support device

JP2026089035APending Publication Date: 2026-05-29GUDENG PRECISION IND CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
GUDENG PRECISION IND CO LTD
Filing Date
2025-11-14
Publication Date
2026-05-29

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  • Figure 2026089035000001_ABST
    Figure 2026089035000001_ABST
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Abstract

The present invention provides a support device that is assembled in a semiconductor container and used to mount a semiconductor substrate. [Solution] A support device to be placed inside a semiconductor container, comprising a main body 1 having opposing upper surface 11 and lower surface 12, and a mounting body 2 provided on the upper surface of the main body, wherein the mounting body includes a common mounting section 2a, a first mounting section 2b, and a second mounting section 2c, and the semiconductor substrate is placed in the common mounting section and the first mounting section or the common mounting section and the second mounting section according to the design of the semiconductor substrate.
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