Pickup device

Abstract

To provide a highly reliable and highly efficient pickup device. [Solution] The system includes a pickup means for picking up chips attached to the upper surface of a sheet, and an imaging means for imaging a part of the pickup means. The chip pushing device has a protruding part located near the upper surface of the chip pushing device and protruding from the side of the chip pushing device, and an identifier attached to the protruding part for identifying information about the chip pushing device. The imaging means identifies the identifier and obtains information about the chip pushing device from the identification information obtained, and further controls the movement of the chip pushing device based on the information about the chip pushing device.

Description

[Technical Field]

[0001] This disclosure relates to a pickup device that uses pins to push up and pick up chips supplied in an arranged state on an adhesive sheet from below. [Background technology]

[0002] A pickup device works by using pins to push up chips supplied on an adhesive sheet, which are then picked up (held) by a nozzle or other holder. Another known pickup device uses a tip-pushing device that contacts the underside of the adhesive sheet to suction the sheet with a vacuum while pushing up the pins, thereby separating the chips from the adhesive sheet.

[0003] The pickup device described in Patent Document 1 includes a chip ejector having an identifier, and has a configuration that reads information such as the type and dimensions of the chip ejector stored in the identifier via a camera, and restricts the movement of the chip ejector based on the said information. With this configuration, the movement of the chip ejector can be restricted based on the dimensions of the chip ejector that is actually used, and contact of the chip ejector with other components can be avoided. [Prior art documents] [Patent Documents]

[0004] [Patent Document 1] International Publication No. 2022 / 254703 [Overview of the Initiative] [Problems that the invention aims to solve]

[0005] However, in such a pickup device, the identifier is located on the surface that the chip pusher contacts with the sheet. As a result of repeated pickups, the identifier and the sheet rub against each other repeatedly, causing the identifier to wear down. Consequently, there was a problem in that the accuracy of reading the identifier decreased with each repeated pickup.

[0006] Therefore, the present invention aims to provide a pickup device that suppresses wear on identifiers and has high reading accuracy. [Means for solving the problem]

[0007] The present invention provides a pickup device comprising: a pickup means for picking up a chip attached to the upper surface of a sheet; and an imaging means for imaging a part of the pickup means. The pickup means includes a pickup head for picking up the chip from the sheet, a sheet holding part for holding the sheet in an expanded state, and a chip pushing device that contacts the sheet from below to support the chip, a moving mechanism for relatively moving the chip pushing device and the sheet holding part so that the chip pushing device is positioned below the chip, and a control unit for controlling the movement by the moving mechanism. The chip pushing device is provided with a protruding part located near the upper surface of the chip pushing device and protruding from the side surface of the chip pushing device, and an identifier attached to the upper surface of the protruding part for identifying information about the chip pushing device. The control unit obtains information about the chip pushing device from identification information obtained by identifying the identifier with the imaging means, and further controls the relative positional relationship between the chip pushing device and the sheet holding part based on the information about the chip pushing device, with the upper surface of the protruding part positioned below the upper surface of the chip pushing device. [Effects of the Invention]

[0008] The pickup device described herein can achieve pickup with high reading accuracy. [Brief explanation of the drawing]

[0009] [Figure 1] Configuration explanatory diagram of the main part of the pickup device [Figure 2] Block diagram showing the configuration of the pickup device [Figure 3] Perspective view showing the state where the chip pushing-up device has descended [Figure 4] Cross-sectional view of the chip pushing-up device and the ring frame carrier [Figure 5] Explanatory diagram showing the state where the pin has pushed up the chip [Figure 6] Plan view of the chip pushing-up device [Figure 7] Partial cross-sectional view of the chip pushing-up device [Figure 8] Plan view explaining the state where the protruding part interferes with the sheet holding part [Figure 9] Plan view explaining various numerical values in the collision control [Figure 10] Plan view related to the first control method [Figure 11] Plan view related to the second control method [Figure 12] Flowchart related to the first control method [Figure 13] Flowchart related to the second control method

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments of the working device according to the present disclosure will be described based on the drawings. Note that all the embodiments disclosed below are examples and are not intended to limit the working device according to the present disclosure. Also, in the embodiments disclosed below, detailed descriptions that are not necessary may be omitted. For example, detailed descriptions of well-known matters and overlapping descriptions of substantially the same configurations may be omitted. This is to avoid making the description unnecessarily redundant and to facilitate the understanding of those skilled in the art.

