Novel heat pipe configuration

Abstract

We provide heat pipes that can be advantageously used to cool PCBs, many types of devices, and systems. [Solution] (a) at least one closed pipe, including (i) a condenser section 13, (ii) a first evaporator section 12A in fluid communication with the condenser section, and (iii) at least a second evaporator section 12B in fluid communication with the condenser section; (b) a refrigerant contained in the heat pipe 10; (c) at least a first liquid flow path leading a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section; and (d) at least a second liquid flow path leading a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section, the second evaporator section holding the liquid refrigerant in a different position from the first evaporator section, including a reservoir.

Description

Technical Field

[0001] (Cross-reference) This application claims the benefit of priority of PCT / CN2020 / 12154 filed on October 16, 2020, No. 6, and the entire disclosure thereof is incorporated herein by reference .

[0002] (Field of the Invention) The present invention relates to a novel heat pipe configuration, and particularly to a method and system for using the same .

Background Art

[0003] As used herein, the term "heat pipe" means a heat transfer device that contains a liquid heat transfer fluid in the evaporation section and a vapor working fluid in the condensation section,[[ID=二十九]] and this heat transfer device uses the power of evaporation to move the vapor fluid from the evaporation section to the condensation section and returns the liquid working fluid to the evaporation section with little or no energy input .

[0004] One of the most common types of heat pipes is shown in Figure A, which is commonly known as a gravity return heat pipe or a thermosyphon heat pipe . This type of heat pipe relies at least partially on gravity to return the liquid working fluid from the condensation section to the evaporation section . As shown in Figure A, in a typical configuration, the heat pipe is a sealed container arranged vertically, with the evaporation section located at the bottom of the pipe and the condensation section located at the top of the pipe. The evaporation section absorbs heat from the item, object or fluid to be cooled, thereby boiling to form vapor of the working fluid ​​​It contains the working fluid in liquid form. Boiling of the working fluid in the evaporation section occurs due to the pressure difference. This causes the steam to be sent to the condensation section. The steam working fluid in the condensation section is selected The heat is released into the heatsink (for example, the surrounding air), where it condenses, and heat A liquid working fluid is formed on or near the inner surface of the pipe. Then, this liquid is subjected to gravity It returns to the evaporation section below and merges with the liquid working fluid contained there.

[0005] As mentioned earlier, boiling increases the mass of vapor in the evaporation section, and the mass of vapor condenses. As the pressure decreases in each section, a pressure difference is created that sends steam from the boiling section to the condensing section. Therefore, to transport the working fluid from the evaporator section to the condenser section... A continuous heat transfer cycle that does not require energy input (other than heat absorbed during cooling) To be made.

[0006] In some applications, it is desirable to position the heat pipes horizontally or at an angle. If the heat pipe is positioned perfectly horizontally, the heat pipe will be in the capillary return heat pipe. It is commonly known as a pip, or wicking heat pipe, and one example is... This is shown in Figure B.

[0007] In the configuration shown in Figure B, heat is transferred to the liquid in the evaporation section (shown on the left side of Figure B). It is absorbed into the working fluid, causing the liquid to boil, and thereby condenses the vapor into sections as described above. A pressure difference is provided to move the liquid into the atmosphere. However, the working flow of the condensed liquid depends solely on gravity. Instead of returning the body, the flow of the condensing working fluid is directed from the condensing section to the evaporation section by capillary action. A wicking structure that returns the fluid to the cushion is provided adjacent to the container wall. Figure B shows the capillary return. The heat pipe is shown in a vertical position, but the capillary return heat pipe is shown in a given application. Depending on the required needs, specific geometric shapes, and capillary forces, virtually any orientation is possible. It will be understood that orientation is possible. Therefore, the “capillary return” heap used in this specification The term "heat pipe" refers to a heat pipe that has capillary return force regardless of its orientation. Includes ipu.

[0008] Using almost or entirely additional energy to return the working fluid condensate to the evaporation section Other heat pipe configurations that are not used include electrohydrodynamic heat pipes (which utilize dynamic power). ), electroosmotic heat pipes, magnetohydrodynamic heat pipes (utilizing magnetism), osmotic heat This includes pipes and vibrating heat pipes.

[0009] As a result of the extremely high heat transfer coefficients of boiling and condensation, heat pipes are very effective. It is a heat conductor. Therefore, heat pipes have many applications, especially for cooling electronic devices. It is used for... One important application of heat pipe cooling is mounted on printed circuit boards. This involves eliminating heat from multiple components, such as a microchip. For this purpose, there is a vertically mounted printed circuit board (PCB) C1, and this The substrate consists of three components C2, It has 3 and C4. Components C2, C3, and C4 generate heat during operation, and Gravity return heaps are mounted to be in thermal communication with each of the constituent elements C2, C3, and C4. The heat needs to be removed from there by the C5 heat pipe. Due to limitations, the lower part of the heat pipe is where the liquid phase of the working fluid is primarily located. Therefore, it was common to design the circuit board configuration so that the heat generating component could be surely adjacent to the lower part of the heat pipe on the circuit board. Further, according to the conventional implementation, it was impossible to substantially increase the size of the evaporator section without sacrificing the size and performance of the condenser section, which is also important for the performance of the entire heat pipe. on the circuit board to be located. According to the conventional implementation, it was impossible to substantially increase the size of the evaporator section without sacrificing the size and performance of the condenser section, which is also important for the performance of the entire heat pipe. sacrificing the size and performance of the condenser section, which is also important for the performance of the entire heat pipe. was impossible.

[0010] The present applicants have also come to understand that by utilizing the novel heat pipe configuration as disclosed herein, the PCB cooling performance can be improved, and even the process of designing the PCB layout can be dramatically improved. Further, the novel heat pipe configuration of the present invention can be advantageously used to cool many types of devices and systems other than PCBs and electronic systems. By utilizing the novel heat pipe configuration as disclosed herein, the PCB cooling performance can be improved, and even the process of designing the PCB layout can be dramatically improved. Further, the novel heat pipe configuration of the present invention can be advantageously used to cool many types of devices and systems other than PCBs and electronic systems. for cooling many types of devices and systems other than PCBs and electronic systems. can be advantageously used. SUMMARY OF THE INVENTION

[0011] The present invention is a type of heat pipe having a condenser section in which a gaseous refrigerant is condensed to generate a liquid refrigerant, comprising: (a) at least one closed pipe, (i) a condenser section, (ii) a first evaporator section in fluid communication with the condenser section, and (iii) at least a second evaporator section in fluid communication with the condenser section, including at least one closed pipe; (b) a refrigerant contained in the heat pipe; (c) at least a first liquid flow path for guiding a first portion of the liquid refrigerant condensed in the condenser section to the first evaporator section; and (d) a second liquid flow path for guiding a second portion of the liquid refrigerant condensed in the condenser section to the second evaporator section. A refrigerator section, wherein the second evaporator section is different from the first evaporator section. A small portion of the second evaporator section leads to the reservoir, which holds the liquid refrigerant in a different position. The present invention provides a heat pipe that includes, at the very least, a second liquid flow path. For convenience, the heat pipe described in this paragraph will be referred to as heat pipe 1 in this specification.

