Method for peeling and method for manufacturing a metal-resin bond

Abstract

The present invention provides a method for easily separating the resin component of a metal-resin joint from the metal component, and a method for manufacturing a metal-resin joint using the separated metal component. [Solution] The resin member 10 of the metal-resin joint 30, which is formed by joining the resin bonding surface 12 of a thermoplastic resin resin member 10 to the metal bonding surface 22 of a metal member 20 provided with an anchor portion 24, is peeled off the metal member 20 while heated to a temperature lower than the melting point of the thermoplastic resin constituting the resin member 10. The resin member 10 is then peeled off the metal member 20. The resin bonding surface 12 of a new resin member 10 is joined to the metal bonding surface 22 of the metal member 20 from which the resin member 10 has been peeled off to manufacture a metal-resin joint 30.

Description

Technical Field

[0001] The present invention relates to a peeling method and a method for manufacturing a metal resin bonded body.

Background Art

[0002] The technology of bonding a resin member to a metal member enables replacement of a part of a metal part with resin and is very important for weight reduction of parts (see, for example, Patent Document 1 below). When recycling a metal resin bonded body in which a resin member is bonded to a metal member, it is desirable that the metal member and the resin member can be easily separated.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present invention has been made in view of the above points, and in a metal resin bonded body in which a resin bonding surface of a resin member is bonded to a metal bonding surface of a metal member, a peeling method capable of easily peeling the resin member of the metal resin bonded body from the metal member, and a manufacturing method for manufacturing a metal resin bonded body by reusing the metal member from which the resin member has been peeled are provided as problems.

Means for Solving the Problems

[0005] According to the present embodiment, the following aspects [1] to [4] are provided.

[0006] [1] A peeling method for peeling the resin member of a metal resin bonded body in which a resin bonding surface of a resin member made of a thermoplastic resin is bonded to a metal bonding surface of a metal member provided with an anchor portion from the metal member in a state where the resin member is heated to a temperature lower than the melting point of the thermoplastic resin constituting the resin member.

[0007] [2] The peeling method according to [1] above, wherein the temperature of the resin member when peeling the resin member from the metal member is equal to or greater than the load deflection temperature of the thermoplastic resin constituting the resin member when a load of 1.8 MPa is applied.

[0008] [3] A method for manufacturing a metal-resin joint, comprising joining the resin bonding surface of a new resin member to the metal bonding surface of the metal member from which the resin member has been peeled off by the peeling method of [1] or [2] above.

[0009] [4] A method for manufacturing a metal-resin joint according to [3] above, wherein the metal bonding surface of the metal member from which the resin member has been peeled off is heated by induction heating, and the resin bonding surface of a new resin member is bonded to it. [Effects of the Invention]

[0010] In this invention, the resin component of a metal-resin joint can be easily peeled off from the metal component. Furthermore, the metal component from which the resin component has been peeled off can be used again as a joint component, thereby reducing costs. [Brief explanation of the drawing]

[0011] [Figure 1] Cross-sectional view showing the schematic structure of a metal-resin joint, in which the metal bonding surface of a metal component is joined to the resin bonding surface of a resin component. [Figure 2] This figure shows a schematic configuration of a bonding apparatus used in a method for manufacturing a metal-resin bond according to one embodiment of the present invention. [Modes for carrying out the invention]

[0012] One embodiment of the present invention will be described below with reference to the drawings.

[0013] (1) Metal-resin bonded body 30 First, the metal-resin bond 30 to which the peeling method of this embodiment is applied will be described. As shown in Figure 1, the metal-resin bond 30 comprises a resin member 10 made of thermoplastic resin and a metal member 20 made of metal.

[0014] One surface of the resin member 10 is a resin bonding surface 12 that is joined to the metal member 20. One surface of the metal member 20 is a metal bonding surface 22 that is joined to the resin bonding surface 12 of the resin member 10. The metal-resin joint 30 is formed by joining the resin bonding surface 12 of the resin member 10 and the metal bonding surface 22 of the metal member 20.

