Multilayer electronic components

Abstract

This suppresses the occurrence of problems caused by the shield conductor. [Solution] The electronic component 1 comprises a laminate 50, a shield conductor 80, and an inductor L12 integrated with the laminate 50. The laminate 50 has sides 50C, 50D, 50E, and 50F. The shield conductor 80 includes a first conductor portion 80C covering side 50C and a second conductor portion 80E covering side 50E. The conductor layer 41 of the inductor L12 extends in a first direction parallel to the axis intersecting the sides 50E and 50F. A plurality of first columnar conductors T1 are connected to the vicinity of the first end 41a of the conductor layer 41. At least one second columnar conductor T2 is connected to the vicinity of the second end 41b of the conductor layer 41. The distance D1 between the inductor L12 and side 50C is greater than the distance D2 between the inductor L12 and side 50E.

Description

【Technical Field】 【0001】 The present invention relates to a multilayer electronic component provided with a shield conductor integrated with a laminate. 【Background Art】 【0002】 In recent years, there has been a market demand for miniaturization and space saving of small mobile communication devices, and miniaturization of bandpass filters used in such communication devices has also been required. As a bandpass filter suitable for miniaturization, one using a laminate including a plurality of stacked dielectric layers and a plurality of conductor layers is known. As an inductor used in a bandpass filter using a laminate, an inductor constituted by a conductor layer and a columnar conductor extending in the stacking direction of a plurality of dielectric layers is known. Such an inductor is disclosed in, for example, Patent Document 1. 【0003】 In addition, along with the miniaturization and space saving of small mobile communication devices, the density of mounting of electronic components used in communication devices has been increasing. As a result, the distance between a plurality of electronic components mounted on a mounting substrate has been decreasing. When the distance between a plurality of electronic components decreases, electromagnetic interference between the plurality of electronic components is likely to occur. In order to suppress electromagnetic interference, it is conceivable to provide a shield on the main body of an electronic component. Patent Document 2 discloses an electronic component including a laminate and shield electrodes provided on four side surfaces of the laminate and electrically connected to a ground external electrode. 【Prior Art Documents】 【Patent Documents】 【0004】 【Patent Document 1】 Japanese Unexamined Patent Application Publication No. 2021-121110 【Patent Document 2】 International Publication No. 2017 / 169102 【Summary of the Invention】 【Problems to be Solved by the Invention】 【0005】 When an inductor composed of a conductive layer and a columnar conductor, as disclosed in Patent Document 1, is applied to an electronic component equipped with a shield, as disclosed in Patent Document 2, if the laminate is miniaturized, the coupling between the columnar conductor and the shield becomes stronger, and as a result, it may not be possible to achieve the desired characteristics. 【0006】 The above problem applies not only to bandpass filters, but to all multilayer electronic components that include a shield and an inductor composed of a conductive layer and columnar conductors. 【0007】 The present invention has been made in view of the above problems, and its object is to provide a laminated electronic component comprising a shielding conductor integrated with a laminate and an inductor including a columnar conductor and a conductor layer and integrated with the laminate, which suppresses the occurrence of problems caused by the shielding conductor and enables the realization of desired characteristics. [Means for solving the problem] 【0008】 A first aspect of the present invention is a laminated electronic component comprising a laminate including a plurality of stacked dielectric layers, a shielding conductor integrated with the laminate, a plurality of first columnar conductors and at least one second columnar conductor each extending in the stacking direction of the plurality of dielectric layers, and a conductor layer, as well as an inductor integrated with the laminate. The laminate has a first face and a second face located at both ends in the stacking direction, and a first side, a second side, a third side, and a fourth side connecting the first face and the second face. The first side and the second side face opposite each other. The third side and the fourth side face opposite each other. The shielding conductor includes a first conductor portion covering the first side