Pickup unit and thrusting member

Abstract

It suppresses damage to chip components. [Solution] The pickup unit 30 is used to pick up a semiconductor chip 101 attached to the surface 120a of a dicing sheet 120 from the dicing sheet 120. The pickup unit 30 comprises a stage 35 and a plurality of push-up members 40 arranged on the back surface 120b side of the dicing sheet 120 held by the stage 35, which push up the semiconductor chip 101 along the Z direction via the back surface 120b. The plurality of push-up members 40 have a first push-up member 41, which includes a first member 80 that contacts the dicing sheet 120 by a push-up operation, and a second member 90 connected to the side of the first member 80 opposite to the dicing sheet 120 side via a connecting portion 200, at which the first member 80 is pivotably connected to the second member 90.

Description

Technical Field

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[0001] The present invention relates to a pickup unit and a lifting member.

Background Art

[0002] As a technology related to a pickup unit used for picking up chip components attached on the surface of a sheet from the sheet, for example, a pickup device described in Patent Document 1 is known. In this pickup device, a sheet (adhesive sheet) to which a chip component (semiconductor chip) is attached is adsorbed and held by a stage (backup body), and a plurality of lifting members (pushing bodies) are raised to push up the chip component through the sheet. Then, the chip component is picked up by lowering the plurality of lifting members.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] In this pickup unit, the first member is pivotably connected to the second member by a connecting portion. As a result, when the first member pushes up the chip component, the inclination of the first member is adjusted so that the inclination of the contact surface of the first member with the sheet is at an appropriate angle with respect to the chip component, thereby preventing the first member from pushing up the chip component at an angle. Consequently, damage to the chip component can be suppressed.

[0008] In the pickup unit described above, the multiple thrusting members may further include a second thrusting member that, when viewed from a first direction, surrounds the outside of the first thrusting member and is positioned with a gap between it and the first thrusting member. In this case, the gap between the first thrusting member and the second thrusting member can be used to pivot the first member of the first thrusting member.

[0009] In the pickup unit described above, the connecting portion is such that the first member is pivotably connected to the second member in a second direction perpendicular to the first direction. The first member has a contact portion that contacts the sheet and an extending portion that extends from the contact portion in the first direction away from the sheet. The contact portion may be formed in an elongated shape with the second direction as its longitudinal direction when viewed from the first direction. When the contact portion pivots along the longitudinal direction of the elongated shape, the influence of the inclination of the contact surface with the sheet on the first member is greater than when the contact portion pivots along the short direction. Therefore, by pivotably connecting the first member to the second member in the second direction, which is the longitudinal direction, it is possible to effectively suppress damage to the chip component.

[0010] In the pickup unit described above, the connecting portion includes a first end face formed on the sheet side of the second member and a second end face formed on the opposite side of the first member from the sheet side and in contact with the first end face of the second member, and either the first end face or the second end face may be curved in a convex shape. In this case, the function of the connecting portion, which is to pivotably connect the first member to the second member, can be specifically realized.

[0011] In the pickup unit described above, either the first end face or the second end face may be curved convexly in a cross-section along the first direction, and the other end face may be curved concavely in a cross-section along the first direction, corresponding to the convex shape. In this case, when the first member swings, it is possible to suppress the displacement of the first member relative to the second member at the connecting portion.

[0012] In the pickup unit described above, the connecting portion further comprises a groove formed on the first end face so as to open toward the sheet side and extending in a second direction perpendicular to the first direction, and a projection provided on the second end face so as to protrude toward the side opposite to the sheet side and extending in the second direction, wherein the groove is formed in a C-shape with a narrowing opening, and the projection is provided so as to have its tip protruding on both sides, and the groove and projection may engage with each other in the first direction. In this case, the connecting portion can engage the first member with the second member in the first direction, and the first member can be pivotably connected to the second member.

[0013] One embodiment of the present invention is a push-up member used when picking up a chip component attached to the surface of a sheet from the sheet. The push-up member is positioned on the back side of the sheet and pushes the chip component upward along a first direction via the back side. The push-up member includes a first member that contacts the sheet when the push-up motion is performed, and a second member connected to the side of the first member opposite to the sheet side via a connecting portion. At the connecting portion, the first member is pivotably connected to the second member. As a result, when the first member pushes up the chip component, the inclination of the first member is adjusted so that the inclination of the contact surface of the first member with the sheet is at an appropriate angle with respect to the chip component, thereby suppressing the first member from pushing up the chip component at an oblique angle. Consequently, damage to the chip component can be suppressed. [Effects of the Invention]

