Coil components

JP2026084649APending Publication Date: 2026-05-21SAMSUNG ELECTRO MECHANICS CO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date
2025-07-04
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing coil components face issues with vibration resistance and bonding failure between the lead frame and the coil, which affect the bonding strength with the substrate during substrate mounting.

Method used

A coil component design featuring grooves on the body to accommodate lead wires and lead frames, with a specific ratio of groove length to lead frame length, ensuring the lead frames are partially or fully outside the body, and incorporating anchor portions for improved fixation.

Benefits of technology

Enhances vibration resistance and bonding strength with the substrate, minimizing magnetic material volume loss and improving electrical properties.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention provides a coil component with improved vibration resistance and reduced poor bonding between the lead frame and the coil. [Solution] In the coil component, the body includes a first surface 101 and a second surface 102 facing in the first direction (X direction), a third surface 103 and a fourth surface 104 facing in the second direction (Y direction), and a fifth surface 105 and a sixth surface 106 facing in the third direction (Z direction). Grooves R331 and R332 are formed on at least one of the first, second, third, and fourth surfaces, and the coil contains a magnetic material. The coil includes a wound portion arranged inside the body and lead wires 331 and 332, each having a groove in at least a portion of it. A first lead frame 400 and a second lead frame 500 connected to the lead wires are arranged on the body so as to be spaced apart in the first direction. When the length of the groove along the third direction is a and the length of the lead frame along the third direction is b, the ratio a / b satisfies 0.042 or more and 0.502 or less.
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Description

Technical Field

[0001] The present invention relates to a coil component.

Background Art

[0002] An inductor, which is one type of coil component, is a typical passive electronic component used in electronic devices together with a resistor and a capacitor.

[0003] Recently, the market for high-current power inductors has been increasing in fields such as AI, electrical equipment, and robots. In particular, against the backdrop of increases in the operating current, voltage, etc. of electronic devices, the importance of the efficiency of inductor elements has been on the rise.

[0004] Medium and large-sized power inductors are generally composed of a magnetic body, a coil, and a lead frame. The lead frame forms an "L"-shaped electrode through a bending process and forms an etching on the surface of the magnetic body where the lead frame is to be placed, so that the lead frame is recessed into the surface of the magnetic body without a step.

Summary of the Invention

Problems to be Solved by the Invention

[0005] One object of the present invention is to provide a coil component with improved vibration resistance and capable of improving the bonding failure between the lead frame and the coil.

[0006] Another object of the present invention is to provide a coil component that can easily ensure the bonding strength with a substrate during substrate mounting.

Means for Solving the Problems

[0007] One embodiment of the present invention provides a coil component comprising a body containing a magnetic material, a coil including a winding portion disposed within the body and lead wires, at least a portion of which are disposed in the grooves, the body being disposed on the body so as to be spaced apart in the first direction and connected to the lead wires, and where a is the length of the grooves along the third direction and b is the length of the lead frames along the third direction, the ratio of a / b being 0.042 or more and 0.502 or less.

[0008] Another embodiment of the present invention provides a coil component comprising a body having grooves formed on one surface and containing a magnetic material, a coil including a winding portion disposed within the body and lead wires, at least a portion of which are disposed in the grooves, and a lead frame disposed on one surface of the body and including an inner surface that contacts the lead wires and an outer surface that faces the inner surface, wherein the inner surface of the lead frame is co-plane with one surface of the body or is located outside the body. [Effects of the Invention]

[0009] One effect of the present invention is to provide a coil component with improved electrical properties by minimizing the volume loss of the magnetic material.

