Semiconductor device and method for manufacturing a semiconductor device

Abstract

To provide a semiconductor device and a method for manufacturing a semiconductor device that can improve productivity. [Solution] A hollow case body containing a semiconductor element and a hollow cylindrical cap 20 are bonded together. The base 21 of the cap 20 has a side projection 23 that protrudes from its outer surface. When the base 21 of the cap 20 is placed in the recess 31 of the positioning jig 30, the side projection 23 of the base 21 of the cap 20 is fitted into the groove 33 on the inner surface of the recess 31. When adhesive is continuously applied to the second main surface of the base 21 of the cap 20 in a hollow circular shape along the outer circumference, the side projection 23 of the cap 20 catches on the side wall of the groove 33 of the recess 31 of the positioning jig 30, preventing the cap 20 from rotating in the circumferential direction θ, thus improving productivity.

Description

Technical Field

[0001] This disclosure relates to a semiconductor device and a method for manufacturing a semiconductor device.

Background Art

[0002] Patent Document 1 below describes a technique in which a sensor element is housed in a recess of a resin case, and a resin cap having a pressure introduction pipe is adhered to the resin case so as to cover the recess of the resin case, and a space formed between the resin case and the resin cap is used as a pressure detection chamber.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In Patent Document 1 above, when the resin case and the resin cap are adhered to each other by applying an adhesive to the resin cap and aligning the resin case, since the resin cap has a hollow cylindrical shape, when the adhesive is continuously applied in a hollow circular shape along the outer periphery on the main surface of the resin cap, the resin cap connected to the nozzle, which is the discharge port of the adhesive through the adhesive, is pulled in the moving direction of the nozzle and rotates. Therefore, there is a risk that the adhesive cannot be uniformly applied to the resin cap.

[0005] An object of this disclosure is to provide a semiconductor device and a method for manufacturing a semiconductor device that can improve productivity.

Means for Solving the Problems

[0006] A semiconductor device according to one aspect of this disclosure is as follows: It comprises a semiconductor element, a hollow case having an opening for housing the semiconductor element, and a hollow cylindrical lid bonded to the case via an adhesive layer that circularly surrounds the opening, wherein a projection protrudes locally from the surface of the lid.

[0007] Furthermore, a method for manufacturing a semiconductor device according to one aspect of this disclosure is as follows: A first step is performed in which a semiconductor element is housed in a hollow case having an opening. A second step is performed in which a hollow cylindrical lid is housed in a circular planar recess of a positioning jig with its first main surface facing downwards. A third step is performed in which adhesive is continuously applied to the second main surface of the lid housed in the recess of the positioning jig in a hollow circular shape along the outer circumference, surrounding the hollow portion of the lid. A fourth step is performed in which the case is bonded to the second main surface of the lid via the adhesive, connecting the hollow portion of the lid and the opening of the case. The lid has a projection that protrudes locally from the surface facing the inner surface of the recess. The positioning jig has a groove on the inner surface of the recess at a location corresponding to the projection of the lid. In the second step, when housing the lid in the recess of the positioning jig, the projection of the lid is fitted into the groove. [Effects of the Invention]

[0008] The semiconductor device and method for manufacturing the semiconductor device described herein have the effect of improving productivity. [Brief explanation of the drawing]

[0009] [Figure 1] This is a perspective view showing the external appearance of the pressure sensor device according to Embodiment 1. [Figure 2] This is a cross-sectional view showing the cross-sectional structure along the cutting line A-A' in Figure 1. [Figure 3] This is a plan view showing the state of the pressure sensor device according to Embodiment 1 during the manufacturing process. [Figure 4]This is a cross-sectional view showing the state of the pressure sensor device according to Embodiment 1 during the manufacturing process. [Figure 5] This is a cross-sectional view (part 1) showing the state of the cap during the manufacturing process of the pressure sensor device according to Embodiment 1. [Figure 6] This is a cross-sectional view (part 2) showing the state of the cap during the manufacturing process of the pressure sensor device according to Embodiment 1. [Figure 7] This is a cross-sectional view showing the state of the case during the manufacturing process of the pressure sensor device according to Embodiment 1. [Figure 8] Figure 7 is a plan view showing the case as seen from the pressure inlet side. [Figure 9] This is a plan view showing the structure of the pressure sensor device according to Embodiment 2. [Figure 10] This is a plan view showing the state of the pressure sensor device according to Embodiment 2 during the manufacturing process. [Figure 11] This is a perspective view showing the external appearance of the pressure sensor device according to Embodiment 3. [Figure 12] This is a plan view showing the state of the pressure sensor device according to Embodiment 3 during the manufacturing process. [Figure 13] This is a cross-sectional view showing the state of the pressure sensor device according to Embodiment 3 during the manufacturing process. [Figure 14] This is a perspective view showing the external appearance of the pressure sensor device according to Embodiment 4. [Figure 15] This is a plan view showing the state of the pressure sensor device according to Embodiment 4 during the manufacturing process. [Figure 16] This is a cross-sectional view showing the state of the pressure sensor device according to Embodiment 4 during the manufacturing process. [Figure 17] This is a perspective view showing the external appearance of a reference example pressure sensor device. [Figure 18] This flowchart shows an overview of the manufacturing method for a reference example pressure sensor device. [Figure 19] This is a schematic cross-sectional view (Part 1) showing the manufacturing process of a reference example pressure sensor device. [Figure 20]A cross-sectional view schematically showing a state during the manufacture of the pressure sensor device of the reference example (Part 2). [Figure 21] A cross-sectional view schematically showing a state during the manufacture of the pressure sensor device of the reference example (Part 3). [Figure 22] A plan view showing a state of the vicinity of the cap in FIG. 20 as viewed from the upper surface side of the positioning jig. [Figure 23] A cross-sectional view showing a cross-sectional structure at the cutting line AA-AA' in FIG. 22. [Figure 24] A plan view showing another example of the state of the vicinity of the cap in FIG. 20 as viewed from the upper surface side of the positioning jig. [Figure 25] A cross-sectional view showing a cross-sectional structure at the cutting line BB-BB' in FIG. 24.

Embodiments for Carrying Out the Invention

[0010] <Summary of Embodiments of the Present Disclosure> (1) A semiconductor device according to one aspect of this disclosure is as follows. A semiconductor element, a hollow case having an opening for housing the semiconductor element, and a hollow cylindrical lid body that is adhered to the case via an adhesive layer that circularly surrounds the periphery of the opening and is connected to the opening, and a protrusion locally projects from the surface of the lid body.

[0011] According to the above-described disclosure, a semiconductor device having a high adhesive strength between the hollow cylindrical lid body and the case can be provided with high productivity.

[0012] (2) Further, in the semiconductor device according to this disclosure, in (1) described above, the lid body is a hollow molded product, and the width by which the protrusion projects from the surface of the lid body is preferably larger than the height of minute convex portions that unintentionally occur on the surface of the lid body during molding of the lid body.

[0013] According to the disclosure described above, when bonding the lid to the case, the protrusions on the lid prevent the lid from rotating in the circumferential direction when continuously applying adhesive to the hollow cylindrical lid, allowing the adhesive to be applied uniformly.

[0014] (3) In addition, in the semiconductor device relating to this disclosure, in (1) or (2) above, the semiconductor element is a sensor element that converts pressure into an electrical signal, and the cover may have a pressure inlet.

[0015] According to the disclosure described above, by applying a semiconductor device to a pressure sensor device, it is possible to provide a pressure sensor device with high pressure resistance (internal pressure strength) in a productive manner.

[0016] (4) The semiconductor device according to this disclosure may also have, in (3) above, a hollow cylindrical pressure introduction pipe that serves as the pressure inlet, and a hollow cylindrical base on which the pressure introduction pipe is erected on the first main surface and which is bonded to the case on the second main surface and connected to the opening.

[0017] According to the disclosures mentioned above, there is a high degree of design flexibility in the pressure introduction path of the pressure sensor device.

[0018] (5) In addition, in the semiconductor device relating to this disclosure, the projection may extend from the outer surface of the base as described in (4) above.

[0019] According to the disclosure described above, when continuously applying adhesive to the hollow cylindrical lid to bond the lid to the case, the strength of the protrusions on the lid can be increased.

[0020] (6) In addition, in the semiconductor device relating to this disclosure, the case may be a hollow rectangular parallelepiped as described in (5) above, and the projection may be located in the plane of the case as viewed from the first main surface side of the base.

[0021] According to the disclosure described above, the maximum dimensions of the semiconductor device can be maintained even if a protrusion is provided on the cover.

[0022] (7) In addition, in the semiconductor device relating to this disclosure, the projection may extend from the first main surface of the base as described in (4) above.

[0023] According to the disclosure described above, the maximum dimensions of the pressure sensor device can be maintained even if a protrusion is provided on the lid.

