support device
JP2026089035APending Publication Date: 2026-05-29GUDENG PRECISION IND CO LTD
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- GUDENG PRECISION IND CO LTD
- Filing Date
- 2025-11-14
- Publication Date
- 2026-05-29
Smart Images

Figure 2026089035000001_ABST
Abstract
The present invention provides a support device that is assembled in a semiconductor container and used to mount a semiconductor substrate. [Solution] A support device to be placed inside a semiconductor container, comprising a main body 1 having opposing upper surface 11 and lower surface 12, and a mounting body 2 provided on the upper surface of the main body, wherein the mounting body includes a common mounting section 2a, a first mounting section 2b, and a second mounting section 2c, and the semiconductor substrate is placed in the common mounting section and the first mounting section or the common mounting section and the second mounting section according to the design of the semiconductor substrate.
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