Piezoelectric vibration device

Abstract

This invention provides a highly reliable piezoelectric vibration device in a multilayer piezoelectric vibration device with high wiring density due to its miniaturization. [Solution] Instead of providing a connection path from the control function wiring section 39c of the first sealing member 3 to the second sealing member 4 via the piezoelectric diaphragm 2, the control function wiring section 39c and the ground wiring section 39d are provided on one electrode pattern 37c of the first sealing member 3, and the control function wiring section 39c is connected to the ground wiring section 39d. This makes it possible to reliably fix the control function pad 51c of the IC chip 5 to the ground potential via a short connection path in the first sealing member 3.

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