[0024] (8) In addition, in the semiconductor device relating to this disclosure, the projection may extend from the outer surface of the pressure introduction tube as described in (4) above.

[0025] According to the disclosure described above, the maximum dimensions of the semiconductor device can be maintained even if a protrusion is provided on the cover.

[0026] (9) In addition, in any one of (1) to (3) above, the semiconductor device according to this disclosure may be such that the case is a hollow rectangular parallelepiped, the projection protrudes from the outer surface of the lid and is located within the plane of the case when viewed from the lid side.

[0027] According to the disclosure described above, the maximum dimensions of the semiconductor device can be maintained even if a protrusion is provided on the cover.

[0028] (10) A method for manufacturing a semiconductor device according to one aspect of this disclosure is as follows: A first step is performed in which a semiconductor element is housed in a hollow case having an opening. A second step is performed in which a hollow cylindrical lid is housed in a circular planar recess of a positioning jig with its first main surface facing downwards. A third step is performed in which adhesive is continuously applied to the second main surface of the lid housed in the recess of the positioning jig in a hollow circular shape along the outer circumference, surrounding the hollow portion of the lid. A fourth step is performed in which the case is bonded to the second main surface of the lid via the adhesive, connecting the hollow portion of the lid and the opening of the case. The lid has a projection that protrudes locally from the surface facing the inner surface of the recess. The positioning jig has a groove on the inner surface of the recess at a location corresponding to the projection of the lid. In the second step, when housing the lid in the recess of the positioning jig, the projection of the lid is fitted into the groove.

[0029] According to the disclosure described above, the protrusions on the lid prevent the lid from rotating circumferentially during the third step, allowing for uniform application of the adhesive. This suppresses poor adhesion between the lid and the case. Furthermore, since no jigs such as clamping mechanisms are required to fix the lid during the third step, the semiconductor manufacturing equipment can be simplified and equipment costs can be reduced. Also, according to the disclosure described above, since no jigs such as clamping mechanisms are required, the spacing between adjacent recesses in the positioning jig can be narrowed. This allows for an increase in the number of caps that can be placed compared to a positioning jig equipped with a clamping mechanism. In addition, since there is no need to fix and release the lid using a clamping mechanism, the cycle time is shortened. Consequently, productivity (productivity rate relative to manufacturing line operating time and input costs) is improved.

[0030] (11) In addition, in the method for manufacturing a semiconductor device according to this disclosure, in (10) above, the projection may protrude from the outer surface of the cover, and the groove may be provided with the side wall of the recess.

[0031] According to the disclosure described above, a projection can be provided on the outer surface of the lid, and the strength of the projection on the lid can be increased.

[0032] <Knowledge forming the basis of this disclosure> The structure of the reference example pressure sensor device will be explained. Figure 17 is a perspective view showing the external appearance of the reference example pressure sensor device. The reference example pressure sensor device 100 shown in Figure 17 has a configuration in which a pressure sensor chip (not shown) is housed in a concave sensor mounting section formed in a case 110, and a cap 120 having a pressure introduction pipe 122 is attached to the case 110. The case 110 is a resin molded product in which an external lead terminal 112 that penetrates the case body 111 is integrally insert-molded. The case body 111 of the case 110 has a hollow rectangular parallelepiped shape with a partial opening. The partial opening of the case body 111 is a circular planar opening that serves as a pressure introduction port to the internal space (pressure detection chamber) of the case body 111, and is formed in a location opposite the sensor mounting section and communicates with the pressure introduction pipe 122.

[0033] The cap 120 is a resin molded product in which a base 121, which is used for bonding to the case body 111, and a hollow cylindrical pressure introduction pipe 122, into which a pressure medium is introduced from the outside, are integrally molded. The base 121 is a hollow cylindrical shape having a first main surface 121a on which the pressure introduction pipe 122 is erected, a second main surface (the main surface opposite to the pressure introduction pipe 122 side) 121b that is bonded to the case body 111, and a through hole 121c (see Figure 22 described later) that penetrates between the first and second main surfaces 121a and 121b. The second main surface 121b of the base 121 is bonded to the case body 111 so as to close the pressure introduction port of the case body 111. The space formed between the case body 111 and the base 121 of the cap 120 becomes the pressure detection chamber. The through-hole 121c of the base 121 connects the pressure introduction pipe 122 and the pressure detection chamber.

[0034] Figure 18 is a flowchart outlining the manufacturing method of the reference example pressure sensor device. Figures 19-21 are schematic cross-sectional views showing the pressure sensor device in the process of manufacturing the reference example pressure sensor device. In Figures 19-21, the hollow portion of the cap 120 is omitted from the illustration. Figure 22 is a plan view showing the vicinity of the cap in Figure 20 as seen from the top side of the positioning jig. Figure 24 is a plan view showing another example of the vicinity of the cap in Figure 20 as seen from the top side of the positioning jig. Figures 23 and 25 are cross-sectional views showing the cross-sectional structure at the cutting line AA-AA' in Figure 22 and the cutting line BB-BB' in Figure 24, respectively. In Figures 23 and 25, the pressure introduction pipe 122 of the cap 120 and the through hole 132 of the positioning jig 130 are omitted from the illustration.

[0035] First, a pressure sensor chip (pressure sensor element) is housed in a concave sensor mounting section formed in the case body 111 of the case 110 (step S1). Next, as shown in Figure 19, a cap 120 is placed on the upper surface 130a of the positioning jig 130 by accommodating the cap 120 in a recess 131 on the upper surface 130a of the positioning jig 130 with the second main surface 121b of the base 121 facing upwards (step S2). The positioning jig 130 is a flat tray with a plurality of recesses 131 arranged at predetermined intervals on its upper surface 130a, each accommodating a different cap 120. The cap 120 has a pressure introduction pipe 122 inserted into a through hole 132 on the bottom surface of the recess 131 of the positioning jig 130, and its base 121 is housed in the recess 131 of the positioning jig 130.

[0036] Next, as shown in Figure 20, adhesive (not shown) is continuously applied to the application area in a hollow circular shape along the outer circumference in the circumferential direction θ on the hollow circular planar second main surface 121b of the base 121 of the cap 120 housed in the recess 131 of the positioning jig 130 (step S3). Next, as shown in Figure 21, the case body 111 of the case 110 is bonded to the second main surface 121b of the base 121 of the cap 120 in a predetermined orientation via the adhesive (step S4). Next, the adhesive between the resin molded products bonded in step S4 is cured (step S5). After that, the lead terminals 112, which are insert-molded into the case body 111 of the case 110, are molded (step S6), completing the pressure sensor device 100 shown in Figure 17.

[0037] However, as shown in Figures 22 and 23, the base 121 and pressure introduction pipe 122 of the cap 120 have a circular outer circumference shape and do not have any projections that perform a predetermined function that are intentionally formed on the outer surface (single curved surface). Minute protrusions such as the overflow 120a (see Figure 17) of excess resin that has spilled into the gate (inlet for pouring resin into the product part) of the resin molding die, or burrs of excess resin that have spilled into gaps due to poor accuracy of the mating surface of the resin molding die, are unnecessary parts that occur unintentionally and have no function, and although they do not cause any problems even if they remain on the product surface, they are generally removed. In addition, the recess 131 of the positioning jig 130 that houses the cap 120 has a circular planar shape with a diameter slightly larger than the outer diameter (diameter) of the base 121 of the cap 120. As a result, a gap 134 is created between the side wall of the recess 131 of the positioning jig 130 and the outer surface of the base 121 of the cap 120.

[0038] The through-hole 132 at the bottom of the recess 131 of the positioning jig 130 also has a circular planar shape with a diameter slightly larger than the outer diameter of the pressure introduction pipe 122 of the cap 120, creating a gap 135 between it and the outer surface of the pressure introduction pipe 122 (see Figure 19). Therefore, the position of the cap 120 is not fixed within the recess 131 of the positioning jig 130. If the process of step S3 (see Figures 18 and 20) is performed in this state, the cap 120, which is connected to the nozzle 140, which is the discharge port of the adhesive, via the adhesive applied to the second main surface 121b of the base 121, will be pulled in the direction of movement of the nozzle 140 (circumferential direction θ of the base 121) and rotate. As a result, the adhesive cannot be applied uniformly to the second main surface 121b of the base 121 of the cap 120, which may lead to poor adhesion of the case 110. In addition, if the adhesive is repeatedly reapplied, it will take longer to complete the process of step S3, and the cycle time will increase.