and a second conductor portion covering the third side. The inductor is positioned closer to the first side than to the second side and closer to the third side than to the fourth side. The conductor layer extends in a first direction parallel to the axis intersecting the third and fourth sides, and has first and second ends located at both ends in its longitudinal direction. A plurality of first columnar conductors are connected to the vicinity of the first end of the conductor layer. At least one second columnar conductor is connected to the vicinity of the second end of the conductor layer. The distance between the inductor and the first side is greater than the distance between the inductor and the third side. 【0009】 A laminated electronic component according to a second aspect of the present invention comprises a laminate including a plurality of stacked dielectric layers, a shield conductor integrated with the laminate, and an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in the stacking direction of the plurality of dielectric layers, and a conductor layer. The laminate has a first face and a second face located at both ends in the stacking direction, and a first side, a second side, a third side, and a fourth side connecting the first face and the second face. The first side and the second side face opposite each other. The third side and the fourth side face opposite each other. The shield conductor includes a first conductor portion covering the first side and a second conductor portion covering the third side. The inductor is positioned closer to the first side than to the second side and closer to the third side than to the fourth side. The conductor layer extends in a direction perpendicular to the lamination direction and parallel to the axis intersecting the third and fourth sides, and in a direction parallel to the axis intersecting the first and second sides, and has first and second ends located at both ends in its longitudinal direction. At least one first columnar conductor is connected to the portion of the conductor layer near the first end. At least one second columnar conductor is connected to the portion of the conductor layer near the second end. [Effects of the Invention] 【0010】 In the multilayer electronic component according to the first aspect of the present invention, the conductor layer of the inductor extends in a first direction parallel to the axis intersecting the third and fourth sides. The distance between the inductor and the first side is greater than the distance between the inductor and the third side. As a result, the multilayer electronic component according to the first aspect of the present invention has the effect of suppressing the occurrence of problems caused by the shield conductor and achieving desired characteristics. 【0011】 In the stacked electronic component of the second aspect of the present invention, the conductor layer of the inductor extends in a direction perpendicular to the stacking direction and parallel to the axis intersecting the third and fourth sides, and in a direction parallel to the axis intersecting the first and second sides. As a result, the stacked electronic component of the second aspect of the present invention has the effect of achieving desired characteristics while suppressing the occurrence of problems caused by the shield conductor. [Brief explanation of the drawing] 【0012】 [Figure 1] This is a block diagram showing the configuration of a stacked electronic component according to the first embodiment of the present invention. [Figure 2] This is a circuit diagram showing an example of the circuit configuration of a stacked electronic component according to the first embodiment of the present invention. [Figure 3] This is a perspective view showing a part of a stacked electronic component according to the first embodiment of the present invention. [Figure 4] This is a perspective view showing a laminate in the first embodiment of the present invention. [Figure 5] This is a perspective view showing a laminate in the first embodiment of the present invention. [Figure 6] This is a perspective view showing the appearance of a stacked electronic component according to the first embodiment of the present invention. [Figure 7] This is a perspective view showing a part of the interior of the laminate in the first embodiment of the present invention. [Figure 8] This is a plan view showing a part of the interior of the laminate in the first embodiment of the present invention. [Figure 9] This is a plan view showing another part of the interior of the laminate in the first embodiment of the present invention. [Figure 10] This is a plan view showing a part of the interior of the laminate in the second embodiment of the present invention. [Figure 11] This is a plan