Setup determination device and setup determination method

Abstract

This reduces the number of trolleys and parts required for external setup, thereby making the setup changeover process more efficient. [Solution] The setup determination device includes an external setup group generation unit that generates multiple external setup groups for performing external setup, where the parts supply is placed when the parts supply cart is not connected to the parts mounting device, between productions of different types of substrates; and a setup data generation unit that generates and outputs, for each setup group, external setup data for supplying parts to the parts supply cart and internal setup data for supplying parts to the parts supply cart by swapping the parts supply in at least one slot of multiple slots when the parts supply cart is connected to the parts mounting device, and the setup data generation unit generates internal setup data when it determines that the number of slots in which parts supply is swapped in one internal setup is less than or equal to a threshold.

Description

Technical Field

[0004] , , , ,

[0005] , , , , ,

[0001] The present disclosure relates to a setup determination device and a setup determination method.

Background Art

[0002] In Patent Document 1, in a component mounting line in which a plurality of component mounting devices to which component supply carts on which a plurality of component supply means for supplying components can be arranged are detachably connected, a group determination method for dividing a plurality of types of mounting substrates to be produced into a plurality of groups in which the arrangement of the component supply means in the component mounting device is common is disclosed. The group determination method calculates the external setup work time required for the external setup work of arranging the component supply means used in the group to be produced next in the group being produced on the component mounting line on the component supply cart removed from the component mounting line, and calculates the production completion time when the production of all the mounting substrates to be produced is completed in consideration of the external setup work time, and determines the group so that the production completion time is shortened.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In view of the above-described conventional circumstances, the present disclosure has been devised, and an object thereof is to provide a setup determination device and a setup determination method that reduce the number of carts required for external setup and the number of components for external setup, and improve the efficiency of the setup change process.

Means for Solving the Problems

[0005] This disclosure provides a setup determination device that can communicate with a component mounting device on which a component supply cart having a plurality of slots on which component supplies used for the production of multiple types of substrates can be placed, comprising: an external setup group generation unit that generates a plurality of external setup groups for which external setup is performed between the production of different types of substrates, in which component supplies are placed in at least one slot of the plurality of slots when the component supply cart is not connected to the component mounting device; and a setup data generation unit that generates and outputs, for each external setup group, data for the external setup in which component supplies are supplied to the component supply cart, and data for the internal setup in which component supplies are supplied to the component supply cart by replacing the component supplies in at least one slot of the plurality of slots when the component supply cart is connected to the component mounting device, wherein the setup data generation unit generates the internal setup data when it determines that the number of slots on which the component supplies are replaced in one internal setup is less than or equal to a threshold.

[0006] Furthermore, this disclosure provides a setup determination method performed by a setup determination device that can communicate with a component mounting device to which a component supply cart having a plurality of slots on which component supplies used for the production of multiple types of substrates can be placed, wherein the setup determination device generates a plurality of external setup groups in which external setup is performed between the production of different types of substrates, in which the component supplies are placed in at least one slot of the plurality of slots when the component supply cart is not connected to the component mounting device, and generates and outputs for each external setup group data for supplying the component supplies to the component supply cart and internal setup data for supplying the component supplies to the component supply cart by replacing the component supplies in at least one slot of the plurality of slots when the component supply cart is connected to the component mounting device, wherein the internal setup data is generated when it is determined that the number of slots on which the component supplies are replaced in one internal setup is less than or equal to a threshold. [Effects of the Invention]

[0007] According to this disclosure, the number of trolleys required for external setup and the number of parts used for external setup can be reduced, making the setup changeover process more efficient. [Brief explanation of the drawing]

[0008] [Figure 1] A top-down view of the interior of the floor where the component mounting system according to the embodiment is located. [Figure 2] Diagram illustrating a component mounting line according to an embodiment. [Figure 3] A top view of the component mounting device according to the embodiment. [Figure 4] Figure 3 shows a cross-section of the component mounting device, from the base to the table, along the AA cross-section line. [Figure 5] Diagram showing an example of the internal configuration of the management computer according to the embodiment. [Figure 6] A flowchart showing an example of the setup data generation procedure for the management computer according to the embodiment. [Figure 7] This diagram shows an example of setup data when no internal setup settings are configured. [Figure 8] This diagram shows an example of setup data when internal setup settings are present. [Modes for carrying out the invention]

[0009] (Background leading to this disclosure) Patent Document 1 enables a reduction in the production cycle time using a batch exchange unit by reducing the time required for external setup work by workers to place parts on the parts supply cart and by selecting the combination that results in the shortest production cycle time.

[0010] Here, we will explain the man-hours required for setup changes (hereinafter referred to as "setup man-hours"). Even for experienced workers, changing a single carrier tape (component) requires 1 to 2 minutes of setup man-hours. In particular, external setup, which is performed on carts that are not connected to component mounting equipment between board production runs, requires significantly more setup man-hours than internal setup, which is performed on carts that are connected to component mounting equipment and require the board production group to be completed. This is because external setup involves loading many of the carrier tapes (components) necessary for the production of board groups containing multiple different types of boards onto carts connected to each of the component mounting equipment (e.g., 10 or 20 carts). Furthermore, because external setup requires a large amount of setup man-hours, if external setup is performed by a small number of workers, an increase in the number of external setups can lead to longer downtimes on the production line, which can significantly impact the overall production efficiency of the entire factory or floor, thus necessitating a larger workforce.

[0011] Therefore, there is a need to improve the overall efficiency of setup in the production of multiple types of circuit boards by changing some of the carrier tapes (components) that were previously replaced in the conventional external setup process between or during circuit board production to an internal setup process performed on a trolley connected to the component mounting equipment. In the conventional internal setup process, the operator manually planned the setup by comparing the external setup data for multiple types of circuit boards. As a result, the number of internal setups planned by the operator was arbitrary, and the number of components subject to internal setup tended to increase. Consequently, the conventional setup changeover was sometimes inefficient from the perspective of the overall production efficiency of circuit boards on the floor.

[0012] In addition, in actual circuit board production, the production order of circuit boards is not always predetermined. In such cases, workers would request a changeover that could be used even if the production order of circuit boards was arbitrary, in order to determine the next circuit board to be produced based on the actual production status.

[0013] The following describes in detail the various embodiments of the setup determination apparatus and setup determination method disclosed herein, with reference to the drawings as appropriate. However, unnecessary details may be omitted. For example, detailed explanations of already well-known matters and redundant explanations of substantially identical configurations may be omitted. This is to avoid the following explanation becoming unnecessarily verbose and to facilitate understanding by those skilled in the art. The accompanying drawings and the following explanation are provided to enable those skilled in the art to fully understand this disclosure and are not intended to limit the subject matter described in the claims.

[0014] Herein, the terms used in the following description are illustrative and not intended to limit the scope. For example, the term "carrier tape" includes components that are contained in and supplied by this carrier tape. While this disclosure describes an example of supplying components using a carrier tape, the components may also be supplied by a tray feeder.

[0015] Furthermore, the term "external setup" used in the following explanation refers to setup performed on a trolley that is not connected to a component mounting device, in which one or more carrier tapes are placed in or replaced in each of the multiple slots on the trolley. The term "internal setup" refers to setup performed on a trolley that is connected to a component mounting device, in which one or more carrier tapes are placed in or replaced in each of the multiple slots on the trolley.