[0010] One effect of the present invention is to provide a coil component that makes it easier to ensure bonding strength with the substrate during mounting. [Brief explanation of the drawing]

[0011] [Figure 1] This is a perspective view showing a coil component according to the first embodiment of the present invention. [Figure 2] This figure shows the lead frame and lead wires. [Figure 3] This is a perspective view showing the main body of Figure 1 before the lead frame is bent. [Figure 4]This is a view of the coil component in Figure 1 from the Z direction. [Figure 5] This figure shows a cross-section along the line I-I' in Figure 1. [Figure 6] This is a perspective view showing a coil component according to a second embodiment of the present invention. [Figure 7] Figure 6 is a perspective view showing the main body. [Figure 8] Figure 6 shows the coil component viewed from the Z direction. [Figure 9] This figure shows a cross-section along the line II-II' in Figure 6. [Figure 10] This figure shows a modified version of Figure 8. [Figure 11] This is a perspective view showing a coil component according to a third embodiment of the present invention. [Figure 12] Figure 11 shows the coil component viewed from the Z direction. [Figure 13] This figure shows one modified example of Figure 11. [Figure 14] This figure shows another modified example of Figure 11. [Modes for carrying out the invention]

[0012] The terminology used in this application is used solely to describe specific embodiments and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, terms such as “includes” or “having” are intended to specify the existence of features, figures, stages, actions, components, parts, or combinations thereof described in the specification, and should be understood not to preemptively exclude the possibility of the existence or addition of one or more other features, figures, stages, actions, components, parts, or combinations thereof. Throughout the specification, “above” means located above or below the part in question, and does not necessarily mean located above the direction of gravity.

[0013] Note that the term "coupling" does not only mean physical direct contact between components in the contact relationship between components, but is used as a concept that includes cases where other components are interposed between components and the components are in contact with different components respectively.

[0014] The size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited to what is shown.

[0015] <( In the drawings, the X direction can be defined as the first direction or the length direction, the Y direction can be defined as the second direction or the width direction, and the Z direction can be defined as the third direction or the thickness direction.

[0016] Hereinafter, the coil component according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. When describing with reference to the accompanying drawings, the same or corresponding components are given the same drawing numbers, and redundant descriptions thereof are omitted.

[0017] Various types of electronic components are used in electronic devices, and various types of coil components can be appropriately used between such electronic components for the purpose of noise removal or the like.

[0018] That is, the coil component in an electronic device can be used for a power inductor, a high-frequency inductor, a general bead, a GHz bead, a common mode filter, or the like.

[0019] (First Embodiment) FIG. 1 is a perspective view showing a coil component according to a first embodiment of the present invention, FIG. 2 is a view showing a lead frame and lead wires of FIG. 1, FIG. 3 is a perspective view showing the main body of FIG. 1 before bending the lead frame, FIG. 4 is a view of the coil component of FIG. 1 seen from the Z direction, and FIG. 5 is a view showing a cross section taken along the line I-I' of FIG. 1.

[0020] Referring to Figure 1, a coil electronic component according to one embodiment of the present invention includes a body 100 containing a magnetic material, a coil 300 disposed within the body 100, and lead frames 400 and 500 disposed on the body 100 so as to be spaced apart in a first direction.

[0021] The main body 100 has the overall appearance of the coil component 1000 according to this embodiment, and the coil 300 is embedded inside.

[0022] The main body 100 can be formed in the shape of a hexahedron overall. Using Figure 1 as a reference, the main body 100 includes a first face 101 and a second face 102 that face each other in the first direction (X direction), a third face 103 and a fourth face 104 that face each other in the second direction (Y direction), and a fifth face 105 and a sixth face 106 that face each other in the third direction (Z direction). Each of the first face 101, second face 102, fifth face 105, and sixth face 106 of the main body 100 corresponds to the side surface of the main body 100 that connects the third face 103 and the fourth face 104 of the main body 100.

[0023] The main body 100 may be formed such that the coil component 1000 according to this embodiment, on which the lead frames 400 and 500 described later are formed, has a length of 4.0 mm and a width of 4.0 mm, or it may have a length of 5.0 mm and a width of 5.0 mm, or it may have a length of 6.0 mm and a width of 6.0 mm, or it may have a length of 13.0 mm and a width of 13.0 mm, but it is not limited to these. The sizes of the coil component 1000 according to this embodiment described above are merely illustrative, and cases where it is formed in sizes other than those described above are not excluded from the scope of the present invention.