view showing another part of the interior of the laminate in the second embodiment of the present invention. [Modes for carrying out the invention] 【0013】 [First Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, referring to FIG. 1, the configuration of a stacked electronic component (hereinafter simply referred to as an electronic component) 1 according to the first embodiment of the present invention will be described. FIG. 1 is a block diagram showing the configuration of the electronic component 1 according to the present embodiment. The electronic component 1 according to the present embodiment is configured to function as a band-pass filter that selectively passes signals having frequencies within a predetermined passband. 【0014】 The electronic component 1 according to the present embodiment includes a first signal terminal 2, a second signal terminal 3, a first circuit portion 10, a second circuit portion 20, and a third circuit portion 30 provided between the first signal terminal 2 and the second signal terminal 3 in terms of circuit configuration. In particular, in the present embodiment, the first signal terminal 2 may be a terminal for connecting to an antenna. The second signal terminal 3 may be a terminal for connecting to at least one of a transmission circuit for processing a transmission signal and a reception circuit for processing a reception signal. In the present application, the expression "in terms of circuit configuration" is used to refer to the arrangement on the circuit diagram rather than the arrangement in the physical configuration. 【0015】 The first circuit portion 10, the second circuit portion 20, and the third circuit portion 30 are provided in this order from the first signal terminal 2 toward the second signal terminal 3. The first circuit portion 10 includes a first filter 11 and a second filter 12. The first filter 11 is connected to the first signal terminal 2. The second filter 12 is provided between the first filter 11 and the second circuit portion 20 in terms of circuit configuration. 【0016】 The first filter 11 and the second filter 12 are each constituted by a resonance circuit including at least one inductor and at least one capacitor. In the first filter 11, the resonance circuit may constitute a low-pass filter. In the second filter 12, the resonance circuit may constitute a high-pass filter. FIG. 1 shows an example in which the resonance circuit of the first filter 11 is a low-pass filter and the resonance circuit of the second filter 12 is a high-pass filter. In this case, the entire first circuit portion 10 becomes a band-pass filter. 【0017】 The second circuit portion 20 is constituted by a resonance circuit including at least one surface acoustic wave device. 【0018】 The third circuit portion 30 is constituted by a resonance circuit including at least one inductor and at least one capacitor. In the third circuit portion 30, the resonance circuit may constitute a high-pass filter. 【0019】 Next, referring to FIG. 2, an example of the circuit configuration of the electronic component 1 will be described. FIG. 2 is a circuit diagram showing the circuit configuration of the electronic component 1. First, the configuration of the first circuit portion 10 will be described. The first filter 11 of the first circuit portion 10 includes inductors L11 and L12, and capacitors C1, C2, C3, and C4. One end of the inductor L11 is connected to the first signal terminal 2. One end of the inductor L12 is connected to the other end of the inductor L11. 【0020】 One end of the capacitor C1 is connected to the connection point between the inductors L11 and L12. One end of the capacitor C2 is connected to the other end of the inductor L12. The other ends of the capacitors C1 and C2 are connected to the ground. 【0021】 The capacitor C3 is connected in parallel to the inductor L11. The capacitor C4 is connected in parallel to the inductor L12. 【0022】 The second filter 12 of the first circuit section 10 includes inductors L13, L14, L15 and capacitors C5, C6, C7, C8, C9, C10, C11, C12. One end of capacitor C5 is connected to the other end of inductor L12 of the first filter 11. One end of capacitor C6 is connected to the other end of capacitor C5. 【0023】 One end of inductor L13 is connected to one end of capacitor C5. Capacitor C7 is connected in parallel with inductor L13. One end of capacitor C8 is connected to the other end of inductor L13. The other end of capacitor C8 is connected to ground. 【0024】 One end of inductor L14 is connected to the connection point between capacitors C5 and C6. Capacitor C9 is connected in parallel with inductor L14. One end of capacitor C10 is connected to the other end of inductor L14. The other end of capacitor C10 is connected to ground. 