[0016] Figure 1 is a top view of the interior of floor F where the component mounting system 1 according to the embodiment is located. The component mounting system 1 according to the embodiment is a system that performs a solder printing process for printing solder onto a circuit board, a printing inspection process for inspecting printing defects of the solder printed on the circuit board, a component mounting process for mounting components onto the circuit board after solder printing, a mounting inspection process for inspecting the components mounted on the circuit board, and a reflow process for reflowing the solder printed on the circuit board.

[0017] The component mounting system 1 according to the embodiment includes a plurality of component mounting lines L1, L2, L3, a communication network 2, a management computer 3, a setup work support device 4, and each of a plurality of carts S1, S2, S3, S4, … (an example of a component supply cart). In FIG. 1, an example of three component mounting lines is shown, but there may be one, two, or four or more lines.

[0018] The communication network 2 is connected so as to enable data communication between the management computer 3, each of the plurality of component mounting lines L1 to L3, and the setup work support device 4. In the example of FIG. 1, the communication network 2 is shown as being connected for wired communication, but it may be capable of wireless communication. The wireless communication mentioned here is a communication method provided in accordance with a wireless communication standard such as, for example, wireless Local Area NetWork (LAN), Bluetooth (registered trademark), or Wi-Fi (registered trademark).

[0019] The management computer 3 is, for example, a Personal Computer (hereinafter referred to as “PC”), a notebook PC, or a tablet terminal, etc., and is communicably connected to each of the plurality of component mounting lines L1 to L3 (that is, each of the component mounting devices constituting each of the plurality of component mounting lines L1 to L3) and the setup work support device 4 via the communication network 2. Further, the management computer 3 includes a user interface capable of receiving a user operation (for example, a mouse, a keyboard, a touch panel, a touch pad, or a pointing device, etc.), and converts an input based on the user operation into a control signal.

[0020] The management computer 3 comprehensively controls the production process, including solder printing, printing inspection, and component mounting processes, which are performed by each component mounting device constituting each of the multiple component mounting lines L1 to L3. For example, the management computer 3 generates production information related to the production process, which is pre-input or set by the worker, and execution commands to execute the production process, and transmits these to the component mounting lines that perform these production processes. Note that the production process includes at least the component mounting process, but other processes are not mandatory.

[0021] Furthermore, the management computer 3 generates external setup groups (for example, external setup groups GR11, GR12, GR13, etc. shown in Figure 8) and setup groups (for example, setup groups "S1", "S2", "S3", "S4", etc. shown in Figure 8) for producing multiple types of circuit boards, based on production data for producing multiple types of circuit boards that have been pre-input or set by the operator. The external setup groups and setup groups referred to here are groups of circuit boards that are produced using similar components from among multiple types of circuit boards, and each group includes at least one type of circuit board. An external setup group is a group of circuit boards that are produced by reusing the trolley and components set up in the initial external setup, after the initial external setup has been performed. Here, the production of circuit boards included in an external setup group may not be possible with only the initial external setup. The management computer 3 generates multiple setup groups by further grouping the various types of circuit boards included in the external setup group into groups that can be produced using the trolley set up in the initial external setup, and at least one group that can be produced for each setup (external setup or internal setup) that further replaces the trolley or part of the components.

[0022] The management computer 3 determines the trolleys S1,... used for external setup and the mounting heads used for mounting components, for each of the component mounting devices M3 to M6's tables SRA, SRB (see Figure 3). The management computer 3 generates component placement tables for each of the multiple trolleys S1,... for each setup group. The component placement tables referred to here are data showing the placement of components to be mounted in each slot (tape feeder) of the trolleys S1,..., and are generated by associating the address information of each slot with the information of the components to be mounted in each slot.

[0023] The production data referred to here is information used to execute the component mounting process by the component mounting device, and is generated by the management computer 3 and recorded in the management storage unit 32. The production data includes, for example, the size of the substrate, the position of the substrate recognition mark, the size of the component, the nozzle suction time, the mounting position, the substrate (mounting) height, information on the suction nozzle, and the number of substrates produced. However, the production data is not limited to the data of the items described above.

[0024] Furthermore, when generating the parts placement table, the management computer 3 may refer to the parts placement tables for each trolley S1,... stored in the management storage unit 32 (see Figure 5), or it may refer to the parts placement tables for each trolley S1,... transmitted from the setup work support device 4.

[0025] The setup support device 4 is located in the external setup area Ap and is connected to the management computer 3 and each of the multiple trolleys S1,... via the communication network 2, enabling data communication. The setup support device 4 may also be included in and integrally formed with the management computer 3. The setup support device 4 acquires parts placement tables from each of the multiple trolleys S1,... and transmits them to the management computer 3.

[0026] Each of the multiple trolleys S1,... is located, for example, in the external setup area Ap and is connected to the setup work support device 4 so as to be able to communicate data. Each of the multiple trolleys S1,... is detachably attached to the tables of the component mounting devices M3 to M6 and is equipped with tape feeders (slots) that supply one or more components to be mounted on a substrate in a component mounting process performed by a predetermined component mounting device. Each of the multiple trolleys S1,... transmits at least the identification information of the trolley, the number of slots that the trolley is equipped with, and information about each slot (for example, information on whether a double feeder can be mounted or not) to the setup work support device 4.

[0027] Next, with reference to Figure 2, each component mounting device constituting the component mounting line L1 will be described. Figure 2 is a diagram illustrating the component mounting line L1 according to an embodiment. Note that each of the multiple component mounting lines L1 to L3 has a similar configuration, and Figure 2 describes the production of substrate B carried out by component mounting line L1.

[0028] The component mounting line L1 consists of a solder printing device M1, a printing inspection device M2, each of the multiple component mounting devices M3 to M6, an installation inspection device M7, and a reflow device M8, each serving as a component mounting device. Each of these component mounting devices M3 to M6 that make up the component mounting line L1 is connected to a management computer 3 via a communication network 2, enabling data communication, and performs control based on production process execution commands transmitted from the management computer 3.

[0029] In this embodiment, the component mounting line L1 in the component mounting system 1 is shown as an example comprising a solder printing device M1, a printing inspection device M2, each of the multiple component mounting devices M3 to M6, a mounting inspection device M7, and a reflow device M8. However, it is sufficient for the system to include at least one component mounting device. In other words, the component mounting line L1 may be configured to include at least one component mounting device and a mounting inspection device M7.

[0030] The solder printing device M1 performs a solder printing process in which it prints solder onto substrate B via a mask, based on the solder data of substrate B (e.g., solder printing pattern, etc.) transmitted from the management computer 3, and substrate B is brought in from the upstream side of the component mounting line L1 (the left side of the solder printing device M1 shown in Figure 2). After solder printing, the solder printing device M1 delivers substrate B to the printing inspection device M2.

[0031] The printing inspection device M2 performs a printing inspection process to inspect the condition of the solder printed on circuit board B, which has been brought in from the solder printing device M1, based on the solder data of circuit board B (e.g., the solder printing pattern) transmitted from the management computer 3. The printing inspection device M2 is equipped with a camera that takes an image of the incoming circuit board B, and uses the image captured by the camera to inspect the condition of the solder (i.e., whether or not there are any solder printing defects). The printing inspection device M2 records the results of the solder printing inspection of circuit board B in its memory (not shown) and delivers the circuit board B that has passed the inspection to the component mounting device M3.