[0012] The present invention relates to a Thai refrigerant having a condenser section in which a gaseous refrigerant is condensed to produce a liquid refrigerant. It is a heat pipe, (a) at least one closed pipe, (i) Condenser section and, (ii) A first evaporator section that is in fluid communication with the condenser section, (iii) at least a second evaporator section that is in fluid communication with the condenser section A closed pipe including a suction, (b) The heat pipe, which uses gravity at least partially Then the refrigerant liquid is returned from the condenser section to the first and second evaporator sections. The refrigerant contained within the heat pipe is configured to be such that, (c) The first portion of the liquid refrigerant condensed in the condenser section is evaporated by the first evaporation A first liquid channel leading to the container section, (d) the second portion of the liquid refrigerant condensed in the condenser section is evaporated (i) a second liquid channel leading to a container section, Oriented diagonally with respect to the vertical, at least a portion of the liquid refrigerant is directed to the condenser section. Includes one or more obstacles that cause the second evaporator to detour from the second evaporator. The refrigerator section holds the liquid refrigerant in a position different from the first evaporator section. A heat pipe is provided, comprising at least a second liquid flow path including a carbide. For convenience, the heat pipe described in this paragraph will be referred to as heat pipe 2 in this specification.

[0013] The present invention relates to a Thai refrigerant having a condenser section in which a gaseous refrigerant is condensed to produce a liquid refrigerant. It is a heat pipe, (a) at least one closed pipe, (i) Using gravity, at least partially, to remove the refrigerant liquid from the condenser section The condenser section that returns to the evaporator section, (ii) A first evaporator section that is in fluid communication with the condenser section, (iii) A fluid that is in fluid communication with the condenser section and the first evaporator section A second evaporator section located midway between the condenser section and the condenser section, (iv) A fluid is in communication with the condenser section and the first evaporator section A small number of evaporators, including at least a third evaporator section located between the condenser section and the condenser section. At the very least, one closed pipe, (b) The heat pipe, which uses gravity at least partially The condenser section then cools each of the first, second, and third evaporator sections. A refrigerant housed within the heat pipe is configured to return a fluid medium, (c) The first portion of the liquid refrigerant condensed in the condenser section is evaporated by the first evaporation A first liquid channel leading to the container section, (d) the second portion of the liquid refrigerant condensed in the condenser section is evaporated (i) a second liquid channel leading to a container section, Oriented diagonally with respect to the vertical, at least a portion of the liquid refrigerant is directed to the condenser section. Includes one or more obstacles that cause the second evaporator to detour from the second evaporator. The refrigerator section holds the liquid refrigerant in a position different from the first evaporator section. A second liquid flow path including a hub, (e) the third portion of the liquid refrigerant condensed in the condenser section is evaporated by the third evaporation (i) at least a third liquid channel leading to a container section, Oriented diagonally with respect to the vertical, at least a portion of the liquid refrigerant is directed to the condenser section. Includes one or more obstacles that divert the third evaporator from the third evaporator The evaporator section is located at a different position from the first evaporator section, and the second evaporator A reservoir containing a liquid refrigerant at a different location from the section, including at least a third liquid A heat pipe is provided, which includes a flow path. For convenience, the heat pipe described in this paragraph is this It is referred to as heat pipe 3 in the specification.

[0014] The present invention relates to a Thai refrigerant having a condenser section in which a gaseous refrigerant is condensed to produce a liquid refrigerant. It is a heat pipe, (a) at least one closed pipe, (i) Condenser section and, (ii) A first evaporator section that is in fluid communication with the condenser section, (iii) at least a second evaporator section that is in fluid communication with the condenser section A closed pipe including a suction, (b) The refrigerant contained in the heat pipe, (c) The first portion of the liquid refrigerant condensed in the condenser section is evaporated by the first evaporation A first liquid channel leading to the container section, (d) the second portion of the liquid refrigerant condensed in the condenser section is evaporated A refrigerator section, wherein the second evaporator section is different from the first evaporator section. The second evaporator section includes a reservoir that holds liquid refrigerant in different positions, and the second evaporator section is the first Approximately 70% or less of the volume of the evaporator section, or approximately 60% or less, or approximately 50% or less, or At least two leading to the second evaporator section having a total volume of 40% or less A heat pipe is provided that includes a liquid flow path. For convenience, the heat pipe described in this paragraph will be referred to as heat pipe 4 in this specification.

[0015] The present invention relates to a printed circuit board (PCB), (a) at least a first heat-generating component attached to the PCB at a first position, (b) At least one of the components attached to the PCB at a second position different from the first position Two heat-generating components, (c) at least one heat pipe including a closed pipe, (i) A condenser section that is in thermal communication with the cooling fluid located outside the heat pipe Yon, (ii) A first refrigerant containing a liquid refrigerant that is in heat transfer contact with the first heat generating component The first evaporator section includes a reservoir, (iii) the first portion of the liquid refrigerant condensed in the condenser section A first liquid channel leading to the reservoir in the evaporator section, (iii) A second reservoir located at a position along the heat pipe different from the first reservoir A reservoir is included, and the liquid refrigerant is in heat transfer contact with at least the second heat generating component. A second evaporator section housing the second part, (iv) the second portion of the liquid refrigerant condensed in the condenser section A minimum of two liquid channels, including at least two liquid channels leading to the reservoir in the evaporator section of the 2 The present invention provides a printed circuit board (PCB) equipped with at least one heat pipe. For convenience, the PCB referred to in this paragraph will be called PCB1 in this specification.

[0016] The present invention relates to a printed circuit board (PCB), (a) at least a first heat-generating component attached to the PCB at a first position, (b) At least one of the components attached to the PCB at a second position different from the first position Two heat-generating components, (c) A heat pipe including a closed pipe, (i) Thermally communicating with the cooling fluid located outside the heat pipe, and the vapor refrigerant is liquid The condenser section where the refrigerant is condensed, (ii) A first refrigerant containing a liquid refrigerant that is in heat transfer contact with the first heat generating component A first evaporator section including a reservoir, wherein gravity causes condensation within the condenser section. The first provides at least a portion of the force that returns the liquid refrigerant to the first evaporator section. 1. Evaporator section, (iii) the first portion of the liquid refrigerant condensed in the condenser section A first liquid channel leading to the reservoir in the evaporator section, (iii) A second reservoir located at a position along the heat pipe different from the first reservoir A reservoir is included, and the liquid refrigerant is in heat transfer contact with at least the second heat generating component. At least a second evaporator section housing the second part, wherein gravity is directed to the condenser At least the force that returns the liquid refrigerant condensed within the section back to the second evaporator section A portion of the evaporator section, at least a second evaporator section, (iv) the second portion of the liquid refrigerant condensed in the condenser section The evaporator section includes at least a second liquid channel leading to the reservoir, A printed circuit board (PCB) is provided, which includes a pipe. For convenience, the PCB referred to in this paragraph will be referred to as PCB2 in this specification.