【0025】 One end of inductor L15 is connected to the other end of capacitor C6. Capacitor C11 is connected in parallel with inductor L15. One end of capacitor C12 is connected to the other end of inductor L15. The other end of capacitor C12 is connected to ground. 【0026】 Next, the second circuit section 20 will be described. The second circuit section 20 includes elastic wave elements 21 and 22, capacitors C21 and C22, and an LC parallel circuit 23. One end of elastic wave element 21 is connected to the other end of capacitor C6 of the second filter 12. One end of elastic wave element 22 is connected to the other end of elastic wave element 21. 【0027】 Capacitor C21 is connected in parallel to the elastic wave element 21. One end of capacitor C22 is connected to the other end of the elastic wave element 22. 【0028】 The LC parallel circuit 23 includes an inductor L21 and a capacitor C23. One end of the inductor L21 is connected to the other end of the capacitor C22. The capacitor C23 is connected in parallel with the inductor L21. The other end of the inductor L21 is connected to ground. 【0029】 Next, the third circuit section 30 will be described. The third circuit section 30 includes inductors L31 and L32 and capacitors C31, C32, and C33. One end of capacitor C31 is connected to the other end of the elastic wave element 21 of the second circuit section 20. One end of inductor L31 is connected to the other end of capacitor C31. The other end of inductor L31 is connected to the second signal terminal 3. 【0030】 One end of capacitor C32 is connected to one end of inductor L31. One end of inductor L32 is connected to the other end of capacitor C32. Capacitor C33 is connected in parallel with inductor L32. The other end of inductor L32 is connected to ground. 【0031】 Next, the specific configuration of the electronic component 1 will be described with reference to Figures 1 to 6. Figure 3 is a perspective view showing a part of the electronic component 1. Figures 4 and 5 are perspective views showing the laminate. Figure 6 is a perspective view showing the external appearance of the electronic component 1. The electronic component 1 according to this embodiment comprises a laminate 50 and mounted components 60 mounted on the laminate 50. 【0032】 First, the structure of the laminate 50 will be described. The laminate 50 includes multiple stacked dielectric layers and multiple conductors (multiple conductor layers and multiple through-holes). Each of the multiple dielectric layers is made of a dielectric material. For example, low-temperature co-fired ceramics (LTCC) are used as the dielectric material. 【0033】 The inductors L11-L15, L21, L31, L32 and capacitors C1-C12, C21-C23, C31-C33 shown in Figure 2 are composed of multiple conductors provided within the laminate 50. In other words, the inductors L11-L15, L21, L31, L32 and capacitors C1-C12, C21-C23, C31-C33 are integrated with the laminate 50. 【0034】 Inductors L11, L12 and capacitors C1-C4 are components of the first filter 11 shown in Figure 1, inductors L13-L15 and capacitors C5-C12 are components of the second filter 12 shown in Figure 1, and the first filter 11 and the second filter 12 are components of the first circuit section 10 shown in Figure 1. Therefore, it can be said that the first filter 11 and the second filter 12 are integrated with the laminate 50, and the first circuit section 10 is also integrated with the laminate 50. 【0035】 Furthermore, the inductor L21 and capacitors C21-C23 are part of the components of the second circuit section 20 shown in Figure 1, and represent the portion of the second circuit section 20 excluding the elastic wave elements 21 and 22. Therefore, it can be said that the portion of the components of the second circuit section 20 excluding the elastic wave elements 21 and 22 is integrated with the laminate 50. 【0036】 Furthermore, the inductors L31, L32 and capacitors C31-C33 are components of the third circuit section 30 shown in Figure 1. Therefore, it can be said that the third circuit section 30 is integrated with the laminate 50. 【0037】 The laminate 50 has a first surface 50A and a second surface 50B located at both ends of the stacking direction T of the multiple dielectric layers, and four side surfaces 50C to 50F connecting the first surface 50A and the second surface 50B. Side surfaces 50C and 50D face opposite each other, and side surfaces 50E and 50F also face opposite each other. Side surfaces 50C to 50F are perpendicular to the first surface 50A and the second surface 50B. 