[0032] Each of the component mounting devices M3 to M6 performs a component mounting process, mounting one or more components onto the substrate B delivered from the printing inspection device M2, based on execution commands transmitted from the management computer 3. Note that the component mounting line L1 is not limited to a configuration of four component mounting devices M3 to M6; for example, it may consist of one to three or five or more component mounting devices M3 to M6.

[0033] Each of the component mounting devices M3 to M6 controls a suction nozzle based on production data for substrate B transmitted from the management computer 3, and picks up components from a tape feeder placed on a trolley attached to the component mounting device. Each of the component mounting devices M3 to M6 transports the components picked up by the suction nozzle to a predetermined position on substrate B and mounts them. Each of the component mounting devices M3 to M5 delivers the substrate B with the components mounted to the next connected component mounting device. Component mounting device M6 then delivers the substrate B with the components mounted to the mounting inspection device M7.

[0034] The mounting inspection device M7 performs a mounting inspection process to check the condition of components mounted on board B, which has been brought in from the component mounting device M6, based on the production data of board B transmitted from the management computer 3. The mounting inspection device M7 is equipped with a camera that takes an image of the incoming board B, and uses the image captured by the camera to inspect the condition of the mounted components. The mounting inspection device M7 records the component mounting inspection results of board B in its memory (not shown) and delivers board B that has passed the inspection to the reflow machine M8.

[0035] The reflow apparatus M8 performs a reflow process to join the electrode portions of substrate B, which is brought in from the mounting inspection apparatus M7, with one or more mounted components, based on the reflow data of substrate B transmitted from the management computer 3 (for example, the conveying speed of the conveyor that transports substrate B, the heating temperature, etc.). The reflow apparatus M8 heats substrate B as it is transported by a belt conveyor, hardening the solder on substrate B and joining the electrode portions of substrate B with one or more mounted components. The reflow apparatus M8 then discharges the reflowed substrate B downstream of the component mounting line L1 (to the right of the reflow apparatus M8 shown in Figure 2).

[0036] Next, the configurations of component mounting devices M3 to M6 will be described with reference to Figures 3 and 4. Figure 3 is a top view of component mounting device M3 according to the embodiment. Figure 4 is a cross-sectional view of component mounting device M3 shown in Figure 3, from the base 6 to the table SRA along the AA cross-sectional line. Note that each of the multiple component mounting devices M3 to M6 has a similar configuration, and here we will describe component mounting device M3.

[0037] In addition, each of the component mounting devices M3 to M6 according to the embodiment is equipped with multiple tables SRA and SRB on both sides (Y direction and -Y direction) of a pair of substrate transport mechanisms 7 that transport substrate B, but the tables may be provided on only one side. Furthermore, although each of the component mounting devices M3 to M6 according to the embodiment is shown as having a single lane configuration (i.e., a pair of substrate transport mechanisms 7 capable of transporting one substrate B), it may also have a dual lane configuration capable of mounting components on multiple substrates simultaneously.

[0038] The component mounting apparatus M3 shown in Figure 3 comprises a base 6, a substrate transport mechanism 7, multiple tables SRA and SRB, a Y-axis beam 10, an X-axis beam 11, a mounting head 12, a component recognition camera 13, a substrate recognition camera 14, one or more carrier tapes 15, and multiple reels 16.

[0039] The base 6 is equipped with a substrate transport mechanism 7 at its central position for transporting the substrate B. The substrate transport mechanism 7 transports the substrate B, which has been brought in from the connected printing inspection device M2 (or the connected component mounting device in the case of component mounting devices M4 to M6), to a predetermined component mounting position at the central position of the base 6 and holds it there. The substrate transport mechanism 7 also transports the substrate B, after the components have been mounted, to the next connected component mounting device M4 (or the connected mounting inspection device M7 in the case of component mounting device M6).

[0040] Each of the multiple tables SRA and SRB is equipped with multiple tape feeders arranged side by side to supply components to be mounted on substrate B. In the component mounting apparatus M3 according to this embodiment, the tape feeder is described as a double feeder capable of mounting two carrier tapes, but it may also be a single feeder capable of mounting one carrier tape. In other words, the component mounting apparatus M3 may be composed of tables that can be arbitrarily fitted with single feeders and double feeders.

[0041] In Figure 3, each of the multiple tables SRA and SRB has the function of attaching a carrier tape containing components to be mounted on substrate B to a tape feeder and feeding the components contained on this carrier tape by pitch to the component pick-up position by the suction nozzle 12b. Each of the multiple tables SRA and SRB feeds each of the carrier tapes containing the components by pitch in a predetermined tape feeding direction, thereby supplying each component to the component pick-up position by the mounting head 12 described below.

[0042] Table SRA comprises multiple tape feeders SRA1, SRA2, ..., SRAK. Each of the multiple tape feeders SRA1, SRA2, ..., SRAK is configured with a tape feeder address to identify the location of the tape feeder to which carrier tapes (components) can be attached.

[0043] The SRB table comprises several tape feeders, SRB1, SRB2, ..., SRBK. Each of the SRB1, SRB2, ..., SRBK tape feeders is configured with a tape feeder address to identify the location of the tape feeder to which a carrier tape (component) can be attached.

[0044] The management computer 3 stores data for a component placement table, which is generated by associating the tape feeder addresses of multiple tape feeders SRA1, SRA2, ..., SRAK in table SRA with information on carrier tapes (components), in the management storage unit 32 (see Figure 5).

[0045] On the upper surface of the base 6, a Y-axis beam 10 equipped with a linear drive mechanism is arranged along the Y direction at one end in the X direction. Two X-axis beams 11, each similarly equipped with a linear drive mechanism, are coupled to the Y-axis beam 10 so as to be movable in the Y direction and -Y direction. Each of the two X-axis beams 11 is arranged along the X direction. Each of the two X-axis beams 11 is provided with a plate 11a. The plate 11a attaches a mounting head 12 and a substrate recognition camera 14, which are driven integrally with the X-axis beam 11, to the X-axis beam 11.

[0046] The mounting head 12 is driven (moved) in conjunction with the substrate recognition camera 14 by the X-axis beam 11, and picks up and holds components D stored on carrier tapes attached to each of the multiple tape feeders SRA1, ..., SRAK, SRB1, ..., SRBK, and transports them to the mounting position on the substrate B for mounting. The mounting head 12 consists of a suction unit 12a and a suction nozzle 12b. The suction unit 12a performs suction control to pick up components D. A suction nozzle 12b is provided at the tip of the suction unit 12a. Based on the execution of the suction control by the suction unit 12a, the suction nozzle 12b picks up and holds or releases the components D and mounts them on the substrate B.

[0047] The substrate recognition camera 14 is driven (moved) in conjunction with the mounting head 12 by the X-axis beam 11 and captures images of substrate marks (not shown) located at predetermined positions on the substrate B from above the substrate B positioned by the substrate transport mechanism 7. The substrate recognition camera 14 transmits the captured images to the control unit 31 (see Figure 5) in the component mounting device M3.

[0048] Multiple component recognition cameras 13 are provided between the table SRA on the base 6 and the substrate transport mechanism 7, and between the table SRB on the base 6 and the substrate transport mechanism 7. Each of the multiple component recognition cameras 13 captures an image of the component D held by the mounting head 12 when the mounting head 12, which has taken out a component stored in the carrier tape 15 on the table SRA or SRB, moves above the component recognition camera 13. Each of the multiple component recognition cameras 13 recognizes the holding posture of the component D based on the captured image. Each of the multiple component recognition cameras 13 transmits the captured image to the management control unit 31 (see Figure 5) in the component mounting device M3.