[0024] A groove R is formed on at least one of the first surface 101, second surface 102, third surface 103, and fourth surface 104 of the main body 100. The groove R can accommodate the lead wires 331 and 332 of the coil 300, which will be described later. On the other hand, the groove R does not need to accommodate the lead frames 400 and 500, which will be described later.

[0025] The lead frames 400 and 500 are folded downwards at the sides of the main body 100, and typically the folded lead frames are housed in grooves formed on the outer surface of the main body with a certain width and depth. However, in such cases, the volume of the magnetic material decreases by the volume of the grooves formed on the outer surface of the main body, which may degrade the electrical properties of coil components such as inductance and isat.

[0026] In contrast, the coil component 1000 according to this embodiment has grooves R formed on the outer surface of the main body that are large enough to accommodate the lead wires 331 and 332 of the coil 300, thereby minimizing the loss of magnetic material.

[0027] The groove R may be recessed inward from the outer surface of the main body. Referring to Figure 3, the groove R may include a bottom surface parallel to the outer surfaces 101, 102, and 103 of the main body, and two sides connecting the outer surfaces 101, 102, and 103 to the bottom surface.

[0028] The length (width, a) of the groove R along the third direction (Z direction) may be between 0.21 mm and 2.51 mm. As described later, the width a of the groove R may be smaller than the width b of the lead frames 400 and 500. By forming a groove R with a width a smaller than the width b of the lead frames 400 and 500 on the outer surface of the main body, magnetic material loss can be minimized, and the electrical characteristics of the coil component can be improved.

[0029] The depth of groove R may be 0.2 mm or less. The depth of groove R may be substantially the same as the thickness of lead wires 331 and 332.

[0030] The groove R may include a first groove R331 and a second groove R332 that are spaced apart in a first direction (X direction) on the third surface 103 of the main body. At least a portion of the first lead wire 331, which will be described later, may be placed in the first groove R331. Similarly, at least a portion of the second lead wire 332, which will be described later, may be placed in the second groove R332.

[0031] The first groove R331 can be formed on the first surface 101 of the main body. The first groove R331 can extend from the third surface 103 of the main body to the first surface 101, forming an "L" shape. Similarly, the second groove R332 may be formed on the second surface 102 of the main body. The second groove R332 can extend to the second surface 102 of the main body, forming an "L" shape.

[0032] The main body 100 may contain a magnetic material. The main body 100 can be formed by filling a mold with a magnetic material, or by filling a mold with a composite material containing a magnetic material and an insulating resin. A molding process in which high temperature and high pressure are applied to the magnetic material or composite material in the mold may be carried out further, but is not limited thereto.

[0033] The magnetic material contained in the main body 100 may, for example, be ferrite or metallic magnetic powder.

[0034] The ferrite powder may be at least one of the following, for example: spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn; hexagonal ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co; garnet-type ferrites such as Y-type; and Li-based ferrites.

[0035] The metallic magnetic powder may contain one or more elements selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu), and nickel (Ni). For example, the metallic magnetic powder may be at least one of the following: pure iron powder, Fe-Si alloy powder, Fe-Si-Al alloy powder, Fe-Ni alloy powder, Fe-Ni-Mo alloy powder, Fe-Ni-Mo-Cu alloy powder, Fe-Co alloy powder, Fe-Ni-Co alloy powder, Fe-Cr alloy powder, Fe-Cr-Si alloy powder, Fe-Si-Cu-Nb alloy powder, Fe-Ni-Cr alloy powder, or Fe-Cr-Al alloy powder.

[0036] The metallic magnetic powder may be amorphous or crystalline. For example, the metallic magnetic powder may be an Fe-Si-B-Cr amorphous alloy powder, but is not necessarily limited to this.