【0038】 Here, as shown in Figures 3 to 6, we define the X, Y, and Z directions. The X, Y, and Z directions are orthogonal to each other. In this embodiment, the Z direction is defined as one direction parallel to the stacking direction T. The Z direction is also one direction parallel to the direction in which the stacked body 50 and the mounted components 60 are aligned. Furthermore, the direction opposite to the X direction is defined as the -X direction, the direction opposite to the Y direction is defined as the -Y direction, and the direction opposite to the Z direction is defined as the -Z direction. In addition, the expression "when viewed from a predetermined direction (for example, the stacking direction T)" means viewing the object from a position at a distance in the predetermined direction or one direction parallel to the predetermined direction. 【0039】 As shown in Figures 3 to 5, the first surface 50A is located at the Z-edge of the laminate 50. The first surface 50A is also the top surface of the laminate 50 and the mounting surface for mounting the components 60. The second surface 50B is located at the -Z-edge of the laminate 50. The second surface 50B is also the bottom surface of the laminate 50. Figure 4 shows the laminate 50 as viewed from the first surface 50A side. Figure 5 shows the laminate 50 as viewed from the second surface 50B side. 【0040】 Side 50C is located at the -X end of the laminate 50. Side 50D is located at the X end of the laminate 50. Side 50E is located at the -Y end of the laminate 50. Side 50F is located at the Y end of the laminate 50. 【0041】 The laminate 50 further includes a plurality of electrodes 111, 112, 113, 114, 115, 116, 117, 118, and 119 provided on the second surface 50B of the laminate 50. Electrodes 111, 112, and 113 are arranged in this order in the X direction at a position closer to side surface 50E than to side surface 50F. Electrodes 115, 116, and 117 are arranged in this order in the -X direction at a position closer to side surface 50F than to side surface 50E. 【0042】 Electrode 114 is positioned between electrode 113 and electrode 115. Electrode 118 is positioned between electrode 111 and electrode 117. Electrode 119 is positioned between electrode 112 and electrode 116. Electrode 119 is also positioned approximately in the center of the second surface 50B. 【0043】 Electrode 118 corresponds to the first signal terminal 2. Electrode 114 corresponds to the second signal terminal 3. Therefore, the first signal terminal 2 and the second signal terminal 3 are provided on the second surface 50B of the laminate 50. Each of electrodes 111, 112, 113, 115, 116, 117, and 119 is connected to ground. 【0044】 The laminate 50 further includes four electrodes 121, 122, 123, and 124 provided on the first surface 50A of the laminate 50. Electrodes 121 and 122 are arranged in this order in the X direction. Electrodes 123 and 124 are arranged in this order in the X direction at a position beyond electrodes 121 and 122 in the -Y direction. 【0045】 In this embodiment, electrode 121 is positioned closer to electrode 123 than electrode 124. Electrode 122 is positioned closer to electrode 124 than electrode 123. 【0046】 Next, the configuration of the mounted component 60 will be described. The mounted component 60 includes the elastic wave elements 21 and 22 shown in Figure 2. The mounted component 60 also has a third surface 60A and a fourth surface 60B located at both ends in the stacking direction T, and four side surfaces 60C, 60D, 60E, and 60F connecting the third surface 60A and the fourth surface 60B. The four side surfaces 60C to 60F are perpendicular to the third surface 60A and the fourth surface 60B. 【0047】 The third surface 60A is located at the Z-direction end of the mounted component 60. The third surface 60A is also the top surface of the mounted component 60. The fourth surface 60B is located at the -Z-direction end of the mounted component 60. The fourth surface 60B is also the bottom surface of the mounted component 60 and is the opposing surface to the first surface 50A of the laminate 50. 【0048】 The mounted component 60 further includes four terminals 61, 62, 63, and 64 provided on the fourth surface 60B. When the mounted component 60 is mounted on the laminate 50, terminals 61 to 64 each face electrodes 121 to 124 of the laminate 50. Terminals 61 to 64 are physically connected to electrodes 121 to 124, for example, by solder bumps 7. 【0049】 One end of elastic wave element 21 is connected to terminal 61. The other end of elastic wave element 21 is connected to terminal 62. One end of elastic wave element 22 is connected to terminal 63. The other end of elastic wave element 22 is connected to terminal 64. Since terminals 61 to 64 are connected to electrodes 121 to 124 respectively, one end of elastic wave element 21, the other end of elastic wave element 21, one end of elastic wave element 22, and the other end of elastic wave element 22 are connected to electrodes 121, 122, 123, and 124, respectively. 