[0049] The component mounting device M3 processes the image of component D transmitted from the component recognition camera 13 to obtain the holding posture of component D held by the suction nozzle 12b. The component mounting device M3 also processes the image of substrate B transmitted from the substrate recognition camera 14 to calculate the amount of misalignment of substrate B, the amount of misalignment of electrodes (not shown) provided on substrate B, etc., based on the position information of the substrate recognition marks on substrate B recorded in the production data. Based on the calculated amount of misalignment of substrate B or the electrodes and the obtained holding posture of component D, the component mounting device M3 corrects the mounting position or angle of component D.

[0050] The trolley S0 is configured to be detachably attached to the base 6, and when attached to the base 6, the control unit (not shown) in the trolley S0 and the control unit (not shown) in the component mounting device M3 are electrically connected. The trolley S0 has a reel 16 for storing each of the carrier tapes 15 attached to the tape feeder SRAL (tape feeder SRAL refers to any tape feeder from tape feeders SRA1 to SRAK) in a wound state.

[0051] The carrier tape 15 is pulled out from the reel 16, and one end is attached to the tape feeder SRAL. The tape feeder SRAL feeds the carrier tape 15 in a pitch to the part pick-up position by the suction nozzle 12b.

[0052] Next, with reference to Figure 5, the internal configuration of the management computer 3 according to the embodiment will be described. Figure 5 is a diagram showing an example of the internal configuration of the management computer according to the embodiment.

[0053] The management computer 3 is connected to the setup support device 4 and each of the multiple component mounting lines L1 to L3, enabling data communication. In Figure 5, for the sake of clarity, only the multiple component mounting devices M3 to M6 are shown as components included in each of the multiple component mounting lines L1 to L3. The management computer 3 consists of a management control unit 31, a management storage unit 32, an input unit 33, a display unit 34, and a communication unit 35.

[0054] The management control unit 31 is configured using, for example, a Central Processing Unit (CPU) or a Field Programmable Gate Array (FPGA), and works in cooperation with the management memory unit 32 to perform various processes and controls. Specifically, the management control unit 31 refers to the programs and data held in the management memory unit 32 and executes those programs to realize the functions of each unit. These units include, for example, the setup data generation unit 31a. Through these units, the management control unit 31 executes the functions necessary to generate the setup plan required for the production of all circuit boards.

[0055] Furthermore, the control unit 31 receives an input operation from the operator via the input unit 33 for the maximum number of times that parts can be replaced in one internal setup for a single trolley (hereinafter referred to as the "maximum number of internal setups"). The control unit 31 stores the input information for the maximum number of internal setups in the internal setup maximum number information 32b. Based on the input maximum number of internal setups, the control unit 31 generates setup data Dt11 used for setting up production of multiple types of circuit boards and outputs it to the management storage unit 32 for storage. Details of the setup data Dt11 will be explained in Figure 8. In addition, the control unit 31 generates execution commands to cause each component mounting device to execute each production process and outputs them to the communication unit 35 for transmission.

[0056] The setup data generation unit 31a generates external setup groups and setup groups, and generates setup data Dt11 (see Figure 8), based on the maximum number of internal setups and the production data for all substrates to be produced. The setup data Dt11 generation process will be described later.

[0057] The management memory unit 32 includes, for example, Random Access Memory (RAM) as work memory used when executing each process of the management control unit 31, and Read Only Memory (ROM) which stores programs and data that define the operation of the management control unit 31. The RAM temporarily stores data or information generated or acquired by the management control unit 31. The ROM contains programs that define the operation of the management control unit 31. The management memory unit 32 stores production data 32a, internal setup limit count information 32b, and setup data 32c.

[0058] Production data 32a is generated for each circuit board and stores the production data necessary for producing the circuit board.

[0059] The internal setup limit information 32b is set by the operator for each table SRA and SRB of the component mounting device, and is information on the maximum number of times that parts can be replaced in one internal setup for one trolley.

[0060] Setup data 32c is generated by the setup data generation unit 31a and stores setup data Dt11 (see Figure 8) for producing multiple types of substrates that are the target of production. Setup data Dt11 includes at least one external setup data and one or more internal setup data. The external setup data includes the component placement table set up by the external setup. The internal setup data includes the component placement table after the internal setup.

[0061] The input unit 33 is a user interface that accepts input operations from an operator, and is configured using, for example, a mouse, keyboard, touch panel, touchpad, pointing device, etc. The input unit 33 outputs signals based on the operator's input operations to the management control unit 31.

[0062] The display unit 34 is configured using a display such as a Liquid Crystal Display (LCD) or an organic electroluminescence (EL). The display unit 34 displays setup data Dt11 (see Figure 8) generated by the control unit 31.

[0063] The communication unit 35 is connected to each of the setup work support device 4 and the multiple component mounting devices M3 to M6 via the communication network 2, enabling data communication. The communication unit 35 transmits control commands based on the operator's input operations received by the input unit 33 to each of the component mounting devices M3 to M6.

[0064] Next, with reference to Figure 6, an example of the setup data Dt11 generation procedure will be described. Figure 6 is a flowchart showing an example of the setup data generation procedure of the management computer 3 according to the embodiment.

[0065] The setup data generation unit 31a receives inputs regarding the internal setup settings for each table of component mounting devices M3 to M6, based on the operator's input (St11), when generating setup data. The inputs regarding the internal setup settings referred to here are inputs that determine whether or not to generate internal setup data.

[0066] The setup data generation unit 31a accepts input operations from the operator for the maximum number of internal setups for tables among the component mounting devices M3 to M6 that have been set to generate internal setup data (St12). For example, in the example shown in Figure 8, the setup data generation unit 31a sets the maximum number of internal setups to "10" for tables "3", "5", and "6", and the maximum number of internal setups to "4" for table "4", based on the input operation.

[0067] The setup data generation unit 31a refers to the production data 32a in the management storage unit 32. Based on the production data for each of the substrates to be produced (i.e., multiple types of substrates), the setup data generation unit 31a obtains a list of all components used in the production of these substrates. Based on the number or percentage of common components used in common across different substrates, the number of components, or the number of units produced, etc., based on the list of components, the setup data generation unit 31a generates at least one external setup group (for example, external setup groups GR11 to GR13 shown in Figure 8) (St13).

[0068] Specifically, the setup data generation unit 31a generates, for example, external setup groups GR11 to GR13 (see Figure 8) by grouping each of the multiple types of substrates to be produced so that the production time for all substrates included in each external setup group is minimized.

[0069] First, the setup data generation unit 31a generates external setup data for producing at least one type of substrate included in any one of the first external setup groups (for example, setup group "S1" of external setup group GR11 shown in Figure 8). The external setup data includes component placement tables for trolleys mounted on each of the component mounting devices M3 to M6. The setup data generation unit 31a generates external setup data to switch from the external setup data for starting production of the first external setup group (for example, external setup group GR11 shown in Figure 8) to the production of each of the other external setup groups (for example, external setup groups GR12 and GR13 shown in Figure 8).

[0070] The setup data generation unit 31a repeatedly executes the processes of the following steps St14 to St15 to generate external setup data or internal setup data for producing the substrates included in each external setup group GR11 to GR13 (see Figure 8).

