Imaging unit and imaging device

Abstract

The imaging unit comprises a mounting board on which an image sensor for imaging a subject is mounted, a first power supply circuit section including a regulator, and a second power supply circuit section that supplies additional current to the image sensor when the image sensor requires a second current greater than a first current supplied by the first power supply circuit section. The imaging unit may further include a power supply board connected to the mounting board by a flexible board and having the second power supply circuit section. The first power supply circuit section may be mounted on the mounting board. The imaging unit may further include a detection unit that detects a change in the power supply voltage applied to the image sensor and transmits a signal to the second power supply circuit section.

Description

Technical Field

[0001] The present invention relates to an imaging unit and an imaging device.

Background Art

[0002] A solid-state imaging device including a pixel array in which a plurality of pixels are arranged is known (for example, Patent Document 1). Conventionally, an increase in power consumption has been a problem. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-176616

Summary of the Invention

[0003] In a first aspect of the present invention, an imaging unit is provided. The imaging unit may include a mounting substrate on which an image sensor for imaging a subject is mounted. The imaging unit may include a first power supply circuit section including a regulator. The imaging unit may include a second power supply circuit section that supplies additional current to the image sensor when the image sensor requires a second current amount that is greater than the first current amount supplied from the first power supply circuit section.

[0004] Note that the above summary of the invention does not list all of the necessary features of the present invention. Also, sub-combinations of these feature groups can also be inventions.

Brief Description of the Drawings

[0005] [Figure 1] FIG. 37 is a schematic cross-sectional view of a camera 10, which is an example of an imaging device according to an embodiment. [Figure 2] FIG. 40 is a top view schematically showing a part of an imaging unit 40 according to an embodiment. [Figure 3] FIG. 43 is a cross-sectional view schematically showing the A-A cross-section of FIG. 2. [Figure 4] FIG. 46 is a schematic circuit diagram of an imaging unit 40 according to an embodiment. [Figure 5]This is a schematic circuit diagram of an imaging unit 41 according to one embodiment. [Figure 6] This is a schematic circuit diagram of an imaging unit 42 according to one embodiment. [Figure 7] This is a schematic circuit diagram of an imaging unit 43 according to one embodiment. [Figure 8] This graph shows an example of the relationship between the change in current consumption of the image sensor 100 and the change in terminal voltage in an imaging unit 43 according to one embodiment. [Figure 9] This is a schematic circuit diagram of an imaging unit 44 according to one embodiment. [Figure 10] This is a schematic circuit diagram of an imaging unit 45 according to one embodiment. [Modes for carrying out the invention]

[0006] The present invention will be described below through embodiments of the invention, but these embodiments are not intended to limit the invention as defined in the claims. Furthermore, not all combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0007] Figure 1 is a schematic cross-sectional view of a camera 10, which is an example of an imaging device according to one embodiment. Camera 10 is, for example, a digital compact camera. Camera 10 comprises a lens unit 20 and a camera body 30.

[0008] The lens unit 20 has an optical system within its lens barrel, and the optical axis 22 is defined by this optical system. The lens unit 20 is attached to the camera body 30. The lens unit 20 may be housed within the camera body 30 and extend outward when in use, as shown in the figure.

[0009] The lens unit 20 guides the incident subject light beam into the housing 31 of the camera body 30. Note that the lens unit 20 shown in Figure 1 includes two lenses and an aperture for illustrative purposes only, but is not limited to this configuration.

[0010] The camera body 30 includes an imaging unit 40 and a display unit 88. The camera body 30 further includes a first flexible substrate 250 and a second flexible substrate 260.

[0011] The subject light beam incident on the lens unit 20 is guided by the lens unit 20 to the imaging unit 40. The imaging unit 40 includes an image sensor 100 for imaging the subject, a mounting substrate 120 having a first main surface 111 and a second main surface 112, a connector 180 mounted on the second main surface 112 of the mounting substrate 120, and a substrate unit 60 including a substrate 62 connected to the mounting substrate 120 by a first flexible substrate 250 and a second flexible substrate 260. In this embodiment, the imaging unit 40 further includes a frame 140 and a cover glass 160. Note that the imaging unit 40 does not necessarily have to include the connector 180, frame 140 and cover glass 160. Note that the substrate 62 is an example of a power supply substrate. In the following description, the substrate 62 may be referred to as a power supply substrate.

[0012] The image sensor 100 is, for example, a CMOS image sensor or a CCD image sensor, and its main plane has a rectangular shape. The image sensor 100 is mounted on the first main surface 111 of the mounting substrate 120. Note that the image sensor 100 is just one example of an image sensor.

[0013] In this embodiment, the direction along the optical axis 22 is defined as the z-axis direction. That is, the direction in which the subject light beam is incident on the imaging surface of the image sensor 100 is defined as the z-axis direction. Specifically, the direction in which the subject light beam is incident is defined as the z-minus direction, and the opposite direction is defined as the z-plus direction. The longitudinal direction of the image sensor 100 is defined as the x-axis direction. The short direction of the image sensor 100 is defined as the y-axis direction. Specifically, the x-axis and y-axis directions are defined as shown in Figure 1. The x-axis, y-axis, and z-axis are in a right-handed Cartesian coordinate system.

[0014] In this configuration, the mounting board 120, board 62, and display unit 88 in this embodiment are arranged sequentially in the negative z-axis direction. For the sake of explanation, the positive z-axis direction may be referred to as the front, front side, etc. The negative z-axis direction may be referred to as the rear, rear side, etc. The side in the negative z-axis direction may be referred to as the back side, etc.

[0015] The substrate 62 of the substrate unit 60 is positioned in the negative z-axis direction of the imaging unit 40. Connectors 182 and 184, an MPU 51, an ASIC 52, and a power supply unit 53 are mounted on the substrate 62 of the substrate unit 60. Additional or alternative electronic circuits may be mounted on the substrate 62. The substrate unit 60 may include multiple substrates on which each component is mounted individually, multiple substrates on which several components are mounted together, or multiple substrates that combine these.

[0016] The MPU 51 is responsible for the overall control of the camera 10. The ASIC 52 processes the image signal output from the image sensor 100. In this embodiment, the ASIC 52 receives the image signal from the image sensor 100 via the mounting board 120, connector 180, first flexible board 250, and connector 184.

[0017] The power supply unit 53 includes a battery attached to the camera 10 and a power supply circuit that supplies power stored in the battery to various parts of the camera 10. In this embodiment, the power supply unit 53 supplies current to the image sensor 100 via the connector 182, the second flexible substrate 260, the connector 180, and the mounting substrate 120.

[0018] The ASIC52 generates image data for display based on the image signal from the image sensor 100. The ASIC52 generates image data for display by applying, for example, image processing or compression processing to the image signal from the image sensor 100.

[0019] The image data for display generated by the ASIC 52 is output to the display unit 88. The image data may be recorded on a recording medium mounted on the camera body 30. The recording medium may be configured to be detachable from the camera body 30.

