Active ester resin, curable resin composition, and cured product thereof

Abstract

The present invention provides an active ester resin, a curable resin composition, and a cured product thereof, which have a low softening point, excellent low dielectric properties, and heat resistance. [Solution] An activated ester resin (A) represented by the following formula (1). TIFF2026094235000021.tif19170 In formula (1), X A Each of these independently represents a monovalent organic group represented by the following formula (2), and X B Each independently represents a divalent organic group containing at least one aromatic ring, X C Each of these independently represents a divalent organic group. n is the average value of the number of repetitions, and 0 <n≦10である。 TIFF2026094235000022.tif32170

Claims

1. An activated ester resin (A) represented by the following formula (1). 【Chemistry 1】 (In formula (1), X Ａ Each of these independently represents a monovalent organic group represented by the following formula (2), and X Ｂ Each independently represents a divalent organic group containing at least one aromatic ring, X Ｃ Each of these independently represents a divalent organic group represented by the following formula (3). n is the average number of repeats, where 0 < n ≤ 10. 【Chemistry 2】 (In formula (2), each of the multiple R's exists independently and represents a hydrocarbon group having 1 to 10 carbon atoms, a halogen atom, or an alkoxy group having 1 to 10 carbon atoms. r represents an integer from 0 to 4. * represents a bond.) 【Transformation 3】 (In formula (3), each of the multiple R's exists independently and represents a hydrocarbon group having 1 to 10 carbon atoms, a halogen atom, or an alkoxy group having 1 to 10 carbon atoms. m represents an integer from 0 to 4. * represents a bond.)

2. The activated ester resin (A) according to claim 1, wherein m is 0 in formula (3) above.

3. The active ester resin (A) according to claim 1, wherein the content of n=1, as determined by differential refractive index detection in gel permeation chromatography (GPC), is 10 area percent or more and 80 area percent or less.

4. An active ester resin (A) obtained by polycondensation reaction of a substituted or unsubstituted biphenyl compound (a) having one aromatic hydroxyl group, a compound (b) having two aromatic hydroxyl groups, and an aromatic compound and / or its acid halide (c) having two carboxyl groups, Compound (b) contains a bisphenol (f) having the chemical structure represented by the following formula (4): An active ester resin (A) in which the proportion of molecules containing bisphenols (f), as determined by differential refractometer detection in gel permeation chromatography, is 10 to 95 area percent of the total amount of the active ester resin (A). 【Chemistry 4】 (In formula (4), each of the multiple R's exists independently and represents a hydrocarbon group having 1 to 10 carbon atoms, a halogen atom, or an alkoxy group having 1 to 10 carbon atoms. m represents an integer from 0 to 4.)

5. The active ester resin (A) according to any one of claims 1 to 4, wherein the weight-average molecular weight is 500 to 8000.

6. The activated ester resin (A) according to any one of claims 1 to 4, wherein the softening point measured by the Mettler softening point method is 40 to 150°C.

7. A resin varnish containing 30% by mass or more of the active ester resin (A) described in any one of claims 1 to 4, A resin varnish in which the content of organic solvent species with a boiling point of 150°C or lower is 50% by mass or more of the total amount of organic solvents in the resin varnish.

8. A curable resin composition (C) comprising the active ester resin (A) according to any one of claims 1 to 4.

9. Furthermore, the curable resin composition (C) according to claim 8 contains at least one selected from a curing accelerator, polymerization initiator, epoxy resin, active ester resin other than active ester resin (A), phenol resin, polyphenylene ether compound, amine resin, compound having an ethylenically unsaturated bond, isocyanate resin, polyamide resin, maleimide compound, cyanate ester resin, polyimide resin, polybutadiene and modified thereof, polystyrene and modified thereof, polyethylene and modified thereof, and benzoxazine compound.

10. The curable resin composition (C) according to claim 9, wherein the epoxy resin contains 20% by mass or more of epoxy resin with an epoxy equivalent of 250 g / eq. or more.

11. Furthermore, the curable resin composition (C) according to claim 8, wherein it contains an inorganic filler (D), and the content of the inorganic filler (D) in the total amount of the curable resin composition is 40% by mass or more.

12. Furthermore, the curable resin composition (C) according to claim 8 contains glass fibers (E).

13. A cured product obtained by curing the curable resin composition (C) described in claim 8.

14. A semiconductor encapsulating material (F) obtained by processing the curable resin composition (C) according to claim 8.

15. A copper-clad laminate (G) obtained by processing the curable resin composition (C) described in claim 8.

16. An interlayer insulating material (H) for a build-up substrate obtained by processing the curable resin composition (C) described in claim 8.

17. A semiconductor device obtained by processing at least one material selected from the semiconductor encapsulating material (F) described in claim 14, the copper-clad laminate (G) described in claim 15, and the interlayer insulating material (H) for build-up substrates described in claim 16.

18. A semiconductor package obtained by processing at least one material selected from the semiconductor encapsulating material (F) described in claim 14, the copper-clad laminate (G) described in claim 15, and the interlayer insulating material (H) for build-up substrates described in claim 16.

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