Substrate processing method and substrate processing apparatus

Abstract

The present invention provides a substrate processing method and a substrate processing apparatus that suppress the occurrence of arcing during the substrate processing process. [Solution] The substrate processing method includes a holding step of holding the outer edge Wc of the substrate W with a conductive movable member 18, and a chemical supply step after the holding step of supplying a chemical solution L1 to the upper surface Wa of the substrate through a supply tube 100 provided on the outer surface of a conductive member 120. The conductive member is electrically connected to one end of a variable resistor whose resistance value can be changed. The holding part is electrically connected to the other end of the variable resistor 200. The chemical supply step includes a first sub-step of supplying the chemical solution to the upper surface of the substrate through the supply tube with the resistance value of the variable resistor set to a first value, and a second sub-step after the first sub-step of changing the resistance value of the variable resistor to a second value lower than the first value, while continuing to supply the chemical solution from the first sub-step, and supplying the chemical solution to the upper surface of the substrate through the supply tube.

Description

Technical Field

[0001] The present disclosure relates to a substrate processing method and a substrate processing apparatus.

Background Art

[0002] Patent Document 1 discloses a substrate processing method including supplying a charge removal liquid having a first specific resistance greater than the specific resistance of a processing liquid onto a main surface of a substrate and paddling the entire main surface with the charge removal liquid, reducing the specific resistance of the charge removal liquid supplied onto the main surface of the substrate to a second specific resistance smaller than the first specific resistance, reducing the charge on the main surface of the substrate by paddling the entire main surface of the substrate with the charge removal liquid having the second specific resistance, and supplying the processing liquid onto the main surface of the substrate to perform a predetermined process.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] The present disclosure describes a substrate processing method and a substrate processing apparatus capable of suppressing the occurrence of arcing in the process of substrate processing.

Means for Solving the Problems

[0005] An example of a substrate processing method includes a holding step in which the outer edge of the substrate is held by a conductive holding part, and a chemical supply step in which a conductive member supplies a chemical solution to the upper surface of the substrate through a supply tube provided on the outer surface after the holding step. The conductive member is electrically connected to one end of a variable resistor whose resistance value can be changed. The holding part is electrically connected to the other end of the variable resistor. The chemical supply step includes a first sub-step in which the chemical solution is supplied to the upper surface of the substrate through the supply tube with the resistance value of the variable resistor set to a first value, and a second sub-step in which, after the first sub-step, the resistance value of the variable resistor is changed to a second value lower than the first value, while continuing to supply the chemical solution from the first sub-step, and the chemical solution is supplied to the upper surface of the substrate through the supply tube. [Effects of the Invention]

[0006] According to the substrate processing method and substrate processing apparatus described herein, it is possible to suppress the occurrence of arcing during the substrate processing process. [Brief explanation of the drawing]

[0007] [Figure 1] Figure 1 is a schematic plan view showing an example of a substrate processing system. [Figure 2] Figure 2 is a schematic diagram showing an example of a liquid processing unit, and is a cross-sectional view showing the state when the substrate is in the lowered position. [Figure 3] Figure 3 is a perspective view showing the vicinity of the rotating plate and support plate in the liquid processing unit shown in Figure 2. [Figure 4] Figure 4 is a schematic diagram of an example of a liquid processing unit, showing a cross-sectional view of the unit when the substrate is in the raised position. [Figure 5] Figure 5 schematically shows how the processing liquid is supplied from the supply tube to the substrate held in the holding section. [Figure 6] Figure 6(a) is a cross-sectional view taken along line VII-VII in Figure 6, showing an example of a supply tube, and Figure 6(b) is a cross-sectional view showing another example of a supply tube. [Figure 7]Figure 7 is a block diagram showing an example of the main components of a substrate processing system. [Figure 8] Figure 8 is a schematic diagram showing an example of the controller's hardware configuration. [Figure 9] Figure 9 is a longitudinal cross-sectional view showing an example of a variable resistor section (the first example). [Figure 10] Figure 10(a) is a longitudinal cross-sectional view showing another example of a variable resistor section (second example), illustrating a state where there is electrical conductivity between the supply tube and ground in the variable resistor section, and Figure 10(b) is a cross-sectional view of Figure 10(a) along line BB. [Figure 11] Figure 11(a) is a longitudinal cross-sectional view showing another example of a variable resistor section (second example), illustrating a state where the supply tube and ground are insulated in the variable resistor section, and Figure 11(b) is a cross-sectional view of Figure 11(a) along line BB. [Figure 12] Figure 12(a) is a vertical cross-sectional view showing another example of a variable resistor (a third example), where the supply tube and ground are electrically connected in the variable resistor section, and Figure 12(b) is a vertical cross-sectional view showing another example of a variable resistor (a third example), where the supply tube and ground are insulated in the variable resistor section. [Modes for carrying out the invention]

[0008] In the following descriptions, the same reference numeral will be used for identical elements or elements with the same function, and redundant explanations will be omitted. Furthermore, in this specification, when referring to the top, bottom, right, and left of a figure, the direction of the reference numeral in the figure will be used as the reference.

[0009] [Circuit board processing system] First, with reference to Figure 1, a substrate processing system 1 (substrate processing apparatus) configured to process a substrate W will be described. The substrate processing system 1 comprises an input / output station 2, a processing station 3, and a controller Ctr (control unit). The input / output station 2 and the processing station 3 may be arranged in a single line horizontally, for example.

[0010] The substrate W may be disc-shaped, or it may be a plate shape other than circular, such as a polygon. The substrate W may have a notch in which a part is cut out. The notch may be, for example, a notch (groove such as U-shaped or V-shaped), or a straight section extending in a straight line (a so-called orientation flat). The substrate W may be, for example, a semiconductor substrate (silicon wafer), a glass substrate, a mask substrate, an FPD (Flat Panel Display) substrate, or various other types of substrates. The diameter of the substrate W may be, for example, about 200 mm to 450 mm.

[0011] The loading / unloading station 2 includes a mounting section 4, a loading / unloading section 5, and a shelf unit 6. The mounting section 4 includes a plurality of mounting tables (not shown) arranged in the width direction (vertical direction in Figure 1). Each mounting table is configured to accommodate a carrier 7. The carrier 7 is configured to house at least one substrate W in a sealed state. The carrier 7 includes an opening / closing door (not shown) for loading and unloading the substrate W.

[0012] The loading / unloading section 5 is located adjacent to the loading / unloading section 4 in the direction in which the loading / unloading station 2 and processing station 3 are aligned (left-right direction in Figure 1). The loading / unloading section 5 includes an opening / closing door (not shown) provided for the loading / unloading section 4. When the carrier 7 is placed on the loading / unloading section 4, both the opening / closing door of the carrier 7 and the opening / closing door of the loading / unloading section 5 are opened, creating communication between the inside of the loading / unloading section 5 and the inside of the carrier 7.

[0013] The loading / unloading section 5 incorporates a transport arm A1 and a shelf unit 6. The transport arm A1 is configured to move horizontally in the width direction of the loading / unloading section 5, vertically in the vertical direction, and pivotally around the vertical axis. The transport arm A1 is configured to take the substrate W from the carrier 7 and pass it to the shelf unit 6, and to receive the substrate W from the shelf unit 6 and return it to the carrier 7. The shelf unit 6 is located near the processing station 3 and is configured to accommodate the substrate W.

[0014] The processing station 3 includes a transfer unit 8 and a plurality of liquid processing units U. The transfer unit 8 extends horizontally, for example, in the direction in which the loading / unloading station 2 and the processing station 3 are arranged side by side (the left-right direction in FIG. 1). The transfer unit 8 incorporates a transfer arm A2. The transfer arm A2 is configured to be capable of horizontal movement in the longitudinal direction of the transfer unit 8, vertical movement in the vertical direction, and turning movement around the vertical axis. The transfer arm A2 is configured to take out the substrate W from the shelf unit 6 and deliver it to the liquid processing unit U, and also to receive the substrate W from the liquid processing unit U and return it into the shelf unit 6.

