Semiconductor manufacturing equipment and semiconductor device manufacturing method

Abstract

In semiconductor manufacturing equipment, residual chemicals or pure water at the clamp pin contact points on the wafer surface, sides, and back surfaces caused uneven drying on the wafer, resulting in appearance defects and a decrease in yield. [Solution] The semiconductor manufacturing apparatus 1 according to this disclosure comprises a stage 2 on which a wafer 5 is placed with its surface facing upward and rotated, and clamp pins 41 that hold the wafer 5 by contacting the wafer surface and the wafer side surface 5b, and for discharging a chemical solution onto the wafer surface.

Images