[0039] For example, as shown in the alternative example in Figures 24 and 25, the cap 120 in the recess 131 of the positioning jig 130 can be fixed using the clamp mechanism 150 after the processing of step S2 and before the processing of step S3, thereby preventing the cap 120 from rotating in the recess 131 of the positioning jig 130 during the processing of step S3. The clamp mechanism 150 has two or more claw portions 151 for holding down the cap 120, an extendable cylinder portion 152 for moving the claw portions 151 vertically, and a control unit 153 such as a PLC (Programmable Logic Controller) for driving and controlling the cylinder portion 152. The clamp mechanism 150 is attached to the positioning jig 130 by positioning the claw portions 151 opposite the upper surface 130a of the positioning jig 130 and sandwiching the cap 120 between the claw portions 151 and the bottom surface of the recess 131 of the positioning jig 130.

[0040] The clamping mechanism 150 moves the claw portion 151 downward by shortening the length of the cylinder portion 152 via the control unit 153, and the claw portion 151 presses down on the outer circumference of the second main surface 121b of the base portion 121 of the cap 120, beyond the adhesive application area, thereby fixing the cap 120 between the claw portion 151 and the bottom surface of the recess 131 of the positioning jig 130. This prevents the cap 120 from rotating within the recess 131 of the positioning jig 130 during the process of step S3. Before the process of step S4, the clamping mechanism 150 moves the claw portion 151 upward by extending the length of the cylinder portion 152 via the control unit 153, and releases the cap 120 by separating the claw portion 151 from the cap 120. The clamping mechanism 150 needs to be prepared in the same number as the recesses 131 of the positioning jig 130. This increases equipment costs. Furthermore, the cycle time is increased by fixing and releasing the cap 120 using the clamping mechanism 150.

[0041] One of the problems to be solved in this embodiment is to improve productivity (the ratio of good products to the operating time of the manufacturing line and input costs).

[0042] Preferred embodiments of the semiconductor device and method for manufacturing the semiconductor device according to this disclosure will be described in detail below with reference to the attached drawings. In the following embodiments, a pressure sensor device will be described as an example, but the present invention can be applied to any semiconductor device in which the lid is hollow cylindrical in shape. In the following descriptions of embodiments and attached drawings, the same reference numerals will be used for similar components, and redundant explanations will be omitted.

[0043] (Details of Embodiment 1) Below, a semiconductor device according to Embodiment 1, which solves the above-mentioned problems, will be described using a pressure sensor device as an example. Figure 1 is a perspective view showing the external appearance of the pressure sensor device according to Embodiment 1. Figure 2 is a cross-sectional view showing the cross-sectional structure along the cutting line A-A' in Figure 1. Figures 3 and 4 are a plan view and a cross-sectional view, respectively, showing the pressure sensor device according to Embodiment 1 in the process of manufacturing. Figures 3 and 4 show the cap 20 housed in the recess 31 of the upper surface 30a of the positioning jig 30, in a plan view (viewed from the upper surface 30a side of the positioning jig 30) and a cross-sectional view (viewed from a direction perpendicular to the upper surface 30a of the positioning jig 30), respectively. In Figure 4, the cross-sectional structure of the cap 20 is shown in a simplified manner.

[0044] The pressure sensor device (semiconductor device) 1 according to Embodiment 1 shown in Figures 1 and 2 has a configuration in which a pressure sensor chip (semiconductor element) 2 is housed inside a case 10, and a cap (lid) 20 having a pressure introduction tube 22 is attached to the case 10. The pressure sensor device 1 outputs the pressure received by the pressure sensor chip (pressure sensor element) 2 as an electrical signal to an external circuit (not shown) via lead terminals (lead frame) 12 for external derivation. The case 10 has a case body 11, lead terminals 12, a pressure detection chamber 13, and a concave sensor mounting section 14 for housing the pressure sensor chip 2. The case 10 is a resin molded product (hollow molded product) in which the lead terminals 12 that penetrate the case body 11 are integrally insert-molded.

[0045] The case body 11 is a hollow rectangular parallelepiped with a partial opening on its top surface (the main surface on the cap 20 side). The partially open portion on the top surface of the case body 11 is a circular, planar opening that serves as a pressure inlet 11a into the interior of the case body 11 (pressure detection chamber 13). A convex cap mounting portion 11b is provided on the outer wall surface of the top surface of the case body 11, surrounding the entire circumference of the pressure inlet 11a in a hollow cylindrical shape. The outer diameter of the cap mounting portion 11b is less than or equal to the length of one side of the top surface of the case body 11. The lead terminal 12 penetrates the side surface of the case body 11 so as to be perpendicular to the side surface of the case body 11 (the surface connecting the top surface and the bottom surface (the main surface opposite to the cap 20 side)). A concave sensor mounting portion 14 for housing the pressure sensor chip 2 is provided on the bottom surface inside the case body 11 (the inner wall surface of the bottom surface of the case body 11), facing the pressure inlet 11a.

[0046] The pressure sensor chip 2 is a surface-pressure-sensitive semiconductor IC that utilizes the piezoresistive effect of a diffusion resistance (gauge resistance) formed inside a silicon (Si) semiconductor, and uses the gauge surface (circuit surface with strain gauges) as the pressure-receiving surface of the pressure medium to be detected. The pressure sensor chip 2 has a diaphragm structure in which the thickness of the central part is thinner than the thickness of the outer periphery due to a recess 2b formed by etching the central part from the back side. The pressure sensor chip 2 comprises a diaphragm (pressure-receiving part) 2a that flexes under pressure, a strain gauge (not shown), and a calculation circuit (not shown) for amplifying and correcting the output of the strain gauge.

[0047] The strain gauge consists of multiple gauge resistors (not shown) of approximately the same shape and resistance value, formed from a material (Si semiconductor) that exhibits a piezoresistive effect and connected in a bridge configuration. It is mounted on the front side of the pressure sensor chip 2, facing the diaphragm 2a. Each gauge resistor is electrically connected to a lead terminal 12 via a surface electrode (not shown) on the front surface of the pressure sensor chip 2 and a bonding wire 3. The strain of the diaphragm 2a caused by the pressure from the pressure medium is converted by the strain gauge into an electrical signal of a magnitude proportional to the pressure (a potential difference generated between the gauge resistor bridges in proportion to the pressure), which is then output to an external circuit via the lead terminal 12.

[0048] The pressure sensor chip 2 has its outer periphery on the back side sealed by the base member 4, for example, by electrostatic bonding (anodic bonding) to one side of the base member 4, such that the recess 2b on the back side is sealed by the base member 4. The diaphragm 2a faces the pressure inlet 11a of the case body 11. The diaphragm 2a has a circular planar shape, for example, with a diameter smaller than the pressure inlet 11a. The other side of the base member 4 is die-bonded (fixed) to the bottom surface of the sensor mounting section 14 via an adhesive layer 5. The pressure sensor chip 2 and the base member 4 are positioned away from the side wall of the sensor mounting section 14. The base member 4 is a glass substrate made of, for example, heat-resistant glass. The pressure sensor chip 2 and bonding wire 3 are sealed by a general sealing material (gel-like protective member) 6.

[0049] The cap 20 is a resin molded product (hollow molded product) integrally molded with a base 21 used for bonding to the case body 11 and a hollow cylindrical pressure introduction pipe 22 into which a pressure medium is introduced from a pressure measurement space (not shown). The base 21 is a hollow cylindrical shape having a first main surface 21a on which the pressure introduction pipe 22 is erected, a second main surface (main surface opposite to the pressure introduction pipe 22 side) 21b which is bonded to the case body 11 via an adhesive layer 7, and a through hole (hollow part) 21c that penetrates between the first and second main surfaces 21a and 21b. In plan view (the base 21 viewed from the first main surface 21a side), the base 21 is almost entirely contained within the plane of the upper surface of the case body 11. That is, the outer diameter (diameter) of the base 21 is approximately the same as the length of one side of the outer circumference of the upper surface of the case body 11, or slightly larger than the length of that side.

[0050] The through-hole 21c of the base 21 has a diameter approximately the same as the inner diameter of the pressure introduction pipe 22 (the inner diameter of the base 21) within the plane of the first main surface 21a of the base 21, and communicates with the pressure introduction pipe 22 to form the pressure introduction passage 22a. The through-hole 21c of the base 21 has a diameter approximately the same as the inner diameter of the pressure introduction port 11a of the case body 11 within the plane of the second main surface 21b of the base 21, and communicates with the pressure introduction port 11a of the case body 11. Except for the point of communication with the pressure introduction pipe 22 (the open end within the plane of the first main surface 21a of the base 21), the through-hole 21c of the base 21 is cylindrical with a constant diameter between the first and second main surfaces 21a and 21b. The through hole 21c of the base 21 may have a shape different from the outer shape (cylindrical) of the base 21, for example, a frustoconical shape in which the diameter increases from the first main surface 21a toward the second main surface 21b.

