Filler-containing composition

JP2026094966APending Publication Date: 2026-06-10SEKISUI CHEMICAL CO LTD

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
SEKISUI CHEMICAL CO LTD
Filing Date
2024-11-29
Publication Date
2026-06-10

AI Technical Summary

Benefits of technology

【0011】 本発明によれば、従来よりもフィラーネットワークを形成させやすい高分子添加剤を含有し、熱伝導性の高いフィラー含有組成物を提供することができる。

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Abstract

To provide a filler-containing composition that contains polymer additives that facilitate the formation of a filler network more easily than conventional compositions, and that has high thermal conductivity. [Solution] A filler-containing composition comprising at least (A) a filler, (B) a polymer additive, and (C) a matrix, wherein the polymer additive (B) comprises at least a filler adsorption site and a functional site capable of forming a pseudo-crosslinking site different therefrom, and the matrix (C) is at least one of a solvent or a resin.
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Claims

1. (A) filler, (B) polymer additive, (C) matrix, The polymer additive (B) comprises at least a filler adsorption site and a functional site capable of forming a different pseudo-crosslinking site, The (C) matrix is ​​a filler-containing composition comprising a solvent or resin.

2. The filler-containing composition according to claim 1, wherein the functional sites that can form pseudo-crosslinking points of the polymer additive (B) include any selected from the group consisting of hydrogen-bonding functional groups, crystalline functional groups, and ionic functional groups and salts thereof.

3. The hydrogen bonding functional group is a hydroxyl group, an amide group, or a carbamide group. The crystalline functional group is a long-chain alkyl group, The filler-containing composition according to claim 2, wherein the ionic functional group is a phosphonic acid, a phosphoric acid, a carboxyl group, or a sulfonic acid group.

4. The filler-containing composition according to claim 1 or 2, wherein the filler adsorption site is an aromatic ring or a long-chain alkyl group.

5. The filler-containing composition according to claim 1 or 2, wherein the polymer additive (B) has a (meth)acrylate skeleton or a siloxane skeleton.

6. The filler-containing composition according to claim 1 or 2, wherein the polymer additive (B) is a copolymer represented by the following formula (1) or a polysiloxane compound represented by formula (2). 【Chemistry 1】 The copolymer represented by formula (1) has an aromatic ring-containing unit represented by (1c), and has at least one unit selected from the group consisting of a long-chain alkyl group-containing unit represented by (1a) and a hydrophilic group-containing unit represented by (1b), R 1 ~R 3 Each of the atoms is independently a hydrogen atom or a methyl group, X is an alkyl group having 14 to 22 carbon atoms, Y is a polyalkylene glycol chain, Z is an atomic group containing an aromatic ring, the sum of m and n is 5 to 100, one of m and n may be 0, and l is 1 to 9. 【Chemistry 2】 In equation (2), R 4 ~R 15 Each of these is independently a methyl group, an atomic group containing 14 or more carbon atoms, or an atomic group containing an aromatic ring. 4 ~R 15 In this configuration, at least one atom group contains 14 or more carbon atoms, and at least one atom group contains an aromatic ring. j is between 1 and 100, k is between 1 and 20, and i is between 1 and 20.

7. The filler-containing composition according to claim 1 or 2, wherein the storage modulus measured in small-amplitude vibrational shear (SAOS) in the linear viscoelastic range is 7,500 Pa or more.

8. The filler-containing composition according to claim 1 or 2, wherein the number average molecular weight of the polymer additive (B) is 4,000 or more.

9. The filler-containing composition according to claim 1 or 2, wherein the (A) filler is a thermally conductive filler.

10. The filler-containing composition according to claim 1 or 2, wherein the resin comprises a curable resin, and the curable resin comprises an epoxy compound.