[0017] The present invention relates to a printed circuit board (PCB), (a) at least a first heat-generating component attached to the PCB at a first position, (b) A second heat generating element attached to the PCB at a second position above the first position. Components and, (c) At least third mounting on the PCB at a third position above the first position The heat-generating components and (d) A heat pipe including a closed pipe, (i) Thermally communicating with the cooling fluid located outside the heat pipe, and the vapor refrigerant is liquid The condenser section where the refrigerant is condensed, (ii) Located below the condenser section and heat-transmitting with the first heat-generating component A first evaporator section including a first reservoir containing a liquid refrigerant to come into contact with, Gravity causes the liquid refrigerant condensed in the condenser section to move to the first evaporator section. A first evaporator section that provides at least a portion of the return force, (iii) the first portion of the liquid refrigerant condensed in the condenser section A first liquid channel leading to the reservoir in the evaporator section, (iii) A second reservoir located above the first reservoir, along the heat pipe The system includes a reservoir and contains a second portion of the liquid coolant that is in heat transfer contact with the second heat generating component. A second evaporator section in which gravity causes the liquid condensed in the condenser section The second evaporation provides at least a portion of the force that returns the refrigerant to the second evaporator section. The container section, (iv) the second portion of the liquid refrigerant condensed in the condenser section A second liquid channel leading to the reservoir in the evaporator section 2, (v) A third reservoir located above the first reservoir along the heat pipe It includes a third portion of the liquid refrigerant that is in heat transfer contact with the third heat generating component. At least a third evaporator section, wherein gravity causes condensation within the condenser section A small portion of the force that returns the liquid refrigerant to the third evaporator section is provided. Also, the third evaporator section, (vi) the third portion of the liquid refrigerant condensed in the condenser section The evaporator section of the 3 includes at least a third liquid channel leading to the reservoir, A printed circuit board (PCB) is provided, which includes a pipe. For convenience, the PCB referred to in this paragraph will be called PCB3 in this specification.

[0018] The present invention relates to a printed circuit board (PCB), (a) at least a first heat-generating component attached to the PCB at a first position, (b) At least one of the components attached to the PCB at a second position different from the first position Two heat-generating components, (c) at least one heat pipe including a closed pipe, (i) A condenser section that is in thermal communication with the cooling fluid located outside the heat pipe Yon, (ii) A first refrigerant containing a liquid refrigerant that is in heat transfer contact with the first heat generating component The first evaporator section includes a reservoir, (iii) the first portion of the liquid refrigerant condensed in the condenser section A first liquid channel leading to the reservoir in the evaporator section, (iii) A second reservoir located at a position along the heat pipe different from the first reservoir A reservoir is included, and the liquid refrigerant is in heat transfer contact with at least the second heat generating component. At least a second evaporator section housing the second part, the second evaporator section The volume of the first evaporator section is approximately 70% or less, or approximately 60% or less, or approximately At least a second evaporator section having a total volume of 50% or less, or approximately 40% or less Hmm, (iv) the second portion of the liquid refrigerant condensed in the condenser section A minimum of two liquid channels, including at least two liquid channels leading to the reservoir in the evaporator section of the 2 The present invention provides a printed circuit board (PCB) equipped with at least one heat pipe. For convenience, the PCBs described in this paragraph are referred to as PCB4 in this specification.

[0019] The present invention relates to a method of heat transfer, wherein a gaseous refrigerant is condensed to produce a liquid refrigerant. Includes a type of heat pipe having a shrinking section, (a) Closed-type heat pipe, (i) The heat sink located on the outside of the heat pipe communicates with the condenser sector for heat transfer. Yon, (ii) A first reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A first evaporator section including, (iii) A second reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A second evaporator section including a b, (iv) at least a first liquid that leads from the condenser section to the first reservoir Body passages and (v) at least a second liquid that leads from the condenser section to the second reservoir To provide a closed-type heat pipe including a flow path, (b) The first structure is brought into thermal contact with the liquid coolant in the first reservoir. To cool the component or device and generate refrigerant vapor that moves to the condenser section. and, (c) The second structure is brought into thermal contact with the liquid refrigerant in the second reservoir. To cool the component or device and generate refrigerant vapor that moves to the condenser section. and, (d) The refrigerant vapor is condensed in the condenser section to produce condensed liquid refrigerant, The first portion of the condensed liquid refrigerant is transferred to the first reservoir via the first liquid flow path. Return, and the second portion of the condensed liquid refrigerant is returned through the second liquid channel to the second liquid channel. Provides a method that includes returning the data to the server. For convenience, the heat transfer method described in this paragraph is referred to as heat transfer method 1 in this specification.

[0020] The present invention relates to a method for transferring heat, (a) Closed-type heat pipe, (i) Heat transfer communication is established with the heat sink located on the outside of the heat pipe, and the vapor refrigerant is liquid The condenser section where the refrigerant is condensed, (ii) A first reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A first evaporator section including, (iii) A second reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A second evaporator section including a b, (v) at least a portion of the condensed liquid refrigerant from the condenser section At least a first liquid channel leading to a first reservoir, wherein gravity is directed to the condenser section Provides at least a portion of the force that returns the liquid refrigerant condensed within the evaporator to the first evaporator section. A liquid channel, which provides at least a first liquid channel, (vi) at least one of the liquid refrigerants from the condenser section to the second reservoir At least a second liquid channel that guides the section, wherein gravity causes condensation within the condenser section A small portion of the force that returns the liquid refrigerant to the second evaporator section is provided. To provide a closed-type heat pipe that also includes a second liquid flow path, (b) The first structure is brought into thermal contact with the liquid coolant in the first reservoir. To cool the component or device and generate refrigerant vapor that moves to the condenser section. and, (c) by thermal contact with the liquid refrigerant in the second reservoir, It also cools the second component or device and generates refrigerant vapor that moves into the condenser section. To accomplish, (e) Condensing the refrigerant vapor in the condenser section to produce the condensed liquid refrigerant. To provide a method that includes doing. For convenience, the heat transfer method described in this paragraph is referred to as heat transfer method 2 in this specification.