[0051] By making the base 21 hollow cylindrical (both the outer shape of the base 21 and the through hole 21c have a circular planar shape), the internal pressure applied to the side surface of the base 21 (the single curved surface connecting the first and second main surfaces 21a and 21b) becomes more uniform compared to the case where the base 21 is hollow rectangular parallelepiped (both the outer shape of the base 21 and the through hole 21c have a roughly rectangular planar shape). As a result, the adhesive strength between the base 21 and the case body 11 is increased, and the pressure resistance (internal pressure strength) of the pressure sensor device 1 is increased. By making the through hole 21c of the base 21 a circular planar shape, the pressure loss of the pressure medium flowing from the pressure introduction pipe 22 through the through hole 21c of the base 21 to the pressure detection chamber 13 can be reduced compared to the case where the through hole 21c of the base 21 has a roughly rectangular planar shape.

[0052] The space (hollow portion) enclosed by the inner surface of the pressure introduction pipe 22 becomes the pressure introduction passage 22a for the pressure medium that flows from the pressure measurement space to the pressure detection chamber 13. The open end of the pressure introduction pipe 22 (the open end connected to the pressure measurement space) becomes the pressure inlet (pressure inlet to the pressure introduction passage 22a) 20a of the cap 20. The pressure introduction passage 22a may be cylindrical, similar to the outer surface of the pressure introduction pipe 22 (see Figure 4), or it may be a frustoconical shape with an inner diameter that widens from one open end (open end) of the pressure introduction pipe 22 towards the other open end (open end connected to the pressure detection chamber 13) (see Figure 2). Although not particularly limited, when the pressure sensor device 1 according to Embodiment 1 is for automotive use, the pressure medium is the intake and exhaust of the internal combustion engine, the atmosphere, and the air in the seat cushion.

[0053] The second main surface 21b of the base 21 has a hollow cylindrical recess 21d that surrounds the entire circumference of the through hole 21c of the base 21, which is the mounting location for the case body 11. The cap mounting portion 11b on the upper surface of the case body 11 is fitted into the recess 21d of the second main surface 21b of the base 21 via an adhesive layer 7. The base 21 of the cap 20 is bonded to the case body 11 via the adhesive layer 7 and covers the pressure inlet 11a of the case body 11. The through hole 21c of the base 21 and the pressure inlet 11a of the case body 11 face each other. The pressure inlet pipe 22 of the cap 20 and the pressure detection chamber 13 of the case body 11 are connected via the through hole 21c of the base 21 of the cap 20. The space between the case body 11 and the base 21 of the cap 20 is the pressure detection chamber 13.

[0054] The depth of the recess 21d in the second main surface 21b of the base 21 may be shallower than the height of the cap mounting portion 11b on the upper surface of the case body 11. This creates a gap between the second main surface 21b of the base 21 and the upper surface of the case body 11. When adhesive 41 is applied to the recess 21d of the second main surface 21b of the base 21 and the cap mounting portion 11b on the upper surface of the case body 11 is fitted (processing in step S4 described later: see Figures 6, 18, 21), even if adhesive 41 overflows from inside the recess 21d, the adhesive 41 will rise towards the upper surface of the case body 11 within the gap between the second main surface 21b of the base 21 and the upper surface of the case body 11. Therefore, it is possible to suppress the overflow of adhesive 41 from the outer surface of the base 21 to the outside in the radial direction of the base 21. The height of the outer peripheral side wall of the recess 21d in the second main surface 21b of the base 21 may be greater than the height of the inner peripheral side wall. By relatively lowering the height of the inner circumferential side wall of the recess 21d of the second main surface 21b of the base 21, the design flexibility of the thickness t2 of the side projection 23 on the outer surface of the base 21, which will be described later, is increased.

[0055] On the outer surface of the base 21 (the single curved surface connecting the first and second main surfaces 21a and 21b), a substantially rectangular parallelepiped-shaped side projection 23 is selectively provided, extending outward in the radial direction of the base 21 (away from the outer surface of the base 21) with a predetermined overhang width w1. The side projection 23 of the base 21 fits into a groove 33 on the inner surface of the recess 31 of the positioning jig 30, which will be described later (see Figures 3 and 4). When adhesive (not shown) is continuously applied to the second main surface 21b of the base 21 in a hollow circular shape along the outer circumference in the circumferential direction θ (see step S3 in Figure 18 and Figure 20), the side projection 23 of the base 21 catches on the side wall of the groove 33, functioning to prevent the cap 20 from rotating in the circumferential direction θ.

[0056] The side projections 23 of the base 21 are intentionally formed during the molding of the cap 20, protruding in an overhang shape, and at least the protrusion width w1 of the external dimensions (width w1, w2 and thickness t2) is greater than the height of minute protrusions such as excess resin overflowing from the product part of the resin molding die (see Figure 17) or burrs. The side projections 23 of the base 21 are filled with resin and do not have a hollow part. The more the side projections 23 protrude outward from the outer surface of the case body 11 in the radial direction of the base 21, the larger the maximum dimensions of the product (pressure sensor device 1) in plan view become. Since the side projections 23 of the base 21 are not used in the final product, the protrusion width w1 of the side projections 23 of the base 21 can be, for example, 0.5 mm or more. Also, the protrusion width w1 of the side projections 23 of the base 21 can be about 1 mm or less.

[0057] The position and widths w1, w2 of the side projections 23 of the base 21 are preferably set such that, for example, the entire side projection 23 fits substantially within the plane of the upper surface of the case body 11 in a plan view. As a result, in a plan view, the side projections 23 of the base 21 do not protrude substantially outward from the outer surface of the case body 11, and the maximum dimensions of the product in a plan view are substantially maintained compared to a case where the side projections 23 are not provided, such as the cap 120 in the reference example (see Figure 17). In addition, two or more side projections 23 are arranged at predetermined intervals in the circumferential direction of the base 21. Preferably, the side projections 23 are arranged at approximately equal intervals in the circumferential direction of the base 21. The number of side projections 23 may be even or odd.

[0058] Specifically, for example, the side projections 23 of the base 21 may be arranged in a total of two, one on each side facing a pair of vertices on the upper surface of the case body 11, along the diagonal line connecting those vertices in a plan view. In Figure 1, only one of the two side projections 23 provided on the outer surface of the base 21 is shown, and the other side projection 23, which is not shown, is located on the opposite side of the central axis B of the cap 20 (which coincides with the central axis of the pressure introduction pipe 22). In this case, in a plan view, by making the overhang width w1 of the side projection 23 of the base 21 less than or equal to the distance from the outer surface of the base 21 to the vertex of the upper surface of the case body 11, the side projections 23 can be arranged on the outer surface of the base 21 so that they fit almost within the plane of the upper surface of the case body 11.

[0059] The side projections 23 of the base 21 may be provided one at each vertex on the diagonal of the upper surface of the case body 11, facing each other, in a plan view. Alternatively, the side projections 23 of the base 21 may protrude outward from the outer surface of the case body 11 in a plan view at a position facing the lead terminal 12. In this case, in a plan view, substantially the entire side projection 23 of the base 21 will protrude outward from the outer surface of the case body 11, but it is preferable that the side projections 23 of the base 21 terminate on the base 21 side of the boundary between the L-shaped portion 12b on the tip (open end) side and the straight portion 12a on the fixed end side, excluding the L-shaped portion 12b, of the portion of the lead terminal 12 that protrudes outward substantially perpendicularly from the outer wall of the case body 11.

[0060] In other words, the side projections 23 of the base 21 may be arranged in pairs, one on each opposite side of a pair of opposite sides of the upper surface of the case body 11, so that in a plan view, they terminate on the base 21 side of the boundary between the straight portion 12a and the L-shaped portion 12b of the lead terminal 12, at a position opposite the lead terminal 12. There may be a protrusion on the outer surface of the cap 20 caused by excess resin overflowing into the gate (the opening for pouring resin into the product) of the resin molding die (not shown: corresponding to the protrusion 120a in Figure 17). The side projections 23 may be molded on the outer surface of the cap 20 in place of the protrusion caused by excess resin (corresponding to the protrusion 120a in Figure 17) at a position corresponding to the gate of the resin molding die.

[0061] The length (hereinafter referred to as width) w2 of the circumferential extension of the side projection 23 of the base 21 along the outer surface of the base 21 is set appropriately to obtain sufficient strength so that the side projection 23 of the base 21 is not damaged by contact with the side wall of the groove 33 of the positioning jig 30. Specifically, the width w2 of the side projection 23 of the base 21 may be, for example, about 1 mm so that when the side projection 23 of the base 21 is positioned on a diagonal line connecting a pair of opposite vertices on the upper surface of the case body 11 in a plan view, almost the entire projection fits within the plane of the upper surface of the case body 11. The thickness t2 of the side projection 23 of the base 21 is at least half the thickness t1 of the base 21 and less than or equal to the thickness t1 of the base 21, and is preferably at least 1 mm.