[0037] The ferrite and metallic magnetic powders may each have an average diameter of approximately 0.1 μm to 30 μm, but are not limited to this.

[0038] The main body 100 may contain two or more types of magnetic materials. Here, "different types of magnetic materials" means that at least one of the following characteristics of the magnetic materials—diameter, composition, crystallinity, and shape—is distinguishable from one another. For example, the main body 100 may contain two or more magnetic powders with different diameters.

[0039] The insulating resin may contain, but is not limited to, epoxy, polyimide, liquid crystal polymer, etc., either alone or in combination.

[0040] The main body 100 may include a core 110. The core 110 may refer to a part of the main body 100 that penetrates the coil 300, which will be described later. The core 110 may be located in the inner region of the coil 300 that forms at least one turn, and its cross-section may be circular or elliptical.

[0041] The coil 300 is placed inside the main body 100 and exhibits the characteristics of a coil component. For example, when the coil component 1000 according to this embodiment is used as a power inductor, the coil 300 can stabilize the power supply of electronic equipment by storing the electric field in a magnetic field and maintaining the output voltage.

[0042] The coil 300 may include a winding portion 310 that forms at least one turn around the core 110, and lead wires 331 and 332 that are connected to the lead frame described below.

[0043] Referring to Figures 1 and 5, the winding section 310 can form multiple turns from the core 110 toward the outside of the body 100 along the first direction (X direction) and third direction (Z direction) of the body 100. The winding section 310 may be arranged parallel to the third surface 103 of the body, and the winding axis of the winding section 310 may be formed parallel to the second direction (Y direction).

[0044] The winding section 310 may be wound in an overall circular or elliptical shape, and a core 110 may be placed in the center.

[0045] The first lead wire 331 and the second lead wire 332 are connected to both ends of the winding section 310 and can be connected to the first lead frame 400 and the second lead frame 500, respectively.

[0046] Referring to Figure 4, the first lead wire 331 and the second lead wire 332 may be positioned, at least in part, in grooves R331 and R332 of the main body. The first lead wire 331 and the second lead wire 332 can contact the bottom and side surfaces of the first groove R331 and the second groove R332.

[0047] As described above, the first groove R331 is formed on the first surface 101 and the third surface 103 of the main body 100, and the first lead wire 331 can be formed along the first groove R331 formed on the first surface 101 and the third surface 103 of the main body 100. The second groove R332 is formed on the second surface 102 and the third surface 103 of the main body 100, and the second lead wire 332 can be arranged along the second groove R332 formed on the second surface 102 and the third surface 103 of the main body 100.

[0048] The coil 300 may be an air-core coil, may be composed of metal wire (MW) with a circular cross-section, or may be composed of a rectangular coil, but is not limited to these.

[0049] The coil 300 can be formed by winding conductive metal, and the remaining portion, excluding the portion in contact with the lead frames 400 and 500 described later, can be coated with an insulating film. Specifically, the coil 300 can be formed by spirally winding a metal wire (MW), such as a copper wire (Cu-wire), which includes a metal wire and an insulating film covering the surface of the metal wire.

[0050] Referring to Figures 1 to 5, the lead frames 400 and 500 are arranged on the third surface 103 of the main body 100 and serve as external electrodes for the coil component according to this embodiment.

[0051] The lead frames 400 and 500 may include a first lead frame 400 positioned on the first surface 101 and the third surface 103 of the main body 100, and a second lead frame 500 positioned on the second surface 102 and the third surface 103 of the main body 100. The first lead frame 400 is connected to the first lead wire 331 of the main body 100, and the second lead frame 500 is connected to the second lead wire 332.

[0052] The following explanation will be based on the first lead frame 400, but the same content can be applied to the second lead frame 500, and since detailed information may overlap, the explanation regarding the second lead frame 500 will be omitted.