[0014] According to the present invention, it is possible to provide a pickup unit and a push-up member that can suppress damage to chip components. [Brief explanation of the drawing]

[0015] [Figure 1] Figure 1 is a schematic diagram showing an mounting device equipped with a pickup unit according to one embodiment. [Figure 2] Figure 2 is a schematic diagram showing the configuration of the pickup unit in Figure 1. [Figure 3] Figure 3 is a perspective view showing the tip of the thrust mechanism in Figure 1. [Figure 4] FIG. 4 is a perspective view showing the first lifting portion of the lifting mechanism of FIG. 1. [Figure 5] FIG. 5 is a perspective view showing the upper part of the second member of FIG. 4. [Figure 6] FIG. 6 is a perspective view showing the lower part of the first member of FIG. 4. [Figure 7] FIG. 7 is a perspective view showing the connecting portion of FIG. 4. [Figure 8] FIG. 8 is a side view of the connecting portion of FIG. 4. [Figure 9] FIGS. 9(a) to (c) are schematic side views for explaining the state in which the upper side of the first member of FIG. 4 swings. FIG. 9(a) is a side view showing the state in which the upper side of the first member has moved to one side in the second direction. FIG. 9(b) is a side view showing the state in which the upper side of the first member has not moved. FIG. 9(c) is a side view showing the state in which the upper side of the first member has moved to the other side in the second direction.

BEST MODE FOR CARRYING OUT THE INVENTION

[0016] Hereinafter, embodiments will be described in detail with reference to the drawings. The same or corresponding parts in the drawings are denoted by the same reference numerals, and redundant descriptions are omitted. In each figure, an XYZ orthogonal coordinate system is shown as necessary. In the following description, the X direction corresponds to one horizontal direction, the Y direction (second direction) corresponds to another horizontal direction perpendicular to the X direction, and the Z direction (first direction) corresponds to the vertical direction. Also, the terms "upper" and "lower" respectively correspond to the upper and lower directions in the vertical direction.

[0017] As shown in FIG. 1, the mounting apparatus 1 is an apparatus that removes a semiconductor chip 101, which is an example of a chip component, from a semiconductor wafer and mounts it on a substrate. The semiconductor wafer is configured to include a plurality of diced semiconductor chips 101. The plurality of semiconductor chips 101 are attached on a surface 120a of a dicing sheet 120, which is an example of a sheet. Here, the plurality of semiconductor chips 101 are attached to the surface 120a of the dicing sheet 120 via a viscoelastic film 102 (see FIG. 2). The thickness of each semiconductor chip 101 is, for example, about 20 μm. The thickness of the dicing sheet 120 is, for example, about 100 μm.

[0018] The mounting apparatus 1 includes a pickup unit 30, a bonding unit 50, and a controller unit 20. The pickup unit 30 is a unit used when picking up the semiconductor chip 101 from the dicing sheet 120. The pickup unit 30 peels off and picks up (hereinafter, also simply referred to as "picks up") the semiconductor chip 101 attached on the surface 120a of the dicing sheet 120 together with the viscoelastic film 102 from the dicing sheet 120.

[0019] As shown in FIGS. 1 and 2, the pickup unit 30 includes a wafer holder 34, a stage 35, a pushing-up mechanism 36, a lifting drive device 37, and a pickup head 38. Details of each component of the pickup unit 30 will be described later. In the pickup unit 30, the semiconductor chip 101 is picked up, the picked-up semiconductor chip 101 is transferred toward an intermediate stage 60, and the semiconductor chip 101 is temporarily placed on the intermediate stage 60. The cross-sectional view of FIG. 2 shows a cross-section along an XZ plane of a part of the stage 35 and the pushing-up mechanism 36.

[0020] The intermediate stage 60 is positioned, for example, between the bonding unit 50 and the pickup unit 30. The intermediate stage 60 may be part of a rotary head collet that is movable in the X and Y directions by a drive mechanism such as a linear motor. The pickup unit 30 may be configured to transfer the semiconductor chip 101 to the bonding unit 50 by a so-called flip-chip operation.

[0021] The bonding unit 50 is a unit that holds the semiconductor chip 101 picked up by the pickup unit 30 (in this case, the semiconductor chip 101 on the intermediate stage 60) and bonds the held semiconductor chip 101 onto the substrate 110. The bonding unit 50 includes a bonding stage 12 and a bonding head 13.

