Birefringence measuring device, wafer evaluation method and wafer

Abstract

The present invention provides a birefringence measuring device, a wafer evaluation method, and a wafer that can measure a physical quantity reflecting the magnitude of birefringence of an object under test with high accuracy and speed. [Solution] The birefringence measuring device comprises a first hollow-axis pulse motor 11 which is cylindrical and has a first hollow axis 19 with one end facing a first collimating lens 13 in the direction of the cylindrical axis, i.e., the optical axis OX direction, and a first condensing lens 14 and a polarizer 15 fixed to the other end; a second hollow-axis pulse motor 21 which is cylindrical and has a second hollow axis 29 with an analyzer 22 and a second collimating lens 23 fixed to one end in the direction of the optical axis OX, and the other end facing a second condensing lens 24, and whose cylindrical axis is arranged to coincide with the optical axis OX together with the cylindrical axis of the first hollow axis 19; and a control unit 50 which controls the first hollow-axis pulse motor 11 and the second hollow-axis pulse motor 12 so that the first hollow axis 19 and the second hollow axis 29 rotate synchronously around the optical axis OX.

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