Wafer mounting stage

Abstract

The present invention provides a wafer mounting platform that prevents the resin tube, which is fixed to the base plate via an adhesive layer, from peeling off. [Solution] The wafer mounting stage 10 comprises a ceramic plate 20 with an internal electrostatic electrode 22, a base plate 30 having a refrigerant flow path 32 inside, a base plate through-hole 34 that penetrates the base plate 30 vertically and has a small-diameter upper hole 34a, a large-diameter lower hole 34b, and a hole step portion 34c, with the lower hole 34b being located below the refrigerant flow path 32, an insulating tube 50 housed in the upper hole 34a, a resin tube 60 housed in the lower hole 34b and having an upper surface 61 bonded to the hole step portion 34c via an adhesive layer 80, and a power supply member 70 whose upper surface is connected to the electrostatic electrode 22 and inserted into the insulating tube 50 and the resin tube 60. A convex ring 62 is provided on the upper surface 61 of the resin tube 60 to secure a gap G, and the adhesive layer 80 is filled into the gap G.

Claims

1. A ceramic plate having a wafer mounting surface on its upper surface and containing electrodes, A base plate provided on the lower side of the ceramic plate and having a refrigerant flow path inside, The base plate is penetrated vertically, and has a small-diameter upper hole, a large-diameter lower hole, and a stepped hole between the upper and lower holes, with the lower hole positioned below the refrigerant flow path, An insulating tube inserted into the upper part of the aforementioned hole, A resin tube with a larger diameter than the insulating tube is inserted into the lower part of the hole, and its upper surface is bonded to the stepped portion of the hole via an adhesive layer, The upper surface is connected to the electrode, and the power supply member is inserted into the insulating tube and the resin tube, Equipped with, The upper surface of the resin pipe is provided with a protruding member that secures a gap between the upper surface of the resin pipe and the stepped portion of the stepped hole, and the adhesive layer is filled into the gap. Wafer mounting stand.

2. The aforementioned convex member is a ring member. The wafer mounting platform according to claim 1.

3. The aforementioned convex member is composed of a plurality of small protrusions of the same height. A wafer mounting platform according to claim 1 or 2.

4. The convex member is provided so as to be in contact with the outer edge of the upper surface of the resin pipe. A wafer mounting platform according to claim 1 or 2.

5. The height of the aforementioned protruding member is 50 μm or more and 300 μm or less. A wafer mounting platform according to claim 1 or 2.

6. The aforementioned resin tube is made of engineering plastic. A wafer mounting platform according to claim 1 or 2.

7. The lower end of the insulating tube is fitted into a stepped groove provided on the upper surface of the resin tube. A wafer mounting platform according to claim 1 or 2.

8. The base plate has an average coefficient of linear expansion of 10 ppm / K or less at 40 to 570°C. A wafer mounting platform according to claim 1 or 2.

9. The material of the base plate is a composite material of metal and ceramic. A wafer mounting platform according to claim 1 or 2.

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