Plasma processing equipment

JP2026063599APending Publication Date: 2026-04-13USHIO INC
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-10-01
Publication Date
2026-04-13

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Abstract

The present invention provides a plasma processing apparatus that enhances the uniformity of the plasma-containing gas ejection amount in the direction of the plasma ejection opening extension. [Solution] The plasma processing apparatus comprises: (a) a gas introduction section for introducing a raw material gas into the interior of the plasma processing apparatus; (b) a flow velocity suppressor for suppressing the flow velocity of the raw material gas introduced from the gas introduction section; (c) a gas distribution channel having a plurality of gas distribution ports for distributing the raw material gas that has passed through the flow velocity suppressor to the plurality of gas distribution ports; (d) a plasma generation space and a plurality of branch pipes connecting each of the plurality of gas distribution ports to the plasma generation space; (e) a pair of electrodes arranged to sandwich the plasma generation space; and (f) an opening for ejecting plasma-containing gas.
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