[0022] The bonding stage 12 is a stage on which the substrate 110 is placed. The bonding stage 12 has, for example, suction holes to attract and hold the substrate 110 from below. The bonding head 13 attracts and holds the semiconductor chip 101 on the intermediate stage 60. The bonding head 13 moves the held semiconductor chip 101 toward a predetermined position on the substrate 110 and bonds the semiconductor chip to the predetermined position on the substrate 110. The bonding head 13 may have a heater or the like to provide heat to the semiconductor chip 101.

[0023] The controller unit 20 is a unit that controls the operation of the pickup unit 30 and the bonding unit 50. The controller unit 20 is a computer that includes, for example, a CPU (Central Processing Unit), a storage unit such as ROM (Read Only Memory) or RAM (Random Access Memory), an input / output unit, and a driver. The controller unit 20 operates the input / output unit according to the control of the CPU and reads and writes data to the storage unit. The controller unit 20 generates control signals to operate the pickup unit 30 and the bonding unit 50 and outputs these control signals to the pickup unit 30 and the bonding unit 50.

[0024] Next, we will describe the pickup unit 30 in detail.

[0025] As described above, the pickup unit 30 includes a wafer holder 34, a stage 35, a push-up mechanism 36, a lifting drive device 37, and a pickup head 38. The wafer holder 34 holds the dicing sheet 120. When the wafer holder 34 holds the dicing sheet 120, tension acts on the dicing sheet 120 from the center outwards. This tension stretches the dicing sheet 120.

[0026] Stage 35 adjusts the relative position between the wafer holder 34 and the push-up mechanism 36. Stage 35 may, for example, translate the wafer holder 34 in the X direction. Stage 35 may also rotate the wafer holder 34 around the Z axis. This movement causes Stage 35 to move the semiconductor chip 101 to be picked up directly above the push-up mechanism 36.

[0027] As shown in Figure 2, the stage 35 has a cylindrical outer shape, for example, with the Z direction as its axis. The upper end surface of the stage 35 constitutes a mounting surface 35a on which the dicing sheet 120 is placed. The mounting surface 35a is a plane along the XY plane and is in contact with the back surface 120b of the dicing sheet 120. The stage 35 has an opening 35b, which is an internal space that opens in the center of the mounting surface 35a. The shape of the upper edge (opening edge) of the opening 35b is rectangular, slightly larger than the semiconductor chip 101. A push-up mechanism 36 is located inside the opening 35b.

[0028] A gap is formed between the inner surface of the opening 35b and the outer surface of the push-up mechanism 36. Adsorption grooves 35c are formed around the opening 35b on the mounting surface 35a to adsorb the back surface 120b of the dicing sheet 120. The adsorption grooves 35c are provided, for example, so as to surround the opening 35b. Adsorption holes connected to a vacuum pump are in communication with the adsorption grooves 35c. As air is sucked out of the adsorption grooves 35c through the adsorption holes, the back surface 120b of the dicing sheet 120 surrounding the semiconductor chip 101 is adsorbed to the adsorption grooves 35c.

[0029] The push-up mechanism 36 protrudes upward from the mounting surface 35a and pushes up the back surface 120b of the dicing sheet 120. The push-up mechanism 36 includes a plurality of push-up members 40. The plurality of push-up members 40 are positioned on the back surface 120b side of the dicing sheet 120 held by the stage 35. The plurality of push-up members 40 are configured to be able to move up and down independently (i.e., each push-up member 40 can move back and forth independently along the Z direction). The plurality of push-up members 40 push up the semiconductor chip 101 along the Z direction via the back surface 120b of the dicing sheet 120.

[0030] The multiple protruding members 40 are arranged concentrically in a plan view. The multiple protruding members 40 include a first protruding member 41, a second protruding member 42, a third protruding member 43, and a fourth protruding member 44. The first protruding member 41, the second protruding member 42, the third protruding member 43, and the fourth protruding member 44 are arranged in this order from the inside to the outside. Hereafter, in the Z direction, the side of the multiple protruding members 40 that is positioned relative to the dicing sheet 120 will be referred to as the lower side (opposite side to the dicing sheet 120), and the side opposite to the lower side will be referred to as the upper side (dicing sheet 120 side).