[0011] (Embodiment 1) (Outline of the Pickup Device) First, the configuration of the main parts of the pickup device 1 will be explained with reference to Figures 1 to 4. In Figures 1 and 2, a Y-table 3 is positioned on the base 2 of the pickup device 1 to move the X-table 4 in the Y-axis direction. The X-table 4 moves the chip pushing device 20, which will be described later, in the X-axis direction. The Y-table 3 and X-table 4 are controlled by a control unit 5 provided in the pickup device 1.

[0012] In Figures 1 and 4, a cylindrical sheet holder 6 is positioned above the X table 4. The sheet holder 6 has an open top and an annular edge 6a is formed on the top. The chip push-up device 20 moves in the X-axis and Y-axis directions inside the sheet holder 6. A ring frame carrier holder 7 is positioned above the sheet holder 6. The ring frame carrier holder 7 has the function of holding the ring frame carrier 8.

[0013] The ring frame carrier 8 has an annular ring frame 9 and a stretchable adhesive sheet 10 held by the ring frame 9. Multiple chips 11, which are formed by cutting a wafer into individual pieces, are held on the upper surface (adhesive surface) of the adhesive sheet 10.

[0014] In Figures 1 and 2, a pickup head 12 and an imaging device 18 are positioned above the ring frame carrier holding section 7. For example, a camera can be used as the imaging device 18. The pickup head 12 comprises a plurality (four in this case) of shafts 14, each having a holder 13 at its lower end for holding a chip 11, and a shaft lifting mechanism (not shown) for raising and lowering the shafts 14. The pickup device 1 also includes a pickup head moving mechanism 15 for moving the pickup head 12 horizontally (in the X-axis and Y-axis directions).

[0015] The shaft lifting mechanism and the pickup head moving mechanism 15 are controlled by the control unit 5. The control unit 5 controls the shaft lifting mechanism and the pickup head moving mechanism 15 to move the pickup head 12 horizontally, lower the shaft 14 to bring the holder 13 into contact with the chip 11 held on the adhesive sheet 10, and hold the chip 11 in the holder 13, and then raise the shaft 14 to pick up the chip 11 from the adhesive sheet 10. The control unit 5 also controls the shaft lifting mechanism and the pickup head moving mechanism 15 to place (transfer) the chip 11 that the holder 13 was holding onto the pickup head 12 that was holding the chip 11 onto a tray, substrate, intermediate stage, etc. (not shown).

[0016] In Figure 4, the imaging device 18 is configured to image the ring frame carrier 8 from above and is movable in both the X-axis and Y-axis directions by the control unit 5. The imaging device 18 images the chip 11 to be picked up and acquires the image. The control unit 5 controls the pickup head movement mechanism 15 based on the position of the chip 11 recognized by the image recognition device equipped with the imaging device 18.

[0017] (Explanation of the sheet holder) Next, in Figures 2 and 4, the pickup of the chip 11 on the adhesive sheet 10 is performed with the ring frame carrier holding unit 7 expanding the adhesive sheet 10 using the sheet holding unit 6. Now, the sheet expansion process of the adhesive sheet 10 by the ring frame carrier holding unit 7 will be described. The ring frame carrier holding unit 7 is equipped with a ring frame retainer 17 that moves up and down by a ring frame retainer lifting mechanism 16 controlled by the control unit 5.

[0018] In Figure 4, during the sheet expansion process of the adhesive sheet 10, the ring frame carrier 8 is first placed on the sheet holding section 6 so as to contact the edge 6a of the sheet holding section 6. In this state, in a plan view, the adhesive sheet 10 between the multiple chips 11 on the adhesive sheet 10 and the ring frame 9 is located at the edge 6a of the sheet holding section 6. Next, the control unit 5 controls the ring frame retainer lifting mechanism 16 to lower the ring frame retainer 17.

[0019] As the ring frame retainer 17 descends, it comes into contact with the ring frame 9 from above. As the ring frame retainer 17 descends further, the ring frame carrier 8 descends together with the ring frame retainer 17, and the ring frame 9 descends to a position lower than the height of the edge 6a of the sheet holding portion 6 (the state shown in Figure 4). In this state, the adhesive sheet 10 is pulled and expanded toward the outer circumference.