[0015] The plurality of liquid processing units U are arranged in a row along the longitudinal direction of the transfer unit 8 (the left-right direction in FIG. 1) on each of both sides of the transfer unit 8. The configuration of the liquid processing unit U will be described later.

[0016] The controller Ctr, which will be described in detail later, is configured to control the substrate processing system 1 partially or entirely.

[0017] [Liquid Processing Unit] Referring to FIGS. 2 to 7, the configuration of the liquid processing unit U will be described. As illustrated in FIG. 2, the liquid processing unit U includes a rotation holding unit 10, a lifting unit 20, a cup unit 30, a chemical solution supply unit 40, and a cleaning solution supply unit 50.

[0018] The rotation holding unit 10 includes a rotating plate 11, a support plate 12, a holding unit 13, and a regulating unit 14.

[0019] The rotating plate 11 is, for example, a disk configured to have a larger diameter than the substrate W. The rotating plate 11 includes a collection groove 11a provided on the upper surface of the rotating plate 11 so as to extend in the circumferential direction of the rotating plate 11, a discharge hole 11b extending in the radial direction of the rotating plate 11 from the bottom surface of the collection groove 11a toward the outer peripheral surface of the rotating plate 11, and a plurality of through holes 11c.

[0020] The collection groove 11a is configured to collect the processing liquid (chemical solution L1 and cleaning solution L2, described later) that has entered between the rotating plate 11 and the support plate 12. The discharge hole 11b is inclined downward as it extends radially outward, and is configured to discharge the processing liquid collected in the collection groove 11a to the outside using the centrifugal force of the rotating plate 11. Multiple through holes 11c penetrate the rotating plate 11 along the vertical direction. The multiple through holes 11c may be arranged at approximately equal intervals so that they form a circular shape when viewed from above. As illustrated in Figure 3, if there are three multiple through holes 11c, they may be arranged at approximately 120° intervals.

[0021] The rotating plate 11 is connected at its lower central portion to the upper end of a rotating shaft 15 that extends vertically. The rotating shaft 15 is connected to a drive unit 16. The drive unit 16 operates based on an operation signal from the controller Ctr and is configured to rotate the rotating shaft 15. As the drive unit 16 rotates the rotating shaft 15, the rotating plate 11 rotates together with the rotating shaft 15 in a substantially horizontal position around the rotating shaft 15. The drive unit 16 may be, for example, a rotary motor.

[0022] A conductive part 11d made of a conductive material is provided on a portion of the upper surface of the rotating plate 11. The conductive part 11d is grounded via a conductor.

[0023] The support plate 12 is, for example, a disc approximately the same size as the substrate W. The support plate 12 includes a protrusion 12a that projects downward. The protrusion 12a is configured to fit into a recess 11e provided on the upper surface of the rotating plate 11. When the support plate 12 is placed on the rotating plate 11, the protrusion 12a of the support plate 12 and the recess 11e of the rotating plate 11 fit together, and the lower surface of the support plate 12 comes into contact with the upper surface of the rotating plate 11. In this state, the support plate 12 rotates together with the rotating plate 11.

[0024] As illustrated in Figures 2 and 3, the support plate 12 includes a plurality of projections 12b that protrude upward from the upper surface of the support plate 12. The plurality of projections 12b are configured to support the substrate W in a substantially horizontal position at a height above the upper surface of the support plate 12 by contacting the lower surface Wb of the substrate W with their tips. The plurality of projections 12b may be arranged at substantially equal intervals near the outer circumference of the support plate 12 so as to form a circular shape when viewed from above.

[0025] A conductive portion 12c made of a conductive material is provided on a part of the lower surface of the support plate 12. The conductive portion 12c is positioned so as to overlap with the conductive portion 11d of the rotating plate 11 and the pressed portion 18a (described later) of the movable member 18 when viewed from above or below.

[0026] Multiple push-up sections 17 are provided on the lower surfaces of the rotating plate 11 and the support plate 12. Each push-up section 17 includes a cylindrical member 17a, a push-up pin 17b, and a spring member 17c.

[0027] The cylindrical member 17a is attached to the lower surface of the rotating plate 11. The cylindrical member 17a communicates with the through hole 11c of the rotating plate 11 and extends along the vertical direction. The push-up pin 17b is inserted inside the cylindrical member 17a and is movable up and down inside the cylindrical member 17a. The upper end of the push-up pin 17b is connected to the protrusion 12a of the support plate 12. The lower end of the push-up pin 17b is provided with a flange member 17d which is approximately the same size as the inner diameter of the cylindrical member 17a. The spring member 17c is, for example, a compression coil spring. The spring member 17c is positioned between the lower surface of the rotating plate 11 and the flange member 17d of the push-up pin 17b so as to surround the push-up pin 17b.

[0028] The holding portion 13 is configured to hold the substrate W together with the restricting portion 14 by pressing the outer peripheral edge Wc of the substrate W against the restricting portion 14. The holding portion 13 includes a movable member 18 and a spring member 19.

[0029] The movable member 18 is conductive. The movable member 18 may be formed of a conductive resin in which conductive particles such as carbon filler or carbon black are dispersed. The resin may be, for example, perfluoroalkoxy alkane (PFA) or polyether ether ketone (PEEK).

[0030] The movable member 18 is substantially L-shaped and includes a pressed portion 18a and an upright portion 18b. The pressed portion 18a extends horizontally from the outer edge of the support plate 12 toward the center, so as to be located within the groove 11f formed in the rotating plate 11.

[0031] The upright portion 18b extends upward continuously from the outer end of the pressed portion 18a, outside the outer peripheral edge of the support plate 12. The tip portion 18c of the upright portion 18b extends radially inward of the rotating plate 11. A groove (not shown) may be formed on the inner circumferential surface of the tip portion 18c at a position facing the outer peripheral edge Wc of the substrate W. The outer peripheral edge Wc of the substrate W fits into this groove, allowing the outer peripheral edge Wc of the substrate W to be held while being pressed towards the regulating portion 14.

[0032] The movable member 18 is supported so as to be rotatable around the rotation axis 18d near the lower end of the upright portion 18b. When viewed from above, the rotation axis 18d extends along the tangential direction of the outer edge of the support plate 12.

[0033] The spring member 19 is, for example, a torsion spring wound around the rotating shaft 18d. One end of the spring member 19 is connected to the side surface of the movable member 18. The spring member 19 biases the upright portion 18b in a direction that causes it to tilt radially outward from the rotating plate 11. Therefore, when the support plate 12 moves to the raised position (details will be described later), as illustrated in Figure 4, the inner end of the pressed portion 18a springs up and pops out of the groove 11f, and the upper end of the upright portion 18b moves radially outward from the rotating plate 11.

[0034] The restricting portion 14 is fixed in a predetermined position (for example, a position facing the movable member 18 with the substrate W in between). The restricting portion 14 is configured to restrict the outer edge Wc of the substrate W when the support plate 12 is placed on the rotating plate 11, that is, when the support plate 12 moves to the lowered position (details will be described later), and to hold the substrate W in cooperation with the movable member 18.

[0035] As illustrated in Figure 3, multiple regulating sections 14 are provided at predetermined positions along the circumferential direction of the support plate 12. The regulating sections 14 may be provided one at each position facing the movable member 18, or two or more at each position.

[0036] The lifting unit 20 includes a supply pipe 21, a plurality of shafts 22, and a drive unit 23, as illustrated in Figure 2.

[0037] The supply pipe 21 is a hollow tubular member extending vertically. The supply pipe 21 may contain multiple flow paths inside. The supply pipe 21 is inserted inside the rotating shaft 15. The tip of the supply pipe 21 penetrates the rotating plate 11 and the support plate 12 and is located above the upper surface of the support plate 12. A nozzle 21a is provided at the tip of the supply pipe 21.

[0038] Inside the supply pipe 21, at least one flow path is formed, extending along the direction of extension of the supply pipe 21. This at least one flow path is connected to a liquid source and / or a gas source (not shown). The processing liquid (e.g., chemical solution, cleaning solution, etc.) stored in the liquid source is supplied through this at least one flow path from the nozzle 21a toward the lower surface Wb of the substrate W. The inert gas (e.g., nitrogen, etc.) stored in the gas source is supplied through this at least one flow path from the nozzle 21a toward the lower surface Wb of the substrate W.