[0053] The first lead frame 400 may include a side portion 410 located on the first surface 101 and a bottom portion 420 located on the third surface 103.

[0054] The first lead frame 400 may include an inner surface and an outer surface facing the main body. Specifically, the side portion 410 includes an inner surface facing the first surface 101 and an outer surface facing the inner surface, and the inner surface of the side portion 410 can contact the first lead wire 331. Similarly, the bottom portion 420 includes an inner surface facing the third surface 103 and an outer surface facing the inner surface, and the inner surface of the bottom portion 420 can contact the second lead wire 332. That is, the first lead wire 331 may be positioned inside the main body 100 beyond the side portion 410 and the bottom portion 420. This prevents stresses and other forces generated on the mounting surface of the substrate from being directly transmitted to the lead wire 331, thereby realizing a coil component with high vibration resistance.

[0055] Referring to Figures 4 and 5, the cross-sectional area of ​​the first lead wire 331 may be rectangular. Furthermore, the first lead wire 331 can extend along the inner surface of the first lead frame 400 to the third surface 103 of the main body. In this case, since the first lead wire 331 is surface-joined with the first lead frame 400, the lead wire and lead frame can have a T-beam shape. This allows for efficient distribution of stress applied to the lead wire 331 due to vibration, resulting in a coil component with high vibration resistance.

[0056] The first lead frame 400 does not have to be located inside the first groove R331. Referring to Figure 5, the lower surface portion 420 of the first lead frame 400 does not have to be located inside the first groove R331. Similarly, the side portion 410 of the first lead frame 400 does not have to be located inside the first groove R331.

[0057] Referring to Figures 4 and 5, the inner surface of the first lead frame 400 can be in contact with the outer surface of the main body.

[0058] Unlike the first lead wire 331, the first lead frame 400 is not positioned in the first groove R331 of the main body 100, and the lead frame protrudes beyond the outer surface of the main body 100. This allows for the formation of a gap between the component and the main body during substrate mounting, making it easier to perform underfill to ensure the adhesion strength between the substrate and the chip. Furthermore, since there is no need to form a groove R331 with a size equal to the width b and thickness of the lead frame, the volume loss of the magnetic material can be minimized.

[0059] The length (width, b) of the first lead frame 400 along the third direction (Z direction) may be 1.8 mm or more and 5.0 mm or less.

[0060] As mentioned above, the length (width, a) of the groove R along the third direction (Z direction) may be between 0.21 mm and 2.51 mm, so a / b can satisfy the range of 0.042 to 0.502. Within the above range of a / b, the volume of the magnetic material of the main body can be increased by as little as 0.8% and as much as 1.8%, improving the electrical characteristics of the coil component. If a / b is less than 0.042, the bonding strength between the lead frame and the lead wire may be weakened. If a / b exceeds 0.502, the size of the groove R becomes excessively large, and it becomes impossible to minimize the volume loss of the magnetic material.

[0061] The length (width, a) of the groove R along the third direction (Z direction) can be measured using the groove R formed on the third surface 103 of the main body 100 as a reference. As shown in Figure 3, the value of a can be determined by measuring the distance between the two ends of the groove R formed on the third surface 103 of the main body 100 that are separated in the third direction (Z direction). As an example, samples can be taken from five equally spaced points on the cross section of the coil component in the second direction (Y direction) - third direction (Z direction). In each sample, the minimum value of the length of the line segment parallel to the third direction (Z direction) that connects the two outermost boundary lines facing each other in the third direction (Z direction) of the groove R331 can be defined as a. Alternatively, a can also mean the arithmetic mean of the lengths of the line segments in each sample.

[0062] The length (width, b) of the first lead frame 400 along the third direction (Z direction) can be measured with reference to the bottom surface 420. Specifically, the length of the bottom surface 420 in the third direction (Z direction) can be measured as shown in Figure 5, and the value of b can be determined.