[0020] (Explanation of the chip pushing device) Next, the configuration of the chip pushing device 20 will be described with reference to Figures 2, 3, and 5 to 7. The chip pushing device 20 has the function of pushing up the chips 11 supplied in a multiple-piece arrangement on the adhesive sheet 10 from the lower surface of the adhesive sheet 10, and assisting the holder 13 in holding the chips 11 (see Figure 5). In Figure 5, the chips 11 are supported by piercing the adhesive sheet 10, but the chips 11 may also be lifted without piercing. In addition, the pickup device 1 is usually configured to allow the replacement of multiple types of chip pushing devices 20 with different dimensions, etc., and is used appropriately depending on the type of chip 11. Figure 7 is a part of the AA cross section in Figure 6.

[0021] In Figures 3 and 7, the chip pushing device 20 comprises a cylindrical body 21 having an internal space 21a, and a cap 22 attached to the upper part 21b of the cylindrical body 21, with an upper surface 22a that contacts the adhesive sheet 10, and a plurality (in this case, 5) of through holes 22b opening in the upper surface 22a. The upper part 21b of the cylindrical body 21 has a plurality of through holes 21c formed at positions corresponding to the through holes 22b of the cap 22 when the cap 22 is attached to the cylindrical body 21.

[0022] An air passage 22e is formed inside the cap 22 in the radial direction of the upper surface 22a. The air passage 22e extends downward at the protrusion 25 and opens into a passage opening 22g on the lower surface 25a of the protrusion 25. One end of the pipe 26 is connected upward to the passage opening 22g. Negative pressure, atmospheric pressure, and positive pressure are supplied to the pipe 26, as will be described later.

[0023] In Figures 6 and 7, when the adhesive sheet 10 is in contact with the upper surface 22a of the cap 22 and negative pressure is supplied to the air passage 22e from the piping 26, the adhesive sheet 10 is attracted to the upper surface 22a of the cap 22. Furthermore, when atmospheric pressure or positive pressure is supplied to the piping 26 while the adhesive sheet 10 is attracted to the upper surface 22a of the cap 22, the vacuum is broken and the adhesive sheet 10 separates from the upper surface 22a of the cap 22.

[0024] Thus, the cap 22 is attached to the upper part 21b of the cylindrical body 21 and has an upper surface 22a that contacts the adhesive sheet 10, a through hole 22b opening in the upper surface 22a, and an air passage 22e that introduces negative pressure to the upper surface 22a. The cap 22 also has a protruding portion 25 that extends horizontally in part, and the air passage 22e is connected from the passage opening 22g on the lower surface 25a of the protruding portion 25 to the upper surface 22a, with one end of the pipe 26 connected upward to the passage opening 22g.

[0025] Furthermore, in Figure 7, the chip pushing device 20 is equipped with multiple pins 23 that sequentially penetrate the through hole 21c of the cylindrical body 21 and the through hole 22b of the cap 22 from below, and protrude upward from the through hole 22b of the cap 22 to push up the chip 11 on the adhesive sheet 10. The pins 23 are controlled by a pin driving mechanism and control unit 5, which are not shown. Note that the chip pushing device 20 does not necessarily need to have multiple pins; it is sufficient to have at least one pin that protrudes from the through hole 22b to push up the chip 11.

[0026] (Explanation of the identification of the chip pushing device) Next, the identification of the chip pushing device 20 will be explained with reference to Figures 3 and 6.

[0027] As shown in Figures 3 and 6, the protruding portion 25 is marked with an identifier 19. The identifier 19 stores information such as the dimensions and part number of the chip push-up device 20.

[0028] The imaging device 18 images the protruding portion 25 and the identifier 19 when the ring frame carrier 8 is not set. The control unit 5 performs identification processing, such as image processing, on the image of the captured identifier 19 to obtain information about the chip pusher 20 stored in the identifier 19. The acquired information is stored in the memory unit of the control unit 5. The recorded information is also read by the control unit 5 as needed. In this way, by imaging the identifier 19 with the imaging device 18, the currently set chip pusher 20 can be identified.

[0029] By providing the identifier 19 on the protruding portion 25, identification can be performed using the imaging device 18 used to control the pickup head 12. Therefore, identification can be easily performed without providing any special mechanism for identification.

