Cooling module
JP2026085675APending Publication Date: 2026-05-25AISIN CORP
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Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- AISIN CORP
- Filing Date
- 2024-11-13
- Publication Date
- 2026-05-25
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Figure 2026085675000001_ABST
Abstract
The present invention provides a cooling module that allows coolant to circulate efficiently within the manifold. [Solution] The manifold M is made of resin and has a cooling channel through which a cooling fluid flows. The manifold M is formed by joining a first housing 10 and a second housing 30, each having three-dimensional curved surfaces 16A, 16B, 17A, 17B, 25A, and 25B. The joining surface Ma of the first housing 10 and the joining surface Mb of the second housing 30 have curved surfaces Ma1 and Mb1 in at least a portion of them.
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