[0071] The setup data generation unit 31a determines whether the internal setup settings, that is, the settings for generating internal setup data, have been made for each table of the component mounting machines M3 to M6 that produce multiple types of substrates that are the target of production (St14).

[0072] If the setup data generation unit 31a determines in step St14 that there is an internal setup setting (St14, YES), it calculates the number of missing parts in each table with an internal setup setting based on the component placement and remaining number of parts after producing a board with the setup corresponding to the previous setup data, and the parts and number required to produce boards that have not yet been produced. The setup data generation unit 31a determines whether the number of missing parts in each table is less than or equal to the maximum number of internal setups set for each table (St15).

[0073] For example, in the example shown in Figure 8, the setup data generation unit 31a calculates the types and numbers of missing parts in the external setup group GR11 based on the remaining number of parts after producing at least one type of substrate included in setup group "S1", and the types and numbers of parts that have not yet been produced but are necessary for producing at least one type of substrate included in setup group "S2". Based on the calculated types and numbers of missing parts, the setup data generation unit 31a calculates the number of parts that need to be exchanged in each of the tables with internal setup settings, that is, the number of parts that require internal setup, when switching production from setup group "S1" to setup group "S2".

[0074] If the setup data generation unit 31a determines in step St15 that the number of parts requiring internal setup is less than or equal to the maximum number of internal setups (St15, YES), it generates internal setup data for tables SRA and SRB. For example, if the number of parts to be replaced in tables "4", "5", and "6" is less than or equal to the maximum number of internal setups, such as when switching production from setup group "S2" to setup group "S3", the setup data generation unit 31a generates internal setup data to replace the parts in tables "4", "5", and "6".

[0075] On the other hand, if the setup data generation unit 31a determines in step St15 that the number of parts requiring internal setup is not less than or equal to the maximum number of internal setups (St15, NO), it generates external setup data for tables SRA and SRB. For example, if the number of parts to be replaced in table "3" (=15) is not less than or equal to the maximum number of internal setups (=10), such as when switching production from setup group "S2" to setup group "S3", the setup data generation unit 31a generates external setup data to replace the trolley in table "3".

[0076] On the other hand, if the setup data generation unit 31a determines in step St14 that there are no internal setup settings (St14, NO), it determines whether setup (i.e., carrier tape replacement work) is required for each table for which there are no internal setup settings. If the setup data generation unit 31a determines that there are tables SRA and SRB for which setup is required and there are no internal setup settings, it generates external setup data for these tables.

[0077] The setup data generation unit 31a generates setup data Dt11 (see Figure 8) for all external setup groups, which includes one or more external setup data and one or more internal setup data for producing all the substrates that are the target of production. The setup data generation unit 31a generates a screen that visualizes the generated setup data Dt11 (see Figure 8) and outputs it to the display unit 34 for display (St16).

[0078] Furthermore, if information regarding work time has been set (input) in advance by the operator, the setup data generation unit 31a may generate an external setup group, a setup group, or setup data by referring to this information regarding work time. The information regarding work time referred to here is, for example, the work time when placing one part (carrier tape) in external setup, or the work time when replacing it, or the work time when replacing one part (carrier tape) in internal setup.

[0079] Furthermore, if the number of workers performing each external setup or each internal setup has been set in advance by the workers, the setup data generation unit 31a may generate external setup groups, setup groups, or setup data based on the number of workers.

[0080] As described above, the management computer 3 in this embodiment can generate setup data Dt11 including internal setup data. This allows the management computer 3 to reduce the number of carts required on a single production line by introducing internal setup to reduce the total number of external setups in the production of multiple types of circuit boards, reduce the number of workers by reducing the number of workers and work hours (work time) required for external setup, and improve the flexibility of worker placement.

[0081] Next, referring to Figures 7 and 8, we will explain the setup data Dt0 when there is no internal setup setting and the setup data Dt11 when there is an internal setup setting. Figure 7 is a diagram showing an example of setup data Dt0 when there is no internal setup setting. Figure 8 is a diagram showing an example of conventional setup data Dt11. Note that the multiple types of substrates set up by setup data Dt0 shown in Figure 7 and the multiple types of substrates set up by setup data Dt11 shown in Figure 8 are the same.

[0082] The setup data Dt0 and Dt11 shown in Figures 7 and 8 are setup data for producing multiple types of circuit boards, each produced by a first component mounting machine equipped with tables "1" and "2", a second component mounting machine equipped with tables "3" and "4", and a third component mounting machine equipped with tables "5" and "6".

[0083] Each of the setup data Dt0 and Dt11 includes information about each component mounting device, information about the external setup settings for each table, information about whether or not the trolleys for each table are being replaced, information about external setup groups and setup groups, or data about the external or internal setup for producing each circuit board. The information included in each of the setup data Dt0 and Dt11 shown in Figures 7 and 8 is an example and is not limited thereto.

[0084] The information regarding each component mounting device refers to the component mounting device used in the production of multiple types of circuit boards that are the target of production. This information includes, for example, information about the mounting heads provided by each component mounting device, or the number of slots provided by the table. The component mounting device described in this disclosure is an example that can be equipped with both single and double feeders. When using a double feeder, it is possible to mount twice the number of components indicated by the setup data Dt0 and Dt11.

[0085] Figures 7 and 8 show that the first component mounting device comprises a mounting head with 16 suction nozzles and tables "1" and "2" having 30 (30-row) slots. The second component mounting device comprises a mounting head with 16 suction nozzles on the side corresponding to table "3" and a mounting head with 8 suction nozzles on the side corresponding to table "4" and tables "3" and "4" having 30 (30-row) slots. The third component mounting device comprises a mounting head with 8 suction nozzles on the side corresponding to table "5" and a mounting head with 3 suction nozzles on the side corresponding to table "6" and tables "5" and "6" having 30 (30-row) slots.

[0086] Information regarding external setup settings indicates whether or not external setup will be performed after production has started. For external setup settings, tables that prohibit external and internal setup after the start of production of multiple types of circuit boards are labeled "Normal," while tables that allow external and internal setup are labeled "Setup." For example, the tables shown in Figures 7 and 8 indicate that tables "1," "2," and "4" are set to not perform external setup during production, while tables "3," "5," and "6" are set to perform external setup during production.

[0087] Information regarding whether or not a trolley is replaced indicates in each table whether or not a trolley is replaced, i.e., whether or not external setup occurs, in the setup data generation results. For tables where a trolley is replaced, the information regarding whether or not a trolley is replaced is marked "Replaced," and for tables where a trolley is not replaced, the information is marked "Common." For example, the tables shown in Figures 7 and 8 indicate that tables "1," "2," and "4" are tables where a trolley is replaced, and tables "3," "5," and "6" are tables where a trolley is not replaced.

[0088] The external setup group and setup group information indicate the grouping results of multiple types of substrates that are the target of production. For example, the setup data Dt0 shown in Figure 7 indicates that the setup groups included in the first external setup group GR01 are "S1" and "S2", the setup groups included in the second external setup group GR02 are "S3" and "S4", and the setup groups included in the third external setup group GR03 are "S5" and "S6". Also, the substrate shown in Figure 8 indicates that the setup groups included in the first external setup group GR11 are "S1", "S2", "S3", and "S4", the setup groups included in the second external setup group GR12 are "S5", "S6", "S7", and "S8", and the setup groups included in the third external setup group GR13 are "S9", "S10", "S11", and "S12".