[0021] The present invention relates to a method for transferring heat, (a) Closed-type heat pipe, (i) Heat transfer communication is established with the heat sink located on the outside of the heat pipe, and the vapor refrigerant is liquid The condenser section where the refrigerant is condensed, (ii) A first reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A first evaporator section including, (iii) A second reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A second evaporator section including a b, (iv) A third reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A third evaporator section including, (v) at least a portion of the condensed liquid refrigerant from the condenser section At least a first liquid channel leading to a first reservoir, wherein gravity is directed to the condenser section Provides at least a portion of the force that returns the liquid refrigerant condensed within the evaporator to the first evaporator section. A liquid channel, which provides at least a first liquid channel, (vi) at least one of the liquid refrigerants from the condenser section to the second reservoir At least a second liquid channel that guides the section, wherein gravity causes condensation within the condenser section A small portion of the force that returns the liquid refrigerant to the second evaporator section is provided. However, the second liquid channel, (vii) Leading the liquid refrigerant from the condenser section to the third reservoir less Both are third liquid flow paths, and gravity causes the liquid refrigerant condensed in the condenser section At least a third liquid that provides at least a portion of the force returning to the third evaporator section To provide a closed-type heat pipe including a body flow path, (b) The first structure is brought into thermal contact with the liquid coolant in the first reservoir. To cool the component or device and generate refrigerant vapor that moves to the condenser section. and, (c) by thermal contact with the liquid refrigerant in the second reservoir, It also cools the second component or device and generates refrigerant vapor that moves into the condenser section. To accomplish, (d) by thermal contact with the liquid refrigerant in the third reservoir, It also cools the third component or device and generates refrigerant vapor that moves into the condenser section. To accomplish, (e) Condensing the refrigerant vapor in the condenser section to produce the condensed liquid refrigerant. To provide a method that includes doing. For convenience, the heat transfer method described in this paragraph is referred to as heat transfer method 3 in this specification.

[0022] The present invention relates to a method of heat transfer, wherein a gaseous refrigerant is condensed to produce a liquid refrigerant. Includes a type of heat pipe having a shrinking section, (a) Closed-type heat pipe, (i) The heat sink located on the outside of the heat pipe communicates with the condenser sector for heat transfer. Yon, (ii) A first reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A first evaporator section including, (iii) A second reservoir that is in fluid communication with the condenser section and contains liquid refrigerant. A second evaporator section including a b, wherein the second evaporator section is Approximately 70% or less of the volume of the first evaporator section, or approximately 60% or less, or approximately 50% or less. or at least a second evaporator section having a total volume of approximately 40% or less, (iv) at least a first liquid that leads from the condenser section to the first reservoir Body passages and (v) at least a second liquid that leads from the condenser section to the second reservoir To provide a closed-type heat pipe including a flow path, (b) The first structure is brought into thermal contact with the liquid coolant in the first reservoir. To cool the component or device and generate refrigerant vapor that moves to the condenser section. and, (c) The second structure is brought into thermal contact with the liquid refrigerant in the second reservoir. To cool the component or device and generate refrigerant vapor that moves to the condenser section. and, (d) The refrigerant vapor is condensed in the condenser section to produce condensed liquid refrigerant, The first portion of the condensed liquid refrigerant is transferred to the first reservoir via the first liquid flow path. Return, and the second portion of the condensed liquid refrigerant is returned through the second liquid channel to the second liquid channel. Provides a method that includes returning the data to the server. For convenience, the heat transfer method described in this paragraph is referred to as heat transfer method 4 in this specification. [Brief explanation of the drawing]

[0023] [Figure A] This is a schematic diagram of a gravity-return heat pipe. [Figure B] This is a schematic diagram of a capillary return heat pipe. [Figure C] This is a schematic diagram of a printed circuit board that houses three heat-generating components. [Figure 1] This is a schematic diagram of a heat pipe according to one embodiment of the present invention. [Figure C1] This is a schematic diagram of a conventional heat pipe. [Figure C2] This is a schematic diagram of the cross-section of the heat pipe used in Comparative Example 1. [Figure C3] This is a schematic diagram of the cross-section of the heat pipe used in Comparative Example 2. [Figure C4] This is a schematic diagram of the cross-section of the heat pipe used in Comparative Example 3. [Figure 1A] This is a schematic diagram of the cross-section of the heat pipe used in Example 1. [Figure 1B] This is a schematic diagram of the cross-section of the heat pipe used in Example 1. [Figure 2] This is a schematic diagram of a heat pipe according to one embodiment of the present invention. [Figure 2A] This is a schematic diagram of a heat pipe according to one embodiment of the present invention, and its performance is described in Example 2A. [Figure 2B] This is a schematic diagram of a heat pipe according to one embodiment of the present invention, and its performance is described in Example 2B. [Figure 3A] This is a schematic diagram of a heat pipe according to an embodiment of the present invention. [Figure 3B] This is a schematic diagram of a heat pipe according to an embodiment of the present invention. [Figure 3C] This is a schematic diagram of a heat pipe according to an embodiment of the present invention. [Figure 3D] This is a schematic diagram of a heat pipe according to an embodiment of the present invention. [Figure 3E] This is a schematic diagram of a heat pipe according to an embodiment of the present invention. [Figure 3F] This is a schematic diagram of a heat pipe according to an embodiment of the present invention. [Figure 4] These are photographs of a heat pipe according to an embodiment of the present invention and a heat pipe outside the scope of the present invention. [Modes for carrying out the invention]

[0024] The applicants describe the heat pipes, devices, systems and / or methods described herein. By using it, the above needs and benefits can be achieved in particular, and / or We unexpectedly discovered that it was possible to achieve both cooling efficiency and cooling effect at a low cost.

[0025] Heat pipe The present invention provides excellent thermal performance, and in preferred embodiments, small located at different positions It includes heat pipes that provide the ability to efficiently and effectively cool at least two heat sources. As an example, Figure 1 of this specification schematically shows a cross-section of a heat pipe generally shown as 10. See reference. The heat pipe 10 is schematically shown as having a rectangular cross-section. However, a person skilled in the art would know that a wide variety of internal and external shapes and Dimensions may be used, and all such shapes and dimensions are within the scope of the present invention. They will understand.

[0026] The heat pipe 10 preferably includes an outer pipe wall surface 11A and an inner pipe wall surface 11B. The heat pipe includes a containment area bounded by a pipe wall 11. The first evaporator section 12A is located at one end of the heat pipe, and the condensation section is located at the other end of the heat pipe. The evaporator section 12A includes the heat pipe section 13. As shown, the condenser section is shown as being at the other end of the heat pipe, According to the present invention, these sections do not need to be located at either end of the heat pipe. It will be understood that...

