Electronic devices

The electronic device design addresses vibration resistance and miniaturization challenges by incorporating a housing with a storage chamber and cooling water channel, enabling secure fixation and efficient cooling.

JP2026085933APending Publication Date: 2026-05-26ASTEMO LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
ASTEMO LTD
Filing Date
2024-11-14
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing electronic devices using immersion boiling cooling methods face challenges in ensuring vibration resistance and miniaturization, particularly when mounted on moving objects like vehicles, due to the need for a structure that fixes the circuit board within the housing, which increases device size.

Method used

An electronic device design that includes a housing with a storage chamber for liquid refrigerant and a cooling water channel, securely fixing the circuit board and electronic components, allowing for miniaturization while maintaining effective cooling through immersion boiling.

Benefits of technology

The design achieves miniaturization of electronic devices while ensuring secure fixation of the circuit board and components, enhancing vibration resistance and cooling efficiency.

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Abstract

This invention provides an immersion boiling cooling method electronic device that can be miniaturized while securely fixing a housing that stores liquid refrigerant and a circuit board on which electronic components are mounted and immersed in the liquid refrigerant within the housing. [Solution] An electronic device comprising a circuit board on which electronic components are mounted, a housing fixed on the main surface of the circuit board so as to cover the mounting positions of the electronic components and forming a storage chamber for storing liquid refrigerant between itself and the circuit board, and a cooling water channel which together with the storage chamber constitutes the housing and carries cooling water to cool the boiling refrigerant that has been boiled by the heat generated by the electronic components immersed in the liquid refrigerant in the storage chamber.
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