure, c) The presence of particles on the upper surface of the superstraight of the multilayer structure, d) The presence of scratches on the upper surface of the superstraight of the multilayer structure, Further including detecting one or more of the following: The method according to feature 1.

6. The detection is performed when the multilayer structure moves from the planarization station to the curing station. The method according to specification 5.

7. The detection is performed by a detector positioned between the planarization station and the curing station. The method according to specification 5.

8. c) If the presence of particles is detected on the upper surface of the superstraight, remove the detected particles. The method according to specification 5.

9. When the multilayer structure moves from the planarization station to the curing station, the detected particles are removed. The method according to feature 8.

10. The detected particles are removed via a vacuum or electrostatic tool placed between the planarization station and the curing station. The method according to feature 8.

11. a) If the presence of particles between the superstraight of the multilayer structure and the substrate is detected, or b) If incomplete spreading of the moldable material within the multilayer structure is detected, The further step includes, before curing the film of the multilayer structure, reforming the multilayer structure in which no particles are present between the superstraight and the substrate and the moldable material has spread completely. The method according to claim 5, characterized in that it is a feature of the present invention.

12. d) If the presence of a scratch on the upper surface of the superstraight of the multilayer structure is detected, The further step includes reforming the multilayer structure having a scratch-free superstraight layer before curing the film of the multilayer structure. The method according to specification 5.

13. The process further includes moving the multilayer structure from the curing station to the planarization station after curing. The method according to feature 1.

14. The planarization station further includes removing the superstraight from the multilayer cured film, The method according to the present invention, characterized by the present invention.

15. The superstraight is transparent to the light emitted from the light-emitting diode. The method according to feature 1.

16. The super straight chuck is not transparent to the light emitted from the light-emitting diode. The method according to feature 1.

17. The distribution of the moldable material is performed at a distribution station located at a third position, which is separated from the first and second positions. The method according to feature 1.

18. A flattening system, A substrate chuck configured to hold a substrate, A super straight chuck configured to hold a super straight, Positioning stage and A distribution system configured to distribute moldable material onto the substrate, A planarization station configured to bring a moldable material distributed on the substrate into contact with the superstraight at a first position to form a multilayer structure including the superstraight, a film of the moldable material, and the substrate, The system comprises a curing station including an array of light-emitting diodes, located at a second position away from the first position, The super straight chuck is further configured to release the super straight, The positioning stage is configured to move the multilayer structure from the planarization station to the curing station after the superstraight is released. When the multilayer structure is placed in the curing station, the curing station is configured to cure the film of the multilayer structure by exposing it to light emitted from the array of light-emitting diodes. A planarization system characterized by the following features.

19. A first housing including the flattening station and the curing station, A second housing further comprising an additional planarization station and an additional curing station, The second housing is stacked on top of the first housing. The planarization system according to claim 18.

20. A method for manufacturing an article, Distributing moldable material onto a substrate, In the planarization station at the first position, the superstraight held by the superstraight chuck is brought into contact with the moldable material on the substrate, thereby forming a multilayer structure including the superstraight, a film of the moldable material, and the substrate. To release the super straight from the super straight chuck, The multilayer structure is moved from the first position to a curing station which includes an array of light-emitting diodes and is located at a second position away from the first position. The film is cured by exposing it to light emitted from the array of light-emitting diodes, To process the cured film to produce the article, A method for manufacturing an article, characterized by including the following:

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