[0039] Each of the multiple shafts 22 is connected to the supply pipe 21 via a connecting member 22a. The multiple shafts 22 extend vertically toward the support plate 12. The multiple shafts 22 may be arranged at approximately equal intervals so that they form a circular shape when viewed from above. For example, if there are three multiple shafts 22, they may be arranged at approximately 120° intervals.

[0040] The drive unit 23 is connected to the supply pipe 21. The drive unit 23 operates based on an operation signal from the controller Ctr and is configured to raise and lower the supply pipe 21. The drive unit 23 may be a power source such as a linear actuator. As the drive unit 23 raises and lowers the supply pipe 21, the supply pipe 21 and the multiple shafts 22 connected to the supply pipe 21 move up and down between a lowered position (see Figure 2) and an raised position (see Figure 4).

[0041] As illustrated in Figure 2, in the lowered position, the tip of the supply pipe 21 (nozzle 21a) is located below the tips of the multiple protrusions 12b. In the lowered position, the tips of the multiple shafts 22 are located below the push-up portion 17. In the lowered position, the restoring force of the spring acts in the direction that extends the spring member 17c, so that the support plate 12 is pulled downward via the push-up pin 17b. As a result, the convex portion 12a of the support plate 12 and the concave portion 11e of the rotating plate 11 fit together, and the lower surface of the support plate 12 comes into contact with the upper surface of the rotating plate 11. Therefore, the pressed portion 18a of the movable member 18 is pushed downward by the lower surface (conductive portion 12c) of the support plate 12 and pushed into the groove 11f formed in the rotating plate 11. Then, the upright portion 18b becomes upright, extending vertically, and the tip portion 18c of the upright portion 18b comes into contact with the outer edge Wc of the substrate W, which is supported on the multiple protrusions 12b. As a result, the movable member 18 presses the outer edge Wc of the substrate W against the restricting portion 14, and holds the substrate W together with the restricting portion 14.

[0042] In the lowered position, the conductive part 11d and the conductive part 12c come into contact, and the conductive part 12c comes into contact with the pressed part 18a. As a result, the conductive parts 11d, 12c and the movable member 18 are electrically connected to earth.

[0043] On the other hand, as illustrated in Figure 4, as the supply pipe 21 rises from the lowered position to the raised position, the multiple shafts 22 rise together with the supply pipe 21 via the connecting member 22a. When the multiple shafts 22 reach the push-up section 17, the push-up pins 17b located at positions corresponding to the multiple shafts 22 are pushed up by the shafts 22. As a result, the spring member 17c is compressed, the support plate 12 floats up relative to the rotating plate 11, and the multiple protrusions 12b come into contact with the lower surface of the substrate W. At the same time, the biasing force of the spring member 19 causes the upright section 18b to tilt radially outward from the rotating plate 11. Therefore, the holding of the outer edge Wc of the substrate W by the regulating section 14 and the movable member 18 is released, and the substrate W is supported by the multiple protrusions 12b. As the supply pipe 21 rises further to the raised position, the substrate W floats up to a height above the cup section 30. In this case, it becomes possible to transfer the substrate W between the external transport arm and the main unit without interfering with other equipment.

[0044] In the raised position, the support plate 12 floats above the rotating plate 11, causing the conductive part 11d and the conductive part 12c to separate. As a result, the conductive part 12c and the movable member 18 are electrically disconnected from the ground.

[0045] The cup section 30 functions as a liquid collection container that receives the processing liquid supplied to the upper surface Wa and lower surface Wb of the substrate W and shaken off from the substrate W. The cup section 30 includes an inner cup 31, an intermediate cup 32, and an outer cup 33.

[0046] The inner cup 31 has an annular shape overall and is provided to surround the substrate W from the outside while it is being held by the regulating portion 14 and the movable member 18. The inner cup 31 is connected to the rotating plate 11 by a connecting member (not shown) with its lower edge separated from the upper surface of the rotating plate 11. As a result, the inner cup 31 rotates in conjunction with the rotation of the rotating plate 11. As a result, the processing liquid supplied to the lower surface Wb of the substrate W and shaken off the substrate W is discharged into the outer cup 33 through the gap between the lower edge of the inner cup 31 and the rotating plate 11.

[0047] The middle cup 32 has an annular shape overall and is positioned to surround the inner cup 31 from the outside. The middle cup 32 is connected to the rotating plate 11 by a connecting member (not shown) such that its lower edge is separated from the upper surface of the rotating plate 11. As a result, the middle cup 32 rotates in conjunction with the rotation of the rotating plate 11. This causes the processing liquid supplied to the upper surface Wa of the substrate W and then shaken off the substrate W to be discharged into the outer cup 33 through the gap between the lower edge of the middle cup 32 and the rotating plate 11.

[0048] The outer cup 33 has an annular shape overall and is positioned to surround the inner cup 32 from the outside, extending from the lower part of the rotating plate 11 to the side of the inner cup 32. A drain pipe 33a is provided in the bottom wall of the outer cup 33. The processed liquid discharged from the inner cup 31 and the inner cup 32 is received by the outer cup 33 and discharged to the outside of the liquid processing unit U through the drain pipe 33a.

[0049] The chemical solution supply unit 40 includes a liquid source 41, a pump 42, a valve 43, piping 44, a drive unit 45 (tube drive unit), and a supply tube 100A. The liquid source 41 is the source of the chemical solution L1.

[0050] The chemical solution L1 may include, for example, an alkaline or acidic chemical solution (etching solution) for removing the film on the upper surface Wa of the substrate W. The alkaline chemical solution may include, for example, SC-1 solution (a mixture of ammonia, hydrogen peroxide, and pure water). The acidic chemical solution may include, for example, SC-2 solution (a mixture of hydrochloric acid, hydrogen peroxide, and pure water), SPM (a mixture of sulfuric acid and hydrogen peroxide), HF / HNO3 solution (a mixture of hydrofluoric acid and nitric acid). The film on the upper surface Wa of the substrate W may be a conductive film such as titanium nitride, tungsten, or cobalt.

[0051] Pump 42 operates based on an operating signal from controller Ctr and is configured to supply the chemical solution L1 drawn from liquid source 41 to supply tube 100A via piping 44 and valve 43. Valve 43 operates based on an operating signal from controller Ctr and is configured to transition between an open state that allows fluid flow in piping 44 and a closed state that prevents fluid flow in piping 44. Piping 44 connects, in order from upstream, the liquid source 41, pump 42, valve 43, and supply tube 100A.

[0052] The drive unit 45 is connected to the supply tube 100A via an arm 46. The drive unit 45 is configured to operate based on an operating signal from the controller Ctr and to drive the arm 46. As a result, the supply tube 100A moves horizontally or vertically above the substrate W as the arm 46 moves. The supply tube 100A may pivot between, for example, a discharge position where the discharge port faces the center of the substrate W and a retracted position where the discharge port is retracted radially outward from the outer edge Wc of the substrate W.

[0053] The supply tube 100A is positioned above the substrate W such that its discharge port faces the upper surface Wa of the substrate W. The supply tube 100A is configured to discharge the chemical solution L1 sent from the pump 42 from its discharge port toward the upper surface Wa of the substrate W. The detailed configuration of the supply tube 100A will be described later.

[0054] The cleaning fluid supply unit 50 includes a liquid source 51, a pump 52, a valve 53, piping 54, a drive unit 55, and a supply tube 100B. The liquid source 51 is the source of the cleaning fluid L2.

[0055] The cleaning solution L2 is a liquid used to remove (wash away) the chemical solution L1 supplied to the upper surface Wa of the substrate W, as well as the film-dissolving components caused by the chemical solution L1, from the substrate W. The cleaning solution L2 may contain, for example, pure water (DIW: deionized water), ozonated water, carbonated water (CO2 water), ammonia water, etc.