[0027] The heat pipe 10 is located midway between the condenser section and the first evaporator section. It includes at least a second evaporator section 12B. In this case as well, a person skilled in the art will see Figure 1 The heat pipe 10 shown is shown as having substantially straight side walls. Therefore, the evaporator section 12B is above the first evaporator section 12A and Although it is located below the condenser section 13, this arrangement is not necessarily required. Let it be understood. In the configuration shown in Figure 1, the upper part of the first evaporator section 12A is It is represented by a horizontal line 30 located at approximately 30 percent of the volume of the pipe, but a person skilled in the art will understand Therefore, please understand that this position is for illustrative purposes only and is not necessarily limiting. It will be understood. Furthermore, line 30 is inside the heat pipe when the heat pipe is not operating. This represents the approximate liquid level, which is referred to as the charge level in this specification, but during operation. It should be understood that the liquid level may not correspond to this position. During operation, heat is generated. Liquid in the first evaporator section 12A flows from the heat source (heater 1) through the pipe wall 11. It is transferred into the refrigerant reservoir, generating refrigerant vapor, which is the refrigerant in Figure 1. Indicated as bubble 21, it generally flows upward toward the condenser section 13.

[0028] In the condenser section 13, the outer surface of the heat pipe is located in the condenser section 13. The refrigerant vapor that comes into contact with the inner surface 11B of the heat pipe wall 11 is cooled and condensed. Sink (for example, blowing across the top of a heat pipe as schematically shown in Figure 1) It is exposed to the relatively low temperature of the surrounding air. The first part of the condensed refrigerant liquid is, for example If following the first flow path, commonly referred to as path 14A, to the first evaporator section 12 It returns to the reservoir housed in A. In many heat pipe configurations according to the present invention, the condenser section There are multiple channels leading from the sump to the evaporator section 12A, and channel 14A may exist. Those skilled in the art will understand that only one common flow path is shown. Another possibility The flow path may include a general path as shown as 14B. Therefore, the refrigerant liquid This at least first part has numerous different flow paths when it returns to the first evaporator section It is thought that this is possible, but the first channel is under the influence of gravity in condenser section 13 This may simply include a series of droplets falling into the first evaporator section 12A.

[0029] An important and definitive aspect of the present invention is the condensed refrigerant liquid in the condenser section 13. So that at least the second part of the body flows into the reservoir housed in the evaporator section 12B To guide or direct, for example, by providing a second channel, commonly shown as item 15. As those skilled in the art will understand, a portion of the condensed liquid is captured by the condenser. To deliver heat from the cooling system to the reservoir, the heat pipe can incorporate numerous features. One such feature is, for example, that the liquid refrigerant is released from the condenser section 13 under the influence of gravity. A series of angled platforms and plates located within the typical flow path through which a fall occurs. These platforms or plates may include 16 tiles, etc. Such droplets flow toward the inner wall of the heat pipe and are contained in the second evaporator section 12B. It is positioned and angled to flow into the reservoir. In a preferred embodiment, To allow some of the refrigerant vapor to pass upward, adjacent platforms, It is preferable that small gaps are included between the plates, etc. In addition, the lower edge of each plate Preferably, the upper edge of the next flow plate, platform, etc. in the direction of the liquid flow. They are aligned so as to overlap. Considering the teachings contained in this application, a person skilled in the art will see the individual uses Regarding the desired flow of refrigerant into the reservoir of the evaporator section 12B, and the desired level To achieve the refrigerant vapor flow, the range of vertical separation and the range of vertical overlap Both options can be chosen. In this way, the desired supply of liquid refrigerant is first It is provided at an intermediate point between the evaporator section and the condenser section, and in a preferred embodiment, The second evaporator section is positioned close to the heat source to be cooled, for example, heater 2 in Figure 1. Therefore, such a second heat source is cooled by phase-change heat transfer of the refrigerant. Therefore, it provides excellent cooling, which is a second heat source that can occur in conventional heat pipe configurations. This method of heat transfer is far more effective and efficient than others.

[0030] Those skilled in the art will know that Figure 1 discloses a gravity-driven heat pipe, but the present invention is condensed Other or multiple forces drive the return of the liquid in the general direction of the first evaporator section. It will be understood that it can be easily adapted for use with heat pipes having Therefore, the present invention particularly favors capillary return heat pipes and gravity / capillary return heat pipes. A heat pipe having one or a combination of the above-mentioned liquid refrigerant driving forces Includes pipes.

[0031] Figure 2 shows the bottom region of the heat pipe that typically houses the first evaporator section 12A. A hexagon to allow free upward flow of refrigerant vapor from to the condenser section 13 The heat pipe 10 has a typical honeycomb grid pattern of cells. First evaporation The upper part of the component section 12A is typically located at approximately 30 percent of the heat pipe's volume. It is represented by a horizontal line. During operation, heat is transferred from the heat source (not shown) through the pipe wall to the first The liquid refrigerant is transferred to the reservoir in the evaporator section 12A. Refrigerant vapor is generated. , open vertical and diagonal channels within the heat pipe, i.e., one of tile 16 As a result, the water flows upward through the unblocked channels to the condenser section 13. In the condenser section 13, the outer surface of the heat pipe is in the condenser section 13. A heat sink (for example) cools and condenses the refrigerant vapor that comes into contact with the inner surface of the heat pipe wall. For example, it is exposed to the relatively low temperature of the ambient air. The first part of the condensed refrigerant liquid is, for example, Following a first flow path such as 14A, the reservoir is contained in the first evaporator section 12A. Return to the base. As mentioned above, when the liquid refrigerant returns to the first evaporator section 12A, for example It is also possible to follow alternative and / or additional channels such as channel 14B and channel 14C. Therefore, when this first portion of the refrigerant liquid returns to the first evaporator section 12A, numerous... It is thought that various flow paths can be taken, but the first flow path is, for example, between column 5 and column 6 One or more open channels, such as the outlet between them and the lower part between column 4 and column 5, and flow path 1 Many other submersibles, including but not limited to those represented by 4B and channel 14C. Through the present channel, under the influence of gravity, from condenser section 13 to the first evaporator section It can simply include a series of droplets falling onto 12A.

[0032] An important and definitive aspect of the present invention is the condensed refrigerant liquid in the condenser section 13. At least a second portion of the body is flowed into reservoir 12B' housed in evaporator section 12B. To direct the flow, at least the second channel, commonly shown as item 15 in Figure 2 The solution is to provide a mechanism that captures a portion of the condensed liquid. To send heat from the shrinker section to the reservoir, the heat pipe can include multiple structural elements. One such structure is, for example, one in which a liquid refrigerant flows into the flow path 14 under the influence of gravity. A series of corners arranged within the general flow path through which the condenser section 13 falls. It can include 16 prescription platforms, plates, tiles, etc. The foam or plate is preferably such that such droplets are directed toward the inner wall of the heat pipe. The water then flows into reservoir 12B', which is housed in the second evaporator section 12B. They are positioned, angled, or configured in such a way. In a preferred embodiment, the refrigerant vapor To allow some upward passage, small gaps are made between the platform or plate. A vertical gap is included, allowing the liquid refrigerant to flow along the desired path through the evaporator section 12B. To help guide it into the reservoir, small between adjacent platforms or plates. Vertical overlap is included. In this way, the desired supply of liquid refrigerant is supplied to the first evaporator. Provided at at least one intermediate point between the section and the condenser section, preferred implementation In this configuration, a second heat source (not shown) is located near this second evaporator section. Therefore, it is possible to perform a phase change of the refrigerant, especially when a second heat source is present. Because it is cooled by heat transfer, the heat pipe of this invention provides excellent cooling performance, This is far more effective and efficient than heat transfer that can occur in conventional heat pipe configurations. .