[0020] The display unit 88 is disposed at a position in the minus z-axis direction of the substrate 62 of the substrate unit 60. As the display unit 88, for example, a liquid crystal panel or the like can be applied. The display surface of the display unit 88 appears on the back surface of the camera body 30. The display unit 88 displays an image based on the image data for display generated by the ASIC 52.

[0021] Note that the imaging unit 40 may include two or more connectors. In other words, two or more connectors may be mounted on the second main surface 112 of the mounting substrate 120. Further, an individual flexible substrate may be connected to each of the two or more connectors. Each set of connectors and flexible substrates may be specialized for a specific application. Also, the applications of a plurality of such sets may be partially or entirely common to each other.

[0022] FIG. 2 is a top view schematically showing a part of the imaging unit 40 according to an embodiment. FIG. 3 is a cross-sectional view schematically showing the A-A cross section of FIG. 2. However, in FIG. 3, in addition to a part of the imaging unit 40 shown by a solid line, a bracket 150, a first flexible substrate 250, and a second flexible substrate 260 are shown by a broken line.

[0023] The imaging device 100 is configured to include an imaging region 101 and a peripheral region 102. As shown in FIG. 2, both the imaging region 101 and the peripheral region 102 are rectangular in plan view.

[0024] The imaging region 101 is formed at the central portion of the imaging device 100. In the imaging region 101, a plurality of photoelectric conversion elements that photoelectrically convert subject light are two-dimensionally arranged, whereby the imaging surface of the imaging device 100 is formed. Each pixel is configured to include one or more photoelectric conversion elements.

[0025] The peripheral region 102 is located around the imaging region 101. The peripheral region 102 includes a processing circuit 104 that reads out the image signal obtained by photoelectric conversion in the photoelectric conversion element and performs signal processing. The processing circuit 104 includes an AD conversion circuit that converts the output image signal into a digital signal. The processing circuit 104 also includes a transmission circuit 105 for transmitting the image signal.

[0026] The image sensor 100 is mounted on the mounting substrate 120 using the COB (Chip On Board) method. The image sensor 100 is fixed to the mounting substrate 120 by adhesive parts 210. The adhesive parts 210 are, for example, thermosetting adhesives. Other adhesive parts, which will be described later, are also, for example, thermosetting adhesives.

[0027] The image sensor 100 is electrically connected to the mounting substrate 120 via bonding wires 110. The image signal, converted into a digital signal by the AD conversion circuit of the image sensor 100, is output to the mounting substrate 120 via the bonding wires 110. The image sensor 100 may also be flip-chip mounted on the mounting substrate 120.

[0028] The mounting substrate 120 includes a first layer 121, a core layer 207, and a second layer 122. The first layer 121 includes a solder resist layer 201, a wiring layer 202, an insulating layer 203, a wiring layer 204, and an insulating layer 205. The second layer 122 includes an insulating layer 215, a wiring layer 214, an insulating layer 213, a wiring layer 212, and a solder resist layer 211. The mounting substrate 120 is a multilayer core substrate having the core layer 207 as the core layer.

[0029] On the mounting substrate 120, the layers are arranged in the following order in the negative z-axis direction: solder resist layer 201, wiring layer 202, insulating layer 203, wiring layer 204, insulating layer 205, core layer 207, insulating layer 215, wiring layer 214, insulating layer 213, wiring layer 212, and solder resist layer 211.

[0030] The insulating layers 203, 205, 215, and 213 are, for example, resin layers. The thickness of each insulating layer, such as 203, in the z-axis direction is, for example, 20 μm to 50 μm.

[0031] The wiring layers 202, 204, 214, and 212 include wiring patterns. Materials such as nickel-iron alloys (e.g., 42 alloy, 56 alloy), copper, and aluminum can be used for the wiring layer 202, etc. The thickness of each wiring pattern in the wiring layer 202, etc., is, for example, 10 μm to 50 μm.

[0032] The core layer 207 is formed of metal. When the core layer 207 is formed of metal, for example, an alloy of nickel and iron (e.g., 42 alloy, 56 alloy), copper, aluminum, etc. may be used as the material for the core layer 207. The thickness of the core layer 207 is greater than the thickness of any of the wiring layers 202, etc. The thickness of the core layer 207 is greater than the thickness of any of the insulating layers 203, etc. Specifically, the thickness of the core layer 207 is, for example, 0.1 mm to 0.8 mm.

[0033] The rigidity of the core layer 207 is higher than the rigidity of any of the wiring layers 202, etc. The rigidity of the core layer 207 may be higher than the rigidity of the first layer 121. The rigidity of the core layer 207 may be higher than the rigidity of the second layer 122.

[0034] The core layer 207 may be made of resin. When the core layer 207 is made of resin, it may be made of a material with a higher modulus of elasticity than FR4, for example. When the core layer 207 is made of resin, it is sandwiched between the wiring layers in the z-axis direction. For example, when the core layer 207 is made of resin, the layers may be arranged in the negative z-axis direction in the following order: solder resist layer 201, wiring layer 202, insulating layer 203, wiring layer 204, core layer 207, wiring layer 214, insulating layer 213, wiring layer 212, and solder resist layer 211. When two additional wiring layers are added, an additional insulating layer in contact with wiring layer 204 and an additional wiring layer in contact with core layer 207 are arranged sequentially in the negative z-axis direction between wiring layer 204 and core layer 207, and an additional wiring layer in contact with core layer 207 and an additional insulating layer in contact with wiring layer 214 are arranged sequentially in the negative z-axis direction between core layer 207 and wiring layer 214.

[0035] Thus, the mounting substrate 120 is a multilayer core substrate having a metal core or a resin core. The thickness of the mounting substrate 120 may be, for example, 0.3 mm to 1.5 mm.

[0036] At least a portion of the wiring layer 202 is used for a wiring pattern that receives the image signal output from the image sensor 100 via the bonding wire 110. The wiring layer 202 includes a bonding pad 240 to which the bonding wire 110 is connected.

[0037] The wiring patterns included in wiring layer 204 and wiring patterns included in wiring layer 214 can be used for, for example, ground lines, power lines, etc.

[0038] The image sensor 100 is placed on a solder resist layer 201 and is electrically connected to a bonding pad 240 by bonding wires 110. The bonding pad 240 and the wiring layer 212 are electrically connected by vias 131 that penetrate the first layer 121 and the core layer 207. The vias 131 are covered with an insulator 132. The image signal output from the image sensor 100 is transmitted to the wiring layer 212 via the wiring layer 202 and the vias 131.

[0039] Electronic components such as the connector 180, the bypass capacitor group 185, and the circuit group 187 are mounted on the solder resist layer 211. In other words, these electronic components are mounted on the second main surface 112 of the mounting substrate 120, which is opposite to the first main surface 111 on which the image sensor 100 is mounted. Other electronic components such as resistors, regulators, and transistors may also be included on the solder resist layer 211.

[0040] These electronic components are electrically connected to the wiring layer 212 by lead members. These lead members are fixed to the wiring layer 212 with solder or the like. A portion of the wiring layer 212 is exposed to the outside through an opening formed in the solder resist layer 211, providing electrodes such as lands.

