Degradation prediction system, degradation prediction method, and electronic device

The degradation prediction system addresses the cost and throughput issues of existing failure prediction methods by using a variable power supply to detect minimum operational voltages, enabling accurate component degradation assessment without additional hardware, thus optimizing maintenance.

JP2026086098APending Publication Date: 2026-05-26HITACHI LTD
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Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
HITACHI LTD
Filing Date
2024-11-14
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing methods for predicting the failure time of electronic devices require monitoring circuits for each component, increasing manufacturing costs and potentially reducing throughput due to interruptions in main operations.

Method used

A degradation prediction system that includes a variable output voltage power supply circuit and control circuit to gradually lower power supply voltage, detecting the minimum voltage at which semiconductor components can operate normally, and a terminal device to determine component degradation based on temperature and voltage changes.

Benefits of technology

Enables the detection of component deterioration without implementing monitoring circuits, allowing for timely replacement of circuit boards and optimizing maintenance schedules.

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Abstract

This allows users to easily check for deterioration of electronic device components without having to implement monitoring circuits in the electronic device itself. [Solution] A degradation prediction system comprising an electronic device and a terminal device, wherein the electronic device comprises a semiconductor component, a variable output voltage power supply circuit for supplying power to the semiconductor component, and a control circuit for controlling the variable output voltage power supply circuit, the control circuit controls the variable output voltage power supply circuit to gradually lower the power supply voltage supplied to the semiconductor component and detect the minimum power supply voltage at which the semiconductor component can operate normally, and the terminal device determines whether or not the semiconductor component is degraded based on at least one of the shipping specification temperature versus minimum power supply voltage, which represents the change in the minimum power supply voltage in response to temperature changes as a shipping specification of the semiconductor component, and a first minimum power supply voltage detected from the electronic device before shipment, and a second minimum power supply voltage detected from the electronic device after shipment and operation.
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