[0031] Figure 3 is a perspective view showing the upper part of the push-up mechanism 36. In Figure 3, the upper part of the first push-up member 41 (the contact portion 81 described later) is formed in the shape of a rectangular column with the Z direction as the axial direction. The cross-sectional shape of the upper part of the first push-up member 41 is a long rectangle with the Y direction as the longitudinal direction. The detailed configuration of the first push-up member 41 will be described later. The upper part of the second push-up member 42 is positioned to surround the outside of the first push-up member 41 in a plan view and is formed in the shape of a stepped cylinder coaxial with the first push-up member 41. The cross-sectional shape of the upper part of the second push-up member 42 is a long rectangular frame with the Y direction as the longitudinal direction. The upper part of the second push-up member 42 is positioned with a gap S between it and the first push-up member 41 in the Y direction. In this example, a pair of gaps S are formed on both sides of the first push-up member 41 in the Y direction. The length of each gap S in the Y direction is, for example, about 10 μm.

[0032] The upper part of the third protruding member 43 is positioned to surround the outside of the second protruding member 42 in a plan view and is formed in a stepped cylindrical shape coaxial with the upper part of the first protruding member 41. The cross-sectional shape of the upper part of the third protruding member 43 is a long rectangular frame with the Y direction as its longitudinal direction. The upper part of the fourth protruding member 44 is positioned to surround the outside of the third protruding member 43 in a plan view and is formed in a stepped cylindrical shape coaxial with the upper part of the first protruding member 41. The cross-sectional shape of the upper part of the fourth protruding member 44 is a long rectangular frame with the Y direction as its longitudinal direction.

[0033] A notch K1 is formed on each of the pair of outer surfaces along the longitudinal direction at the top of the first protruding member 41. The notch K1 is formed at the upper end of the outer surface and forms a recess that is inwardly curved in a mountain shape when viewed from above. A notch K2 is formed on each of the pair of outer surfaces along the longitudinal direction and the pair of outer surfaces perpendicular to the longitudinal direction at the top of the second protruding member 42. The notch K2 is formed at the upper end of the outer surface and forms a recess that is inwardly curved in a mountain shape when viewed from above. A notch K3 is formed on each of the pair of outer surfaces along the longitudinal direction and the pair of outer surfaces perpendicular to the longitudinal direction at the top of the third protruding member 43. The notch K3 is formed at the upper end of the outer surface and forms a recess that is inwardly curved in a mountain shape when viewed from above. A notch K4 is formed on each of the pair of outer surfaces along the longitudinal direction and the pair of outer surfaces perpendicular to the longitudinal direction at the top of the fourth protruding member 44. The notch K4 is formed at the upper end of the outer surface and constitutes a recess that is inwardly curved in a mountain shape when viewed from above.

[0034] Returning to Figures 1 and 2, the lifting drive device 37 is a device that moves each of the multiple thrust members 40 up and down. The lifting drive device 37 receives a control signal from the controller unit 20 and moves each thrust member 40 in the Z direction.

[0035] The pickup head 38 attracts and holds the semiconductor chip 101 and picks up the semiconductor chip 101. The pickup head 38 includes a collet 39. The collet 39 attracts the main surface 101a of the semiconductor chip 101, for example by vacuum attraction. The collet 39 moves between the area where picking is performed and the intermediate stage 60. The collet 39 moves up and down in the Z direction, for example by a die motor.

[0036] Next, the configuration of the first thrusting member 41 will be described in detail with reference to Figures 4 to 8. As shown in Figure 4, the first thrusting member 41 includes a first member 80 that contacts the dicing sheet 120 by a thrusting motion, and a second member 90 connected to the lower side of the first member 80 via a connecting portion 200 (described later).

[0037] The first member 80 includes a contact portion 81 and an extended portion 82. The contact portion 81 is the part that contacts the dicing sheet 120 when the first push-up member 41 pushes up the semiconductor chip 101. As described above, the contact portion 81 is formed in the shape of a rectangular column with the Z direction as its axial direction, and the shape of the cross-section of the contact portion 81 is a long rectangle with the Y direction as its longitudinal direction (see Figure 3). That is, the contact portion 81 is formed in the shape of a rectangle (long shape) with the Y direction as its longitudinal direction when viewed from the Z direction, for example. The length of the contact portion 81 in the longitudinal direction is several times longer than the length of the contact portion 81 in the short direction, for example.

[0038] The contact portion 81 includes a contact surface 81a that faces the back surface 120b of the dicing sheet 120 in the Z direction. The contact surface 81a is the surface that contacts the back surface 120b of the dicing sheet 120 when the first push-up member 41 pushes up the semiconductor chip 101 through the dicing sheet 120. The extension portion 82 extends downward from the contact portion 81. The extension portion 82 is formed in a cylindrical shape, for example, with the Z direction as its axial direction. The first member 80 is connected to the upper end 91a of the second member 90 via a connecting portion 200 at the lower end 82a of the extension portion 82.