[0056] Pump 52 operates based on an operating signal from controller Ctr and is configured to send cleaning fluid L2 drawn from liquid source 51 to supply tube 100B via piping 54 and valve 53. Valve 53 operates based on an operating signal from controller Ctr and is configured to transition between an open state that allows fluid flow in piping 54 and a closed state that prevents fluid flow in piping 54. Piping 54 connects, in order from upstream, the liquid source 51, pump 52, valve 53, and supply tube 100B.

[0057] The drive unit 55 is connected to the supply tube 100B via an arm 56. The drive unit 55 is configured to operate based on an operating signal from the controller Ctr and to drive the arm 56. As a result, the supply tube 100B moves horizontally or vertically above the substrate W as the arm 56 moves. The supply tube 100B may also pivot between, for example, a position where the discharge port faces the center of the substrate W and a position where the discharge port is retracted radially outward from the outer edge Wc of the substrate W.

[0058] The supply tube 100B is positioned above the substrate W such that its discharge port faces the upper surface Wa of the substrate W. The supply tube 100B is configured to discharge the cleaning fluid L2 sent from the pump 52 from its discharge port toward the upper surface Wa of the substrate W. The detailed configuration of the supply tube 100B will be described later.

[0059] Here, the configuration of supply tubes 100A and 100B will be explained with reference to Figures 5 and 6. Note that in this document, supply tubes 100A and 100B will sometimes be collectively referred to as "supply tube 100".

[0060] The supply tube 100 includes a resin tube body 110 and a plurality of conductive parts 120 (conductive member, another conductive member), as illustrated in Figures 5 and 6(a). The tube body 110 may be made of, for example, a heat-meltable fluororesin. The plurality of conductive parts 120 may be made of, for example, a heat-meltable fluororesin composition containing a conductive substance.

[0061] In the examples shown in Figures 5 and 6(a), the multiple conductive parts 120 are provided on the outer circumferential surface of the tube body 110 so as to extend along the longitudinal direction of the tube body 110, with the tube body 110 spaced apart from each other in the radial direction of the tube body 110. As illustrated in Figure 6(a), if there are four multiple conductive parts 120, the multiple conductive parts 120 may be arranged at approximately 90° intervals in the radial direction of the tube body 110.

[0062] As illustrated in Figure 5, the multiple conductive parts 120 are electrically connected to earth via a variable resistor 200 whose resistance value can be changed. Specifically, one end of the variable resistor 200 is electrically connected to the multiple conductive parts 120. The other end of the variable resistor 200 is electrically connected to earth. Therefore, the other end of the variable resistor 200 is electrically connected to the movable member 18 which is grounded. Details of the variable resistor 200 will be described later. In this document, the variable resistor 200 connected to the supply tube 100A is sometimes referred to as "variable resistor 200A," and the variable resistor 200 connected to the supply tube 100B is sometimes referred to as "variable resistor 200B" (another variable resistor).

[0063] When the processing liquid (chemical solution L1 or cleaning solution L2) flows through the supply tube 100, virtual capacitances are generated between the processing liquid and each of the multiple conductive parts 120. Therefore, when the processing liquid is supplied from the supply tube 100 to the upper surface of the substrate W held by the movable member 18, and the processing liquid comes into contact with the movable member 18 that holds the outer edge Wc of the substrate W, an electrical circuit is formed by the movable member 18, the processing liquid, the supply tube 100, and the variable resistor 200.

[0064] In this electrical circuit, setting the resistance value of the variable resistor 200 to a relatively high value (first value) makes it difficult for current to flow between the supply tube 100 (multiple conductive parts 120) and the ground (movable member 18). As a result, static discharge of the processing liquid flowing through the supply tube 100 becomes less likely. Therefore, when the processing liquid is supplied from the supply tube 100 to the substrate W, if the substrate W is charged, the substrate W is discharged by ions in the processing liquid. The first value at this time may be a value that provides insulation between the supply tube 100 (multiple conductive parts 120) and the ground (movable member 18). The first value may be, for example, 100 kΩ or more.

[0065] On the other hand, in the electrical circuit, if the resistance value of the variable resistor 200 is set to a value lower than the first value (the second value), current flows more easily between the supply tube 100 (multiple conductive parts 120) and the ground (movable member 18). As a result, the processing liquid flowing through the supply tube 100 is more easily discharged. Therefore, when the processing liquid is supplied from the supply tube 100 to the substrate W, charging from the processing liquid to the substrate W is suppressed. The second value at this time may be a value such that there is conductivity between the supply tube 100 (multiple conductive parts 120) and the ground (movable member 18). The second value may be, for example, 1 kΩ or less.

[0066] The multiple conductive parts 120 may include an outer conductor 121, an inner conductor 122, and a connecting conductor 123, as illustrated in Figure 6(b). The outer conductors 121 are provided on the outer circumferential surface of the tube body 110 so as to extend along the longitudinal direction of the tube body 110, spaced apart from each other in the radial direction of the tube body 110. As illustrated in Figure 6(b), if there are four of the multiple outer conductors 121, the multiple outer conductors 121 may be arranged at approximately 90° intervals in the radial direction of the tube body 110.

[0067] The inner conductors 122 are provided on the inner circumferential surface of the tube body 110 so as to extend along the longitudinal direction of the tube body 110, with each conductor spaced apart from the others in the radial direction of the tube body 110. The inner conductors 122 are positioned to face the outer conductors 121. As illustrated in Figure 6(b), if there are four inner conductors 122, the inner conductors 122 may be arranged at approximately 90° intervals in the radial direction of the tube body 110.

[0068] The connecting conductor 123 extends along the thickness direction of the tube body 110 so as to integrally connect the outer conductor 121 and the inner conductor 122. Therefore, the outer conductor 121, the inner conductor 122, and the connecting conductor 123 are electrically connected to each other.

[0069] [controller] As shown in Figure 7, the controller Ctr has a reading unit M1, a storage unit M2, a processing unit M3, and an instruction unit M4 as functional modules. These functional modules are merely a convenient division of the controller Ctr's functions into multiple modules, and do not necessarily mean that the hardware constituting the controller Ctr is divided into such modules. Each functional module is not limited to being implemented by program execution, but may also be implemented by a dedicated electrical circuit (e.g., a logic circuit) or an integrated circuit (ASIC: Application Specific Integrated Circuit) that integrates these.

[0070] The reading unit M1 is configured to read a program from a computer-readable recording medium RM. The recording medium RM stores programs for operating each part of the substrate processing system 1 (drive units 16, 23, 45, 55, variable resistor unit 200, pumps 42, 52, valves 43, 53, etc.). The recording medium RM may be, for example, a semiconductor memory, an optical recording disk, a magnetic recording disk, or a magneto-optical recording disk. The recording medium RM may be built into the substrate processing system 1 or may be separate from the substrate processing system 1.

[0071] The storage unit M2 is configured to store various types of data. For example, the storage unit M2 may store programs read from the recording medium RM by the reading unit M1, setting data input from the operator via an external input device (not shown), and so on.

[0072] The processing unit M3 is configured to process various types of data. For example, the processing unit M3 may be configured to generate operation signals for operating each part of the substrate processing system 1 based on various types of data stored in the storage unit M2.

[0073] The instruction unit M4 is configured to transmit the operation signals generated in the processing unit M3 to each part of the substrate processing system 1.

[0074] The hardware of the controller Ctr may consist of, for example, one or more control computers. The controller Ctr may include, for example, the circuit C1 shown in Figure 8 as a hardware configuration. Circuit C1 may consist of electrical circuit elements. Circuit C1 may include, for example, a processor C2, a memory C3 (storage unit), a storage C4 (storage unit), a driver C5, and an input / output port C6. The processor C2 executes a program in cooperation with at least one of the memory C3 and storage C4, and performs signal input and output via the input / output port C6, thereby configuring each of the above-mentioned functional modules. The memory C3 and storage C4 function as storage units M2. The driver C5 is a circuit that drives each part of the board processing system 1. The input / output port C6 performs signal input and output between the driver C5 and each part of the board processing system 1.