[0030] Furthermore, the upper surface of the protrusion 25 to which the identifier 19 is attached may be located below the upper surface 22a. With this configuration, when the upper surface 22a comes into contact with the adhesive sheet 10 during pickup, the upper surface of the protrusion 25 to which the identifier 19 is attached is less likely to come into contact with the adhesive sheet 10, thereby preventing the identifier 19 from becoming faded or damaged due to wear.

[0031] Furthermore, the upper surface 22a is provided with through holes 22b for the pins 23 and a mechanism for adsorbing the adhesive sheet 10. Therefore, by attaching the identifier 19 to the protruding portion 25 instead of the upper surface 22a, design flexibility for the chip pushing device 20 can be ensured.

[0032] (Collision avoidance between the chip pushing device and the sheet holding part) In Figures 4 and 8, the pickup device 1 raises the chip pushing device 20 until it contacts the adhesive sheet, and moves it in a direction that aligns the chips 11 on the adhesive sheet 10, while the holder 13 of the pickup head 12 picks up (holds) the chips 11. However, since the chip pushing device 20 is in a raised position, there is a problem that the chip pushing device 20 and the sheet holding part 6 may collide.

[0033] For example, when picking up a chip 11 located on the outer circumference of the protruding portion 25 (the rightmost chip 11 in Figure 4, and the lowermost chip 11 in Figure 8), the chip pushing device 20 needs to be moved to near the periphery, which can cause the chip pushing device 20 to collide with the sheet holding portion 6. In other words, there is a region B1 (the area hatched diagonally in Figure 8) where the protruding portion 25 collides with the sheet holding portion 6.

[0034] Therefore, collision avoidance between the chip pushing device 20 and the sheet holding unit 6 is achieved by performing the following control.

[0035] The area where the protruding portion 25 and the seat holding portion 6 collide is determined according to the shape of the protruding portion 25, the amount of protrusion, and other factors, and is not limited to the position, size, or shape of area B1 shown in Figure 8. The collision avoidance control described below is applicable even when the area where the protruding portion 25 and the seat holding portion 6 collide has a different position, size, or shape from area B1 shown in Figure 8.

[0036] Collision avoidance control of the chip pushing device 20 and the sheet holding unit 6 will be explained using Figures 6 and 9 to 11.

[0037] In Figure 6, let C be the center of the upper surface 22a of the chip pushing device 20, and let D1 be the distance between center C and the farthest point on the upper surface 22a. If the upper surface 22a is circular, the distance D1 will be the same as the radius of the upper surface 22a. Also, when the upper surface 22a is viewed from above, let D2 be the distance between the center C and the point on the plane containing the upper surface 22a that coincides with the farthest point of the protrusion 25 from center C.

[0038] Figure 9 is a plan view when the chip pushing device 20 is located below the ring frame carrier 8. For simplicity, the chips 11 are omitted. Let O be the center of the expanded ring frame carrier 8 and sheet holding section 6, and let L be the distance from center O to the inside of the sheet holding section 6. The X and Y axes each pass through center O, forming a Cartesian coordinate system with center O as the origin. Let P be a point on the ring frame carrier 8 such that the line segment connecting it to center C is parallel to the Z axis, and let the coordinates of point P be (x1, y1).

[0039] At this time, information related to the chip pushing-up device 20 (such as distance D1, distance D2, etc.) is stored directly or indirectly in the identifier 19. Also, information related to the ring frame carrier 8 (such as distance L, etc.) may be stored directly or indirectly in the identifier attached to the ring frame carrier 8, or may be measured by image recognition by the imaging device 18, or may be numerically input in advance. Further, information related to the relative positional relationship between the chip pushing-up device 20 and the ring frame carrier 8 (such as the coordinates (x1, y1) of point P, etc.) may be obtained by the control unit 5 and the movement amounts of the Y table 3 and the X table 4.

[0040] The first control method will be described using FIG. 10. In the first control method, the distance D2 is used.

[0041] In the first control method, always (L - D2) 2 ≧ x1 2 + y1 2 The control of the chip pushing-up device 20 is performed so that. (L - D2) 2 < x1 2 + y1 2 If this is the case, the chip pushing-up device 20 and the sheet holding portion 6 will collide. Therefore, always (L - D2) 2 ≧ x1 2 + y1 2 By setting it like this, collision avoidance can be achieved.

[0042] Also, in the first control method, regardless of the coordinates (x1, y1) of point P, collision avoidance between the chip pushing-up device 20 and the sheet holding portion 6 can always be achieved. Therefore, it is possible to perform collision avoidance control with simple control.