[0033] Therefore, in a preferred embodiment of this heat pipe including heat pipes 1 to 4, The inside of the pipe is not perfectly homogeneous, but instead, for example, it is formed in a grid structure. One or more angled tiles, plates, platforms or similar obstacles, etc. Guide at least a portion of the condensed refrigerant liquid along a channel that leads to the second evaporator section. There is a tendency to include honeycomb grids, which involve a series of changes to the grid structure. For example, Such an exemplary structure includes a channel that guides a portion of the condensed liquid refrigerant to a second evaporator section. They are arranged to form a channel. In particular, a typical honeycomb pattern disclosed in Figure 2 The row consists of six vertical columns of hexagonal cells or islands, and the liquid around it is generally The flow is downward, and the space between the rows of cells is generally for the downward flow of liquid and the upward flow of vapor. This allows for flow. For example, liquid flowing from above rows 5 and 6 through the heat pipes. It can flow to the bottom and reach the first evaporator section. All rows and spaces are If they are essentially the same for each conventional heat pipe, then all the liquids are thus , it flows to the first evaporator section at the bottom of the heat pipe. However, in the implementation of the present invention Depending on the form, some of the horizontal rows are overlapping angled, incorporated into a honeycomb structure. It is interrupted by a tile or plate. For example, the flow between column 4 and column 5 in Figure 2 A portion of the liquid refrigerant is in the 9 cells. 番目 Encountering a row of angled tiles or plates, Therefore, at least a portion of the refrigerant liquid is supplied to the heat piping above the first evaporator section. Towards the side of the pipe, preferably adjacent to the second heat source, the inner surface of the heat pipe and the heat transfer contact Divert the liquid refrigerant to a second reservoir, positioned to hold the selected amount that comes into contact with it. .

[0034] Cells or islands, steam channels, tiles or platforms, and reservoirs In contrast, alternative heat pipe configurations with different shapes and sizes are shown in Figures 3A to 3E. These are shown.

[0035] In Figure 3A, the horizontal rows of the hexagonal cells 20 are arranged such that the cells in each horizontal row are aligned vertically, and each vertical row The cells are aligned in a configuration known as a rectangular grid, where the cells are aligned horizontally. A series of angled evaporators for sending a portion of the condensed refrigerant fluid to the reservoir in the intermediate evaporator 12B. Includes plate or tile 16.

[0036] In Figure 3B, the arrangement is aligned in a configuration known as a honeycomb grid arrangement, and a series of angled A row of hexagonal cells 20 having plates or tiles 16 contains a portion of the condensed refrigerant fluid. It is used to send the water to the reservoir in the intermediate evaporator 12B.

[0037] In Figure 3C, a horizontal row of circular cells 20 having a series of angled plates or tiles 16 is It is used to send a portion of the condensed refrigerant fluid to the reservoir in the intermediate evaporator 12B.

[0038] Figure 3D shows a row of square cells 20 having a series of angled plates or tiles 16. However, a portion of the condensed refrigerant fluid is used to send to the reservoir in the intermediate evaporator 12B. .

[0039] In Figure 3E, some of them are cropped, as explained below in relation to Figure 3F. The vertical columns of 20 angled, overlapping rectangular cells contain the condensed refrigerant fluid. Used to form channels that lead to several intermediate reservoirs within the intermediate evaporator section. As seen in this embodiment, the angled rectangular cell is shown in more detail in relation to Figure 3F. As described, ledges, tiles, plates, etc., to provide the necessary intermediate refrigerant flow paths. To provide.

[0040] Figure 3F provides an enlarged view of the top of the heat pipe shown in Figure 3E, and is an angled rectangle. The five columns of cell 20 contain the condensed refrigerant fluid in several intermediate evaporator sections. From left to right, columns 20A to 20E are used to create the flow path leading to the intermediate reservoir. Labeled on the right. As can be seen from the diagram, rows 20A and 20E are heat Located on the left and right sides of the pipe, each of these rectangular cells is on the left and right edges, respectively. Partially cut along the section. During operation, heat between row 20A and row 20B Most of the refrigerant condenses at the top of the pipe, and also condenses above rows 20B and 20C. A portion of the refrigerant tends to follow the flow path 15A to the reservoir of the evaporator 12B. In addition, most of the refrigerant condensed at the top of the heat pipe between row 20B and row 20C, Furthermore, a portion of the refrigerant condensed above rows 20C and 20D is released into the reservoir of evaporator 12C. It tends to follow the flow path 15B to the valve. Considering this explanation, the configuration in Figure 3E is a series To those skilled in the art, it is helpful to provide a series of multiple channels leading to the intermediate evaporation sections 12B-12J. Let's be understood.

[0041] Each of the heat pipes 1 to 4, and each of the PCBs 1 to 4 and heat transfer methods 1 to 4 are included. The tiles and plates used in the heat pipe of the present invention, which includes a heat pipe, are multi The tiles may be angled over a variety of angles, but in a preferred embodiment, the tiles are Perpendicular to the general flow direction of the refrigerant liquid from the condenser section to the first evaporator section For a plane, in many applications including gravity return heat pipes, the ratio is approximately 1 for a horizontal plane. It has an angle ranging from 0° to approximately 70°.

[0042] The present invention relates to each of the heat pipes 1 to 4, as well as PCBs 1 to 3 and heat transfer methods 1 to 4. Each of the heat pipes of the present invention includes a condenser section to a first evaporator section Gravity return heat pipe with respect to a plane perpendicular to the general flow direction of the refrigerant liquid into the cushion. In many applications, including this one, it is used at an angle of approximately 20° to 50° relative to the horizontal plane. Includes tiles and plates. Preferred implementation of heat pipe 4, heat transfer method 4, and PCB 4. In this configuration, the second evaporator section is located in another evaporator section, as shown in Figure 2B. It does not include any flow paths or channels leading to the

[0043] Each of the heat pipes 1 to 4, and each of the PCBs 1 to 4 and heat transfer methods 1 to 4 are included. The packing density used in the heat pipe of the present invention, including the heat pipe, can vary considerably. However, in a preferred embodiment, the filling rate is approximately 20% by volume to approximately 90% by volume. .

[0044] Each of the heat pipes 1 to 4, and each of the PCBs 1 to 4 and heat transfer methods 1 to 4 are included. The filling rate used in the heat pipe of the present invention, including the heat pipe, is a preferred embodiment. In its current state, the volume percentage ranges from approximately 20% to approximately 60%.