[0062] When the thickness t2 of the side projection 23 is thinner than the thickness t1 of the base 21 (see Figure 4), for example, the upper surface of the side projection 23 (the main surface on the pressure introduction pipe 22 side) is almost seamlessly continuous with the first main surface 21a of the base 21. A step is formed between the lower surface of the side projection 23 (the main surface opposite to the pressure introduction pipe 22 side) and the second main surface 21b of the base 21. By forming a step between the lower surface of the side projection 23 and the second main surface 21b of the base 21, even if there is some variation in the thickness t2 of the side projection 23 during the molding of the cap 20, the side projection 23 will not protrude beyond the second main surface 21b of the base 21 toward the case 10. Therefore, adhesion defects such as the cap 20 being tilted when bonded to the upper surface of the case body 11 can be prevented.

[0063] As shown in Figures 3 and 4, the caps 20 are arranged on the upper surface 30a of the positioning jig 30 during the manufacturing of the pressure sensor device 1. The positioning jig 30 is a flat tray with a plurality of recesses 31 arranged at predetermined intervals on its upper surface 30a, each of which accommodates a different cap 20. The recesses 31 of the positioning jig 30 have through holes 32 that extend from the bottom surface of the recess 31 to the lower surface 30b of the positioning jig 30, and grooves 33 formed by locally recessing the inner surface (inner surface (side wall and bottom surface), side wall in Figures 3 and 4) of the recess 31. The cap 20 has its pressure introduction pipe 22 inserted into the through hole 32 at the bottom surface of the recess 31 of the positioning jig 30, its side projection 23 fitted into the groove 33 on the inner surface of the recess 31 of the positioning jig 30, and its base 21 housed in the recess 31 of the positioning jig 30.

[0064] The recess 31 of the positioning jig 30 has a circular planar shape with a diameter slightly larger than the outer diameter of the base 21 of the cap 20. Therefore, when the base 21 of the cap 20 is placed in the recess 31 of the positioning jig 30 with their central axes aligned, a first gap 34 with a width w3 of, for example, about 0.1 mm is created between the side wall of the recess 31 of the positioning jig 30 and the outer surface of the base 21 of the cap 20. The through hole 32 in the bottom surface of the recess 31 of the positioning jig 30 has a circular planar shape with a diameter larger than the outer diameter of the pressure introduction pipe 22 of the cap 20. The width of the second gap 35 between the inner surface (side wall) of the through hole 32 in the bottom surface of the recess 31 of the positioning jig 30 and the outer surface of the pressure introduction pipe 22 of the cap 20 is, for example, the same as the width w3 of the first gap 34.

[0065] The groove 33 of the recess 31 of the positioning jig 30 is designed to accommodate the side projection 23 of the base 21 of the cap 20, and its planar shape and dimensions are appropriately set so that the side projection 23 does not come out of the groove 33 when an external force is applied that rotates the cap 20 in the circumferential direction θ. Specifically, the groove 33 of the recess 31 of the positioning jig 30 has a planar shape that is substantially rectangular, the same as the main surface (upper and lower surface) of the side projection 23 of the base 21 of the cap 20, and has dimensions that allow the side projection 23 of the base 21 to be fitted with a small margin. The width of the third gap 36 between the side wall of the groove 33 of the recess 31 of the positioning jig 30 and the side surface of the side projection 23 of the base 21 of the cap 20 may be narrower than the width w3 of the first gap 34.

[0066] The cap 20 is housed in the recess 31 of the positioning jig 30, thereby restricting its linear movement in a direction parallel to the upper surface 30a of the positioning jig 30 to approximately the width of the first and second gaps 34 and 35. Furthermore, by fitting the side projection 23 of the base 21 of the cap 20 into the groove 33 of the recess 31 of the positioning jig 30, the rotation of the recess 31 of the positioning jig 30 in the circumferential direction (circumferential direction θ of the base 21) is restricted to approximately the width of the third gap 36. In addition, the presence of first to third gaps 34 to 36 between the inner surface of the recess 31 and through hole 32 of the positioning jig 30 and the outer surface of the cap 20 facilitates the housing of the cap 20 in the recess 31 of the positioning jig 30 and the pickup (removal) of the cap 20 from the recess 31 of the positioning jig 30.

[0067] The depth d1 of the recess 31 of the positioning jig 30 is preferably shallower than the thickness t1 of the base 21 of the cap 20, and may also be shallower than the thickness t2 of the side projection 23 of the base 21. This allows the second main surface 21b of the base 21 of the cap 20 (and furthermore, the lower surface of the side projection 23) housed in the recess 31 of the positioning jig 30 to be positioned above the upper surface 30a of the positioning jig 30. Therefore, even if adhesive 41 (see Figures 6 and 21) overflows from inside the recess 21d when the cap mounting portion 11b on the upper surface of the case body 11 is fitted into the recess 21d of the second main surface 21b of the base 21 of the cap 20, it is possible to prevent the adhesive 41 from being embedded in the first gap 34 between the inner surface of the recess 31 of the positioning jig 30 and the outer surface of the base 21 of the cap 20.

[0068] The pressure sensor device 1 according to Embodiment 1 can be manufactured (made) using the positioning jig 30 described above (see Figures 3 and 4) in the same manufacturing method as the manufacturing method of the reference example pressure sensor device 100 (see Figures 18 to 21). For this reason, the manufacturing method of the pressure sensor device 1 according to Embodiment 1 will be explained with reference to Figures 18 to 21 and 3 to 8. Note that the reference numerals 110 to 112, 120, 121, 121a, 121b, 122, 130, 130a, 131, and 132 in Figures 19 to 21 are to be read as reference numerals 10 to 12, 20, 21, 21a, 21b, 22, 30, 30a, 31, and 32, respectively.

[0069] Figures 3 and 4 show the cap 20 housed in the recess 31 on the upper surface 30a of the positioning jig 30 during the process of step S2 in Figure 18. Figures 5 and 6 are cross-sectional views showing the state of the cap during the manufacturing process of the pressure sensor device according to Embodiment 1. Figures 5 and 6 show in detail the state of the cap 20 during the processes of steps S2 and S3 in Figure 18, respectively. Figure 7 is a cross-sectional view showing the state of the case during the manufacturing process of the pressure sensor device according to Embodiment 1. Figure 8 is a plan view showing the case of Figure 7 as seen from the pressure inlet side. Figures 7 and 8 show in detail the state of the case 10 during the process of step S1 in Figure 18.

[0070] First, as shown in Figures 7 and 8, the pressure sensor chip 2 is housed in a concave sensor mounting section 14 formed in the case body 11 of the case 10 (Step S1: First step). Specifically, in the process of Step S1, the base member 4 to which the pressure sensor chip 2 is attached is die-bonded to the sensor mounting section 14 inside the case body 11, and the diaphragm 2a of the pressure sensor chip 2 is positioned opposite the pressure inlet 11a on the upper surface of the case body 11. The surface electrodes on the front surface of the pressure sensor chip 2 are electrically connected to lead terminals 12 that are insert-molded into the case body 11 via bonding wires 3.

[0071] The sealing material 6 is filled into the inside of the case body 11 so as to embed the sensor mounting section 14, and the pressure sensor chip 2 and bonding wire 3 are sealed by covering them with the sealing material 6. The sealing material 6 may also be filled to the inside of the cap mounting section 11b that surrounds the pressure inlet 11a on the top surface of the case body 11 in a hollow cylindrical shape. The lead terminals 12 that are insert-molded into the case body 11 have not yet been molded (cut or formed) at this stage and are in the shape of a rectangular flat plate. The processing in step S1 can be performed at any time before the processing in step S4, which will be described later.

[0072] Next, as shown in Figures 19 and 5, the caps 20 are placed on the upper surface 30a of the positioning jig 30 by accommodating each cap 20 in each recess 31 of the upper surface 30a of the positioning jig 30 with the second main surface 21b of the base 21 facing upward (Step S2: Second step). The cap 20 is accommodated by inserting the pressure introduction pipe 22 into the through hole 32 in the bottom surface of the recess 31 of the positioning jig 30, fitting the side projection 23 into the groove 33 on the inner surface of the recess 31 of the positioning jig 30, and accommodating the base 21 of the cap 20 in the recess 31 of the positioning jig 30. The side projection 23 of the base 21 of the cap 20 and the groove 33 on the inner surface of the recess 31 of the positioning jig 30 are fitted together, fixing the cap 20 so that it does not rotate in the circumferential direction θ.

[0073] For example, in the manufacturing method of the reference example pressure sensor device 100, it is necessary to use a jig such as a clamp mechanism 150 (see Figures 24 and 25) to fix the caps 120 housed in the recesses 131 of the positioning jig 130. Each recess 131 of the positioning jig 130 needs to be equipped with a clamp mechanism 150, which widens the spacing between adjacent recesses 131. As a result, the number of caps 120 that can be placed in the positioning jig 130 is, for example, about 25. Furthermore, equipping each recess 131 of the positioning jig 130 with a clamp mechanism 150 complicates the equipment of the pressure sensor manufacturing apparatus and increases equipment costs.