[0041] The frame 140 is formed of resin. The frame 140 is bonded to the solder resist layer 201 of the mounting substrate 120 by an adhesive portion 220. In other words, the mounting substrate 120 is fixed to the frame 140.

[0042] The frame 140 may be constructed by inserting a metal body into a resin. The material for the metal body can be a nickel-iron alloy (e.g., 42 alloy, 56 alloy), copper, or aluminum. Using a lightweight material such as aluminum for the metal body can reduce the weight of the frame 140. Using a material with relatively high thermal conductivity, such as copper, for the metal body can improve the heat dissipation characteristics from the frame 140.

[0043] The frame 140 has a first surface 141, a second surface 142, a third surface 143, a fourth surface 144, a fifth surface 145, and a sixth surface 146. The sixth surface 146 forms an opening 138. The sixth surface 146 forms the inner wall surface of the frame 140. The opening 138 is formed, for example, in the central part of the xy plane. The image sensor 100, which is mounted on the first main surface 111 of the mounting substrate 120, is located within the opening 138.

[0044] The first surface 141 is the surface that is bonded to the cover glass 160 by the adhesive portion 230. The first surface 141 is the surface that is in contact with the end of the sixth surface 146. The first surface 141 is formed along the outer edge of the sixth surface 146. The first surface 141 is a surface that is substantially parallel to the xy plane.

[0045] The second surface 142 is a surface that is in contact with the end of the first surface 141. The second surface 142 is a surface that is formed along the outer edge of the first surface 141. The second surface 142 has a surface that is substantially parallel to the yz plane and a surface that is substantially parallel to the xz plane.

[0046] The third surface 143 is the surface that is in contact with the end of the second surface 142. The third surface 143 is a surface that is approximately parallel to the xy-plane and is approximately parallel to the first surface 141.

[0047] The fourth surface 144 is a surface that is in contact with the end of the third surface 143. The fourth surface 144 is a surface that is formed along the outer edge of the third surface 143. The fourth surface 144 has a surface that is substantially parallel to the yz plane and a surface that is substantially parallel to the xz plane.

[0048] The fifth surface 145 is a surface that is in contact with the edge of the fourth surface 144. The fifth surface 145 is a surface that is formed along the outer edge of the fourth surface 144. The fifth surface 145 is a surface that is substantially parallel to the xy plane. The fifth surface 145 is a surface that is substantially parallel to the first surface 141 and the third surface 143. The fifth surface 145 is a surface that is bonded to the solder resist layer 201 of the mounting substrate 120 by the adhesive portion 220. The fifth surface 145 faces the adhesive portion 220. The fifth surface 145 is a surface that is in contact with the edge of the sixth surface 146. The fifth surface 145 is formed along the outer edge of the sixth surface 146.

[0049] The frame 140 has stepped sections formed by a first surface 141, a second surface 142, and a third surface 143. The frame 140 has mounting holes 148 as mounting sections. The frame 140 has, for example, three mounting holes 148. All three mounting holes 148 are holes that penetrate from the third surface 143 to the fifth surface 145. All three mounting holes 148 are used to attach the imaging unit 40 to another structure such as the housing 31 of the camera body 30.

[0050] The frame 140 is fixed to the bracket 150 by, for example, screws 149 through three mounting holes 148. The bracket 150 is fixed to the housing 31 of the camera body 30 by, for example, screws. Thus, the imaging unit 40 is fixed to the housing 31 of the camera body 30.

[0051] If the frame 140 and the bracket 150 are fastened together using mounting holes 148, for example, with metal screws 149, a heat transfer path can be formed to allow the heat generated when the image sensor 100 is operating to dissipate to the housing 31 via the screws 149.

[0052] The frame 140 has positioning holes 147. The frame 140 has, for example, two positioning holes 147. Both positioning holes 147 are holes that penetrate from the third surface 143 to the fifth surface 145. Of the two positioning holes 147, one is formed as a fitting hole, and the other positioning hole 147 is formed as an elongated hole.

[0053] The frame 140 is positioned relative to the bracket 150 using two positioning holes 147. For example, two positioning pins provided on the bracket 150 are inserted into the two positioning holes 147 to position the frame 140 and the bracket 150. The frame 140 is then fixed in its positioned state relative to the bracket 150. Thus, the imaging unit 40 is fixed in its positioned state to the housing 31. Note that the frame 140 and the bracket 150 may be fixed to structures other than the housing 31.

[0054] The imaging unit 40 may be fixed to the housing 31 without using the bracket 150. The imaging unit 40 may be fixed to the housing 31, for example, by screwing it through the three mounting holes 148.

[0055] The cover glass 160 is made of, for example, borosilicate glass, quartz glass, alkali-free glass, heat-resistant glass, or crystal. The cover glass 160 is translucent. The thickness of the cover glass 160 is, for example, 0.5 mm to 0.8 mm.

[0056] The cover glass 160 is used to seal the image sensor 100 housed within the opening 138 of the frame 140. More specifically, the cover glass 160 is fixed to the frame 140 so as to cover the opening 138 of the frame 140. The cover glass 160 is fixed to the frame 140 after the image sensor 100, bonding wires 110, and frame 140 have been mounted on the mounting substrate 120. The cover glass 160 is bonded to the frame 140 by an adhesive portion 230. Since the cover glass 160 is light-transmitting, the adhesive portion 230 may be a light-curing adhesive.

[0057] The cover glass 160, together with the frame 140 and the mounting substrate 120, seals the space within the opening 138. Therefore, the image sensor 100 located within the opening 138 is placed in a space sealed by the mounting substrate 120, the frame 140, and the cover glass 160. As a result, the image sensor 100 is less susceptible to external environmental influences. For example, the image sensor 100 is less susceptible to the effects of moisture present outside the space. This helps to suppress the deterioration of the image sensor 100.

[0058] Figure 4 is a schematic circuit diagram of an imaging unit 40 according to one embodiment. The imaging unit 40 comprises a first power supply circuit section 310, a second power supply circuit section 410, and a detection unit 190. In the imaging unit 40 of this embodiment, the first power supply circuit section 310 and the detection unit 190 are mounted on a mounting board 120, and the second power supply circuit section 410 is mounted on a board 62.

[0059] The first power supply circuit section 310 includes a capacitor 312 and an LDO 311, which is an example of a regulator. Capacitor 312, indicated by the symbol C in the figure, has one end connected to the ground Gcob of the mounting board 120 and the other end electrically connected to the image sensor 100, smoothing out current changes on the image sensor 100 side.

[0060] One end of the LDO311 is electrically connected to the positive power supply of the power supply unit 53 via connector 180, power line 262 of the second flexible board 260, and connector 182, and receives a positive voltage Vcc from the positive power supply. The other end of the LDO311 is electrically connected to the input terminal of the image sensor 100. The LDO311 outputs a voltage drop from the positive voltage Vcc input from the positive power supply to, for example, a voltage V2 near the input terminal of the image sensor 100. V2 changes depending on the change in the current consumption flowing into the image sensor 100. In the following explanation, the normal voltage range of the terminal voltage specified for the image sensor 100 is denoted as Vsen.

