Semiconductor package with bumps

Abstract

To provide a semiconductor package with improved reliability and a method for forming the same. [Solution] The semiconductor package includes a wiring structure 21 having a first surface 21S1 forming a flat surface, a second surface 21S2 facing the first surface, and a first electrode 31 on the first surface. The second surface includes a recessed area superimposed on the first electrode. A first bump 63 is provided on the first surface of the wiring structure and in contact with the first electrode, the first bump including a first conductive pillar 65 on the first electrode and a first solder 64 on the first conductive pillar. The horizontal width W3 of the first conductive pillar may be smaller than the first electrode. A semiconductor chip 91 is placed on the second surface.

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