[0063] As an example, samples can be taken from five equally spaced points on the cross-section of the coil component in the second direction (Y direction) and third direction (Z direction). In each sample, the minimum value of the length of the line segment parallel to the third direction (Z direction) that connects the two outermost boundary lines facing each other in the third direction (Z direction) of the lower surface portion 420 can be defined as b. Alternatively, b can also represent the arithmetic mean of the line segment lengths in each sample.

[0064] The lead frames 400 and 500 may further include anchor portions 430 and 530. The anchor portion 430 is located inside the main body 100 and can serve to improve the fixing strength between the lead frame 400 and the main body 100. In one embodiment, the anchor portions (430 and 530) may include at least one projection having an "L" shape to further improve the fixing strength. In another embodiment, a portion of the lead wire 331 (or 332) may be placed in an internal groove of the anchor portion of the lead frame 400 (or 500). Here, a portion of the lead wire 331 (or 332) may be further placed in a groove formed on the inner surface of the side portion 410 (or 510). The first lead frame 400 may have a structure that extends to the first surface 101 of the main body via the anchor portion 430 and is bent to the lower surface of the main body via the side portion 420 and the lower surface portion 430.

[0065] The lead frames 400 and 500 can contain metals such as copper (Cu), silver (Ag), palladium (Pd), and nickel (Ni), and are not limited to any conductive metal. Although not shown in the figures, metal layers may also be formed on the inner and outer surfaces of the lead frames 400 and 500. The metal layers are for joining the lead wires 331 and 332 and the lead frames 400 and 500, and can be formed by processes such as dipping and soldering. The metal layers 440 and 540 can contain nickel (Ni), tin (Sn), copper (Cu), etc., and can be constructed in multiple layers.

[0066] The coil 300 and lead frames 400 and 500 according to the present invention can be joined as follows.

[0067] Prepare lead frames 400 and 500 and coil 300, respectively. At this time, the insulating film formed on the lead wires of the coil can be removed in order to join them with the lead frames 400 and 500. The lead wires 331 and 332 of the coil from which the insulating film has been removed can be rolled, and the rolled lead wires of the coil may have a rectangular cross-section as described above. The thickness of the rolled lead wires 331 and 332 may be 0.15 mm to 0.2 mm.

[0068] Subsequently, the lead frames 400, 500 and lead wires 331, 332 are surface-joined using a metal layer through processes such as dipping and soldering. The joined lead frames 400, 500 and lead wires 331, 332 have a T-beam shape.

[0069] (Second Embodiment) Figure 6 is a perspective view showing a coil component according to a second embodiment of the present invention, Figure 7 is a perspective view showing the main body of Figure 6, Figure 8 is a view of the coil component of Figure 6 from the Z direction, and Figure 9 is a view showing a cross-section along the line II-II' of Figure 6.

[0070] The coil component 2000 according to the second embodiment differs in the arrangement of the lead frames 400 and 500 compared to the first embodiment.

[0071] The following describes the coil component according to the second embodiment, focusing on the differences compared to the first embodiment.

[0072] Referring to Figure 7, the coil component 2000 according to the second embodiment may have a third groove R410 and a fourth groove R510 formed on the first surface 101 and the second surface 102 of the main body for accommodating the lead frames 400 and 500.

[0073] Referring to Figures 8 and 9, at least a portion of the side portion 410 of the first lead frame may be located in the third groove R410. That is, the inner surface of the side portion 410 of the lead frame may be located inside the first surface 101 of the main body 100. Similarly, at least a portion of the side portion R510 of the second lead frame may be located in the fourth groove R510. That is, the inner surface of the side portion 510 of the lead frame may be located inside the second surface 102 of the main body 100.

[0074] On the other hand, the outer surface of the side portion 410 can be in the same plane as the first surface 101 of the main body 100.