[0043] On the other hand, in the first control method, depending on the combination of the ring frame carrier 8 and the chip pushing-up device 20, among the plurality of chips 11 arranged on the adhesive sheet 10, the pickup of the chips 11 located on the outer periphery may not be possible. That is, as shown in FIG. 10, in the first control method, a non-pickup area B2 for the chip 11 occurs.

[0044] Therefore, using the second control method described in FIG. 11, the chips within region B2 can also be picked up. In the second control method, collision avoidance control is performed using distance D1 in a certain region and distance D2 in another region.

[0045] In FIG. 11, in the second control method, a boundary value Yh is set, and in the region where the y - coordinate y1 of the coordinates (x1, y1) of point P satisfies y1 ≧ Yh, the control of the chip pushing - up device 20 is performed such that 2 (L - D1) 2 ≧ x1 2 + y1 2 Here, the boundary value Yh is an arbitrary value within the range where the chip pushing - up device 20 does not collide with the ring - frame carrier 8.

[0046] At this time, if the chip pushing - up device 20 is controlled such that (L - D1) 2 ≧ x1 2 + y1 2 is always satisfied for all (x1, y1), the ring - frame carrier 8 and the chip pushing - up device 20 will collide. Therefore, in the region where y1 < Yh, similar to the first control method, the control of the chip pushing - up device 20 is performed such that (L - D2) 2 ≧ x1 2 + y1

[0047] By performing control in this way, while avoiding collision of the chip pushing - up device 20, the chips in region B3 of FIG. 12 can be picked up. Thus, the chips located in the range where y1 ≧ Yh in region B2 can be picked up, and compared with the first control method, more chips can be picked up.

[0048] Furthermore, by combining the second control method with the sheet rotation process, the chips located in the range where y1 < Yh in region B2 can also be picked up.

[0049] First, using the second control method, while moving the chip pushing-up device 20 and the pickup head 12, pick up the chips in area B3. Next, rotate the sheet holding unit 6 and the ring frame carrier 8 by 180° to move the chips located in the range of y1 < Yh in area B2, which could not be picked up before rotation, to the area where y1 ≥ Yh (sheet rotation step). Then, while moving the chip pushing-up device 20 and the pickup head 12, pick up the remaining chips. Thus, by using the sheet rotation step, all of the plurality of chips 11 arranged on the adhesive sheet 10 can be picked up by the pickup head 12.

[0050] Thus, by combining the second control method and the sheet rotation step, it becomes possible to pick up the chips located at the outer edge of the adhesive sheet 10 while performing collision avoidance control.

[0051] Note that in the above description, the control in which only the chip pushing-up device 20 moves has been explained, but actually, it is only necessary that the chip pushing-up device 20 and the sheet holding unit 6 perform relative movement. That is, any of the control in which only the chip pushing-up device 20 moves, the control in which only the sheet holding unit 6 moves, or the control in which both the chip pushing-up device 20 and the sheet holding unit 6 move may be used.

[0052] Also, when the chip pushing-up device 20 remains lowered and there is no risk of collision between the chip pushing-up device 20 and the sheet holding unit 6, there is no need to perform collision avoidance control.

[0053] (Operation Explanation) Using FIG. 12, an example of the operation of the pickup device 1 in the movement availability determination of the first control method will be described.

[0054] First, the control unit 5 sets the position of the chip to be picked up by the chip pushing-up device 20 as the movement destination and acquires the coordinates (x1, y1) (S101).

[0055] Next, the control unit 5 reads the information stored in the memory unit, either directly or indirectly, that is stored in the identifier 19, and obtains the distance D2 (S102).

[0056] Next, the control unit 5 uses the coordinates (x1, y1) obtained in S101 and the distance D2 obtained in S102 to calculate (L-D2) 2 ≥x1 2 +y1 2 Perform the calculation (S103).

[0057] The control unit 5 determines whether the equation calculated in S103 is true or false and performs collision avoidance control (S104).

[0058] When the control unit 5 determines that the equation calculated in S103 is true, it permits the chip pushing device 20 to move to the coordinates of the planned destination and terminates the process.

[0059] Conversely, if the control unit 5 determines that the formula calculated in S103 is false, it does not permit the chip pushing device 20 to move to the coordinates of the planned destination and terminates the process.