[0074] On the other hand, in Embodiment 1, a side projection 23 is formed on the outer surface of the base 21 of the cap 20, and a groove 33 is formed on the inner surface of the recess 31 of the positioning jig 30 for fitting the side projection 23 of the base 21 of the cap 20. By fitting the side projection 23 of the base 21 of the cap 20 with the groove 33 on the inner surface of the recess 31 of the positioning jig 30, the cap 20 housed in the recess 31 of the positioning jig 30 can be fixed so as not to rotate in the circumferential direction θ. Since no jig such as a clamp mechanism 150 is required to fix the cap 20, the equipment of the pressure sensor manufacturing apparatus can be simplified and equipment costs can be reduced.

[0075] Furthermore, in Embodiment 1, since no fixtures such as a clamping mechanism 150 are required, the spacing between adjacent recesses 31 of the positioning fixture 30 can be narrowed. As a result, the number of caps 20 that can be placed on the positioning fixture 30 can be increased to, for example, twice the number (i.e., 50) compared to the positioning fixture 130 equipped with a clamping mechanism 150. In addition, since there is no need to fix and release the caps 20 using the clamping mechanism 150, the cycle time is shortened. Consequently, productivity (the yield rate relative to the operating time of the manufacturing line and input costs) is improved.

[0076] Next, as shown in Figures 20 and 6, adhesive 41 is continuously applied to the inside of the recess 21d of the second main surface 21b of the base 21 of the cap 20, which is housed in the recess 31 of the positioning jig 30 (Step S3: Third step). Through the process in Step S3, the adhesive 41 is applied to the second main surface 21b of the base 21 of the cap 20 in a hollow circular shape surrounding the through hole 21c of the base 21. The adhesive 41 used in the process in Step S3 preferably has a viscosity of 0.1 [Pa·S] or more and 1000 [Pa·S] or less. Furthermore, the adhesive 41 should be in a jelly-like state with a viscosity high enough to remain at the application site and not flow and spread.

[0077] As described above, the cap 20 housed in the recess 31 of the positioning jig 30 is fixed so as not to rotate in the circumferential direction θ. Therefore, even if the cap 20 is pulled in the direction of movement of the nozzle 140 (circumferential direction θ of the base 121) via the adhesive 41 applied to the second main surface 21b of the base 21, it will not rotate in the direction of movement of the nozzle 140. Thus, the adhesive 41 can be uniformly and continuously applied to the recess 21d of the second main surface 21b of the base 21 of the cap 20. Furthermore, if the movement speed of the nozzle 140 is increased, the cap 20 is more likely to be pulled in the direction of movement of the nozzle 140, but the cap 20 does not rotate in the direction of movement of the nozzle 140 because of the side projections 23 provided on the cap 20. Thus, the application time of the adhesive 41 can be shortened.

[0078] The side projection 23 of the base 21 of the cap 20 is substantially rectangular in shape, and therefore has two parallel sides 23a facing each other at approximately right angles to the outer surface of the base 21. For this reason, regardless of whether the direction of movement of the nozzle 140, which moves along the outer circumference of the second main surface 21b of the base 21, is clockwise or counterclockwise (Figure 3 shows the counterclockwise circumferential direction θ), the side projection 23 of the base 21 of the cap 20 will catch on the side wall of the groove 33 of the recess 31 of the positioning jig 30 with one of the two sides 23a that are substantially right angles to the outer surface of the base 21. This prevents the cap 20 from rotating in the circumferential direction θ.

[0079] Next, as shown in Figure 21, the case body 11 of the case 10 is bonded to the second main surface 21b of the base 21 of the cap 20 in a predetermined orientation via adhesive 41 (see Figure 6) (Step S4: fourth step). Specifically, in step S4, the cap mounting portion 11b on the upper surface of the case body 11 of the case 10 is fitted into the recess 21d of the second main surface 21b of the base 21 of the cap 20 via adhesive 41 (see Figure 6). As a result, the case body 11 of the case 10 is bonded to the second main surface 21b of the base 21 of the cap 20 in a predetermined orientation, and the through hole 21c of the base 21 and the pressure inlet 11a of the case body 11 are connected.

[0080] Next, the adhesive 41 between the second main surface 21b of the base 21 of the cap 20, which was bonded in step S4, and the case body 11 of the case 10 is cured (heated and dried) (step S5). After that, the lead terminals 12 of the case 10 are formed by pressing with a mold or the like (step S6), and the pressure sensor device 1 shown in Figures 1 and 2 is completed.

[0081] The manufacturing method for the pressure sensor device 1 described in this embodiment 1 can be realized by executing a pre-prepared program on a control device such as a PLC equipped on the pressure sensor manufacturing apparatus. Furthermore, the program for realizing the manufacturing method for the pressure sensor device 1 according to this embodiment 1 is recorded on a recording medium readable by the control device, such as a solid-state drive (SSD), hard disk, Blu-ray disc (BD), flexible disk, USB flash memory, CD-ROM, MO, or DVD, and executed by being read from the recording medium by the control device. This program may also be transmitted on a transmission medium that can be distributed via a network such as the Internet.

[0082] As described above, according to Embodiment 1, a projection (side projection) is formed on the surface of the cap, and a groove is formed on the inner surface of the recess of the positioning jig for fitting the projection of the cap. By fitting the projection of the cap with the groove on the inner surface of the recess of the positioning jig, the cap housed in the recess of the positioning jig can be fixed so as not to rotate in the circumferential direction. When continuously applying adhesive in a hollow circular shape surrounding the hollow part of the cap along the outer circumference of the main surface of the cap, a jig such as a clamp mechanism for fixing the cap is not required, thus simplifying the equipment of the pressure sensor manufacturing apparatus and reducing equipment costs. In addition, by preventing the cap from rotating in the circumferential direction during continuous application of adhesive, the adhesive can be applied uniformly.

[0083] Furthermore, according to Embodiment 1, since no jigs such as clamping mechanisms are required, the spacing between adjacent recesses of the positioning jig can be narrowed. This allows for an increase in the number of caps that can be placed on the positioning jig compared to a positioning jig equipped with a clamping mechanism. Also, since there is no need to fix and release the caps using a clamping mechanism, the cycle time is shortened. Therefore, productivity (the yield rate relative to the operating time and input costs of the manufacturing line) is improved. Moreover, according to Embodiment 1, even when using hollow cylindrical caps, the adhesive strength between the case and the cap can be increased, and a pressure sensor device with high pressure resistance (internal pressure strength) can be provided with high productivity.

[0084] (Details of Embodiment 2) Below, a semiconductor device according to Embodiment 2, which solves the above-mentioned problems, will be described using a pressure sensor device as an example. Figure 9 is a plan view showing the external appearance of the pressure sensor device according to Embodiment 2. Figure 9 shows the pressure sensor device 54 as viewed from the first main surface (the surface on the pressure introduction pipe 22 side) of the base 51. Figure 10 is a plan view showing the pressure sensor device according to Embodiment 2 in the process of being manufactured. Figure 10 shows the cap 50 housed in the recess 31 of the upper surface 30a of the positioning jig 30 in a plan view (viewed from the upper surface 30a side of the positioning jig 30). The cross-sectional view of the cap 50 housed in the recess 31 of the upper surface 30a of the positioning jig 30 in a cross-sectional view (viewed from a direction perpendicular to the upper surface 30a of the positioning jig 30) is the same as in Figure 4.

[0085] The difference between the pressure sensor device 54 according to Embodiment 2 shown in Figure 9 and the pressure sensor device 1 according to Embodiment 1 (see Figures 1 and 2) is that the side projection 53 of the base 51 of the cap 50 is made into a roughly right-angled triangular prism shape. In Embodiment 2, since the side projection 53 of the base 51 of the cap 50 is roughly right-angled triangular prism shape, the base 51 has one side surface 53a that is roughly right-angled to the outer surface of the base 51. The overhang width w11 and width w12 of the side projection 53 of the base 51 are, for example, the same as the overhang width w1 and width w2 of the side projection 23 of the base 21 of Embodiment 1, respectively. The configuration of the cap 50 other than the side projection 53 of the base 51 is the same as the base 21 of the cap 20 in Embodiment 1. The configuration of the pressure introduction pipe 22 is the same as in Embodiment 1.

[0086] The method for manufacturing the pressure sensor device 54 according to Embodiment 2 is the same as the method for manufacturing the pressure sensor device 1 according to Embodiment 1 (see Figures 18-21), and as shown in Figure 10, the same positioning jig 30 as in Embodiment 1 can be used. Figure 10 shows the cap 50 housed in the recess 31 on the upper surface 30a of the positioning jig 30 during the process of step S2 in Figure 18. Similar to Embodiment 1, the cap 50 has its pressure introduction pipe 22 inserted into the through hole 32 on the bottom surface of the recess 31 of the positioning jig 30, its side projection 53 fitted into the groove 33 on the inner surface of the recess 31 of the positioning jig 30, and its base 51 housed in the recess 31 of the positioning jig 30.