[0061] The LDO311 uses feedback to maintain its output voltage V2′ within the normal voltage range Vsen. Therefore, even if V2 fluctuates slightly, the LDO311 adjusts itself to ensure that V2 = Vsen. For example, if the current flowing through the LDO311 increases slightly and the terminal voltage V2 decreases, the LDO311 will boost V2′ to raise the terminal voltage V2. This boosting operation is possible as long as it is within the LDO311's drive capability.

[0062] As shown in the figure, the power line 262 of the second flexible board 260 has a resistance value of r2, and the pins of connectors 180 and 182 connected to the power line 262 have a resistance value of r1. In addition, the signal line 261 of the second flexible board 260 has a resistance value of r2'', and the pins of connectors 180 and 182 connected to the signal line 261 have a resistance value of r1''. Furthermore, the ground line 263 of the second flexible board 260 has a resistance value of r2'', and the pins of connectors 180 and 182 connected to the ground line 263 have a resistance value of r1''.

[0063] The first power supply circuit section 310 mounted on the mounting substrate 120 preferably includes a linear regulator such as an LDO 311, compared to a switching regulator with switching operation that tends to increase in proportion to the increase in current, such as a DC-DC converter. This is because it can prevent switching noise from resonating with the sequence operation inside the image sensor 100.

[0064] In recent years, with the increase in pixel count and faster readout speeds of image sensors, there has been a tendency for the power consumption or current consumption of image sensors to increase. Furthermore, the emergence of stacked image sensors equipped with large-scale circuits such as memory has exacerbated the increase in image sensor power consumption. On the other hand, the period during which an image sensor is operating includes periods of various processing, such as the period of accumulating charge in pixels, the period of encoding the charge of each pixel into a digital value corresponding to that charge, i.e., the period of A / D conversion, the period of outputting brightness data from the image sensor, and the period of accumulating digital data in the memory of the image sensor, and these periods may overlap with each other. Therefore, even if the current consumption of an image sensor is at a normal level in one period, it may suddenly increase to an excessively large amount in the next period, or return to a normal level in the following period, and so on, causing abrupt changes in current consumption.

[0065] Furthermore, the terminal voltage V2 of the image sensor has a defined voltage range Vsen in which the image sensor can operate. If the terminal voltage V2 falls outside this voltage range Vsen, it is detected as an error. If the error is repeated, the operation of the image sensor may become unstable, making it impossible to acquire normal images, or the image sensor may stop operating. As mentioned above, if the current consumption of the image sensor changes rapidly, the terminal voltage V2 will change in accordance with the change in current consumption, and it is highly likely that it will exceed the drive capability of the regulator on the mounting board and fall outside the voltage range Vsen. For example, if the current consumption of the image sensor increases rapidly, the terminal voltage V2 of the image sensor will follow suit and drop rapidly, exceeding the drive capability of the regulator on the mounting board and falling below the specified lower voltage limit of that range, making it impossible for the sensor to adjust itself to V2=Vsen. When the drive capability is at its limit, there is a high possibility that it will transiently fall below the specified lower voltage limit. Furthermore, for example, if the increased current consumption of the image sensor suddenly decreases, the terminal voltage V2 of the image sensor will follow suit and rise sharply, potentially exceeding the drive capability of the regulator on the mounting board and transiently exceeding the specified voltage upper limit in that range, i.e., overshooting.

[0066] Therefore, according to the imaging unit 40, the second power supply circuit 410, which is different from the first power supply circuit 310, supplies an additional current (I1) to the image sensor 100 when the image sensor 100 requires a second current amount that is greater than the first current amount (I2) supplied from the first power supply circuit 310.

[0067] In the imaging unit 40 according to this embodiment, the detection unit 190 further detects that the power supply voltage applied to the image sensor 100 has changed and transmits a signal to the second power supply circuit unit 410. In other words, the detection unit 190 transmits an Ena signal to the second power supply circuit unit 410 in response to detecting that the image sensor 100 requires a second current amount (I2+I1) that is greater than the first current amount (I2) supplied from the first power supply circuit unit 310.

[0068] The second power supply circuit 410 according to this embodiment includes a resistor 411 and a switch element 412, which are connected in series in sequence on the path between the positive power supply of the power supply unit 53 and the image sensor 100. The resistor 411 is, for example, a power resistor and has a resistance value Rpw. The switch element 412 can be switched ON / OFF in response to an externally input signal and short-circuits or disconnects the above-mentioned path via the second power supply circuit 410. The switch element 412 may be a semiconductor element capable of carrying a large current, such as a power MOSFET, bipolar transistor, IGBT, etc., or it may be a relay.

[0069] In this embodiment, one end of the detection unit 190 is electrically connected to the input terminal of the image sensor 100 in order to detect changes in the terminal voltage V2 of the image sensor 100. Another end of the detection unit 190 is connected to the switch element 412 of the second power supply circuit unit 410 via the connector 180, the signal line 261 of the second flexible substrate 260, and the connector 182, so as to be able to output an Ena signal. When the detection unit 190 detects a voltage drop (voltage drop, ΔVdrop) in the terminal voltage V2 of the image sensor 100, it sends an Ena signal to the switch element 412 requesting current supplementation, switches the switch element 412 to ON, and short-circuits the above path passing through the switch element 412. When the detection unit 190 no longer detects a voltage drop in the terminal voltage V2 of the image sensor 100, it switches the Ena signal and sends it to the switch element 412, switches the switch element 412 to OFF, and disconnects the above path passing through the switch element 412.

[0070] When the current consumption of the image sensor 100 becomes excessive and exceeds the drive capability of the LDO 311 of the first power supply circuit 310, causing the terminal voltage V2 of the image sensor 100 to drop, the imaging unit 40 supplies an additional current I1 to the image sensor 100 from the second power supply circuit 410. In other words, the second power supply circuit 410 supplements the drive capability of the LDO 311 of the first power supply circuit 310. As a result, the imaging unit 40 prevents the terminal voltage V2 of the image sensor 100 from dropping sharply.

[0071] The imaging unit 40 also stops supplying additional current I1 from the second power supply circuit 410 to the image sensor 100 in response to a decrease in the excessive current consumption of the image sensor 100 causing the terminal voltage Vsen of the image sensor 100 to rise. In other words, the imaging unit 40 maintains the voltage V2 within the specified voltage range solely by the drive capability of the LDO 311 of the first power supply circuit 310. This prevents the imaging unit 40 from causing a rapid increase in the terminal voltage V2 of the image sensor 100.

[0072] As described above, when the image sensor 100 requires a normal amount of current (I2), the imaging unit 40 supplies current to the image sensor 100 via the LDO 311 of the first power supply circuit 310, thereby stabilizing the terminal voltage V2 of the image sensor 100. In other words, the imaging unit 40 can ensure a normal terminal voltage V2 within a specified voltage range with reference to the ground potential Gcob of the mounting substrate 120.