[0075] In contrast, the third groove R410 and the fourth groove R510 do not need to be formed on the third surface 103 of the main body 100. This allows the lower surfaces 420 and 520 of the lead frame to protrude beyond the third surface 103 of the main body in order to facilitate underfilling when mounting the coil components onto the substrate.

[0076] A first groove R331 may be formed at the center of the third groove R410, recessed inward from the third groove into the main body. Similarly, a second groove R332 may be formed at the center of the fourth groove R510, recessed inward from the fourth groove into the main body. As described above in the first embodiment, lead wires 331 and 332 can be placed in the first groove and the second grooves R331 and R332.

[0077] The first lead frame 400 does not need to be placed in the first groove R331. Similarly, the second lead frame 500 does not need to be placed in the second groove R332.

[0078] Figure 10 shows a modified version of Figure 8.

[0079] Referring to Figure 10, grooves do not need to be formed on the first surface 101 and the second surface 102 of the main body in this modified example. Therefore, the lead wires 331 and 332 can extend along the sides 101 and 102 of the main body to the underside of the main body. Similarly, the side portions 410 and 510 of the lead frame can protrude from the sides 101 and 102 of the main body.

[0080] Descriptions of other configurations are the same as in the first embodiment and are therefore omitted.

[0081] (Third embodiment) Figure 11 is a perspective view showing a coil component according to a third embodiment of the present invention, and Figure 12 is a view of the coil component of Figure 11 from the Z direction.

[0082] Referring to Figure 11, the coil component 3000 according to the third embodiment has different heights for the lead wires 331 and 332 compared to the first embodiment.

[0083] The lead wires 331 and 332 of the coil component 3000 according to the third embodiment may have a low-center terminal structure formed in the same area as, or lower than, the center line in the second direction (Y direction) of the third surface 103 and fourth surface 104 of the main body.

[0084] Referring to Figure 12, lead wires 331 and 332 are positioned in grooves R331 and R332 of the main body, and lead frames 400 and 500 protrude beyond the outer surface of the main body 100.

[0085] Figure 13 shows a modified example of Figure 11.

[0086] Referring to Figure 13, the side portions 410 and 510 of the lead frames 400 and 500 may be positioned inward from the outer surface of the main body. As described above in the second embodiment, grooves R410 and R510 for accommodating the lead frames 400 and 500 can be formed on the first surface 101 and the second surface 102 of the main body.

[0087] Figure 14 shows another modified example of Figure 11.

[0088] Referring to Figure 14, grooves do not need to be formed on the first surface 101 and the second surface 102 of the main body. Therefore, the lead wires 331 and 332 can extend along the sides 101 and 102 of the main body to the underside of the main body. Similarly, the side portions 410 and 510 of the lead frame can protrude from the sides 101 and 102 of the main body.

[0089] Although one embodiment of the present invention has been described above, any person with ordinary skill in the art can modify and change the present invention in various ways, such as by adding, changing, or deleting components, without departing from the spirit of the invention as described in the claims, and this can also be said to be within the scope of the rights of the present invention. [Explanation of Symbols]

[0090] 1000, 2000, 3000: Coil parts 100: Main unit 300: Coil 310: Winding section 331, 332: Lead wires 400, 500: Lead frame 410, 510: Side part 420, 520: Bottom part 430, 530: Anchor section R331, R332: First groove and second groove R410, R510: Third groove and fourth groove

Claims

1. A body comprising a first and second surface facing a first direction, a third and fourth surface facing a second direction, and a fifth and sixth surface facing a third direction, wherein a groove is formed on at least one of the first, second, third, and fourth surfaces, and containing a magnetic material, A coil including a winding portion and lead wires, at least a portion of which are arranged in the groove, located within the main body, It includes a first lead frame and a second lead frame, which are arranged on the main body so as to be spaced apart in the first direction and connected to the lead wires, Let a be the average length of the groove along the third direction, and let b be the average length of the lead frame along the third direction. A coil component in which the ratio a / b satisfies 0.042 or more and 0.502 or less.