[0039] The second member 90 has an upper part 91 and a lower part 92 extending downward from the upper part 91. The upper part 91 is formed in a cylindrical shape, for example, with the Z direction as its axial direction. The upper end portion 91a of the upper part 91 has a pair of planes 91b formed on both sides in the Y direction, along the X and Z directions. The lower part 92 is formed in a cylindrical shape with the Z direction as its axial direction and has a smaller diameter than the upper part 91. A coil spring 93 is provided around the lower part 92 to lower the second member 90, which has risen when pushing up the semiconductor chip 101.

[0040] The connecting portion 200 is composed of a first end face 91c formed on the second member 90, a groove 91d formed on the first end face 91c, a second end face 82c formed on the first member 80, and a projection 82d provided on the second end face 82c (see Figures 7 and 8). In the connecting portion 200, the first member 80 is pivotably connected to the second member 90. Specifically, in the connecting portion 200, the first member 80 is pivotable relative to the second member 90, and the upper side of the first member 80 is pivotable. In other words, in the connecting portion 200, the first member 80 is connected to the second member 90 in such a way that the upper side of the first member 80 is pivotable.

[0041] As shown in Figure 5, the first end face 91c is formed on the upper end portion 91a of the upper part 91 of the second member 90 and is curved convexly upwards. The first end face 91c is curved in an arc shape in cross-sections along the Y and Z directions, for example. In addition, the first end face 91c is formed in a straight line along the X direction in cross-sections along the X and Z directions. The first end face 91c is formed, for example, by R-processing (surface tracing) the upper surface of the upper end portion 91a into a convex shape.

[0042] The groove 91d is formed to open upward on the first end face 91c and extends in the Y direction. The groove 91d extends along the Y direction, for example, from one face to the other of a pair of planes 91b of the upper end portion 91a. Both ends of the groove 91d in the Y direction open outward in the Y direction. The groove 91d includes a rectangular bottom surface 91f with the Y direction as its longitudinal direction and a pair of sides 91g facing each other in the X direction.

[0043] The groove 91d is formed in a C-shape in which the opening 91h narrows in cross-section along the X and Z directions. That is, a lip portion 91i is formed on the opening 91h side of the groove 91d, projecting inward to narrow the opening 91h. The upper surface of the lip portion 91i constitutes the first end face 91c.

[0044] As shown in Figure 6, the second end face 82c is formed at the lower end portion 82a of the extended portion 82 and is curved in a concave shape. The second end face 82c faces the first end face 91c of the second member 90 in the Z direction (see Figure 8). The second end face 82c contacts the first end face 91c of the second member 90 when the first push-up member 41 pushes up the semiconductor chip 101. The second end face 82c is curved in a concave shape corresponding to the convex shape of the first end face 91c in cross-sections along the Y and Z directions, for example, so that it can slide against the first end face 91c. The second end face 82c is curved in a concave shape having a curvature corresponding to the convex shape of the first end face 91c in cross-sections along the Y and Z directions, for example. The second end face 82c is curved in a concave shape following (alongside) the first end face 91c in cross-sections along the Y and Z directions, for example. The second end face 82c is curved in an arc shape in cross-sections along the Y and Z directions, for example.

[0045] The projection 82d is provided so as to project downward from the second end face 82c and extends in the Y direction. Both ends of the projection 82d in the Y direction reach the sides of the extending portion 82 in the Y direction. The tip (lower end) of the projection 82d is provided so as to extend outwards on both sides in the X direction. In cross-section along the X and Z directions, the projection 82d is formed in a shape, for example, an inverted T shape (see Figure 7). Specifically, the projection 82d includes a main body portion 82f that projects downward from the center of the second end face 82c in the X direction, and a pair of overhanging portions 82g that project outwards on both sides in the X direction from the tip side of the main body portion 82f.

[0046] As shown in Figure 7, the protruding portion 82g at the tip of the ridge 82d in the first member 80 is positioned inside the groove 91d of the second member 90. As a result, the groove 91d and the ridge 82d engage with each other in the Z direction. Specifically, the lip portion 91i of the groove 91d and the protruding portion 82g of the ridge 82d come into contact with each other, causing the second member 90 and the first member 80 to engage. Note that Figure 7 shows the first end face 91c and the second end face 82c in contact. This is also the case in Figures 4, 8, and 9.