[0015] (2) Resin member 10 The resin member 10 is a component formed by molding a thermoplastic resin into a predetermined shape such as a block, plate, or wire. The resin member 10 may also be a coating film of thermoplastic resin or an adhesive layer made of thermoplastic resin. Specific examples of thermoplastic resins that constitute the resin member 10 include polypropylene resin (PP resin), polyacetal resin (POM resin), polyphenylene sulfide resin (PPS resin), polyether ether ketone resin (PEEK), acrylonitrile / butadiene / styrene resin (ABS resin), polyethylene resin (PE resin), polybutylene terephthalate resin (PBT resin), polyamide resin such as nylon 66 (PA66) (PA resin), epoxy resin, liquid crystal polymer (LCP resin), modified polyphenylene ether resin (modified PPE), and reactor-type flexible polypropylene resin (metallocene-type reactor TPO resin). Furthermore, the resin member 10 may be a carbon fiber reinforced thermoplastic resin (CFRTP) in which carbon fibers are compounded into the thermoplastic resin described above, or a thermoplastic resin in which reinforcing materials such as glass fibers and talc, as well as flame retardants, degradation inhibitors, and elastomer components are compounded into the thermoplastic resin described above.

[0016] (3) Metal member 20 The metal member 20 is a member formed by shaping metal into a predetermined shape such as a block, plate, or wire. The metal constituting the metal member 20 is not particularly limited, and various metals can be used. For example, copper (Cu), iron (Fe), aluminum (Al), titanium (Ti), nickel (Ni), chromium (Cr), etc. can be used as the metal constituting the metal member 20. Further, the metal member 20 may be composed of an alloy consisting of two or more metals such as a copper alloy, an iron alloy (steel material), an aluminum alloy, stainless steel, a titanium alloy, a nickel alloy, a chromium alloy, etc.

[0017] The shape of the metal member 20 can be a desired shape according to its use etc. Any method can be applied as the forming method of the metal member 20, and casting in which molten metal etc. is poured into a mold of a desired shape, cutting by a machine tool etc., punching by a press machine etc. may be used.

[0018] On the metal bonding surface 22 of the metal member 20, a roughening treatment is performed and an anchor portion 24 having an uneven shape is formed. As the roughening treatment for forming the anchor portion 24, various methods such as laser light irradiation, chemical etching, press working etc. can be adopted. For example, in the present embodiment, as the roughening treatment, while linearly moving (scanning) the irradiation position of the laser light in a predetermined direction, pulsed laser light is irradiated onto the metal bonding surface 22, so that an anchor portion 24 extending linearly in the predetermined direction is formed at the portion irradiated with the laser light.

[0019] (4) Peeling method Next, a peeling method for peeling the resin member 10 of the metal - resin bonded body 30 from the metal member 20 will be described.

[0020] To peel the resin member 10 from the metal member 20, while heating the resin member 10 of the metal - resin bonded body 30 to a peeling temperature set to a predetermined temperature, the peripheral portion of the resin member 10 is pulled in a direction away from the metal member 20 to peel the resin member 10 from the metal member 20.

[0021] The heating of the resin member 10 to the peeling temperature may be performed by exposing the entire metal-resin joint 30 to a high-temperature atmosphere. Alternatively, the resin joint surface 12 of the resin member 10 may be heated to the peeling temperature by heating the metal joint surface 22 by induction heating. The peeling temperature is the temperature of the portion of the resin member 10 that is not in contact with the metal member 20, measured by a non-contact radiation thermometer when the resin member 10 is peeled from the metal member 20.

[0022] When peeling the resin member 10 from the metal member 20, it is preferable to peel the resin member 10 from the entire peripheral edge of the resin member 10 toward the opposing peripheral edge that faces the entire peripheral edge across the central portion of the resin member 10.

[0023] When the anchor portion 24 extending linearly in a predetermined direction is formed on the metal joint surface 22 as in the present embodiment, it is preferable to peel the resin member 10 from the entire peripheral edge of the resin member 10 toward the opposing peripheral edge along the linearly extending anchor portion 24.

[0024] The peeling temperature, which is the temperature when peeling the resin member 10 from the metal member 20, is preferably a temperature equal to or higher than the load deflection temperature Tf when a load of 1.8 MPa is applied to the thermoplastic resin constituting the resin member 10. Further, the peeling temperature is preferably a temperature equal to or lower than the melting point of the thermoplastic resin constituting the resin member 10. When the resin member 10 is made of a resin in which a reinforcing material such as carbon fiber, glass fiber, or talc is blended with a thermoplastic resin, the load deflection temperature Tf when a load of 1.8 MPa is applied to the thermoplastic resin constituting the resin member 10 is the load deflection temperature Tf when a load of 1.8 MPa is applied to the thermoplastic resin not containing the reinforcing material.