[0089] The data regarding the external or internal setup for producing each circuit board shows the number of carts and parts required for the external setup of each external setup group, the number of parts required for the internal setup of each external setup group, and the number of parts set up in the external setup or internal setup of each table.

[0090] Although not shown in Figures 7 and 8, setup data Dt0 and Dt11 include the number of parts required for the external and internal setup of each external setup group, and information about each part (e.g., part name or part identification number). When the management computer 3 receives a selection operation for the number of parts required for the external and internal setup of each external setup group in setup data Dt0 and Dt11, it may be able to display a list of parts associated with the information of the required number of parts.

[0091] <Setup data when internal setup is not performed> First, let's explain the setup shown in the setup data Dt0 in Figure 7. Setup data Dt0 indicates that in the setup of production of multiple types of circuit boards included in setup groups "S1" to "S6", the minimum number of trolleys required to realize production and the setup of the next circuit board to be produced is 12, the total number of parts set up in the external setup is 470, and the total number of parts set up in the internal setup is 0 (zero).

[0092] In Figure 7, the setup data Dt0 shows that external setups, such as the replacement of trolleys mounted on the table, are indicated by black cells, and the number of parts set up in these external setups is indicated by numbers. In other words, setup data Dt0 indicates that only external setups are performed when switching between each external setup group GR01 to GR03, and when switching between external setup groups included in each external setup group GR01 to GR03 (for example, switching from setup group "S1" to setup group "S2", switching from setup group "S3" to setup group "S4", etc.).

[0093] The minimum number of trolleys to be owned, as used here, is the smallest of the sum of the total number of trolleys required for setting up external setup group GR01 and the total number of trolleys required for the first setup of external setup group GR02 or external setup group GR03, which will be produced after external setup group GR01 is produced. For example, in the example shown in Figure 7, the setup groups that can be produced after external setup group GR01 is produced are setup group "S3" of external setup group GR02 or setup group "S5" of external setup group GR03. Therefore, the minimum number of trolleys to be owned in Figure 7 is the sum of the total number of trolleys required for setting up setup groups "S1" and "S2" included in external setup group GR01 (=9 trolleys) and the number of trolleys required for setting up setup group "S3" or setup group "S5" (=3 trolleys).

[0094] Note that while this example shows the same number of trolleys required for setup groups "S3" and "S5," it is not limited to this example. If the number of trolleys required for setups that become available after production by external setup group GR01 differs, the minimum number of trolleys to be owned will be the sum of the number of trolleys required for setup groups "S3" and "S5" from the external setup group with the minimum number of trolleys required for setup.

[0095] Furthermore, setup data Dt0 indicates that, for the production sequence of each external setup group, production of external setup group GR02 or external setup group GR03 is possible after setup or production of external setup group GR01, or the first setup group "S1" of external setup group GR01 has been performed.

[0096] Furthermore, setup data Dt0 shows, for each external setup group GR01 to GR03, the number of trolleys required for external setup, the number of parts set up in external setup, and the number of parts set up in internal setup.

[0097] For example, in the example shown in Figure 7, setup data Dt0 indicates that in the setup of external setup group GR01, a total of 9 trolleys are required for external setup, a total of 249 parts are set up in external setup, and a total of 0 (zero) parts are set up in internal setup. Setup data Dt0 indicates that in the setup of external setup group GR02, a total of 6 trolleys are required for external setup, a total of 112 parts are set up in external setup, and a total of 0 (zero) parts are set up in internal setup. Also, setup data Dt0 indicates that in the setup of external setup group GR02, a total of 6 trolleys are required for external setup, a total of 109 parts are set up in external setup, and a total of 0 (zero) parts are set up in internal setup.

[0098] Furthermore, setup data Dt0 indicates the production and setup sequence for each substrate in the external setup groups GR01 to GR03.

[0099] For example, in the example shown in Figure 7, setup data Dt0 indicates that in external setup group GR01, after performing the external setup corresponding to setup group "S1" to produce the substrate for setup group "S1", the substrate for setup group "S2" becomes available for production by performing the external setup. Setup data Dt0 indicates that in external setup group GR02, after performing the external setup to produce the substrate for setup group "S3", the substrate for setup group "S4" becomes available for production by performing the external setup. Furthermore, setup data Dt0 indicates that in external setup group GR03, after performing the external setup to produce the substrate for setup group "S5", the substrate for setup group "S6" becomes available for production by performing the external setup.

[0100] Specifically, setup data Dt0 indicates that in the external setup corresponding to setup group "S1", 46 parts are supplied to table "1", 45 to table "2", 38 to table "3", 29 to table "4", 13 to table "5", and 11 to table "6" using 6 trolleys, and then in the external setup corresponding to setup group "S2", 41 parts are supplied to table "3", 18 to table "5", and 8 to table "6" using 3 trolleys.

[0101] Furthermore, setup data Dt0 indicates the production and setup sequence for each external setup group GR01 to GR03.

[0102] For example, in the example shown in Figure 7, setup data Dt0 indicates that after the setup or production of a substrate corresponding to setup group "S1" or setup group "S2" of external setup group GR01 is completed, if an external setup corresponding to setup group "S3" is performed, the substrates of setup group "S3" become available for production, and if an external setup corresponding to setup group "S5" is performed, the substrates of setup group "S5" become available for production.

[0103] Specifically, setup data Dt0 indicates that after setup or production of a board corresponding to setup group "S1" or setup group "S2" is completed, if an external setup corresponding to setup group "S3" is performed, supplying 41 components to table "3", 18 to table "5", and 8 to table "6" using three trolleys, the boards for setup group "S3" will become ready for production. Similarly, setup data Dt0 indicates that after setup or production of a board corresponding to setup group "S1" or setup group "S2" is completed, if an external setup corresponding to setup group "S5" is performed, supplying 37 components to table "3", 19 to table "5", and 11 to table "6" using three trolleys, the boards for setup group "S5" will become ready for production.

[0104] As a result, in the example, the setup data Dt0 allows the operator to refer to the setup data Dt0 and, based on the actual operating status of the production line, select whether to produce multiple boards in the order of external setup group GR01, external setup group GR02, and external setup group GR03, or in the order of external setup group GR01, external setup group GR03, and external setup group GR02.

[0105] <Setup data when performing internal setup> The setup shown in Figure 8, Dt11, will now be explained. Setup data Dt11 indicates that, in the setup of production of multiple types of substrates included in setup groups "S1" to "S13", the minimum number of trolleys required to realize production and the setup of the next substrate to be produced is 9, the total number of parts set up in the external setup is 406, and the total number of parts set up in the internal setup is 34.

[0106] In Figure 8, the setup data Dt11 shows that external setups, where the trolley mounted on the table is replaced, are indicated by black cells, and the number of parts set up in these external setups is indicated by numbers. Additionally, setup data Dt11 shows internal setups, where parts mounted on the trolley are replaced, by dot-hatched cells, and the number of parts set up in these internal setups is indicated by numbers. In other words, setup data Dt11 indicates that external setups are executed when switching between each external setup group GR11 to GR13. For example, setup data Dt11 indicates that when switching from setup group "S1" to setup group "S2", internal setups in tables "3", "4", and "6" are executed, and when switching from setup group "S2" to setup group "S3", external setups are executed in table "3", and internal setups are executed in tables "4", "5", and "6". Furthermore, when switching from setup group "S2" to setup group "S3", the management computer 3 generates data for the external setup in table "3" because the number of parts that need to be replaced is 15, which is more than the maximum number of internal setups (=10).