[0073] Furthermore, if the image sensor 100 requires an excessive current (I2+I1) greater than the normal current (I2), the imaging unit 40 supplies a supplemental current (I1) to the image sensor 100 via the second power supply circuit 410 without significantly changing the amount of current (I2) supplied to the image sensor 100 via the LDO 311 of the first power supply circuit 310, that is, without increasing the load on the LDO 311. This allows the imaging unit 40 to keep the load on the LDO 311 of the first power supply circuit 310 at the normal current (I2). In other words, the imaging unit 40 can keep the output potential of the LDO 311, which defines the terminal voltage V2 of the image sensor 100, relative to the ground potential (Gcob) at the normal voltage (Vsen), and in other words, can continuously stabilize the terminal voltage V2 of the image sensor 100 within the Vsen standard.

[0074] Furthermore, when the imaging unit 40 no longer needs to consume an excessive current (I2+I1) and requires a normal current (I2), it stops the supplemental current (I1) and supplies current (I2) to the imaging unit 40 via the LDO 311 of the first power supply circuit 310, thereby continuously stabilizing the terminal voltage V2 of the imaging unit 100 within the Vsen standard.

[0075] According to the above embodiment, the imaging unit 40 includes a mounting substrate 120 on which the image sensor 100 is mounted, a first power supply circuit section 310 including a regulator, and a second power supply circuit section 410. The second power supply circuit section 410 supplies additional current to the image sensor 100 when the image sensor 100 requires a second current amount that is greater than the first current amount supplied from the first power supply circuit section 310.

[0076] With an imaging unit 40 having such a configuration, even when the current consumption of the image sensor 100 changes rapidly, the terminal voltage V2 of the image sensor 100 can be kept within the operating voltage range Vsen of the image sensor 100 (preventing the transient undershoot and transient drop below the specified voltage limit mentioned above). In other words, since the imaging unit 40 can adhere to the specified voltage of the image sensor 100, stable operation of the image sensor 100 can be ensured.

[0077] Furthermore, the imaging unit 40 of this embodiment further includes a detection unit 190 that detects a change in the power supply voltage V2 applied to the image sensor 100 and transmits a signal to the second power supply circuit unit 410. With the imaging unit 40 equipped with the detection unit 190, when it is detected that the image sensor 100 requires a second current amount greater than the first current amount supplied from the first power supply circuit unit 310, a signal is transmitted to the second power supply circuit unit 410, causing it to supply additional current to the image sensor 100. It can also be said that the imaging unit 40 according to this embodiment has a configuration that detects a voltage drop in the terminal voltage of the image sensor 100 and feeds it back to a current supplementation means (second power supply circuit unit 410) constructed on a board 62 other than the mounting board 120.

[0078] Furthermore, in the imaging unit 40 of this embodiment, since the first power supply circuit 310 is mounted on the mounting board 120, the regulator of the first power supply circuit 310 can stably maintain a constant terminal voltage V2 near the image sensor 100 with reference to the ground potential Gcob of the mounting board 120.

[0079] Furthermore, if a regulator that operates to stabilize the input terminal voltage of the image sensor within a predetermined voltage is mounted on the mounting board, an increase in the amount of current flowing through the regulator may increase the switching noise and thermal noise of the regulator, potentially degrading the imaging performance of the image sensor. However, according to the imaging unit 40 of this embodiment, the second power supply circuit 410 is mounted on the board 62, and furthermore, when the image sensor 100 requires a larger-than-usual amount of current, supplemental current is supplied to the image sensor 100 via the second power supply circuit 410 without significantly changing the amount of current supplied to the image sensor 100 via the regulator of the first power supply circuit 310. As a result, the imaging unit 40 can suppress the increase in switching noise and thermal noise of the regulator of the first power supply circuit 310 when the image sensor 100 requires a larger-than-usual amount of current, and thus can suppress the degradation of the imaging performance of the image sensor 100.

[0080] For example, switching noise is caused by switching regulators as described above, while thermal noise is caused by linear regulators such as LDOs. Thermal noise is a degradation of imaging performance caused by the conduction of heat generated by the linear regulator to the image sensor through the mounting substrate. For example, it can reduce the number of continuous shots the camera can take because it is more likely to exceed the temperature upper limit, shorten the exposure time the camera can take, or cause parts of the captured image to appear white due to white noise.

[0081] Figure 5 is a schematic circuit diagram of an imaging unit 41 according to one embodiment. In this embodiment, the same or corresponding reference numerals are used for components that are the same as those described in the embodiments using Figures 1 to 4, and redundant explanations are omitted. The same applies to the subsequent descriptions of embodiments.

[0082] In this embodiment, unlike the embodiment described with reference to Figures 1 to 4, the mounting substrate 120 of the imaging unit 41 does not have a configuration corresponding to the detection unit 190 of the imaging unit 40. Instead, the image sensor 100 of the imaging unit 41 includes a transmitter 107 that transmits a signal to the second power supply circuit 420 when the amount of current consumed by the image sensor 100 is changed. In other words, the image sensor 100 including the transmitter 107 directly transmits an Ena signal to the second power supply circuit 420 in such a case.

[0083] Another difference is that the second power supply circuit section 420 of the power supply unit 53 in the imaging unit 41 does not have the resistive element 411 and the switch element 412 of the second power supply circuit section 410 of the power supply unit 53 in the imaging unit 40. Instead, the second power supply circuit section 420 includes an LDO 421 connected in series on the path between the positive power supply of the power supply unit 53 and the image sensor 100. The LDO 421 can be switched ON / OFF in response to the Ena signal input from the oscillator 107 of the image sensor 100, and short-circuits or disconnects the above path via the second power supply circuit section 420.

[0084] More specifically, the transmitter 107 of the image sensor 100 in the imaging unit 41 is connected to the LDO 421 of the second power supply circuit 420 via connector 180, signal line 261 of the second flexible substrate 260, and connector 182, so as to be able to output an Ena signal. When the current consumption of the image sensor 100 changes to a second current amount (I2+I1) that is greater than the first current amount (I2) supplied by the first power supply circuit 310, the transmitter 107 sends an Ena signal to the LDO 421 of the second power supply circuit 420 requesting current supplementation, switches the LDO 421 ON, and short-circuits the above path through the LDO 421. Furthermore, when the transmitting unit 107 changes the current consumption of the image sensor 100 from a second current amount (I2+I1) to a first current amount (I2), it switches the Ena signal and transmits it to the LDO421, which switches the LDO421 to OFF and disconnects the above path passing through the LDO421.

[0085] The power supply circuit of the image sensor 100 is divided into different types for each function, so the current value consumed under normal circumstances and the high current value consumed when many circuits are operating are often known. The imaging unit 41 outputs an Ena signal from the image sensor 100 during periods when a high current flows within each operating period of the image sensor 100. This allows the imaging unit 41 to shorten the overall feedback time and improve responsiveness.