[0075] The substrate processing system 1 may have one controller Ctr, or it may have a controller group (control unit) composed of multiple controllers Ctr. In the latter case, each of the above functional modules may be implemented by one controller Ctr, or by a combination of two or more controllers Ctr. If the controller Ctr is composed of multiple computers (circuit C1), each of the above functional modules may be implemented by one computer (circuit C1), or by a combination of two or more computers (circuit C1). The controller Ctr may include multiple processors C2. In this case, each of the above functional modules may be implemented by one processor C2, or by a combination of two or more processors C2.

[0076] [Substrate Processing Method] Here, we will explain the processing of the substrate W using the processing liquid. First, the controller Ctr instructs the drive unit 23 to raise the supply pipe 21. As a result, the supply pipe 21 and the multiple shafts 22 connected to the supply pipe 21 rise to the raised position (see Figure 4). Next, the substrate W is placed on the multiple protrusions 12b by a transport mechanism (not shown).

[0077] Next, the controller Ctr instructs the drive unit 23 to lower the supply pipe 21. The supply pipe 21 and the multiple shafts 22 connected to the supply pipe 21 descend to the lowered position (see Figure 2). As the supply pipe 21 descends, the lower surface of the support plate 12 comes into contact with the upper surface of the rotating plate 11, and the pressed portion 18a of the movable member 18 is pushed downward by the lower surface (conductive portion 12c) of the support plate 12. As a result, the tip portion 18c of the upright portion 18b comes into contact with the outer edge Wc of the substrate W, which is supported on the multiple protrusions 12b. Consequently, the movable member 18 holds the substrate W together with the regulating portion 14. Furthermore, when the supply pipe 21 is in the lowered position, the conductive portion 11d and the conductive portion 12c come into contact, and the conductive portion 12c comes into contact with the pressed portion 18a. Therefore, the conductive portions 11d, 12c and the movable member 18 are electrically connected to earth.

[0078] Next, the controller Ctr instructs the drive unit 16 to rotate the rotation shaft 15. As a result, the substrate W, which is mounted on the multiple protrusions 12b, rotates together with the rotating plate 11, the support plate 12, and the rotation shaft 15, around the rotation shaft 15 in a substantially horizontal position.

[0079] Next, the controller Ctr instructs the drive unit 45 to move the supply tube 100A from the retracted position to the discharge position. At this time, the controller Ctr may also instruct the variable resistor unit 200A to set the resistance value of the variable resistor unit 200A to a first value. The timing for setting the resistance value of the variable resistor unit 200A to the first value may be at the same time as the supply tube 100A starts moving from the retracted position, or it may be while the supply tube 100A is moving from the retracted position to the discharge position.

[0080] Next, the controller Ctr instructs the pump 42 and valve 43 to supply the chemical solution L1 from the liquid source 41 to the upper surface Wa of the substrate W from the outlet of the supply tube 100A. As a result, the chemical solution L1 spreads from the center of the substrate W toward the outer edge Wc, covering the entire upper surface Wa of the substrate W and coming into contact with the movable member 18. Therefore, the upper surface Wa of the substrate W is treated with the chemical solution L1, and an electrical circuit is formed by the movable member 18, the treatment liquid, the supply tube 100A, and the variable resistor 200A.

[0081] At this time, since the resistance value of the variable resistor 200A is set to the first value, current is less likely to flow between the supply tube 100A (multiple conductive parts 120) and the ground (movable member 18). Therefore, when the chemical solution L1 is supplied from the supply tube 100A to the substrate W, if the substrate W is charged, the ions in the chemical solution L1 will discharge the static charge from the substrate W. The time for supplying the chemical solution L1 to the upper surface Wa of the substrate W while the resistance value of the variable resistor 200A is set to the first value can be appropriately set according to the devices formed on the upper surface Wa of the substrate W, but for example, it may be about 5 seconds.

[0082] Next, with the chemical solution L1 still being supplied to the upper surface Wa of the substrate W, the controller Ctr instructs the variable resistor 200A to change its resistance value to the second value. This makes it easier for current to flow between the supply tube 100A (multiple conductive parts 120) and the ground (movable member 18). As a result, the chemical solution L1 flowing through the supply tube 100A is more easily discharged. Therefore, when the chemical solution L1 is supplied from the supply tube 100A to the substrate W, charging from the chemical solution L1 to the substrate W is suppressed. The time for which the chemical solution L1 is supplied to the upper surface Wa of the substrate W with the resistance value of the variable resistor 200A set to the second value can be set appropriately according to the devices formed on the upper surface Wa of the substrate W, but for example, it may be about 25 seconds.

[0083] Next, the controller Ctr instructs the pump 42 and valve 43 to stop supplying the chemical solution L1. The controller Ctr also instructs the drive unit 45 to move the supply tube 100A from the discharge position to the retracted position.

[0084] Next, the controller Ctr instructs the drive unit 55 to move the supply tube 100B from the retracted position to the discharge position. At this time, the controller Ctr may also instruct the variable resistor unit 200B to set the resistance value of the variable resistor unit 200B to a value lower than the first value (a third value). The timing for setting the resistance value of the variable resistor unit 200B to the second value may be at the same time as the supply tube 100B starts moving from the retracted position, or it may be while the supply tube 100B is moving from the retracted position to the discharge position.

[0085] Next, the controller Ctr instructs the pump 52 and valve 53 to supply the cleaning liquid L2 from the liquid source 51 to the upper surface Wa of the substrate W through the outlet of the supply tube 100B. As a result, the cleaning liquid L2 spreads from the center of the substrate W toward the outer edge Wc, covering the entire upper surface Wa of the substrate W and coming into contact with the movable member 18. Therefore, the upper surface Wa of the substrate W is treated with the cleaning liquid L2, and an electrical circuit is formed by the movable member 18, the treatment liquid, the supply tube 100B, and the variable resistor 200B.

[0086] At this time, since the resistance value of the variable resistor 200A is set to the third value, current flows more easily between the supply tube 100B (multiple conductive parts 120) and the ground (movable member 18). Therefore, the cleaning fluid L2 flowing through the supply tube 100B is more easily discharged. Consequently, when the cleaning fluid L2 is supplied from the supply tube 100B to the substrate W, charging from the cleaning fluid L2 to the substrate W is suppressed. The third value at this time may be a value that allows conductivity between the supply tube 100B (multiple conductive parts 120) and the ground (movable member 18). The third value may be the same as the second value, or it may be, for example, 1 kΩ or less. The time for supplying the cleaning fluid L2 to the upper surface Wa of the substrate W when the resistance value of the variable resistor 200B is set to the third value can be appropriately set according to the devices formed on the upper surface Wa of the substrate W, but it may be, for example, about 30 seconds.

[0087] Next, the controller Ctr instructs the pump 52 and valve 53 to stop supplying the cleaning fluid L2. The controller Ctr instructs the drive unit 55 to move the supply tube 100B from the discharge position to the retracted position.

[0088] Next, the rotation of the substrate W is continued for a predetermined time. This causes the cleaning solution L2 adhering to the substrate W to be shaken off by the rotation of the substrate W, and the surface of the substrate W is dried. The predetermined time can be set as appropriate depending on the processing status of the substrate W, but for example, it may be about 40 seconds.

[0089] Next, the controller Ctr instructs the drive unit 23 to raise the supply pipe 21. As a result, the supply pipe 21 and the multiple shafts 22 connected to the supply pipe 21 rise to the raised position (see Figure 4). Next, the substrate W, supported by the multiple protrusions 12b, is discharged from the liquid processing unit U by a transport mechanism (not shown). With this, the processing of the substrate W is completed.

[0090] [Effect] In the above example, first, with the resistance value of the variable resistor 200A set to a relatively high first value, the chemical solution L1 is supplied to the upper surface Wa of the substrate W through the supply tube 100A. Therefore, even if the substrate W is charged, current is less likely to flow between the multiple conductive parts 120 and the movable member 18 via the variable resistor 200A. Consequently, the charge in the chemical solution L1 gradually discharges the charge on the substrate W, making it possible to suppress the occurrence of arcing during the substrate processing process.