[0060] If the movement is not permitted during the movement feasibility check, the destination may be changed to another chip, and the movement feasibility check may be performed again. Similarly, if the movement is not permitted during the movement feasibility check, the system may be configured to stop operation and issue a warning to call an operator.

[0061] Next, using Figure 13, we will explain an example of the operation of the pickup device 1 in determining whether movement is possible or not using the second control method.

[0062] First, the control unit 5 sets the position of the chip to be picked up by the chip pushing device 20 as the planned destination and obtains the coordinates (x1, y1) (S201).

[0063] Next, the control unit 5 determines whether the equation y1 ≥ Yh is true or false based on the y-coordinate y1 obtained in S201 (S202). If the control unit 5 determines that the equation calculated in S202 is true, the process proceeds to S203; otherwise, it proceeds to S206.

[0064] If it is determined in S202 that the condition is met, and the process proceeds to S203, the control unit 5 reads the information stored in the memory unit, either directly or indirectly, in the identifier 19, and obtains the distance D1.

[0065] Subsequently, the control unit 5 uses the coordinates (x1, y1) obtained in S201 and the distance D1 obtained in S203 to calculate (L-D1) 2 ≥x1 2 +y1 2 Perform the calculation (S204).

[0066] The control unit 5 determines whether the equation calculated in S204 is true or false and performs collision avoidance control (S205).

[0067] When the control unit 5 determines that the equation calculated in S205 is true, it permits the chip pushing device 20 to move to the coordinates of the planned destination and terminates the process.

[0068] Conversely, if the control unit 5 determines that the formula calculated in S205 is false, it does not permit the chip pushing device 20 to move to the coordinates of the planned destination and terminates the process.

[0069] Furthermore, if it is determined in S202 that the condition is not met and the process proceeds to S206, the control unit 5 reads the information stored in the memory unit, either directly or indirectly, in the identifier 19, and obtains the distance D2.

[0070] Subsequently, the control unit 5 uses the coordinates (x1, y1) obtained in S201 and the distance D2 obtained in S206 to calculate (L-D2) 2 ≥x1 2 +y1 2 Perform the calculation (S207).

[0071] The control unit 5 determines whether the equation calculated in S207 is true or false and performs collision avoidance control (S208).

[0072] When the control unit 5 determines that the equation calculated in S207 is true, it permits the chip pushing device 20 to move to the coordinates of the planned destination and terminates the process.

[0073] Conversely, if the control unit 5 determines that the formula calculated in S207 is false, it does not permit the chip pushing device 20 to move to the coordinates of the planned destination and terminates the process.

[0074] If the movement is not permitted during the movement feasibility check, the destination may be changed to another chip, and the movement feasibility check may be performed again. Similarly, if the movement is not permitted during the movement feasibility check, the system may be configured to stop operation and issue a warning to call an operator.

[0075] (Effects of the invention) In the pickup device 1 according to Embodiment 1, an identifier 19 is provided on the protruding portion 25. This allows identification to be performed using the imaging device 18 used to control the pickup head 12, thus enabling easy identification without the need for a special mechanism.

[0076] Furthermore, since the upper surface 22a is provided with through holes 22b for the pins 23 and a mechanism for adsorbing the adhesive sheet 10, attaching the identifier 19 to the protruding portion 25 instead of the upper surface 22a ensures design flexibility for the chip pushing device 20.

[0077] Furthermore, in the pickup device 1 according to Embodiment 1, the upper surface of the protruding portion 25 to which the identifier 19 is attached is located below the upper surface 22a. With this configuration, when the upper surface 22a comes into contact with the adhesive sheet 10 during pickup, the upper surface of the protruding portion 25 to which the identifier 19 is attached is less likely to come into contact with the adhesive sheet 10, thereby preventing the identifier 19 from becoming faded or damaged due to wear.

[0078] Furthermore, in the pickup device 1 according to Embodiment 1, collision avoidance control (first control method, second control method) is performed based on the information stored in the identifier 19.

[0079] In the first control method, (L-D2) 2 ≥x1 2 +y1 2 The chip pushing device 20 is controlled to achieve the following. In the first control method, (L-D2) 2 ≥x1 2 +y1 2 If the coordinates (x1, y1) satisfy the condition, collision avoidance between the chip pushing device 20 and the sheet holding unit 6 can always be performed. Therefore, collision avoidance control can be performed with simple control.