[0107] As a result, by setting up internal setup, the management computer 3 can reduce the minimum number of trolleys it owns from 12 to 9, thereby reducing the total number of trolleys and allowing trolleys to be shared across more production lines. In addition, by reducing the total number of parts set up in external setup, the management computer 3 can reduce, for example, the number of workers dedicated to external setup or the man-hours required for external setup, thereby improving the flexibility of the number and placement of workers throughout the entire floor.

[0108] Furthermore, setup data Dt11 indicates that, for the production sequence of each setup group, production of external setup group GR12 or external setup group GR13 is possible after setup or production of external setup group GR11 or the first setup group "S1" of external setup group GR11 has been performed.

[0109] Furthermore, setup data Dt11 shows the number of trolleys required for external setup, the number of parts set up in external setup, and the number of parts set up in internal setup for each external setup group GR11 to GR13.

[0110] For example, the setup data Dt11 shown in Figure 8 indicates that in the setup of external setup group GR11, a total of 7 trolleys are required for external setup, a total of 205 parts are set up in external setup, and a total of 9 parts are set up in internal setup. The setup data Dt11 indicates that in the setup of external setup group GR12, a total of 4 trolleys are required for external setup, a total of 102 parts are set up in external setup, and a total of 13 parts are set up in internal setup. The setup data Dt11 indicates that in the setup of external setup group GR13, a total of 4 trolleys are required for external setup, a total of 99 parts are set up in external setup, and a total of 12 parts are set up in internal setup.

[0111] Furthermore, setup data Dt11 indicates the production and setup sequence of each substrate in the setup groups included in each external setup group GR11 to GR13.

[0112] For example, in the example shown in Figure 8, setup data Dt11 indicates that in the external setup group GR11, after performing external setup to produce the substrate for setup group "S1", the substrate for setup group "S2" becomes available for production after performing internal setup. Setup data Dt11 indicates that after producing the substrate for setup group "S2", the substrate for setup group "S3" becomes available for production after performing external and internal setup, and after producing the substrate for setup group "S3", the substrate for setup group "S4" becomes available for production after performing internal setup.

[0113] Furthermore, for example, the setup data Dt11 shown in Figure 8 indicates that in the external setup group GR12, after performing external and internal setup to produce the substrate for setup group "S5", the substrate for setup group "S6" becomes available for production by performing internal setup. The setup data Dt11 indicates that after producing the substrate for setup group "S6", the substrate for setup group "S7" becomes available for production by performing external and internal setup, and after producing the substrate for setup group "S7", the substrate for setup group "S8" becomes available for production by performing internal setup.

[0114] Furthermore, for example, the setup data Dt11 shown in Figure 8 indicates that in the external setup group GR13, after performing external setup to produce the substrate for setup group "S9", the substrate for setup group "S10" becomes available for production by performing internal setup. The setup data Dt11 indicates that after producing the substrate for setup group "S10", the substrate for setup group "S11" becomes available for production by performing external and internal setup, after producing the substrate for setup group "S11", the substrate for setup group "S12" becomes available for production by performing internal setup, and after producing the substrate for setup group "S12", the substrate for setup group "S13" becomes available for production by performing internal setup.

[0115] Specifically, setup data Dt11 indicates that in the external setup of setup group "S1", 46 parts are supplied to table "1", 45 to table "2", 42 to table "3", 29 to table "4", 15 to table "5", and 13 to table "6" using 6 carts. Then, in the external setup of setup group "S2", 1 part is replaced (supplied) from tables "3" and "4", and 3 parts are replaced (supplied) from table "6". Setup data Dt11 indicates that in the external and internal setup of setup group "S3", 15 parts are supplied to table "3" using 1 cart, and 1 part is replaced (supplied) from tables "4" to "6" each. Additionally, setup data Dt11 indicates that in the internal setup of setup group "S4", 1 part is replaced (supplied) from table "3".

[0116] Additionally, setup data Dt11 indicates the production and setup sequence for each external setup group GR11 to GR13.

[0117] For example, in the example shown in Figure 8, setup data Dt11 indicates that after the setup or production of a substrate corresponding to setup group "S1" or setup group "S4" of external setup group GR11 is completed, if an external setup corresponding to setup group "S5" is performed, the substrates of setup group "S5" become available for production, and if an external setup corresponding to setup group "S9" is performed, the substrates of setup group "S9" become available for production.

[0118] Specifically, setup data Dt11 indicates that after setup or production of a board corresponding to setup group "S1" or setup group "S4" is completed, if an external setup corresponding to setup group "S5" is performed, supplying 44 parts to table "3", 28 parts to table "5", and 15 parts to table "6" using three trolleys, the boards for setup group "S5" will become ready for production. Similarly, setup data Dt11 indicates that after setup or production of a board corresponding to setup group "S1" or setup group "S4" is completed, if an external setup corresponding to setup group "S9" is performed, supplying 40 parts to table "3", 29 parts to table "5", and 15 parts to table "6" using three trolleys, the boards for setup group "S9" will become ready for production.

[0119] As a result, setup data Dt11 can present the operator with multiple setup procedures and the external or internal setup methods for these procedures. Therefore, by referring to setup data Dt11, the operator can select whether to produce multiple boards in the order of external setup group GR11, external setup group GR12, and external setup group GR13, or in the order of external setup group GR11, external setup group GR13, and external setup group GR12, based on the actual operating status of the production line.

[0120] As described above, the management computer 3 in this embodiment accepts input for the maximum number of internal setup cycles, and generates internal setup data if setup is possible by replacing parts up to or less than the maximum number of cycles. This allows the management computer 3 to more effectively reduce the number of carts that require external setup, the number of empty carts that must be kept for external setup preparation, the number of parts set up by external setup, and the working time in the production of multiple types of circuit boards. This not only improves production efficiency but also streamlines the entire setup process, including the allocation of workers. Furthermore, by accepting input (setting) for the maximum number of internal setup cycles, the management computer 3 can more effectively suppress the increase in downtime of the component mounting equipment due to excessive internal setup, thereby suppressing the decrease in production efficiency due to setup.

[0121] Furthermore, the management computer 3 in this embodiment can propose multiple production sequences even when it generates setup data Dt11 that includes internal setup. This allows the management computer 3 to generate setup data Dt11 that supports the production of each external setup group GR11 to GR13, i.e., the boards included in each external setup group GR11 to GR13, in the production sequence requested by the operator, even when the actual production sequence of the boards has not been determined in advance, or when it is desired to determine the production sequence of the boards according to the actual production status of the boards.

[0122] (Note) Based on the descriptions of the embodiments described above, the following technologies are disclosed.

