Electronic device, method for manufacturing an electronic device, and electronic device.

Abstract

To realize high-quality electronic devices. [Solution] The electronic device 1 includes a first electronic component 10 and a second electronic component 20 facing each other, a third electronic component 30 provided between them, a first solder joint 40, and a plurality of second solder joints 50. The third electronic component 30 is provided in a first region 21 that is partly inside the outer edge 20a of the second electronic component 20 in a plan view, and is joined to the second electronic component 20. The first solder joint 40 is provided linearly in a frame-shaped second region 22 that surrounds the first region 21 of the second electronic component 20 in a plan view, and joins the first electronic component 10 and the second electronic component 20. The plurality of second solder joints 50 are provided in a third region 23 that is outside the second region 22 of the second electronic component 20 in a plan view, and join the first electronic component 10 and the second electronic component 20. The stress generated in the electronic device 1 is absorbed at the first solder joint 40, mitigating the effect of the stress on the second solder joint 50 and suppressing its failure.

Claims

1. First electronic component and, A second electronic component facing the first electronic component, A third electronic component is provided between the first electronic component and the second electronic component, and in a plan view, is located within a first region that is partly inside the outer edge of the second electronic component, and is joined to the second electronic component. A first solder joint is provided between the first electronic component and the second electronic component, and is linearly provided within a frame-shaped second region that surrounds the first region of the second electronic component in a plan view, and joins the first electronic component and the second electronic component. A plurality of second solder joints are provided between the first electronic component and the second electronic component, and in a plan view, are located within a third region outside the second region of the second electronic component, and join the first electronic component and the second electronic component. Electronic devices, including those mentioned above.

2. The electronic device according to claim 1, wherein the first solder joint is provided in a continuous linear manner within the frame-shaped second region in a plan view.

3. The electronic device according to claim 1, wherein the first solder joint provided within the frame-shaped second region has a notch that connects the first region side and the third region side.

4. The electronic device according to claim 1, wherein the first electronic component and the second electronic component have different coefficients of thermal expansion.

5. The electronic device according to claim 1, wherein the side surface of the first solder joint extending from the first electronic component to the second electronic component is a flat surface or a surface recessed inward from the first solder joint.

6. The plurality of second solder joints are arranged in the third region at predetermined pitches and intervals in a plan view. The electronic device according to claim 1, wherein, in a plan view, the area of ​​the first solder joint is greater than the total area of ​​the solder joint group if the solder joint group were arranged in the frame-shaped second region at the predetermined pitch and interval.

7. A step of providing a third electronic component between opposing first and second electronic components, which is located in a first region that is partly inside the outer edge of the second electronic component in a plan view, and which is joined to the second electronic component. A step of providing a first solder joint between the first electronic component and the second electronic component, which is provided linearly within a frame-shaped second region surrounding the first region of the second electronic component in a plan view, and which joins the first electronic component and the second electronic component. A step of providing a plurality of second solder joints between the first electronic component and the second electronic component, which are provided in a third region outside the second region of the second electronic component in a plan view, and which join the first electronic component and the second electronic component. A method for manufacturing electronic devices, including

8. First electronic component and, A second electronic component facing the first electronic component, A third electronic component is provided between the first electronic component and the second electronic component, and in a plan view, is located within a first region that is partly inside the outer edge of the second electronic component, and is joined to the second electronic component. A first solder joint is provided between the first electronic component and the second electronic component, and is linearly provided within a frame-shaped second region that surrounds the first region of the second electronic component in a plan view, and joins the first electronic component and the second electronic component. A plurality of second solder joints are provided between the first electronic component and the second electronic component, and in a plan view, are located within a third region outside the second region of the second electronic component, and join the first electronic component and the second electronic component. Electronic equipment that includes electronic devices.

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