[0087] In Embodiment 2, as in Embodiment 1, the cap 50 is fixed in place so as not to rotate in the circumferential direction θ by the side projection 53 of the base 51 of the cap 50 catching on the side wall of the groove 33 of the recess 31 of the positioning jig 30 with a side 53a that is approximately perpendicular to the outer surface of the base 51. As described above, since the side projection 53 of the base 51 of the cap 50 has only one side 53a that is approximately perpendicular to the outer surface of the base 51, the direction in which the adhesive is continuously applied in step S3 is appropriately set so that the side 53a of the side projection 53 of the base 51 of the cap 50 catches on the groove 33 on the inner surface of the recess 31 of the positioning jig 30.

[0088] As an alternative method for manufacturing the pressure sensor device 54 according to Embodiment 2, a positioning jig may be used in which the groove for fitting the side projection 53 of the base 51 of the cap 50 has a roughly right-angled triangular planar shape. That is, instead of a roughly rectangular planar groove 33, a roughly right-angled triangular planar groove may be provided on the side wall of the recess 31 of the positioning jig 30, having the same roughly right-angled triangular planar shape as the main surface (upper and lower surface) of the side projection 53 of the base 51 of the cap 50, and having dimensions that allow the side projection 53 of the base 51 to be fitted with a little clearance (not shown).

[0089] As described above, according to Embodiment 2, when an external force is applied that causes the cap housed in the recess of the positioning jig to rotate in the circumferential direction, it is sufficient that the circumferential rotation of the cap can be prevented by a portion of the protruding outer surface of the base of the cap catching on the side wall of the groove formed on the upper surface of the positioning jig. The same effect as in Embodiment 1 can be obtained even if the outer shape of the lateral projection of the base of the cap is changed.

[0090] (Details of Embodiment 3) Below, a semiconductor device according to Embodiment 3, which solves the above-mentioned problems, will be described using a pressure sensor device as an example. Figure 11 is a perspective view showing the external appearance of the pressure sensor device according to Embodiment 3. Figures 12 and 13 are a plan view and a cross-sectional view, respectively, showing the pressure sensor device according to Embodiment 3 in the process of manufacturing. Figures 12 and 13 show the cap 60 housed in the recess 71 of the upper surface 70a of the positioning jig 70, in a plan view (viewed from the upper surface 70a side of the positioning jig 70) and a cross-sectional view (viewed from a direction perpendicular to the upper surface 70a of the positioning jig 70), respectively. In Figure 12, the base 61 of the cap 60 is shown in a simplified manner. In Figure 13, the cross-sectional structure of the cap 60 is shown in a simplified manner.

[0091] The difference between the pressure sensor device 64 according to Embodiment 3 shown in Figure 11 and the pressure sensor device 1 according to Embodiment 1 (see Figures 1 and 2) is that a side projection 63 is selectively provided on the outer surface (single curved surface) of the pressure introduction pipe 62 of the cap 60. The configuration of the base 61 of the cap 60 is the same as the base 21 of the cap 20 in Embodiment 1, except that a side projection is not provided on the outer surface. The configuration of the pressure introduction pipe 62 of the cap 60 is the same as the pressure introduction pipe 22 of the cap 20 in Embodiment 1, except that a side projection 63 is provided on the outer surface. The configuration of the pressure introduction passage 62a (the space surrounded by the inner surface of the pressure introduction pipe 62) is the same as the pressure introduction passage 22a in Embodiment 1. The open end of the pressure introduction pipe 62 (the open end connected to the space where the pressure is to be measured) becomes the pressure inlet 60a of the cap 20 (the pressure inlet to the pressure introduction passage 62a). The side projection 63 of the pressure introduction pipe 62 is approximately a rectangular parallelepiped shape that protrudes outward in the radial direction of the pressure introduction pipe 62 (away from the outer surface of the pressure introduction pipe 62) with a predetermined overhang width.

[0092] The side projection 63 of the pressure introduction pipe 62 fits into the groove 73 on the bottom surface of the recess 71 of the positioning jig 70 when the base 61 of the cap 60 is housed in the recess 71 of the positioning jig 70 (see Figures 12 and 13). Similar to the side projection 23 of the base 21 of the cap 20 in Embodiment 1, the side projection 63 of the pressure introduction pipe 62 catches on the side wall of the groove 73 of the positioning jig 70 when adhesive (not shown) is continuously applied in a hollow circular shape along the outer circumference in the circumferential direction θ on the second main surface 61b of the base 61 (the main surface opposite to the pressure introduction pipe 62 side) 61b (see step S3 in Figure 18 and Figure 20), thereby preventing the cap 60 from rotating in the circumferential direction θ. The configuration of the side projection 63 is the same as that of the side projection 23 in Embodiment 1, except for the difference in its placement.

[0093] Two or more side projections 63 are arranged at predetermined intervals in the circumferential direction of the pressure introduction pipe 62. Preferably, the side projections 63 are arranged at approximately equal intervals in the circumferential direction of the pressure introduction pipe 62. The lower surface (main surface on the base 61 side) of the side projections 63 of the pressure introduction pipe 62 is preferably in contact with the first main surface (main surface on the pressure introduction pipe 62 side) 61a of the base 61 of the cap 60. By the side projections 63 in contact with the first main surface 61a of the base 61 of the cap 60 and the outer surface of the pressure introduction pipe 62, the boundary between the base 61 and the pressure introduction pipe 62 is locally reinforced. Therefore, when an external force is applied that causes the cap 60 housed in the recess 71 of the upper surface 70a of the positioning jig 70 to rotate in the circumferential direction θ, the torsional strength against the external force can be increased.

[0094] The manufacturing method for the pressure sensor device 64 according to Embodiment 3 is the same as the manufacturing method for the pressure sensor device 1 according to Embodiment 1 (see Figures 18-21), and uses a positioning jig 70 in which the arrangement of grooves 73 is different from that of Embodiment 1, as shown in Figures 12 and 13. Figures 12 and 13 show the cap 60 housed in the recess 71 on the upper surface 70a of the positioning jig 70 during the process of step S2 in Figure 18. In Embodiment 3, the recess 71 of the positioning jig 70 has a through hole 72 that extends from the bottom surface of the recess 71 to the lower surface of the positioning jig 70, and a groove 73 formed by locally recessing the inner surface (side wall) of the through hole 72. Preferably, the groove 73 of the positioning jig 70 is formed at the opening end of the through hole 72 on the recess 71 side and reaches the bottom surface of the recess 71.

[0095] The configuration of the recess 71 of the positioning jig 70 is the same as the recess 31 of the positioning jig 30 of Embodiment 1, except that a groove is not provided on the inner surface. The configuration of the through hole 72 of the positioning jig 70 is the same as the through hole 32 of the positioning jig 30 of Embodiment 1, except that a groove 73 is provided on the inner surface. The configuration of the groove 73 of the positioning jig 70 is the same as the groove 33 of the positioning jig 30 of Embodiment 1, except that its placement is different.

[0096] The side projection 63 of the pressure introduction pipe 62 is substantially rectangular parallelepiped, similar to the side projection 23 of Embodiment 1, and therefore has two parallel sides 63a facing each other at approximately right angles to the outer surface of the pressure introduction pipe 62. The side projection 63 of the pressure introduction pipe 62 catches on the side wall of the groove 73 of the through hole 72 of the positioning jig 70 with one of the two sides 63a that are substantially right angles to the outer surface of the pressure introduction pipe 62, thereby preventing the cap 60 from rotating in the circumferential direction θ.

[0097] Instead of the side projection 63 of the pressure introduction pipe 62, a roughly rectangular parallelepiped-shaped upper projection extending upward may be provided on the first main surface 61a of the base 61 at a position away from the pressure introduction pipe 62. The configuration of this upper projection is the same as that of the side projection 63, except that it is located away from the pressure introduction pipe 62. In this case, a groove is formed on the bottom surface of the recess 71 of the positioning jig 70, away from the through hole 72, to fit the upper projection of the first main surface 61a of the base 61 of the cap 60.

[0098] By applying Embodiments 1 and 2 to the pressure sensor device 64 according to Embodiment 3, side projections may be provided not only on the side projections 63 of the pressure introduction pipe 62 of the cap 60, but also on the outer surface of the base 61 of the cap 60. By applying Embodiment 2 to the side projections 63 of the pressure introduction pipe 62 of the cap 60 in Embodiment 3, the side projections 63 of the pressure introduction pipe 62 of the cap 60 may be made into a substantially right-angled triangular prism shape.