[0025] In this specification, the temperature of deflection Tf of a thermoplastic resin is the temperature of deflection when a load of 1.8 MPa is applied, as measured by the method conforming to JIS K7191. Typical temperatures of deflection Tf when a load of 1.8 MPa is applied to thermoplastic resins are 57-65°C for polypropylene resin, 66-68°C for nylon 66, 58°C for polybutylene terephthalate resin, and 105°C for polyphenylene sulfide resin.

[0026] Furthermore, in this specification, the melting point Tm of thermoplastic resins is the value measured using a differential scanning calorimeter at a heating rate of 10°C per minute, in accordance with JIS K7121. Typical melting points of thermoplastic resins are 168°C for polypropylene resin, 265°C for nylon 66, 232-267°C for polybutylene terephthalate resin, and 280°C for polyphenylene sulfide resin.

[0027] (5) Method for manufacturing the metal-resin bond 30 The metal-resin bonded body 30 is obtained by performing a bonding process in which the resin bonding surface 12 of the resin member 10 is bonded to the metal bonding surface 22 of the metal member 20. The metal member 20 used in the bonding process may be a metal member 20 obtained by peeling the resin member 10 off the metal-resin bonded body 30 using the peeling method described above, or it may be a new metal member 20 to which the resin member 10 has not been bonded before. Furthermore, if the metal member 20 used in the joining process is a metal member 20 obtained by peeling the resin member 10 from the metal-resin joint 30 by the peeling method described above, the resin member 10 to be joined to this metal member 20 may be a new resin member 10 made of the same resin material as the peeled resin member 10, a new resin member 10 made of a different resin material than the peeled resin member 10, or a new resin member 10 made of the same type of resin material but with different molecular weight, additives, etc., and a different grade.

[0028] In this embodiment, a joining process is performed using a joining device 50 as shown in Figure 2, and a resin joining surface 12 is joined to a metal joining surface 22 to manufacture a metal-resin joined body 30.

[0029] The joining device 50 includes a stage 51 on which the metal member 20 is placed, a heating device 52 for induction heating the metal member 20 placed on the stage 51, a press device 53 for pressurizing the resin member 10 to the metal member 20, and a control device 60 for controlling the heating device 52 and the press device 53.

[0030] The heating device 52 is equipped with an induction heating coil connected to a power supply unit (not shown). When a command is received from the control device 60 and a drive power is input from the power supply unit, the induction heating coil generates a magnetic field to induce heating of the metal bonding surface 22 of the metal member 20 placed on the stage 51.

[0031] The heating device 52 is equipped with a temperature sensor 56 that measures the temperature of the metal bonding surface 22 of the metal member 20 placed on the stage 51. The temperature of the metal bonding surface 22 detected by the temperature sensor 56 is input to the control device 60. Based on the temperature detected by the temperature sensor 56, the control device 60 controls the output of the heating device 52 so that the temperature of the metal bonding surface 22 reaches a predetermined temperature.

[0032] In this embodiment, the temperature sensor 56 is a non-contact type radiation thermometer that measures the temperature of the portion of the induction heating coil of the heating device 52 that is close to the resin member 10. The correlation between the temperature sensor 56 and a thermocouple placed between the resin bonding surface 12 and the metal bonding surface 22 has been investigated in advance. That is, with a thermocouple placed between the resin bonding surface 12 and the metal bonding surface 22, the temperature sensor 56 and the thermocouple are measured while the metal bonding surface 22 is heated by the heating device 52, and the correlation between the temperatures measured by the temperature sensor 56 and the thermocouple has been investigated. The temperature sensor 56 takes the thermocouple temperature, which is estimated based on the correlation with the thermocouple from its measurement results, as the temperature of the metal bonding surface 22.

[0033] The press device 53 includes a rod 54 made of an insulator such as ceramics, a pressurizing unit 55 that moves the rod 54 to press the resin member 10 against the metal member 20, and a pressure sensor 57 that detects the pressure acting on the resin member 10 when the rod 54 presses the resin member 10 against the metal member 20.

[0034] As shown in Figure 2, the rod 54 may be inserted into the hollow portion of the induction heating coil of the heating device 52 and positioned to face the resin member 10.