[0045] Devices and Systems The present invention provides a device comprising PCB1 to PCB4, each requiring cooling during operation. Includes S and systems.

[0046] The present invention relates to a printed circuit board comprising PCB1 to PCB4, and is used for telecommunications. Includes devices and systems.

[0047] The present invention relates to a printed circuit board including a 5G chip, each of which includes PCB1 to PCB4. Includes telecommunications devices and systems equipped with [the specified features].

[0048] The present invention provides cooling by heat pipes of the present invention, each comprising heat pipes 1 to 4. It will include a 5G chip.

[0049] The present invention relates to a heat pipe that includes each of heat pipes 1 to 4. Includes, including, a system or device.

[0050] method The present invention uses a method of the present invention which includes each of the heat transfer methods 1 to 4, A method for cooling a vice or system, or a device or component of a system. Including the law.

[0051] The present invention uses the methods of the present invention, which include each of the heat transfer methods 1 to 4, to enable electric power transfer. This includes a method for cooling a communication device or system.

[0052] The present invention uses the methods of the present invention, which include each of the heat transfer methods 1 to 4, to enable electric power transfer. This includes a method for cooling a communication device or system.

[0053] The present invention uses a method of the present invention which includes each of the heat transfer methods 1 to 4, and 5 This includes a method for cooling telecommunications devices and systems, including G-chips.

[0054] The present invention relates to a method for cooling at least a portion of a printed circuit board, and the printed circuit board is a method for cooling at least a portion of a printed circuit board. At least a portion of the circuit board includes each of the heat pipes 1 to 4, The method includes bringing the device into contact with the heat pipe.

[0055] The present invention relates to a method for cooling at least a portion of a printed circuit board, and a heat pipe The heat pipes of the present invention, including each of the heat pipes from 1 to 5, are brought into contact with the 5G chip. This includes a method that includes a 5G chip. [Examples]

[0056] Comparative Examples 1A-1F A heat pipe generally corresponding to Figure C1 in this specification is two as shown in Figure C1. Except for the fact that a total of three heater bands were used instead of the heater, two aluminum It was formed from aluminum plate. Each of the three heaters has a power output of 13.33 watts. It had a total power of 40 watts. The arrangement in this example is, for example, cooled There are three components, and these positions on the printed circuit board are arranged vertically. If present, simulate the situation in which it exists. The thermocouple is positioned vertically from the bottom of the heat pipe. The following positions were measured in the direction, namely 70mm, 150mm, 210mm, 270mm, It was also positioned on the wall of the 330mm heat pipe.

[0057] As shown in Table C1 below, using the heat pipe configuration described in the embodiment, six We tested different heat pipe filling rates.

[0058] As shown in Figure C2, the cross-section of the heat pipe is between the two aluminum plates. This indicates that the channels have a substantially uniform honeycomb structure, and as a result, during operation, The working fluid R-1233zd(E) contained in the reservoir of the starting section is heated, The working fluid evaporates and generally flows upward through the heat pipes to the condenser section. Once condensed in the condenser section, the working fluid is transferred to the evaporator section containing the liquid working fluid. Generally, the air flows simply downwards. Heat pipes operate at room temperature of approximately 23.7°C. The experiment was conducted. The temperatures measured under equilibrium conditions are reported in Table C1 below.

[0059] [Table 1] As can be seen from the data reported in Table C1, the filling process with the lowest average temperature during operation occurs. The rate is 60% (Example C1C), and the filling rate that results in the smallest temperature difference is 80% (Example C It was 1B.

[0060] Examples 1A-1F The cross-section of the heat pipe is generally as described in relation to Figure 1, specifically as shown in Figure 1. Except as shown in 1A, the overall dimensions were the same as those described in Comparative Example 1. Each heat pipe has the same heater and thermocouple. As shown in Table 1 below. Using the heat pipe configuration described in the example, six different heat pipe filling rates were tested. I tried it.

[0061] As shown in Figure 1A, the cross-section of the heat pipe is between the two aluminum plates. The channel captures a portion of the condensed liquid and transfers it from the condenser section to the evaporator section. This indicates that it has a honeycomb structure that supplies refrigerant to each of reservoirs 12B to 12E. When condensation occurs in the condenser section, some of the condensed working fluid liquid flows into the evaporator section. It flows downwards towards each of 12B through 12E.

[0062] The heat pipe operated at room temperature of approximately 23.7°C. Equilibrium was achieved along with the results from Comparative Example 1. The temperatures measured under normal conditions are reported in Table 1 below.

[0063] [Table 2] *The vertical positions at 70mm, 150mm, 210mm, 270mm and 330mm are: These are indicated as positions 1 through 5 in the table.

[0064] As can be seen from the results reported in Table 1 above, the embodiments of the present invention The configuration is designed to achieve a lower average temperature and smaller temperature difference for all tested filling rates. It was generated. Furthermore, the best performance from conventional heat pipes was 8 when measured at the average temperature. When measured with a 0% filling rate and a temperature difference, a 60% filling rate was obtained. In contrast, the present invention The best performance of heat pipes is achieved with a much lower fill density, i.e., the lowest average temperature and the lowest temperature This occurred when the temperature difference was 50%. Therefore, this embodiment shows that the heat pipe of the present invention is small. At least three important advantages, namely (1) a lower average temperature which is an indicator of the cooling effect ( 2) Helps avoid unnecessary extreme temperatures within the heat pipe, and therefore improves operability and To improve equipment lifespan, a smaller temperature difference (3) and a better performance, the filling rate This provides a reduction in the cost of the working fluid by reducing its performance.

[0065] Comparative Example 2 A heat pipe generally corresponding to Figure C1 in this specification is two as shown in Figure C1. Except for the fact that a total of five heater bands were used instead of the heater, two aluminum It was formed from aluminum plate.

[0066] The heat pipe measures approximately 935mm from bottom to top, and the five heater bands are They were located in approximately the position shown in Figure C3. Each heater had a power of 11 watts, The total power to the heat pipe is 55 watts. The thermocouple is vertically mounted from the bottom of the heat pipe. The following positions were measured in the direction, namely 100mm, 460mm, 600mm, and 740mm. The heat pipes are provided at positions on the wall at m and 880 mm. The arrangement in this example is, for example, cold There are five components that should be rejected, and these are arranged vertically at these locations on the printed circuit board. Simulates the conditions under which it exists. Working fluid R1233zd(E) The filling rate is approximately It was set to 90%. This liquid level is approximately 12A when all heaters are off. This is shown by.