[0086] The imaging unit 41 according to the above embodiment also has the same effects as the embodiment described with reference to Figures 1 to 4. It can also be said that the imaging unit 41 according to this embodiment has a configuration that feeds back the current increase / decrease signal output from the image sensor 100 to a current supplementation means (second power supply circuit 420) constructed on a board 62 other than the mounting board 120.

[0087] Figure 6 is a schematic circuit diagram of an imaging unit 42 according to one embodiment. In this embodiment, unlike the embodiment described with reference to Figures 1 to 4, the second power supply circuit section 430 of the power supply unit 53 in the imaging unit 42 does not have the resistor element 411 and the switch element 412 of the second power supply circuit section 410 of the power supply unit 53 in the imaging unit 40. Instead, the second power supply circuit section 430 includes an LDO 431 connected in series on the path between the positive power supply of the power supply unit 53 and the image sensor 100. Furthermore, the power supply unit 53 of the imaging unit 42 further includes a sequence circuit 54 that controls the operation of the image sensor 100.

[0088] The LDO431 can be switched ON / OFF in response to an externally input signal, short-circuiting or disconnecting the above-mentioned path via the second power supply circuit 430. The sequence circuit 54 outputs a sequence signal Seq to the image sensor 100. The sequence circuit 54 further transmits an (Ena) signal to the LDO431 of the second power supply circuit 430 to supply an additional current (I1) when the operation of the image sensor 100 requires a second current amount (I2+I1).

[0089] More specifically, the sequence circuit 54 is connected to the image sensor 100 via connector 182, signal line 261 of the second flexible substrate 260, and connector 180, enabling it to output a sequence signal Seq. When the image sensor 100 changes its current consumption to a second current amount (I2+I1) which is greater than the first current amount (I2) supplied by the first power supply circuit 310, the sequence circuit 54 sends an Ena signal to the LDO 431 of the second power supply circuit 430 requesting current supplementation, switching the LDO 431 ON and short-circuiting the above path through the LDO 431. Also, when the image sensor 100 changes its current consumption from the second current amount (I2+I1) to the first current amount (I2), the sequence circuit 54 switches the Ena signal and sends it to the LDO 431, switching the LDO 431 OFF and disconnecting the above path through the LDO 431.

[0090] For example, when the user selects the continuous shooting mode for the camera 10, the sequence circuit 54 may determine that a large current will be required for the image sensor 100 and send a sequence signal Seq for continuous shooting mode to the image sensor 100. At the same time, it may also send an Ena signal to the LDO 431 and switch the LDO 431 ON. The sequence signal Seq may be a serial 3-wire signal or an I2C bus, etc.

[0091] The imaging unit 42 according to the above embodiment also has the same effects as the embodiment described with reference to Figures 1 to 4. It can also be said that the imaging unit 42 according to this embodiment has a configuration that uses a current increase / decrease signal output from the sequence circuit 54 that controls the operation of the image sensor 100. The imaging unit 42 according to this embodiment may further include the oscillator 107 of the image sensor 100 as in the imaging unit 41 shown in Figure 5, and may use the Ena signal output from both the sequence circuit 54 and the oscillator 107.

[0092] Figure 7 is a schematic circuit diagram of an imaging unit 43 according to one embodiment. In this embodiment, unlike the embodiment described using Figures 1 to 4, the power supply unit 53 of the substrate 62 in the imaging unit 43 does not have a second power supply circuit section 410, but instead has a first power supply circuit section 320. On the other hand, the mounting substrate 120 of the imaging unit 43 does not have a first power supply circuit section 310, but instead has a second power supply circuit section 440.

[0093] Another difference is that the mounting board 120 of the imaging unit 43 does not have a configuration corresponding to the detection unit 190 of the imaging unit 40. Unlike the embodiments described with reference to Figures 1 to 4, the imaging unit 43 does not need to detect the voltage drop ΔVdrop of the terminal voltage V2 of the image sensor 100 and feed it back to the second power supply circuit 410.

[0094] The first power supply circuit section 320, mounted on the power supply board 62, includes a DC-DC converter 321 (an example of a regulator), a feedback path, and a capacitor 325. The capacitor 325, indicated by the symbol C in the figure, has one end connected to the ground Gnd of the board 62 and the other end electrically connected to a connector 182 located on the output side of the first power supply circuit section 320, smoothing out current changes on the output side of the first power supply circuit section 320.

[0095] The feedback path for maintaining a constant output voltage of the first power supply circuit 320 is a path on the circuit board 62 that feeds back the output voltage Vdcdc of the first power supply circuit 320 to the first power supply circuit 320. More specifically, the feedback path includes a coil 322 connected in series with the DCDC 321 between the positive power supply of the power supply unit 53 and the image sensor 100, and resistors 323 and 324 connected in series between the output side of the coil 322 and the DCDC 321. The coil 322 has an inductance L, and the resistors 323 and 324 have resistance values ​​Rfb1 and Rfb2, respectively.

[0096] Furthermore, the second power supply circuit 440 mounted on the mounting board 120 includes an LDO 441 as a regulator for adjusting the second power supply voltage applied to the image sensor 100. The second power supply circuit 440 also has a feedback path for feeding back the power supply voltage applied to the image sensor 100 on the mounting board 120.

[0097] The function of the LDO 441 and feedback path in the second power supply circuit 440 is the same as the function of the LDO 311 in the first power supply circuit 310 of the imaging unit 40 shown in Figure 4. That is, the LDO 441 and feedback path in the second power supply circuit 440 provide feedback to maintain the output voltage V2' of the LDO 441 at the same level as the terminal voltage V2 (=Vsen). Therefore, the LDO 441 adjusts itself so that V2' = V2 (=Vsen) even if V2 increases or decreases slightly. For example, if the current flowing through the LDO 441 increases slightly and the terminal voltage V2 decreases, the LDO 441 boosts V2' to raise the terminal voltage V2. The second power supply circuit 440 may also have a capacitor 442, similar to the first power supply circuit 310 in the imaging unit 40 shown in Figure 4.

[0098] According to the imaging unit 43 of this embodiment, not only is a current I1 constantly supplied to the image sensor 100 from the first power supply circuit unit 320 mounted on the substrate 62, but a current I2 is also constantly supplied to the image sensor 100 from the second power supply circuit unit 440 mounted on the mounting substrate 120.

[0099] Furthermore, when no current is flowing through the image sensor 100, the output voltage V1 of the first power supply circuit 320 on the substrate 62 and the output voltage V2 of the second power supply circuit 440 on the mounting substrate 120 are set to the same value as the terminal voltage Vsen within the specified range for the image sensor 100.

[0100] Figure 8 is a graph showing an example of the relationship between the change in current consumption and the change in terminal voltage of the image sensor 100 in an imaging unit 43 according to one embodiment. The horizontal axis of the graph represents time [s], and the vertical axis represents the terminal voltage V2 [V] and current consumption [A] of the image sensor 100. In the graph, the upper limit and lower limit of the specified voltage mentioned above are shown as dashed straight lines, respectively.