[0035] The pressurizing unit 55 includes a servo motor capable of varying the pressurizing force, a pneumatic cylinder controlled by an electro-pneumatic regulator, and a spring-type pressurizer. The pressurizing unit 55 can receive commands from the control device 60 and control the speed and position at which the resin member 10 moves together with the rod 54, as well as the pressure applied when the resin member 10 is pressed against the metal member 20.

[0036] The pressure sensor 57 detects the pressure acting on the resin member 10 when the resin member 10 comes into contact with the metal member 20 and pressurizes the metal member 20, and inputs the detected pressure to the control device 60. Based on the detected pressure input from the pressure sensor 57, the control device 60 controls the output of the pressurizing section 55 of the press device 53 so that the pressure acting on the resin member 10 becomes a predetermined pressure.

[0037] The control device 60 is equipped with a computer and is connected to the heating device 52, the pressing device 53, the temperature sensor 56, and the pressure sensor 57.

[0038] The control device 60 controls the operation of the heating device 52 and the pressing device 53 according to the detection results of the temperature sensor 56 and the pressure sensor 57 and a predetermined program, thereby joining the resin bonding surface 12 to the metal bonding surface 22 placed on the stage 51 and integrating the metal member 20 and the resin member 10.

[0039] To manufacture the metal-resin bonded body 30 using the bonding device 50, the metal member 20 is placed on the stage 51 such that the metal bonding surface 22, on which the anchor portion 24 is provided, faces the resin member 10 that will be set later. Next, the resin bonding surface 12 is positioned opposite the metal bonding surface 22 of the metal member 20 placed on the stage 51. As shown in Figure 2, in this embodiment, the resin member 10 is positioned so that the resin bonding surface 12 is in contact with the metal bonding surface 22.

[0040] Next, the heating device 52 is positioned so as to face the metal bonding surface 22 of the metal member 20, with the resin member 10 in between. In the case shown in Figure 2, the heating device 52 is positioned above the resin member 10, and the resin member 10 is positioned between the heating device 52 and the metal member 20.

[0041] Next, the metal bonding surface 22 is induced and heated to a predetermined temperature by the heating device 52, thereby heating the resin bonding surface 12 in contact with the metal bonding surface 22 to a predetermined temperature. Furthermore, with the metal bonding surface 22 and the resin bonding surface 12 heated by the heating device 52, the metal member 20 and the resin member 10 are pressurized to a predetermined pressure.

[0042] Specifically, the control device 60 supplies power to the heating device 52, generating a magnetic field from the induction heating coil provided in the heating device 52 to heat the metal bonding surface 22 of the metal member 20. At that time, the control device 60 adjusts the power supply supplied to the heating device 52 and the position of the induction heating coil provided in the heating device 52 so that the temperature T of the metal bonding surface 22 detected by the temperature sensor 56 becomes a predetermined temperature. The temperature T of the metal bonding surface 22 can be above the melting point Tm of the thermoplastic resin constituting the resin member 10 and below the decomposition temperature of the thermoplastic resin (i.e., below the temperature at which the thermoplastic resin begins to vaporize). Preferably, the temperature T is set to a temperature 20°C lower or lower than the decomposition temperature of the thermoplastic resin. More preferably, the temperature T is set to a temperature 20°C lower or lower than the decomposition temperature of the thermoplastic resin constituting the resin member 10 and 20°C higher or lower than the melting point Tm of the thermoplastic resin (Tm ≤ T ≤ Tm + 20°C).

[0043] As the metal member 20 is heated as described above, the press device 53 moves the rod 54 to press the resin member 10 against the metal member 20, pressurizing the resin member 10 and the metal member 20 so that the pressure detected by the pressure sensor 57 reaches a predetermined pressure. In this way, the press device 53 brings the resin bonding surface 12 into contact with the metal bonding surface 22 which has been heated to a predetermined temperature, and pressurizes the resin member 10 and the metal member 20 with a predetermined pressure.

[0044] Then, when the press device 53 pressurizes the resin member 10 and the metal member 20 at a predetermined pressure for a predetermined time, the heating by the heating device 52 and the pressurizing by the press device 53 are stopped, and the joining process is completed.

[0045] Then, once the resin member 10 and the metal member 20 have cooled down to a predetermined temperature, the metal-resin joint 30, in which the resin member 10 is joined to the metal member 20, is removed from the joining device 50.