[0067] As shown in Figure C3, the cross-section of the heat pipe is between the two aluminum plates. This indicates that the channels have a substantially uniform honeycomb structure, and as a result, during operation, The working fluid R-1233zd(E) contained in the reservoir of the starting section is heated, The working fluid evaporates and generally flows upward through the heat pipes to the condenser section. Once condensed in the condenser section, the working fluid is transferred to the evaporator section containing the liquid working fluid. Generally, the air flows simply downwards. Heat pipes operate at room temperature of approximately 26.6°C. The experiment was conducted. The temperatures measured under equilibrium conditions are reported in Table C2 below.

[0068] [Table 3]

[0069] In this example, the temperature of the heat pipe at the 100mm position is 47.4°C, and 10 The difference between the 0mm position and the 460mm position is 3.9°C, which is the temperature of the heat pipe during operation. This indicates that it was the maximum temperature difference measured by P.

[0070] Example 2 The cross-section of the heat pipe is generally as described in relation to Figure 1, specifically as shown in Figure 1. Except as shown in 1B, the overall dimensions were the same as those described in Comparative Example 2. Each time, a heat pipe having the same heater and thermocouple is formed. Because a more efficient and effective configuration was used, the test was conducted using the same packing density as in Comparative Example 2. The filling rate was 40%, which is less than half. As can be seen in Figure 1B, two aluminum The structure between the plates traps some of the condensed liquid and moves it from the condenser section to the evaporator. It is sent to each reservoir in sections 12B to 12E. The refrigerant is condensed in the condenser section. Then, a portion of the condensed working fluid liquid is directed toward each of the evaporator sections 12B to 12E. It flows downwards.

[0071] The heat pipe operated at room temperature of approximately 26.6°C. The results, along with those from Comparative Example 2, were obtained in equilibrium. The measured temperatures are shown in Table 2 below.

[0072] [Table 4]

[0073] As can be seen from the results reported in Table 2 above, the configuration according to the present invention is a heat pipe Lower temperatures are generated at each position along the line, and under equivalent conditions, the filling density used in Comparative Example 2 Even with a filling rate of less than half, the heat pipe according to the present invention provides more cooling. This indicates that it will be provided. Furthermore, the temperature difference between sections of the heat pipe is different from conventional heat pipes. Compared to a pipe configuration, the heat pipe performance was lower for specific sections. Well, the temperature only rises by 3.1 °C from the position of 100 mm to the position of 460 mm, but conventionally in the heat pipe configuration, the temperature has risen by 3.9 °C, which indicates an excellent level of cooling efficiency between these positions. This example shows the same advantages as described above in relation to Example 1.

[0074] Comparative Example 3A The heat pipe generally corresponding to FIG. C1 in this specification and specifically shown in FIG. C4 is formed from two aluminum plates, has two heat sources of the same size and heat generation amount, Heater 1 is located adjacent to one side of the lower half of the heat pipe, and heater 2 is adjacent to the same side but is located along the upper half of the heat pipe.

[0075] Separate thermocouples were provided at each of seven locations on the heat pipe wall arranged at approximately equal intervals from the bottom to the top of the heat pipe. The working fluid in the heat pipe is R1233zd (E), and the filling amount of R1233zd(E) necessary to provide the best performance in the heat pipe was determined to be 63.1 grams.

[0076] Furthermore, it was tested under the same operating conditions as when using a 1 mm aluminum plate for the heat pipe. The results of these two tests are shown below.

[0077]

Table 5

[0078] Examples 2A and 2B The cross-section of the heat pipe was generally as described in relation to FIG. 1 and specifically as shown in FIGS. 2A and FIG. 2B, except that it was the same as described in Comparative Example 3 ​​​​Two heat pipes having the same overall dimensions and the same heater and thermocouple are formed. In particular, The heat pipe shown in Figure 2A, according to the present invention, as shown, had nine evaporator sec tions and associated flow channels. The heat pipe of Figure 2B had an upper section that was essentially configured as the upper section of the heat pipe of Figure 2A, i.e., The upper five evaporator sections and associated flow channels of each of the heat pipes of Figures 2A and 2B were made to have substantially the same dimensions and configuration as shown. However, the four flow channels at the bottom of the heat pipe of Figure 2A were replaced by a single evaporator section according to the heat pipe of Figure 2B. Importantly, this single lower evaporator section was sized to have a volume less than half the total volume of the four lower evaporator sections of the heat pipe of Figure 2A. The optimized filling and performance for the heat pipes of Figures 2A and 2B, along with the results repeated for Comparative Example 3, are reported in the following table. 図2A及び図2Bのヒートパイプの各々の上部5つの蒸発器セクション及び関連する流路 は、図示のように、実質的に同じ寸法及び構成とされた。しかしながら、図2Aのヒート パイプの底部の4つの流路は、図2Bのヒートパイプに従って単一の蒸発器セクションに よって置き換えられた。重要なこととして、この単一の下部蒸発器セクションは、図2A のヒートパイプの4つの下部蒸発器セクションの総容積の半分未満の容積を有するように 寸法決めされた。図2A及び図2Bのヒートパイプについての最適化された充填及び性能 を、比較例3について繰り返された結果と共に、以下の表に報告する。

[0079]

Table 6

Claims

1. A method of transferring heat, comprising the use of a heat pipe of the type having a condenser section in which a gaseous refrigerant is condensed to produce a liquid refrigerant, wherein the method is (a) A closed-type heat pipe, (i) A condenser section located outside the heat pipe, which is in heat transfer communication with a heat sink, where a gaseous refrigerant is condensed into a liquid refrigerant, (ii) A first evaporator section having fluid communication with the condenser section and including a first reservoir containing a liquid refrigerant, (iii) At least a second evaporator section having fluid communication with the condenser section and including a second reservoir containing a liquid refrigerant, (iv) at least a first liquid channel that guides at least a portion of the condensed liquid refrigerant from the condenser section to the first reservoir, where at least partially using gravity to return the condensed liquid refrigerant from the condenser section to the first evaporator section, (v) at least a second liquid channel that guides at least a portion of the liquid refrigerant from the condenser section to the second reservoir, where the condensed liquid refrigerant is returned from the condenser section to the second evaporator section using at least part gravity, To provide a closed heat pipe, wherein the second liquid flow path comprises one or more obstacles within the heat pipe, which are oriented obliquely to the vertical direction and cause at least a portion of the liquid refrigerant to be diverted from the condenser section toward the second evaporator section. (b) Cooling the first component or device by thermal contact with the liquid refrigerant in the first reservoir and generating refrigerant vapor that moves to the condenser section, (c) Cooling at least the second component or device by thermal contact with the liquid refrigerant in the second reservoir and generating refrigerant vapor that moves to the condenser section, (d) A method comprising condensing refrigerant vapor in the condenser section to produce a condensed liquid refrigerant.

2. The method according to claim 1, further comprising cooling a telecommunications device or system, preferably the telecommunications device or system including a 5G chip.

3. The method according to claim 1, further comprising cooling at least a portion of a printed circuit board by bringing the heat pipe into contact with at least a portion of the printed circuit board.

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