[0101] When a normal current α = I2 + I1 [A] flows into the image sensor 100, the terminal voltage V2 drops by the amount by which the output voltage V1 of the first power supply circuit 320 is dropped across the contact resistance r1 of the connectors 180 and 182 and the transmission resistance r2 of the second flexible substrate 260, i.e., I1(2r1 + r2) [V] (the voltage after the drop is V1α = V1 - I1(2r1 + r2)). However, the LDO 441 of the second power supply circuit 440 generates a differential voltage I1(2r1 + r2) [V] to compensate for the drop, i.e., I1(2r1 + r2) (boosting V2α). In other words, the output voltage V2' of the LDO 441 of the second power supply circuit 440 is maintained such that {V1 - I1(2r1 + r2)} + I1(2r1 + r2) = V2 = Vsen.

[0102] Even when a large current β=I2+I1[A] flows into the image sensor 100, the LDO441 of the second power supply circuit 440 generates a differential voltage I1(2r1+r2) (in this case, the voltage on the mounting board 120 after the output voltage V1 of the first power supply circuit 320 drops is V1β=V1-I1(2r1+r2)). In this way, the DCDC321 of the first power supply circuit 320 attempts to maintain a constant output voltage V1 of the first power supply circuit 320 in response to fluctuations in the current I1 through a small feedback loop on the board 62. Meanwhile, the LDO441 of the second power supply circuit 440 also maintains its output voltage V2′=V2=Vsen through its internal feedback circuit. In other words, the LDO441 of the second power supply circuit section 440 constantly adjusts the output voltage (by boosting V2β) to compensate for the differential voltage I1(2r1+r2), thereby stabilizing the terminal voltage V2 (=Vsen).

[0103] The imaging unit 43 according to the above embodiment also has the same effects as the embodiment described with reference to Figures 1 to 4. The second power supply circuit 440 can also be interpreted as supplying an additional current (I2) to the image sensor 100 when the image sensor 100 requires a second current amount (I1+I2) that is greater than the first current amount (I1) supplied from the first power supply circuit 320, similar to the second power supply circuit 410 in other embodiments. It can also be said that the imaging unit 43 according to this embodiment has a configuration that stabilizes the terminal voltage V2 of the image sensor 100 by the power supply circuits of the substrate 62 and the mounting substrate 120, respectively, without using feedback information such as a signal output by the detection unit 190 of the imaging unit 40 when it detects a voltage drop in the terminal voltage Vsen.

[0104] Furthermore, according to the imaging unit 43 of this embodiment, since the voltage feedback of the output voltage Vdcdc of the DCDC321 in the first power supply circuit section 320 is performed on the substrate 62, the feedback loop system can be made smaller compared to the case where voltage feedback is performed across the mounting substrate 120, making the DCDC321 more resistant to disturbances and stabilizing the DCDC321 itself.

[0105] Figure 9 is a schematic circuit diagram of an imaging unit 44 according to one embodiment. The imaging unit 44 of this embodiment has the same configuration as the imaging unit 43 described with reference to Figures 7 and 8. Unlike the imaging unit 43, the imaging unit 44 includes a first power supply circuit 330 that includes a resistive element 331 with resistance value R, instead of the first power supply circuit 320.

[0106] In the imaging unit 44, the current is roughly adjusted by the resistor element 331 of the first power supply circuit section 330 to supply a current Im = (Vin - Vout) / R to the image sensor 100. Vin is the positive power supply voltage of the power supply unit 53. Let Is be the current consumed by the image sensor 100.

[0107] In the imaging unit 44, if the current consumption of the image sensor 100 increases and the amount of current supplied to the image sensor 100 from the first power supply circuit 330 on the substrate 62 becomes insufficient, the LDO of the second power supply circuit 450 on the mounting substrate 120 compensates for the insufficient current I = Is - Im, thereby controlling the terminal voltage V2 of the image sensor 100 to a constant level. In this way, the LDO of the second power supply circuit 450 on the mounting substrate 120 normally receives current from the first power supply circuit 330 on the substrate 62, and therefore stabilizes the terminal voltage V2 by supplying only a small amount of current. On the other hand, if the amount of current supplied to the image sensor 100 from the first power supply circuit 330 on the substrate 62 becomes insufficient, the LDO compensates for the insufficient current while still receiving the current supply. Therefore, according to the imaging unit 44 of this embodiment, the generation of heat in the LDO can be significantly reduced compared to when the LDO does not receive the current supply, and consequently, thermal noise can be prevented from degrading the imaging performance of the image sensor 100.

[0108] Figure 10 is a schematic circuit diagram of an imaging unit 45 according to one embodiment. In this embodiment, unlike the embodiment described using Figures 1 to 4, the power supply unit 53 in the imaging unit 45 additionally includes a measurement line in which a measuring resistor element 55 is connected in parallel to the second power supply circuit section 460, and a voltage measurement section 56 for measuring the voltage drop across the measuring resistor element 55. The power supply unit 53 further includes a calculation section 57 for calculating the leakage current from the image sensor 100. The configuration of the second power supply circuit section 460 is the same as that of the second power supply circuit section 410 shown in Figure 4, and includes a resistor element 461 and a switch element 462.

[0109] When the second power supply circuit 460 does not supply additional current to the image sensor 100, that is, when the switch element 462 is OFF, the calculation unit 57 puts the image sensor 100 into a non-operating state and has the voltage measurement unit 56 measure the voltage drop across the measuring resistor element 55. Based on the measurement result of the voltage drop and the resistance value of the resistor element 55, the calculation unit 57 calculates the leakage current from the image sensor 100.

[0110] The calculation unit 57 may further determine whether the image sensor 100 is a good product or a defective product based on the calculated leakage current value. For example, the calculation unit 57 may determine the image sensor 100 to be a defective product if the calculated leakage current value is greater than a predetermined value, and determine the image sensor 100 to be a good product if it is less than or equal to that value.

[0111] The imaging unit 45 according to the above embodiment also has the same effects as the embodiment described with reference to Figures 1 to 4.

[0112] In the above-described embodiments, the first power supply circuit and the second power supply circuit may both be mounted on a mounting board, both may be mounted on a power supply board, or one may be mounted on a mounting board and the other on a power supply board.

[0113] An imaging unit may have around 10 different power supply circuits mounted on it, and among them are power supply circuits that should be mounted on the mounting board, such as analog power supply circuits. For example, the pixel power supply that supplies power to drive the pixel circuits of the image sensor is preferably mounted on the board on which the image sensor is mounted in order to suppress noise caused by fluctuations in the power supply from affecting the signal to the pixel system.

[0114] Therefore, in imaging units according to multiple embodiments, the arrangement of the first power supply circuit section and the second power supply circuit section on the mounting board and the power supply board may differ depending on the type of power supply circuit. For example, if the power supply circuit is susceptible to noise, a regulator such as an LDO may be placed on the mounting board to reduce noise interference. For example, if the power supply circuit is a digital system, there is relatively more headroom even if noise affects it, so a regulator such as a DCDC converter may be placed on the power supply board. Note that when both the first power supply circuit section and the second power supply circuit section are mounted on the mounting board of the imaging unit, the power supply board may be considered an independent component not included in the imaging unit.