[0047] Furthermore, the width of the main body portion 82f in the short-side direction (X direction) is smaller than the width between the pair of lip portions 91i in the X direction. Also, the width of the tip of the projection 82d in the X direction is larger than the width between the pair of lip portions 91i of the second member 90. In addition, the projection length of the projection 82d (distance from the second end face 82c to the tip face of the projection 82d in the Z direction) is shorter than the depth of the groove 91d (distance from the first end face 91c to the bottom face 91f in the Z direction). As a result, when the first push-up member 41 pushes up the semiconductor chip 101, the first end face 91c can contact the second end face 82c before the projection 82d contacts the bottom face 91f of the groove 91d.

[0048] As described above, the first member 80 is pivotably connected to the second member 90 in the connecting portion 200. In other words, the connecting portion 200 pivotably connects the first member 80 to the second member 90. Specifically, in the connecting portion 200, the first member 80 is pivotably connected to the second member 90 in the Y direction. In the connecting portion 200, the first member 80 is connected to the second member 90 such that its upper side is pivotable in the Y direction. More specifically, as shown in Figures 7 and 8, the first end face 91c and the second end face 82c come into contact when the first push-up member 41 pushes up the semiconductor chip 101. Then, as shown in Figures 9(a) to (c), the second end face 82c slides along the first end face 91c, allowing the upper part of the first member 80 to swing in a plane including the Z and Y directions, with the upper end portion 91a of the second member 90 as the pivot point.

[0049] Furthermore, as described above, in the connecting portion 200, the groove 91d and the projection 82d are engaged with each other in the Z direction. Specifically, the protruding portion 82g of the projection 82d and the lip portion 91i of the groove 91d come into contact with each other in the Z direction, causing the groove 91d and the projection 82d to engage with each other in the Z direction.

[0050] As described above, in the pickup unit 30 and the first push-up member 41 of this embodiment, the first member 80 is pivotably connected to the second member 90 by the connecting portion 200. As a result, when the first member 80 pushes up the semiconductor chip 101, the inclination of the first member 80 (the inclination of the axis of the first member 80) is adjusted so that the inclination of the contact surface 81a of the first member 80 with the dicing sheet 120 is at an appropriate angle with respect to the semiconductor chip 101. This prevents the first member 80 from pushing up the semiconductor chip 101 in an oblique direction (a direction inclined with respect to the normal direction of the dicing sheet 120). As a result, damage to the semiconductor chip 101 can be suppressed.

[0051] Specifically, the inclination of the first member 80 is adjusted so that the relative angle between the contact surface 81a of the first member 80 and the back surface 120b of the dicing sheet 120 approaches zero (so that the relative flatness of the contact surface 81a with respect to the back surface 120b approaches zero). This prevents the contact surface 81a from contacting the semiconductor chip 101 at an angle via the dicing sheet 120. As a result, damage to the semiconductor chip 101 can be suppressed.

[0052] Furthermore, since the second push-up member 42 is pushed up via a plurality of push-up pins (not shown), it is possible to adjust the inclination of the contact surface between the second push-up member 42 and the dicing sheet 120 by adjusting the amount of push-up for each of these push-up pins. The same adjustment applies to the third push-up member 43 and the fourth push-up member 44. On the other hand, since the first push-up member 41 is pushed up via the lower part 92 of the second member 90, the inclination of the contact surface between the first push-up member 41 and the dicing sheet 120 cannot be adjusted by adjusting the amount of push-up. Therefore, the above effect of making the first member 80 of the first push-up member 41 swingable and adjusting the inclination of the contact surface between the first push-up member 41 and the dicing sheet 120 is particularly effective.

[0053] In the pickup unit 30, the second thrusting member 42 is positioned with a gap S between it and the first thrusting member 41. This allows the first member 80 of the first thrusting member 41 to swing by utilizing the gap S between the first thrusting member 41 and the second thrusting member 42.

[0054] In the pickup unit 30, the contact portion 81 is formed in an elongated shape with the Y direction as its longitudinal direction. When the contact portion 81 swings along the longitudinal direction (Y direction) of the elongated shape, it is found that the inclination of the contact surface 81a with the dicing sheet 120 on the first member 80 has a greater effect compared to when the contact portion 81 swings along the short direction (X direction). Therefore, by connecting the first member 80 to the second member 90 so as to be able to swing in the longitudinal direction (Y direction), it is possible to effectively suppress damage to the semiconductor chip 101.

[0055] In the pickup unit 30, the first end face 91c of the second member 90 is curved upward in a convex shape. This makes it possible to specifically realize the function of the connecting part 200, which is to pivotably connect the first member 80 to the second member 90.

