Winding electrode
The wound electrode body design addresses winding loosening by using thermosetting resin substrates in cured and semi-cured states to maintain structural integrity and prevent breakage.
JP2026086054APending Publication Date: 2026-05-26TOYOTA JIDOSHA KK +1
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2024-11-14
- Publication Date
- 2026-05-26
AI Technical Summary
Technical Problem
Conventional wound electrode bodies using resin substrates for supporting active material layers face issues with circumferential creep and winding loosening due to the properties of the resin substrate.
Method used
A wound electrode body design where first and second electrode members are wound in a flat shape via a separator, with thermosetting resin substrates in a cured state in flat portions and semi-cured state in curved portions, and a thermosetting temperature higher than 110°C to maintain the wound structure.
Benefits of technology
The design effectively suppresses winding loosening and breakage by controlling the resin substrate's elongation, ensuring the wound electrode body maintains its structure under load.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure 2026086054000001_ABST
Abstract
To provide a wound electrode body that can suppress winding loosening. [Solution] A wound electrode body 10 is provided in which a first electrode member 11A and a second electrode member 11B are wound in a flat shape via a separator 12, and has a pair of flat portions 91 and a pair of curved portions 92 connecting the ends of the pair of flat portions 91, wherein the first electrode member 11A includes a first resin substrate 110, a first conductive layer provided on the surface of the first resin substrate 110, and a first active material layer 200A provided on the main surface of the first conductive layer on the side opposite to the side where the first resin substrate is located relative to the first conductive layer, the first resin substrate 110 is made of a thermosetting resin, the portion 111 of the first resin substrate 110 located on the pair of flat portions 91 is in a hardened state where the thermosetting resin has hardened, and the portion 112 of the first resin substrate 110 located on the pair of curved portions 92 includes a semi-hardened portion where the thermosetting resin is in a semi-hardened state.
Need to check novelty before this filing date? Find Prior Art