[0099] As described above, according to Embodiment 3, when an external force is applied that causes the cap housed in the recess of the positioning jig to rotate in the circumferential direction, it is sufficient that the circumferential rotation of the cap can be prevented by a portion of the protruding outer surface of the cap catching on the side wall of the groove formed on the upper surface of the positioning jig. The same effect as in Embodiment 1 can be obtained even when a side projection is provided on the outer surface of the pressure introduction tube of the cap.

[0100] (Details of Embodiment 4) Below, a semiconductor device according to Embodiment 4, which solves the above-mentioned problems, will be described using a pressure sensor device as an example. Figure 14 is a perspective view showing the external appearance of the pressure sensor device according to Embodiment 4. Figures 15 and 16 are a plan view and a cross-sectional view, respectively, showing the pressure sensor device according to Embodiment 4 in the process of being manufactured. Figures 15 and 16 show the cap 80 housed in the recess 91 of the upper surface 90a of the positioning jig 90, in a plan view (viewed from the upper surface 90a side of the positioning jig 90) and a cross-sectional view (viewed from a direction perpendicular to the upper surface 90a of the positioning jig 90), respectively. In Figure 16, the cross-sectional structure of the cap 80 is shown in a simplified manner.

[0101] The difference between the pressure sensor device 81 according to Embodiment 4 shown in Figure 14 and the pressure sensor device according to Embodiment 1 (see Figures 1 and 2) is that the cap 80 is composed only of the base 21. In Embodiment 4, the configuration of the cap 80 is the same as that of the cap 20 in Embodiment 1, except that a pressure introduction pipe is not provided. The through hole 21c of the base 21 of the cap 80 is directly connected to the pressure measurement space (not shown) at the open end in the plane of the first main surface 21a of the base 21. The open end of the through hole 21c in the plane of the first main surface 21a of the base 21 becomes the pressure introduction port (pressure introduction port to the pressure introduction passage 22a) 80a of the cap 80. In the cap 80, only the through hole 21c of the base 21 serves as the pressure introduction passage 22a.

[0102] The method for manufacturing the pressure sensor device 81 according to Embodiment 4 is the same as the method for manufacturing the pressure sensor device 1 according to Embodiment 1 (see Figures 18-21), and a positioning jig 90 is used in which the bottom surface of the recess 91 in which the cap 80 is housed does not have a through hole, as shown in Figures 15 and 16. Figures 15 and 16 show the cap 80 housed in the recess 91 on the upper surface 90a of the positioning jig 90 in the process of step S2 in Figure 18. In Embodiment 4, the recess 91 of the positioning jig 90 has a groove 92 formed by locally recessing the inner surface.

[0103] The configuration of the recess 91 and groove 92 of the positioning jig 90 is the same as that of the recess 31 and groove 33 of the positioning jig 30 in Embodiment 1, respectively. The cap 80 is fitted with the side projection 23 into the groove 92 on the inner surface of the recess 91 of the positioning jig 90, and the base 21 is housed in the recess 91 of the positioning jig 90. The side projection 23 of the base 21 catches on the side wall of the groove 92 of the recess 91 of the positioning jig 90 with one of the two side surfaces 23a that are approximately perpendicular to the outer surface of the base 21, thereby preventing the cap 80 from rotating in the circumferential direction θ.

[0104] In the manufacturing method of the pressure sensor device 81 according to Embodiment 4, a positioning jig 30 similar to that in Embodiment 1 can be used instead of the positioning jig 90.

[0105] By applying Embodiment 2 to the pressure sensor device 81 according to Embodiment 4, the side projection 23 of the base 21 of the cap 80 may be made into a substantially right-angled triangular prism shape.

[0106] As described above, Embodiment 4 provides the same effects as Embodiment 1. Furthermore, Embodiment 4 allows for miniaturization of the pressure sensor device by not providing a pressure introduction pipe in the cap.

[0107] In summary, this disclosure is not limited to the embodiments described above, and can be modified in various ways without departing from the spirit of this disclosure. [Industrial applicability]

[0108] As described above, the semiconductor device and method for manufacturing the semiconductor device according to this disclosure are useful for pressure sensor devices used in automobiles. [Explanation of symbols]

[0109] 1,54,64,81,100 Pressure sensor device 2. Pressure sensor chip 2a Diaphragm of pressure sensor chip 2b Recess on the back of the pressure sensor chip 3 Bonding wire 4. Base component 5,7 Adhesive layer 6. Sealing material 10,110 cases 11,111 Case body 11a Pressure inlet on the case body 11b Cap mounting area on the top surface of the case body 12,112 Lead terminals inserted into the case body 12a Straight section of lead terminal 12b L-shaped part of lead terminal 13 Pressure detection chamber 14. Sensor mounting area on the case body 20, 50, 60, 80, 120 caps 20a, 60a, 80a cap pressure inlet 21, 51, 61, 121 Base of the cap 21a, 21b, 61a, 121a, 121b Main surfaces (1st and 2nd main surfaces) of the cap base 21c, 121c Through hole at the base of the cap 21d Recess on the main surface of the base of the cap 22,62,122 Pressure introduction pipe 22a, 62a Pressure introduction path 23,53,63 Side protrusion 23a, 53a, 63a Side view of the lateral projection 30, 70, 90, 130 Positioning jigs 30a, 30b, 70a, 90a, 130a Main surfaces (top and bottom surfaces) of positioning jigs 31,71,91,131 Recess of positioning jig 32,72,132 Through-holes at the bottom of the recesses of the positioning jig 33,73,92 Grooves on the inner surface of the recess of the positioning jig 34-36, 134, 135 The gap between the recess of the positioning jig and the cap housed in the recess. 41 Adhesive 80a Open end of the through hole at the base of the cap 120a Tiny protrusion on the side of the base of the cap 140 Adhesive nozzles 150 Clamping Mechanism 151 Clamp mechanism claw 152 Cylinder section of the clamping mechanism 153 Control unit of the clamping mechanism B. Central axis of the cap of the pressure sensor device d1 Depth of the recess in the positioning jig t1 Thickness of the cap base t2 Thickness of the lateral projection at the base of the cap w1, w11: Width of the protrusions on the sides of the cap base. w2, w12 Width of the lateral projection at the base of the cap θ Circumferential direction of the cap

Claims

1. Semiconductor elements and A hollow case with an opening for housing the aforementioned semiconductor element, A hollow cylindrical lid is bonded to the case via an adhesive layer that surrounds the opening in a circular shape, Equipped with, A semiconductor device characterized in that a protrusion locally extends from the surface of the cover.

2. The aforementioned lid is a hollow molded product, The semiconductor device according to claim 1, characterized in that the width of the projection that protrudes from the surface of the lid is greater than the height of a minute protrusion that unintentionally occurs on the surface of the lid during the molding of the lid.

3. The aforementioned semiconductor element is a sensor element that converts pressure into an electrical signal. The semiconductor device according to claim 1, characterized in that the cover has a pressure inlet.

4. The aforementioned hollow cylindrical pressure inlet pipe, The semiconductor device according to claim 3, characterized in that the pressure introduction pipe is erected on the first main surface, and the second main surface has a hollow cylindrical base that is bonded to the case and connected to the opening.

5. The semiconductor device according to claim 4, characterized in that the projection extends from the outer surface of the base.

6. The aforementioned case is a hollow rectangular parallelepiped, The semiconductor device according to claim 5, characterized in that the projection is located within the plane of the case when viewed from the first main surface side of the base.

7. The semiconductor device according to claim 4, characterized in that the projection extends from the first main surface of the base.

8. The semiconductor device according to claim 4, characterized in that the projection extends from the outer surface of the pressure introduction pipe.

9. The aforementioned case is a hollow rectangular parallelepiped, The semiconductor device according to claim 1, characterized in that the projection protrudes from the outer surface of the lid and is located within the plane of the case when viewed from the lid side.

10. The first step involves housing semiconductor elements in a hollow case with an opening, A second step involves placing a hollow cylindrical lid into a circular, planar recess of a positioning jig with the first main surface facing downwards. A third step involves continuously applying adhesive in a hollow circular shape along the outer circumference of the second main surface of the lid, which is housed in the recess of the positioning jig, surrounding the hollow portion of the lid. A fourth step involves bonding the case to the second main surface of the lid via the adhesive, thereby connecting the hollow portion of the lid with the opening of the case. Includes, The lid has a projection that protrudes locally from the surface facing the inner surface of the recess, The positioning jig has grooves on the inner surface of the recess at locations corresponding to the protrusions of the lid, A method for manufacturing a semiconductor device, characterized in that, in the second step, when housing the cover in the recess of the positioning jig, the projection of the cover is fitted into the groove.

11. The aforementioned projection protrudes from the outer surface of the lid, The method for manufacturing a semiconductor device according to claim 10, characterized in that the groove is provided on the side wall of the recess.

Images