[0056] In the pickup unit 30, the second end face 82c of the first member 80 is curved in a concave shape in a cross-section along the Z direction, corresponding to the convex shape of the first end face 91c. This prevents the first member 80 from shifting relative to the second member 90 at the connecting portion 200 when the first member 80 swings.

[0057] In the pickup unit 30, the groove 91d of the second member 90 is formed in a C-shape with a narrowing opening 91h, and the projection 82d of the first member 80 is provided such that its tip protrudes on both sides in the X direction. The groove 91d and the projection 82d are engaged with each other in the Z direction. As a result, the connecting portion 200 can engage the first member 80 with the second member 90 in the Z direction and swingably connect the first member 80 to the second member 90.

[0058] The embodiments described above are not limited to the above-described embodiments.

[0059] The connecting portion 200 may include a member other than the first member 80 and the second member 90. For example, it may include a spherical body in the spherical body mechanism described later, or a pin for connecting the first member 80 and the second member 90.

[0060] In the above embodiment, the first member 80 was pivotably connected to the second member 90 in the Y direction, but the first member 80 may be connected so as to be pivotable in the X direction. In this case, the first end face 91c and the second end face 82c may be curved in an arc shape in cross-section along the X and Z directions. Furthermore, the first member 80 may be connected so as to be pivotable in all directions perpendicular to the Z direction. In this case, the connecting portion 200 may be a spherical mechanism such as a ball joint, and the first member 80 may be connected to the second member 90 via this spherical mechanism.

[0061] In the above embodiment, only the first thrusting member 41 among the multiple thrusting members 40 had a connecting portion 200 that pivotably connects the first member 80 to the second member 90, but the other thrusting members (second thrusting member 42, third thrusting member 43, and fourth thrusting member 44) may have a similar configuration. Also, the first thrusting member 41 does not have to be formed in a rectangular shape when viewed from the Z direction, and may be formed in an elliptical shape with the Y direction as its major axis, for example. The first thrusting member 41 does not have to be formed in an elongated shape when viewed from the Z direction, and may be formed in a square shape, for example.

[0062] Furthermore, in the above embodiment, the first end face 91c was curved in a convex shape and the second end face 82c was curved in a concave shape, but the second end face 82c does not have to be curved in a concave shape and may be formed in a flat shape. Also, in the above embodiment, the first end face 91c was curved in a convex shape and the second end face 82c was curved in a concave shape, but the first end face 91c may be curved in a concave shape and the second end face 82c may be curved in a convex shape.

[0063] Furthermore, in the above embodiment, the second protruding member 42 was positioned to surround the outside of the first protruding member 41 in a plan view, with a gap S between it and the first protruding member 41. However, the second protruding member 42 does not have to be positioned with a gap S between it and the first protruding member 41. In other words, there does not have to be a gap S between the first protruding member 41 and the second protruding member 42. Also, the second protruding member 42 does not have to surround the first protruding member 41. For example, the second protruding member 42 does not have to be positioned on both sides of the first protruding member 41 in the Y direction.

[0064] The connecting portion 200 may have a cylindrical pin (pivot axis) extending in the X direction, and the first member 80 may be connected to the second member 90 via the pin. In this case, for example, the upper side of the first member 80 may be pivotable in the Y direction with the pin as a fulcrum. The first end face 91c does not need to have a groove 91d. The second end face 82c does not need to have a projection 82d. The second member 90 does not need to have a lower part 92.

[0065] The components in the above embodiments are not limited to the materials and shapes described above, and various materials and shapes can be applied to them.

[0066] This disclosure includes the following components:

[0067] This disclosure provides for [1] a pickup unit used to pick up chip components attached to the surface of a sheet from the sheet, comprising: a stage for adsorbing and holding the sheet; and a plurality of push-up members disposed on the back side of the sheet held by the stage, which push up the chip components along a first direction via the back side, wherein the plurality of push-up members include a first push-up member, the first push-up member including a first member that contacts the sheet by a push-up motion, and a second member connected to the side of the first member opposite to the sheet side via a connecting portion, the first member being pivotably connected to the second member at the connecting portion.

[0068] The present disclosure is [2] "the pickup unit according to [1] above, wherein the plurality of the push-up members further comprises second push-up members that, when viewed from the first direction, surround the outside of the first push-up members and are arranged with a gap between them and the first push-up members."

[0069] The present disclosure is [3] "the pickup unit according to [1] or [2] above, wherein the connecting portion is connected to the second member so as to be swingable in a second direction perpendicular to the first direction, the first member has a contact portion that contacts the sheet and an extending portion that extends in the first direction from the contact portion to the side opposite to the sheet, and the contact portion is formed in an elongated shape with the second direction as the longitudinal direction when viewed from the first direction."