[0046] (6) Effects In this embodiment, the resin member 10 of the metal-resin joint 30 can be softened and peeled off the metal member 20 by heating it to a temperature lower than the melting point of the thermoplastic resin constituting the resin member 10. As a result, the resin member 10 can be peeled off the metal member 20 with little force without breaking during peeling, and less of the resin member 10 remains on the anchor portion 24 of the metal member 20 from which the resin member 10 has been peeled off, making it easy to peel the resin member 10 from the metal member 20. Since there is little resin member 10 remaining on the anchor portion 24 after the resin member 10 has been peeled off, a metal-resin joint 30 with high bonding strength can be obtained when the metal member 20 from which the resin member 10 has been peeled off is rejoined with a new resin member 10.

[0047] Even if the metal-resin joint 30 is such that in a tensile shear test in accordance with ISO 19095, the resin member 10 breaks before the resin member 10 delaminates from the metal bonding surface 22 of the metal member 20, the resin member 10 can be delaminated from the metal member 20 without breaking the resin member 10.

[0048] Furthermore, in this embodiment, if the temperature of the resin member 10 when it is peeled off the metal member 20 is above the load deflection temperature of the thermoplastic resin constituting the resin member 10 when a load of 1.8 MPa is applied, the resin member 10 can be peeled off with even less force, and less of the resin member 10 will remain on the anchor portion 24 of the metal member 20 from which the resin member 10 has been peeled off.

[0049] Furthermore, in this embodiment, the resin member 10 can be reused by re-bonding a new resin member 10 to the metal member 20 from which the resin member 10 has been peeled off, thereby reducing the cost of the metal-resin joint 30.

[0050] Furthermore, as in this embodiment, when joining the resin bonding surface 12 of a new resin member 10 to the metal bonding surface 22 of the metal member 20 from which the resin member 10 has been peeled off, the metal bonding surface 22 is heated by induction heating. Therefore, even if the resin material of the peeled resin member 10 is adhering to the anchor portion 24, it is melted by the induction heating of the metal bonding surface 22, and the resin bonding surface 12 of the new resin member 10 can be firmly bonded to the metal bonding surface 22.

[0051] (7) Examples Examples and comparative examples of the present invention will be described below. However, the present invention is not limited to these examples.

[0052] In the examples and comparative examples, a micro-Yb fiber laser with a laser output of 50W and a wavelength of 1064nm was irradiated onto a processing area (5mm x 10mm) on the surface of a metal member to form anchor sections with grooves of 5mm in length at a predetermined pitch on the metal bonding surface. A resin member was then bonded to the metal bonding surface with the anchor sections to produce a metal-resin joint (test piece). The laser conditions for irradiating the metal component vary depending on the metal material constituting the component. However, the laser frequency and feed rate were adjusted within the range of 50-100 kHz and 100-1000 mm / s respectively so that the groove formed in the anchor portion had a width of 40 μm and a depth of 80 μm. The groove pitch in the anchor portion was set to 0.1 mm for Cu, 0.1 mm for Al, and 0.2 mm for SUS304, depending on the metal material constituting the component.

[0053] The conditions of the laser beam irradiated onto the metal bonding surface, the dimensions of the metal members, the dimensions of the synthetic resin members, the bonding area (overlap area) between the synthetic resin members and the metal members, and the details of the metal and resin members in the examples and comparative examples are as follows. The metal and resin members used are shown in Tables 1 and 2. Note that the load deflection temperature Tf of PPS2 resin and PBT resin when a load of 1.8 MPa is applied below is the load deflection temperature Tf of thermoplastic resin without fiber reinforcement when a load of 1.8 MPa is applied. • Dimensions of the metal component: 18mm x 45mm x 1.6mm • Dimensions of the synthetic resin component: 10mm x 40mm x 3.0mm • Bonding area between metal and synthetic resin components: 10mm x 5mm • PPS resin: DIC Corporation PPS FZ2100 (unreinforced) (temperature of deflection under load Tf: 110℃, melting point Tm: 280℃) • PPS2 resin: DIC Corporation PPS Z230Black (glass fiber reinforced) (temperature of deflection under load Tf: 110℃, melting point Tm: 280℃) • PBT resin: Trecon (registered trademark) 1101G-X54 (glass fiber reinforced) (temperature of deflection under load Tf: 60℃, melting point Tm: 224℃) • Cu: Pure copper C1100, which has been heated to above the melting point of Cu (1084°C) in 1 second by laser irradiation, and then oxidized and roughened. • Al: A1050 with an anodized surface treatment • SUS304: SUS304 whose surface has been heated to above its melting point of 1450°C for 1 second by laser irradiation, and then oxidized and roughened. The load required to separate the resin component from the metal component (peel strength) was measured for the obtained metal-resin joint. Then, a new resin component was bonded to the metal joint surface of the metal component from which the resin component had been separated to create a new metal-resin joint, and the rebonding strength of the created metal-resin joint was measured.