2. The coil component according to claim 1, wherein the a is 0.21 mm or more and 2.51 mm or less.

3. The coil component according to claim 1, wherein b is 1.8 mm or more and 5.0 mm or less.

4. The coil component according to claim 1, wherein the groove includes a first groove and a second groove spaced apart in the first direction on the third surface of the main body.

5. The coil component according to claim 4, wherein the first groove extends to the first surface of the main body, and the second groove extends to the second surface of the main body.

6. The coil component according to claim 1, wherein the groove includes a first groove formed on the first surface of the main body and a second groove formed on the second surface of the main body.

7. The first lead frame and the second lead frame include an inner surface facing the third surface of the main body, The coil component according to claim 1, wherein the lead wires are in contact with the inner surfaces of the first lead frame and the second lead frame.

8. The coil component according to claim 7, wherein the inner surfaces of the first lead frame and the second lead frame are in contact with the third surface of the main body or are located outside the main body.

9. The coil component according to any one of claims 1 to 8, wherein the first lead frame and the second lead frame cover the lead wire and are not arranged in the groove.

10. The first lead frame includes a side portion located on the first surface of the main body and a bottom portion located on the third surface of the main body. The coil component according to any one of claims 1 to 8, wherein the second lead frame includes a side portion disposed on the second surface of the main body and a bottom portion disposed on the third surface of the main body.

11. The side portion of the first lead frame includes an inner surface facing the first surface of the main body, The inner surface of the side portion of the first lead frame is in contact with the first lead wire. The side portion of the second lead frame includes an inner surface facing the second surface of the main body, The coil component according to claim 10, wherein the inner surface of the side portion of the second lead frame is in contact with the second lead wire.

12. At least a portion of the first lead wire is placed in a groove formed on the inner surface of the side portion of the first lead frame. The coil component according to claim 11, wherein at least a portion of the second lead wire is arranged in a groove formed on the inner surface of the side surface of the second lead frame.

13. The first lead frame includes an anchor portion that is positioned inside the main body and covers the first lead wire. The coil component according to any one of claims 1 to 8, wherein the second lead frame includes an anchor portion disposed inside the main body and covering the second lead wire.

14. At least a portion of the first lead wire is placed in the internal groove of the anchor portion of the first lead frame, The coil component according to claim 13, wherein at least a portion of the second lead wire is arranged in an internal groove of the anchor portion of the second lead frame.

15. A third groove is formed on the first surface of the main body. A fourth groove is formed on the second surface of the main body. At least a portion of the side surface of the first lead frame is positioned in the third groove. The coil component according to claim 10, wherein at least a portion of the side surface of the second lead frame is disposed in the fourth groove.

16. In the center of the third groove, a first groove is formed that is recessed inward from the third groove into the main body. In the center of the fourth groove, a second groove is formed that is recessed inward from the fourth groove into the main body. The coil component according to claim 15, wherein at least a portion of the lead wires are arranged in the first groove and the second groove.

17. A groove is formed on one side, and the main body contains a magnetic material, A coil including a winding portion and lead wires, at least a portion of which are arranged in the groove, located within the main body, The lead frame includes an inner surface that is arranged on one side of the main body and contacts the lead wire, and an outer surface that faces the inner surface, The inner surface of the lead frame is either in contact with one surface of the main body or located outside the main body, and is a coil component.

18. The coil component according to claim 17, wherein the lead frame covers the lead wire and is not housed in the groove.

19. The main body includes a first surface and a second surface facing in the first direction, and a third surface and a fourth surface facing in the second direction. The lead frame includes a first lead frame and a second lead frame that are spaced apart in the first direction from the main body. The coil component according to claim 17, wherein the groove is formed on the third surface of the main body.

20. The groove includes a first groove and a second groove spaced apart in the first direction on the third surface of the main body. The first groove extends to the first surface of the main body, The coil component according to claim 19, wherein the second groove extends to the second surface of the main body.