[0070] This disclosure is [4] "The pickup unit according to any one of [1] to [3] above, wherein the connecting portion comprises a first end face formed on the sheet side of the second member and a second end face formed on the side of the first member opposite to the sheet side and in contact with the first end face of the second member, and either the first end face or the second end face is curved in a convex shape."

[0071] The present disclosure is [5] "the pickup unit according to [4] above, wherein either the first end face or the second end face is curved convexly in a cross section along the first direction, and the other end face is curved concavely in a cross section along the first direction, corresponding to the convex shape."

[0072] The present disclosure is [6] "the pickup unit according to [5] above, wherein the connecting portion further comprises a groove formed on the first end face so as to open toward the sheet side and extending in a second direction perpendicular to the first direction, and a projection provided on the second end face so as to project toward the opposite side from the sheet side and extending in the second direction, wherein the groove is formed in a C-shape with a narrowing opening, and the projection is provided so as to have its tip protruding on both sides, and the groove and the projection engage with each other in the first direction."

[0073] The present disclosure is [7] "a push-up member used when picking up a chip component attached to the surface of a sheet from the sheet, disposed on the back side of the sheet, and pushing up the chip component in a first direction via the back side, the push-up member comprising a first member that contacts the sheet by a push-up motion, and a second member connected to the side of the first member opposite to the sheet side via a connecting portion, wherein the first member is pivotably connected to the second member at the connecting portion." [Explanation of Symbols]

[0074] 30...Pickup unit, 35...Stage, 40...Push-up member, 41...First push-up member, 42...Second push-up member, 80...First member, 81...Contact part, 82...Extending part, 82c...Second end face, 82d...Protrusion, 90...Second member, 91c...First end face, 91d...Groove, 91h...Opening, 101...Semiconductor chip (chip component), 120...Dicing sheet (sheet), 120b...Back surface, 200...Connecting part, S...Gap.

Claims

1. A pickup unit used to pick up chip components attached to the surface of a sheet from the sheet, A stage for adsorbing and holding the aforementioned sheet, The sheet held by the stage comprises a plurality of push-up members arranged on the back side of the sheet, which push up the chip component along a first direction via the back side, The multiple aforementioned thrusting members each have a first thrusting member, The first thrusting member is, It includes a first member that contacts the sheet by an upward thrusting motion, and a second member connected to the first member on the side opposite to the sheet via a connecting portion, In the aforementioned connecting portion, the first member is pivotably connected to the second member in a pickup unit.

2. The pickup unit according to claim 1, wherein the plurality of the aforementioned protruding members further include a second protruding member that, when viewed from the first direction, surrounds the outside of the first protruding member and is positioned with a gap between it and the first protruding member.

3. In the connecting portion, the first member is connected to the second member so as to be able to swing in a second direction perpendicular to the first direction. The first member has a contact portion that contacts the sheet and an extending portion that extends in the first direction from the contact portion to the side opposite to the sheet. The pickup unit according to claim 1 or 2, wherein the contact portion is formed in an elongated shape with the second direction as the longitudinal direction when viewed from the first direction.

4. The aforementioned connecting portion is The first end face formed on the sheet side of the second member, The first member is formed on the side opposite to the sheet side and includes a second end face that contacts the first end face of the second member, The pickup unit according to claim 1 or 2, wherein either the first end face or the second end face is curved in a convex shape.

5. Either the first end face or the second end face is curved convexly in a cross-section along the first direction. The pickup unit according to claim 4, wherein either the first end face or the second end face is curved in a concave shape corresponding to the convex shape in a cross section along the first direction.

6. The aforementioned connecting portion is A groove is formed on the first end face so as to open toward the sheet side and extends in a second direction perpendicular to the first direction, The second end face is provided so as to project toward the side opposite to the sheet side, and the protrusion extends in the second direction, and the configuration further includes The groove is formed in a C-shape with a narrowing opening. The aforementioned protrusions are provided such that their tips extend outwards on both sides. The pickup unit according to claim 5, wherein the groove and the projection engage with each other in the first direction.

7. A push-up member used when picking up a chip component attached to the surface of a sheet from the sheet, positioned on the back side of the sheet, and pushing up the chip component along a first direction via the back side, The aforementioned thrusting member is It includes a first member that contacts the sheet by an upward thrusting motion, and a second member connected to the first member on the side opposite to the sheet via a connecting portion, In the aforementioned connecting portion, the first member is pivotably connected to the second member by a thrusting member.

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