[0091] In the above example, while the supply of the chemical solution L1 continues, the resistance value of the variable resistor 200A is changed to a second, relatively low value. As a result, current flows more easily between the multiple conductive parts 120 and the movable member 18 via the variable resistor 200A. Consequently, the charge of the chemical solution L1 flowing through the supply tube 100A is discharged, making it possible to suppress the generation of static electricity in the supply tube 100A while suppressing the charging of the substrate W due to the charge of the chemical solution L1.

[0092] As shown in the above example, it is possible to effectively suppress arcing during the initial discharge of the chemical solution L1 onto the substrate W, static electricity generation in the supply tube 100A due to the continued discharge of the chemical solution L1 onto the substrate W, and charging of the substrate W due to the continued discharge of the chemical solution L1 onto the substrate W.

[0093] In the above example, with the resistance value of the variable resistor 200B set to a relatively low third value, the cleaning liquid L2 is supplied to the upper surface Wa of the substrate W through the supply tube 100B. As a result, current flows more easily between the multiple conductive parts 120 and the movable member 18 via the variable resistor 200B. Therefore, it is possible to suppress the charging of the substrate W by creating friction between the cleaning liquid L2 and the substrate W as the cleaning liquid L2 flows over the upper surface Wa of the substrate W.

[0094] In the above example, the chemical solution L1 can be supplied to the upper surface Wa of the substrate W through the supply tube 100A while the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 are insulated from each other. Therefore, even if the substrate W is charged, no current flows between the multiple conductive parts 120 via the variable resistor 200A and the movable member 18. Thus, it becomes possible to more effectively suppress the occurrence of arcing during the substrate processing process. Alternatively, in the above example, the chemical solution L1 can be supplied to the upper surface Wa of the substrate W through the supply tube 100A while the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 are electrically connected. Therefore, a current flows between the multiple conductive parts 120 via the variable resistor 200A and the movable member 18. Thus, it becomes possible to more effectively suppress the generation of static electricity in the supply tube 100A while more effectively suppressing the charging of the substrate W due to the charge of the chemical solution L1.

[0095] In the above example, the resistance value of the variable resistor 200A can be set to a first value while moving the supply tube 100A so that its discharge port is located on the upper surface Wa of the substrate W. In this case, the resistance value of the variable resistor 200A is set to a relatively high first value before the chemical solution L1 is discharged onto the upper surface Wa of the substrate W. Therefore, before the chemical solution L1 is discharged onto the upper surface Wa of the substrate W, it becomes difficult for current to flow between the multiple conductive parts 120 and the movable member 18 via the variable resistor 200A. Thus, it becomes possible to more reliably suppress the occurrence of arcing during the substrate processing process.

[0096] [Example of a variable resistor section] Here, an example of the variable resistor section 200 will be described with reference to Figures 9 to 12.

[0097] (Example 1) Figure 9 shows a variable resistor section 200 according to the first example. The variable resistor section 200 according to the first example may be a potentiometer. Specifically, the variable resistor section 200 may consist of a plurality of resistors 201 connected in parallel and a switch 202 connected in series with each resistor 201. With this configuration, the combined resistance value of the variable resistor section 200 changes according to the number of times each switch 202 is opened or closed.

[0098] The resistance values ​​of the multiple resistors 201 may be set such that the combined resistance of the variable resistor section 200 changes between a first value and a second value. The resistance values ​​of the multiple resistors 201 may all be the same, at least one may be different from the others, or all may be different from each other. The largest resistance value among the multiple resistors 201 may be 100kΩ or more. The smallest resistance value among the multiple resistors 201 may be 1kΩ or less.

[0099] According to the first example, it is possible to change the resistance value of the variable resistor 200 with a simple configuration.

[0100] (Second example) Figures 10 and 11 show a variable resistor unit 200 according to the second example. The variable resistor unit 200 according to the second example includes a conductive ring 210, a rotating part 220, a conductive member 230, and a drive unit 240.

[0101] The conductive ring 210 is a cylindrical component made of a conductive material. The conductive ring 210 is attached to the outer surface of the supply tube 100. Therefore, the conductive ring 210 is electrically connected to the multiple outer conductors 121 of the supply tube 100.

[0102] The rotating part 220 includes an insulating part 221 and a plurality of conductive parts 222. The insulating part 221 is a cylindrical member made of a resin material. In the example in Figures 10 and 11, the plurality of conductive parts 222 are provided on the outer circumferential surface of the insulating part 221 so as to extend along the longitudinal direction of the insulating part 221, spaced apart from each other in the radial direction of the insulating part 221. As illustrated in Figures 10(b) and 11(b), if there are four plurality of conductive parts 222, the plurality of conductive parts 222 may be arranged at approximately 90° intervals in the radial direction of the insulating part 221.

[0103] The rotating part 220 is rotatably mounted on the outer surface of the supply tube 100 so as to be in contact with the conductive ring 210. Therefore, the conductive ring 210 and the multiple conductive parts 222 are electrically connected. In the examples of Figures 10 and 11, the upper end surface of the rotating part 220 is in contact with the lower end surface of the conductive ring 210, but the lower end surface of the rotating part 220 may be in contact with the upper end surface of the conductive ring 210.

[0104] The conductive member 230 is made of a conductive material and is positioned to be in contact with the outer circumferential surface of the rotating part 220. The conductive member 230 is electrically connected to earth.

[0105] The drive unit 240 operates based on an operation signal from the controller Ctr and is configured to rotate the rotating unit 220. By the drive unit 240 rotating the rotating unit 220, the rotating unit 220 rotates between a connection position (see Figure 10) where one of the plurality of conductive parts 222 is electrically connected to the conductive member 230, and a non-connection position (see Figure 11) where none of the plurality of conductive parts 222 are electrically connected to the conductive member 230. The drive unit 240 may be, for example, a rotary motor.

[0106] In the second example, the controller Ctr may instruct the drive unit 240 to drive the rotating unit 220, thereby supplying the chemical solution L1 to the upper surface Wa of the substrate W through the supply tube 100A while the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 are insulated (see Figure 11). Subsequently, while the supply of the chemical solution L1 to the substrate W continues, the controller Ctr may instruct the drive unit 240 to drive the rotating unit 220, thereby creating conductivity between the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 (see Figure 10). In this case, it is possible to switch between insulation and conductivity between the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 with a simple configuration of rotating the rotating unit 220.

[0107] (Third example) Figure 12 shows a variable resistor unit 200 according to the third example. The variable resistor unit 200 according to the third example includes a conductive ring 250, a conductive part 260, and a drive unit 270.

[0108] The conductive ring 250 has the same configuration as the conductive ring 210 of the variable resistor section 200 in the second example, so its description is omitted.

[0109] The conductive part 260 is made of a conductive material and is configured to be movable up and down. The conductive part 260 is electrically connected to earth.

[0110] The drive unit 270 operates based on an operation signal from the controller Ctr and is configured to move the conductive part 260 up and down. As the drive unit 270 moves the conductive part 260 up and down, the conductive part 260 moves between a connection position where the conductive ring 250 and the conductive part 260 are electrically connected (see Figure 12(a)) and a non-connection position where the conductive ring 250 and the conductive part 260 are not electrically connected (see Figure 12(b)). The drive unit 270 may be, for example, a rotary motor.

[0111] In the third example, the controller Ctr may instruct the drive unit 270 to drive the conductive part 260, thereby supplying the chemical solution L1 to the upper surface Wa of the substrate W through the supply tube 100A while the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 are insulated (see Figure 12(b)). Subsequently, while the supply of the chemical solution L1 to the substrate W continues, the controller Ctr may instruct the drive unit 270 to drive the conductive part 260, thereby creating conductivity between the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 (see Figure 12(a)). In this case, it is possible to switch between insulation and conductivity between the multiple conductive parts 120 via the variable resistor 200A and the movable member 18 with a simple configuration of moving the conductive part 260.

[0112] [Differentiation] The disclosures herein should be considered in all respects to be illustrative and not restrictive. Various omissions, substitutions, and modifications may be made to the above examples without departing from the claims and the gist thereof.