[0115] In the above embodiments, a camera including a lens unit and a camera body was described as an example of an imaging device. However, an imaging device does not necessarily have to include a lens unit. For example, a camera body is an example of an imaging device. Furthermore, the term "imaging device" is a concept that includes not only interchangeable-lens imaging devices such as single-lens reflex cameras, but also non-interchangeable-lens imaging devices.

[0116] The term "imaging unit" may also refer to the ASIC and power supply unit, among other components. Additionally, the term "imaging unit" may also refer to the first flexible substrate and the second flexible substrate, either additionally or alternatively.

[0117] Although the present invention has been described above using embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It will be apparent to those skilled in the art that various modifications or improvements can be made to the above embodiments. It will be clear from the claims that such modified or improved forms may also be included in the technical scope of the present invention.

[0118] It should be noted that the execution order of operations, procedures, steps, and stages in the apparatus, systems, programs, and methods shown in the claims, specifications, and drawings is not explicitly stated as "before," "prior to," etc., and that these can be implemented in any order unless the output of a previous process is used in a later process. Even if the operation flow in the claims, specifications, and drawings is described using phrases such as "first," "next," etc. for convenience, it does not mean that it is essential to perform the operations in that order. [Explanation of Symbols]

[0119] 10 Camera, 20 Lens unit, 22 Optical axis, 30 Camera body, 31 Housing, 40, 41, 42, 43, 44, 45 Imaging unit, 100 Image sensor, 101 Imaging area, 102 Peripheral area, 104 Processing circuit, 105 Transmission circuit, 107 Transmitter, 110 Bonding wire, 120 Mounting board, 111 First main surface, 112 Second main surface, 121 First layer, 122 Second layer, 131 Via, 132 Insulator, 138 Aperture, 180, 182, 184 Connector, 185 Bypass capacitor group, 187 Circuit group, 190 Detection unit, 201, 211 Solder resist layer, 202, 204, 212, 214 Wiring layer, 203, 205, 213, 215 Insulation layer, 207 Core layer, 210, 220, 230 Adhesive part, 240 Bonding pad, 140 Frame, 141 First surface, 142 Second surface, 143 Third surface, 144 Fourth surface, 145 Fifth surface, 146 Sixth surface, 147 Positioning hole, 148 Mounting hole, 149 Screw, 150 Bracket, 160 Cover glass, 250 First flexible substrate, 260 Second flexible substrate, 261 Signal line, 262 Power line, 263 Ground line, 60 Board unit, 62 Board, 51 MPU, 52 ASIC, 53 Power supply unit, 54 Sequence circuit, 55 Resistor element, 56 Voltage measurement unit, 57 Calculation unit, 88 Display unit, 310, 320, 330 First power supply circuit unit, 311 LDO, 312, 325 Capacitor, 321 DCDC, 322 Coils, 323, 324, 331 Resistor elements, 410, 420, 430, 440, 450, 460 Second power supply circuit section, 411, 461 Resistor elements, 412, 462 Switch elements, 421, 431, 441 LDO, 442 Capacitor

Claims

1. An image sensor that captures the subject, A first power supply circuit unit for supplying a predetermined voltage to the image sensor, A second power supply circuit supplies current to the image sensor so that the voltage supplied from the first power supply circuit becomes the predetermined voltage, A control circuit unit that controls whether or not to supply the current from the second power supply circuit unit to the image sensor based on the operation of the image sensor. Equipped with, When a mode for continuous shooting is selected for the image sensor, the control circuit unit controls the supply of the current from the second power supply circuit unit to the image sensor. Imaging unit.

2. An image sensor that captures the subject, A first power supply circuit unit for supplying a predetermined voltage to the image sensor, A second power supply circuit supplies current to the image sensor so that the voltage supplied from the first power supply circuit becomes the predetermined voltage, A control circuit unit that controls whether or not to supply the current from the second power supply circuit unit to the image sensor based on the operation of the image sensor. Equipped with, The control circuit unit controls whether or not to supply the current from the second power supply circuit unit to the image sensor based on a mode related to continuous shooting in which the subject is continuously photographed. Imaging unit.

3. In the imaging unit according to claim 2, When the mode selected for the image sensor to perform continuous shooting is selected, the control circuit unit controls the supply of the current from the second power supply circuit unit to the image sensor. Imaging unit.

4. In the imaging unit according to any one of claims 1 to 3, When the control circuit unit supplies the current to the image sensor from the second power supply circuit unit, it outputs a control signal to the second power supply circuit unit to cause the current to be supplied to the image sensor. Imaging unit.

5. In the imaging unit according to any one of claims 1 to 4, An imaging unit comprising a first mounting substrate having a first surface on which the image sensor is mounted, and a second surface opposite to the first surface on which electronic components electrically connected to the image sensor are mounted.

6. In the imaging unit according to claim 5, The first power supply circuit is mounted on the second surface of the first mounting board. Imaging unit.

7. In the imaging unit according to claim 5 or claim 6, An imaging unit comprising a second mounting board electrically connected to the first mounting board and on which the second power supply circuit section is mounted.

8. In the imaging unit according to claim 7, The control circuit unit is mounted on the second mounting board. Imaging unit.

9. In the imaging unit according to claim 7 or claim 8, The second mounting board is electrically connected to the first mounting board via a flexible board. Imaging unit.

10. In the imaging unit according to claim 9, The first mounting board has a connector mounted on it that is electrically connected to the flexible board. The connector is located on the second surface of the first mounting board. Imaging unit.

11. In the imaging unit according to any one of claims 5 to 10, The first mounting substrate is a multilayer core substrate having a first layer including a first wiring that is electrically connected to at least one of the image sensor and the electronic component, a second layer including a second wiring that is electrically connected to at least one of the image sensor and the electronic component, and a core layer formed of one of the metal member and the resin member. Imaging unit.

12. In the imaging unit according to any one of claims 5 to 11, An imaging unit comprising a frame arranged on the first surface of the first mounting substrate so as to surround the image sensor.

13. In the imaging unit according to claim 12, The frame has at least one of a metal member and a resin member. Imaging unit.

14. In the imaging unit according to claim 12 or claim 13, The frame is fixed to the first mounting board with adhesive. Imaging unit.

15. In the imaging unit according to any one of claims 12 to 14, An imaging unit comprising a light-transmitting substrate fixed to the frame, which together with the first mounting substrate and the frame forms a space for housing the image sensor.

16. An imaging apparatus comprising an imaging unit according to any one of claims 1 to 15.

17. In the imaging device according to claim 16, An imaging device comprising a mounting portion for attaching a lens unit having an optical system for emitting light to the image sensor.

18. In the imaging apparatus according to claim 16 or claim 17, An imaging device comprising a generation unit that is electrically connected to the imaging unit and generates image data.

19. In the imaging device according to any one of claims 16 to 18, An imaging apparatus comprising a power supply unit that supplies power to the aforementioned imaging unit.

Images