Molding apparatus, planarizing apparatus, molding method, and method for manufacturing articles

Abstract

This provides a new technology for molding molding materials. [Solution] A molding apparatus comprising: an adhesion layer forming unit that forms an adhesion layer on a substrate; a supply unit that supplies droplets of molding material to the substrate; an image acquisition unit that acquires an image of the droplets of molding material supplied to the substrate on which the adhesion layer has been formed; and a control unit that determines the conditions for forming the adhesion layer in the adhesion layer forming unit based on the image.

Claims

1. An adhesion layer forming section that forms an adhesion layer on the substrate, A supply unit that supplies droplets of molding material to the substrate, An image acquisition unit that acquires an image of droplets of the molding material supplied to the substrate on which the adhesion layer is formed, A control unit that determines the conditions for forming the adhesion layer in the adhesion layer forming section based on the aforementioned image, A molding apparatus characterized by comprising:

2. The molding apparatus according to claim 1, wherein the aforementioned image is an image of a plurality of liquid droplets discretely arranged on a substrate on which the adhesion layer is formed.

3. The molding apparatus according to claim 1, which acquires information about abnormal droplets in the aforementioned image.

4. The planarization apparatus according to claim 1, which acquires information regarding the contact angle of droplets of the molding material from the aforementioned image.

5. The molding apparatus according to claim 1, which obtains at least one piece of information from the aforementioned image, namely the position, area, spread shape, and volume of the droplets of the molding material.

6. The molding apparatus according to claim 5, which acquires information on the position, area, spread shape, and volume of droplets of the molding material from the aforementioned image.

7. The molding apparatus according to claim 2, wherein the conditions for forming the adhesion layer include the conditions for supplying the adhesive material that forms the adhesion layer.

8. The molding apparatus according to claim 7, wherein the supply conditions for the adhesive are at least one of the application temperature of the adhesive, application time, application area, and composition of the adhesive.

9. The molding apparatus according to claim 3, wherein the conditions for forming the adhesion layer are determined such that the number of abnormal droplets measured is below a threshold.

10. The molding apparatus according to claim 1, wherein the conditions for forming the adhesion layer are determined using the relationship between the contact angle of the droplets of the molding material and the conditions for forming the adhesion layer.

11. The molding apparatus according to any one of claims 1 to 9, wherein the molding material is a planarizing material for planarizing a substrate, and the molding apparatus is a planarizing apparatus for planarizing a substrate.

12. The molding apparatus according to claim 1, further comprising: a mold holding section for holding a mold to be in contact with the molding material disposed on the substrate; and a curing section for curing the molding material while the mold and the molding material are in contact.

13. The molding apparatus according to claim 1, wherein the adhesion layer forming section is located outside the frame of the molding apparatus.

14. A process of forming an adhesion layer on a substrate, A process of supplying droplets of molding material to a substrate, The process includes obtaining the state of droplets of the molding material supplied to the substrate on which the adhesion layer is formed, A molding method for determining the conditions for forming the adhesion layer in the step of forming the adhesion layer, based on the state of the liquid droplets.

15. The molding method according to claim 14, further comprising the step of obtaining the relationship between the state of the liquid droplets placed on the substrate and the state of the adhesion layer.

16. The molding method according to claim 14, wherein the conditions for forming the adhesion layer are determined using the relationship between the contact angle of the droplets of the molding material and the conditions for forming the adhesion layer.

17. A molding step of forming a substrate by the molding method described in claim 14, The process includes processing the substrate after the molding process, A method for manufacturing an article, characterized by obtaining an article from the substrate that has undergone the processing step.

18. A molding step of molding a substrate using the molding apparatus described in claim 1, The process includes processing the substrate after the molding process, A method for manufacturing an article, characterized by obtaining an article from the substrate that has undergone the processing step.

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