[0113] (1) The resistance value of the variable resistor 200 may change discretely or continuously. That is, when the resistance value of the variable resistor 200 transitions from a first value to a second value, the resistance value may change directly from the first value to the second value, or it may change gradually from the first value to the second value. The same applies when the resistance value of the variable resistor 200 transitions from a second value to a third value.

[0114] (2) In the above example, the holding and non-holding of the substrate W was switched by moving the movable member 18 using the rotating shaft 18d. However, the switching between holding and non-holding of the substrate W is not limited to this configuration. For example, the holding and non-holding of the substrate W may be switched by moving the movable member 18 in the radial direction of the substrate W.

[0115] [Other examples] Example 1. An example of a substrate processing method includes a holding step in which the outer edge of the substrate is held by a conductive holding part, and a chemical supply step in which a conductive member supplies a chemical solution to the upper surface of the substrate through a supply tube provided on the outer surface after the holding step. The conductive member is electrically connected to one end of a variable resistor whose resistance value can be changed. The holding part is electrically connected to the other end of the variable resistor. The chemical supply step includes a first sub-step in which the resistance value of the variable resistor is set to a first value, a second sub-step in which the chemical solution is supplied to the upper surface of the substrate through the supply tube after the first sub-step, and a third sub-step in which, while continuing to supply the chemical solution from the first sub-step, the resistance value of the variable resistor is changed to a second value lower than the first value.

[0116] Incidentally, during the pre-treatment process of a substrate (for example, etching), the substrate may become charged. Therefore, if the holding part and the conductive member of the supply tube are each connected to, for example, earth, supplying a polarized chemical to a charged substrate will cause the chemical to act as a conductor, moving the charge on the substrate from one earth to the other. This causes an electric current to flow on the substrate, resulting in a discharge from the substrate called arcing (surface discharge). Consequently, devices (for example, patterns) formed on the upper surface of the substrate may be damaged due to dielectric breakdown.

[0117] On the other hand, if a supply tube with a conductive component on its outer surface is not used, there is a concern that static electricity may be generated as nonpolar chemicals, alcohols, etc. flow through the tube, potentially becoming an ignition source. In addition, if nonpolar chemicals, alcohols, etc. are discharged onto the top surface of the substrate and flow across that surface, the substrate may become further charged.

[0118] However, according to Example 1, in the second sub-step of the chemical solution supply process, the chemical solution is first supplied to the upper surface of the substrate through the supply tube with the resistance value of the variable resistor set to a relatively high first value. Therefore, even if the substrate is charged, current is less likely to flow between the conductive member and the holding part via the variable resistor. Consequently, the charge in the chemical solution gradually discharges the charge on the substrate, making it possible to suppress the occurrence of arcing during the substrate processing process.

[0119] In addition, according to Example 1, in the third sub-process following the second sub-process, the resistance value of the variable resistor is changed to a second value, which is relatively low, while the supply of the chemical solution from the first sub-process continues. As a result, current flows more easily between the conductive member and the holding part via the variable resistor. Consequently, the charge of the chemical solution flowing through the supply tube is discharged, making it possible to suppress the generation of static electricity in the supply tube while suppressing the charging of the substrate due to the charge of the chemical solution.

[0120] Based on the above, Example 1 makes it possible to effectively suppress arcing during the initial discharge of the chemical solution onto the substrate, static electricity generation in the supply tube due to continued discharge of the chemical solution onto the substrate, and static charge on the substrate due to continued discharge of the chemical solution onto the substrate.

[0121] Example 2. The method of Example 1 further includes a cleaning fluid supply step after the chemical solution supply step, in which a cleaning fluid is supplied to the upper surface of the substrate through another supply tube having another conductive member provided on its outer surface, wherein the other conductive member is electrically connected to one end of another variable resistor whose resistance value can be changed, and the retaining part is electrically connected to the other end of the other variable resistor, and the cleaning fluid supply step may include supplying the cleaning fluid to the upper surface of the substrate through the other supply tube with the resistance value of the other variable resistor set to a third value lower than the first value. In this case, the cleaning fluid is supplied to the upper surface of the substrate through the other supply tube with the resistance value of the variable resistor set to a relatively low third value. As a result, current flows more easily between the conductive member and the retaining part via the variable resistor. Consequently, it is possible to suppress the charging of the substrate by friction between the cleaning fluid and the substrate as the cleaning fluid flows over the upper surface of the substrate.

[0122] Example 3. In the method of Example 1 or Example 2, the first sub-step may include setting the resistance value of the variable resistor so that there is insulation between the conductive member and the holding part via the variable resistor, and the third sub-step may include setting the resistance value of the variable resistor so that there is conductivity between the conductive member and the holding part via the variable resistor. In this case, in the second sub-step, the chemical solution is supplied to the upper surface of the substrate through the supply tube while there is insulation between the conductive member and the holding part via the variable resistor. Therefore, even if the substrate is charged, no current flows between the conductive member and the holding part via the variable resistor. Thus, it is possible to more effectively suppress the occurrence of arcing during the substrate processing process. Also, in this case, in the third sub-step, the chemical solution is supplied to the upper surface of the substrate through the supply tube while there is conductivity between the conductive member and the holding part via the variable resistor. Therefore, current flows between the conductive member and the holding part via the variable resistor. Thus, it is possible to more effectively suppress the generation of static electricity in the supply tube while more effectively suppressing the charging of the substrate due to the charge of the chemical solution.

[0123] Example 4. In any of the methods in Examples 1 to 3, the first sub-step may include moving the supply tube so that the discharge port of the supply tube is located on the upper surface of the substrate, while setting the resistance value of the variable resistor to a first value. In this case, the resistance value of the variable resistor is set to a relatively high first value before the chemical solution is discharged onto the upper surface of the substrate. Therefore, before the chemical solution is discharged onto the upper surface of the substrate, it becomes difficult for current to flow between the conductive member and the holding part via the variable resistor. Thus, it becomes possible to more reliably suppress the occurrence of arcing during the substrate processing process.

[0124] Example 5. An example of a substrate processing apparatus comprises a conductive holding part configured to hold the outer edge of a substrate, a chemical supply part configured to supply a chemical solution to the upper surface of the substrate through a supply tube provided on the outer surface of a conductive member, a variable resistor part having one end electrically connected to the conductive member and the other end electrically connected to the holding part, and configured to change its resistance value, and a control unit. The control unit is configured to perform a first process of controlling the holding part to hold the outer edge of the substrate, a second process of controlling the variable resistor part after the first process to set the resistance value of the variable resistor part to a first value, a third process of controlling the chemical supply part after the second process to supply a chemical solution to the upper surface of the substrate through the supply tube, and a fourth process of controlling the chemical supply part and the variable resistor part after the third process to change the resistance value of the variable resistor part to a second value lower than the first value, while continuing to supply the chemical solution from the third process. In this case, the same effects and advantages as the apparatus in Example 1 can be obtained.

[0125] Example 6. The apparatus of Example 5 further comprises a cleaning fluid supply unit configured to supply cleaning fluid to the upper surface of the substrate through another supply tube having another conductive member provided on its outer surface, and another variable resistor unit having one end electrically connected to another conductive member and the other end electrically connected to a holding unit, and configured to change its resistance value. The control unit may be configured to perform a fifth process after the fourth process by controlling the cleaning fluid supply unit and the other variable resistor unit to supply cleaning fluid to the upper surface of the substrate through the other supply tube while the resistance value of the other variable resistor unit is set to a third value lower than the first value. In this case, the same effects and advantages as the apparatus of Example 2 can be obtained.

[0126] Example 7. In the apparatus of Example 5 or Example 6, the second process may include setting the resistance value of the variable resistor so that insulation is provided between the conductive member and the holding part via the variable resistor, and the fourth process may include setting the resistance value of the variable resistor so that electrical conductivity is established between the conductive member and the holding part via the variable resistor. In this case, the same effects as the apparatus of Example 3 can be obtained.

[0127] Example 8. Any apparatus of Examples 5 to 7 further comprises a tube drive unit configured to move a supply tube above the upper surface of a substrate, and the second process may include operating the variable resistor unit so that the resistance value of the variable resistor unit becomes a first value while the tube drive unit moves the supply tube so that the discharge port of the supply tube is located on the upper surface of the substrate. In this case, the same effects as the apparatus of Example 4 can be obtained.