[0123] (Technology 1) A setup determination device (management computer 3) that can communicate with a component supply trolley (carrier) having multiple slots on which component supplies (carrier tapes) used for the production of multiple types of circuit boards D can be placed, An external setup group generation unit (setup data generation unit 31a) generates a plurality of external setup groups GR11 to GR13 that perform external setup between productions of different types of substrates D, in which the component supply trolley (trolley) is not connected to the component mounting device, in which the component supply material (carrier tape) is placed in at least one slot of the plurality of slots. The system includes a setup data generation unit 31a that generates and outputs, for each of the external setup groups GR11 to GR13, external setup data (external setup data) for supplying the component supply material (carrier tape) to the component supply trolley (cart) based on the component supply material (carrier tape) used in the production of the multiple types of substrates D included in the external setup group, and internal setup data (internal setup data) for supplying the component supply material (carrier tape) to the component supply trolley (cart) by swapping the component supply material (carrier tape) in at least one slot of the multiple slots while the component supply trolley (cart) is connected to the component mounting device, The setup data generation unit 31a generates the setup data when it determines that the number of slots in which the parts supply (carrier tape) is replaced in one setup (maximum number of setups) is less than or equal to a threshold. Setup determination device (management computer 3). As a result, the management computer 3 in this disclosure accepts input for the maximum number of internal setup cycles and generates internal setup data if setup is possible by replacing parts up to or less than the maximum number of cycles. The management computer 3 can more effectively reduce the number of carts that require external setup, the number of empty carts that must be kept for external setup preparation, the number of parts set up by external setup, and the work time in the production of multiple types of circuit boards, thereby improving not only production efficiency but also the overall efficiency of setup, including worker allocation. Furthermore, by accepting input (setting) for the maximum number of internal setup cycles, the management computer 3 can more effectively suppress the increase in downtime of the component mounting equipment due to excessive internal setup, thereby suppressing the decrease in production efficiency due to setup.

[0124] (Technology 2) The setup data generation unit 31a generates the external setup group when it determines that the number of slots in which the parts supply (carrier tape) is replaced in one internal setup (maximum number of internal setups) is not less than or equal to the threshold. The setup determination device (management computer 3) described in (Technology 1). As a result, if the management computer 3 in this disclosure determines that it is necessary to replace more parts (carrier tapes) than the set upper limit for internal setup, it generates external setup data, thereby generating setup data that more effectively suppresses the downtime of the component mounting devices M3 to M6 due to internal setup.

[0125] (Technology 3) The aforementioned threshold (maximum number of internal setup cycles) is set for each parts supply unit (table STA, STB) to which the parts supply trolley (cart) is connected. A setup determination device (management computer 3) as described in (Technology 1) or (Technology 2). As a result, the management computer 3 in this disclosure can set an upper limit on the number of internal setups for each table, thereby limiting the component mounting equipment or tables in which internal setups occur, and making the movement of workers during internal setup work, or the time workers spend moving during internal setups, more efficient.

[0126] (Technology 4) A setup determination method performed by a setup determination device (management computer 3) that can communicate with a component mounting device to which a component supply trolley (carrier) having multiple slots on which component supplies (carrier tapes) used for the production of multiple types of circuit boards D can be placed, Multiple external setup groups GR11 to GR13 are generated to perform external setup between production runs of different types of substrates D, in which the component supply trolley (trolley) is placed in at least one slot of the multiple slots while the component supply trolley (trolley) is not connected to the component mounting device. Based on the component supplies (carrier tapes) used in the production of the multiple types of substrates D included in the external setup group, external setup data (external setup data) for supplying the component supplies (carrier tapes) to the component supply trolley (cart), and internal setup data (internal setup data) for supplying the component supplies (carrier tapes) to the component supply trolley (cart) after replacing the component supplies (carrier tapes) in at least one slot of the multiple slots while the component supply trolley (cart) is connected to the component mounting device, are generated and output for each of the external setup groups GR11 to GR13. The data for the aforementioned internal setup is generated when it is determined that the number of slots in which the parts supply (carrier tape) is replaced in one internal setup is below a threshold. How to decide on the arrangements. As a result, the management computer 3 in this disclosure accepts input for the maximum number of internal setup cycles and generates internal setup data if setup is possible by replacing parts up to or less than the maximum number of cycles. The management computer 3 can more effectively reduce the number of carts that require external setup, the number of empty carts that must be kept for external setup preparation, the number of parts set up by external setup, and the work time in the production of multiple types of circuit boards, thereby improving not only production efficiency but also the overall efficiency of setup, including worker allocation. Furthermore, by accepting input (setting) for the maximum number of internal setup cycles, the management computer 3 can more effectively suppress the increase in downtime of the component mounting equipment due to excessive internal setup, thereby suppressing the decrease in production efficiency due to setup.

[0127] Although various embodiments have been described above with reference to the attached drawings, this disclosure is not limited to such examples. It will be clear to those skilled in the art that various modifications, alterations, substitutions, additions, deletions, and equivalents can be conceived within the scope of the claims, and these will also be understood to fall within the technical scope of this disclosure. Furthermore, the components of the various embodiments described above can be combined arbitrarily without departing from the spirit of the invention. [Industrial applicability]

[0128] This disclosure is useful as a setup determination device and setup determination method that reduces the number of trolleys required for external setup and the number of parts for external setup, thereby making the setup changeover process more efficient. [Explanation of Symbols]

[0129] 1. Component mounting system 2. Communication Network 3. Management Computer 4. Work support devices 15 Carrier Tape 31 Management and Control Unit 31a Setup data generation unit 32 Management storage unit 32a Production Data 32b Information on the maximum number of internal setup steps 32c Setup Data 33 Input section 34 Display section 35 Communications Department B substrate D parts Dt0, Dt11 data F Floor GR01, GR02, GR03, GR11, GR12, GR13 External Setup Group L1, L2, L3 component mounting lines M3, M4, M5, M6 component mounting equipment S0, S1, S2, S3, S4 Trolley SRA, SRB Table

Claims

1. A setup determination device that can communicate with a component supply cart having multiple slots on which component supplies used for the production of multiple types of circuit boards can be placed, An external setup group generation unit generates multiple external setup groups that perform external setup between productions of different types of circuit boards, in which the external setup involves placing the component supply in at least one slot of the plurality of slots while the component supply trolley is not connected to the component mounting device. The system includes a setup data generation unit that generates and outputs, for each of the external setup groups, external setup data for supplying component supplies to a component supply cart based on the component supplies used in the production of the multiple types of circuit boards included in the external setup group, and internal setup data for supplying component supplies to the component supply cart by replacing the component supplies in at least one slot of the multiple slots while the component supply cart is connected to the component mounting device, The setup data generation unit generates the setup data when it determines that the number of slots in which the parts supplied are replaced in one setup is below a threshold. Setup determination device.

2. The setup data generation unit generates the external setup group when it determines that the number of slots in which the parts supplied are replaced in one internal setup is not less than or equal to the threshold. The setup determination device according to claim 1.

3. The threshold is set for each parts supply unit to which the parts supply trolley is connected. The setup determination device according to claim 1.

4. A setup determination method performed by a setup determination device that can communicate with a component supply cart having multiple slots on which component supplies used for the production of multiple types of circuit boards can be placed, Multiple external setup groups are generated to perform external setup between productions of different types of circuit boards, in which the external setup involves placing the component supply in at least one slot of the multiple slots while the component supply trolley is not connected to the component mounting device. Based on the component supplies used in the production of the multiple types of circuit boards included in the external setup group, data for the external setup that supplies the component supplies to the component supply cart, and data for the internal setup that replaces the component supplies in at least one slot of the multiple slots and supplies the component supplies to the component supply cart while the component supply cart is connected to the component mounting device, are generated and output for each external setup group. The data for the internal setup is generated when it is determined that the number of slots in which the parts supplied are replaced in one internal setup is less than or equal to a threshold. How to decide on the arrangements.

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