[0080] In the second control method, when y1 ≥ Yh, (L-D1) 2 ≥x1 2 +y1 2 , y1 <Yhであるときは(L-D2) 2 ≥x1 2 +y1 2 The chip pushing device 20 is controlled in such a manner. As a result, while collision avoidance control is performed, it becomes possible to pick up chips located on the outer edge of the adhesive sheet 10 that cannot be picked up with the first control method.

[0081] Furthermore, by combining the second control method with the sheet rotation process, it becomes possible to pick up chips over an even wider area on the adhesive sheet 10.

[0082] These configurations contribute to high reading accuracy in the pickup device 1 according to Embodiment 1. Furthermore, the chip can be picked up without the chip pushing device 20 and the sheet holding unit 6 colliding.

[0083] (Other examples) In the pickup device 1 according to Embodiment 1, the ring frame carrier and the sheet holding part are separate, and the case where the ring frame carrier is pressed against the sheet holding part and expanded has been described. However, a pre-expanded type ring frame carrier may also be used, in which the ring frame carrier side has the sheet holding part and the sheet is already set in an expanded state.

[0084] Furthermore, various types of identifiers 19 can be used. For example, one-dimensional codes such as barcodes or two-dimensional codes may be used as identifiers 19. [Industrial applicability]

[0085] The pickup device of the present invention is highly reliable, has the effect of improving pickup efficiency, and is useful in the field of removing chips from adhesive sheets and mounting them onto substrates. [Explanation of symbols]

[0086] 1. Pickup device 2 bases 3 Y-table 4 X Table 5. Control Unit 6. Sheet holding section 6a Edge 7. Ring frame carrier holding section 8-Ring Frame Carrier 9 Ring Frame 10 Adhesive Sheets 11 chips 12 Pickup heads 13 Holder 14 shafts 15. Pickup head movement mechanism 16. Ring frame retaining lifting mechanism 17 Ring frame retainer 18 Imaging device 19 Identifiers 20 Chip pushing device 21. Cylindrical body 21a Interior space 21b Upper part 21c through hole 22 caps 22a Top side 22b Through hole 22e Airflow channel 22g flow channel opening 23 pins 25 Protrusion 25a Bottom side 26 Piping

Claims

1. A pickup mechanism for picking up chips attached to the top surface of a sheet, The system includes an imaging means for imaging a part of the aforementioned pickup means, The aforementioned pickup means is A pickup head unit for picking up the chip from the sheet, It has a sheet holding part that holds the sheet in an expanded state, A chip push-up device that contacts the sheet from below to support the chip, A moving mechanism for relatively moving the chip pushing device and the sheet holding portion so that the chip pushing device is positioned below the chip, It has a control unit that controls the movement by the aforementioned moving mechanism, The aforementioned chip pushing device includes: A protruding portion is positioned near the upper surface of the chip pushing device and protrudes from the side surface of the chip pushing device, An identifier for identifying information of the chip pushing device is provided on the upper surface of the protruding portion, The control unit acquires information about the chip pushing device from the identification information obtained by identifying the identifier with the imaging means, and further controls the relative positional relationship between the chip pushing device and the sheet holding unit based on the information about the chip pushing device. The upper surface of the protrusion is located below the upper surface of the chip pushing device, and is a pickup device.

2. The pickup device according to claim 1, wherein the movement of the chip pushing device is controlled such that the upper surface of the chip pushing device avoids the sheet holding portion.

3. The aforementioned pickup means is The pickup device according to claim 2, further comprising the sheet holding portion and a rotation mechanism for rotating the sheet in the circumferential direction.

4. The pickup device according to claim 1, wherein the movement of the chip pushing device is controlled such that the upper surface of the chip pushing device and the protruding portion avoid the sheet holding portion.

5. The control of the movement of the aforementioned chip pushing device includes: Control such that the upper surface of the chip pushing device avoids the sheet holding portion, The control of the movement of the chip pushing device includes control such that the upper surface of the chip pushing device and the protruding portion avoid the sheet holding portion. The pickup device according to claim 1, wherein any of the control methods can be selected.

6. The chip pushing device has a pickup assisting means that protrudes upward from the chip pushing device when supporting the chip, The pickup assisting means is controlled by pneumatic control, as described in claims 1 to 5.

Images