[0128] Example 9. In any of the devices in Examples 5 to 8, the variable resistor may be a potentiometer. In this case, it becomes possible to change the resistance value of the variable resistor with a simple configuration.

[0129] Example 10. In any of the devices of Examples 5 to 8, the variable resistor includes an insulating part and a conductive part, and includes a rotating part rotatably mounted on the outer surface of the supply tube and a drive part configured to rotate the rotating part, the second process includes supplying a chemical solution to the upper surface of the substrate through the supply tube while the conductive member and the holding part are insulated via the variable resistor, by driving the rotating part with the drive part so that the insulating part is positioned between the conductive member and the holding part, and the third process may include supplying a chemical solution to the upper surface of the substrate through the supply tube while the conductive member and the holding part are electrically connected via the variable resistor, by driving the rotating part with the drive part so that the conductive part is positioned between the conductive member and the holding part. In this case, it is possible to switch between insulation and conductivity between the conductive member and the holding part via the variable resistor with a simple configuration of rotating the rotating part.

[0130] Example 11. In any of the devices of Examples 5 to 8, the variable resistor unit includes a conductive part and a drive unit configured to drive the conductive part so that it moves closer to and away from a conductive member, and the second process includes supplying a chemical solution to the upper surface of the substrate through a supply tube while the space between the conductive member and the holding part is insulated via the variable resistor unit by the drive unit driving the conductive part so that it moves away from the conductive member, and the third process may include supplying a chemical solution to the upper surface of the substrate through a supply tube while the space between the conductive member and the holding part is electrically connected via the variable resistor unit by the drive unit driving the conductive part so that it contacts the conductive member. In this case, it is possible to switch between insulation and conductivity between the conductive member and the holding part via the variable resistor unit with a simple configuration of moving the conductive part. [Explanation of symbols]

[0131] 1...Substrate processing system (substrate processing device), 10...Rotating holding unit, 13...Holding unit, 18...Movable member, 40...Chemical solution supply unit, 45...Drive unit (tube drive unit), 50...Cleaning solution supply unit, 100,100A...Supply tube, 100,100B...Supply tube (another supply tube), 120...Conductive part (conductive member, another conductive member), 200,200A...Variable resistor unit, 200,200B...Variable resistor unit (another variable resistor unit), 220...Rotating unit, 221...Insulating unit, 222...Conductive part, 240...Drive unit, 260...Conductive part, 270...Drive unit, Ctr...Controller (control unit), L1...Chemical solution, L2...Cleaning solution, W...Substrate, Wa...Top surface, Wc...Outer edge.

Claims

1. A holding step in which the outer edge of the substrate is held by a conductive holding part, Following the holding step, the process includes a chemical solution supply step in which a conductive member is provided on the outer surface of a supply tube to supply a chemical solution to the upper surface of the substrate, The conductive member is electrically connected to one end of a variable resistor whose resistance value can be changed. The holding portion is electrically connected to the other end of the variable resistor portion. The aforementioned drug solution supply process is, A first sub-step in which the resistance value of the variable resistor is set to a first value, A second sub-step is performed after the first sub-step, in which the chemical solution is supplied to the upper surface of the substrate through the supply tube, A substrate processing method comprising, after the second sub-step, a third sub-step in which, while continuing to supply the chemical solution from the first sub-step, the resistance value of the variable resistor is changed to a second value lower than the first value.

2. The process further includes a cleaning solution supply step, which, following the aforementioned chemical solution supply step, supplies the cleaning solution to the upper surface of the substrate through another supply tube having another conductive member provided on its outer surface, The aforementioned other conductive member is electrically connected to one end of another variable resistor whose resistance value can be changed. The holding portion is electrically connected to the other end of the other variable resistor portion. The method according to claim 1, wherein the cleaning fluid supply step includes supplying the cleaning fluid to the upper surface of the substrate through the other supply tube while the resistance value of the other variable resistor is set to a third value lower than the first value.

3. The first sub-step includes setting the resistance value of the variable resistor such that the conductive member and the holding portion are insulated via the variable resistor, The method according to claim 1 or 2, wherein the third sub-step includes setting the resistance value of the variable resistor so that electrical conductivity is established between the conductive member and the holding portion via the variable resistor.

4. The method according to claim 1 or 2, wherein the first sub-step includes moving the supply tube so that the discharge port of the supply tube is located on the upper surface of the substrate, while setting the resistance value of the variable resistor to the first value.

5. A conductive holding part configured to hold the outer edge of the substrate, A chemical solution supply unit configured to supply a chemical solution to the upper surface of a substrate through a supply tube provided on the outer circumferential surface of a conductive member, A variable resistor is configured such that one end is electrically connected to the conductive member and the other end is electrically connected to the holding part, and the resistance value can be changed. It includes a control unit, The control unit, A first process involves controlling the holding portion to hold the outer edge of the substrate, A second process is performed after the first process, in which the variable resistor is controlled to set the resistance value of the variable resistor to a first value, A third process is performed after the second process, in which the chemical supply unit is controlled to supply the chemical solution to the upper surface of the substrate through the supply tube, A substrate processing apparatus configured to perform a fourth process, after the third process, by controlling the chemical supply unit and the variable resistor unit to change the resistance value of the variable resistor unit to a second value lower than the first value, while continuing to supply the chemical solution from the third process.

6. A cleaning fluid supply unit configured to supply cleaning fluid to the upper surface of the substrate through another supply tube having another conductive member provided on its outer surface, The system further comprises another variable resistor, one end of which is electrically connected to the other conductive member and the other end of which is electrically connected to the holding portion, and which is configured to change the resistance value. The apparatus according to claim 5, wherein the control unit is configured to further perform a fifth process after the fourth process, by controlling the cleaning fluid supply unit and the other variable resistor unit to supply cleaning fluid to the upper surface of the substrate through the other supply tube while the resistance value of the other variable resistor unit is set to a third value lower than the first value.

7. The second process includes setting the resistance value of the variable resistor such that the conductive member and the holding portion are insulated via the variable resistor, The apparatus according to claim 5 or 6, wherein the fourth process includes setting the resistance value of the variable resistor so that electrical conductivity is established between the conductive member and the holding portion via the variable resistor.

8. The tube drive unit is further configured to move the supply tube above the upper surface of the substrate, The apparatus according to claim 5 or 6, wherein the second process includes the tube drive unit moving the supply tube so that the discharge port of the supply tube is located on the upper surface of the substrate, while operating the variable resistor so that the resistance value of the variable resistor becomes the first value.

9. The apparatus according to claim 5 or 6, wherein the variable resistor is a potentiometer.

10. The aforementioned variable resistor section is A rotating part, which includes an insulating part and a conductive part, is rotatably mounted on the outer surface of the supply tube, It includes a drive unit configured to rotate the aforementioned rotating part, The second process includes driving the rotating part with the drive unit so that the insulating part is positioned between the conductive member and the holding part, thereby supplying the chemical solution to the upper surface of the substrate through the supply tube while the conductive member and the holding part are insulated via the variable resistor. The apparatus according to claim 5 or 6, wherein the third process includes driving the rotating part by the drive part so that the conductive part is positioned between the conductive member and the holding part, thereby supplying the chemical solution to the upper surface of the substrate through the supply tube while electrical conductivity is established between the conductive member and the holding part via the variable resistor part.

11. The aforementioned variable resistor section is Conductive part and The conductive portion includes a drive unit configured to drive the conductive portion so that it moves closer to and further away from the conductive member, The second process includes supplying the chemical solution to the upper surface of the substrate through the supply tube, while the drive unit drives the conductive part so that the conductive part is separated from the conductive member, thereby insulating the conductive member and the holding part via the variable resistor. The apparatus according to claim 5 or 6, wherein the third process includes the drive unit driving the conductive part so that the conductive part comes into contact with the conductive member, thereby supplying the chemical solution to the upper surface of the substrate through the supply tube while electrical conductivity is established between the conductive member and the holding part via the variable resistor.

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