[0054] (a) Peel strength With the metal-resin bond heated to the peeling temperatures shown in Tables 1 and 2, the resin member was pulled using a tensile testing machine (Shimadzu Corporation, Autograph AGX-V), and the load at which the resin member of the metal-resin bond peeled off from the metal member was measured as the peeling strength. In each of Examples 1 to 36, the resin member was peeled off while the metal-resin bond was heated. Examples 1 to 3, 10 to 12, and 19 to 21 are examples where the resin member was heated to a temperature below the deflection temperature Tf when a 1.8 MPa load was applied to the thermoplastic resin constituting the resin member, while Examples 4 to 9, 13 to 18, and 22 to 27 are examples where the resin member was heated to a temperature below the melting point of the thermoplastic resin, which was above the deflection temperature Tf when a 1.8 MPa load was applied to the thermoplastic resin constituting the resin member.

[0055] Comparative Examples 1-9 are examples in which the resin component was peeled off at room temperature (25°C) without heating the metal-resin bond, while Comparative Examples 10-18 are examples in which the resin component was peeled off while heated to a temperature higher than the melting point of the thermoplastic resin constituting the resin component.

[0056] (b) Rejoining strength A metal-resin joint was obtained by re-bonding a new resin component made of the same resin material as the debonded resin component to the metal bonding surface of a metal component from which a resin component had been debonded. For the obtained metal-resin joint, the bonding strength was measured using a tensile testing machine (Shimadzu Corporation, Autograph AGX-V) at a tensile speed of 10 mm / min and a measurement temperature of 25°C, with the dimensions of the metal component, the dimensions of the synthetic resin component, and the bonding area between the synthetic resin component and the metal component changed as described above, and other conditions conforming to the same standard.

[0057] The results are shown in Tables 1 and 2.

[0058] [Table 1] [Table 2] In Examples 1-18 and 22-27, where the thermoplastic resin constituting the resin component was heated to a temperature lower than its melting point, the peel strength was lower and the re-bonding strength was higher compared to Comparative Examples 1-6 and 10-18, which were not heated. Furthermore, in Examples 19-21, where the resin component was made of PBT and the peeling temperature was below the deflection temperature when a load of 1.8 MPa was applied, the peeling strength was the same as in Comparative Examples 7-9, where the peeling temperature was room temperature, but the re-bonding strength was greater than in Comparative Examples 7-9. From this, it was found that in Examples 19-21, less resin component remained on the anchor portion of the metal component after peeling compared to Comparative Examples 7-9. In Examples 4-9, 13-18, and 22-27, where the thermoplastic resin constituting the resin component was heated above its deflection temperature under a 1.8 MPa load, the peel strength was even lower and the re-bonding strength was even higher. In Comparative Examples 10-18, the resin component fractured before it could be separated from the metal component, preventing separation. [Explanation of Symbols]

[0059] 10...Resin component, 12...Resin bonding surface, 20...Metal component, 22...Metal bonding surface, 24...Anchor part, 30...Metal-resin joint

Claims

1. A peeling method for a metal-resin joint, in which the resin bonding surface of a resin member made of thermoplastic resin is bonded to the metal bonding surface of a metal member provided with an anchor portion, is peeled off the metal member while heated to a temperature lower than the melting point of the thermoplastic resin constituting the resin member, thereby separating the resin member from the metal member.

2. The peeling method according to claim 1, wherein the temperature of the resin member when peeling the resin member from the metal member is equal to or greater than the load deflection temperature of the thermoplastic resin constituting the resin member when a load of 1.8 MPa is applied.

3. A method for manufacturing a metal-resin joint, comprising joining the resin bonding surface of a new resin member to the metal bonding surface of a metal member from which the resin member has been peeled off by the peeling method of claim 1 or 2, thereby producing a metal-resin joint.

4. A method for manufacturing a metal-resin joint according to claim 3, wherein the metal bonding surface of the metal member from which the resin member has been peeled off is heated by induction heating, and the resin bonding surface of a new resin member is bonded to it to produce a metal-resin joint.

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