【0050】 The electronic component 1 further includes a sealing portion (not shown) that seals the mounted component 60. The sealing portion covers the periphery of the mounted component 60 and at least a portion of the first surface 50A of the laminate 50. The sealing portion may further cover at least a portion of the sides 50C to 50F of the laminate 50. The sealing portion is made of an insulating material, for example, a resin. 【0051】 As shown in Figure 6, the electronic component 1 further comprises a shield conductor 80 made of a conductor and integrated with the laminate 50. The shield conductor 80 includes a first conductor portion 80C that covers the side surface 50C of the laminate 50 and a second conductor portion 80E that covers the side surface 50E of the laminate 50. The first conductor portion 80C covers all or almost all of the side surface 50C. The second conductor portion 80E covers all or almost all of the side surface 50E. 【0052】 The shield conductor 80 further includes a conductor portion 80A that covers the mounted component 60 and the first surface 50A of the laminate 50, a conductor portion 80D that covers the side surface 50D of the laminate 50, and a conductor portion 80F that covers the side surface 50F of the laminate 50. The conductor portion 80D covers all or almost all of the side surface 50D. The conductor portion 80F covers all or almost all of the side surface 50F. 【0053】 The shield conductor 80 may consist of a single metal layer or may include multiple stacked metal layers. In this case, it is preferable that the first conductor portion 80C, the second conductor portion 80E, and the conductor portions 80A, 80D, and 80F are continuous. That is, it is preferable that the first conductor portion 80C is connected to the second conductor portion 80E and the conductor portions 80A and 80F, and that the second conductor portion 80E is connected to the first conductor portion 80C and the conductor portions 80A and 80D. Figure 6 shows the case where the first conductor portion 80C, the second conductor portion 80E, and the conductor portions 80A, 80D, and 80F are continuous. 【0054】 Furthermore, if the electronic component 1 has a sealing portion, the shield conductor 80 may be provided so as to cover the sealing portion. That is, the conductor portion 80A may cover the mounted component 60 and the first surface 50A via the sealing portion. The first conductor portion 80C may cover the side surface 50C via the sealing portion. The conductor portion 80D may cover the side surface 50D via the sealing portion. The second conductor portion 80E may cover the side surface 50E via the sealing portion. The conductor portion 80F may cover the side surface 50F via the sealing portion. 【0055】 The shield conductor 80 is electrically connected to at least one of the electrodes 111, 112, 113, 115, 116, 117, and 119, which are connected to ground. The laminate 50 includes multiple conductors (multiple conductor layers and multiple through-holes) that electrically connect the shield conductor 80 to at least one of the electrodes 111, 112, 113, 115, 116, 117, and 119. 【0056】 Next, the structural features of the electronic component 1 according to this embodiment will be described with reference to Figures 7 to 9. Figure 7 is a perspective view showing a part of the interior of the laminate 50 in this embodiment. Figure 8 is a plan view showing a part of the interior of the laminate 50 in this embodiment. Figure 9 is a plan view showing another part of the interior of the laminate 50 in this embodiment. 【0057】 The structural features of the electronic component 1 will be described below, using the inductor L12 of the first filter 11 of the first circuit section 10 as an example. The inductor L12 is integrated with the laminate 50 and is positioned closer to side 50C than to side 50D and closer to side 50E than to side 50F. 【0058】 Furthermore, the inductor L12 is wound around an axis extending in a direction perpendicular to the stacking direction T. Here, a columnar structure formed by connecting multiple through-holes in series is called a columnar conductor. The columnar conductor extends in a direction parallel to the stacking direction T. The inductor L12 includes a plurality of first columnar conductors T1 and at least one second columnar conductor T2, and a conductor layer connecting the plurality of first columnar conductors T1 and at least one second columnar conductor T2. The conductor layer extends in a first direction parallel to an axis intersecting the sides 50E, 50F. The first direction may be perpendicular to the stacking direction T. Alternatively, the first direction may intersect the stacking direction T at an angle other than 90°. In this case, the first direction may be a direction that moves away from the first surface 50A as it moves away from the side 50E, or a direction that moves closer to the first surface 50A as it moves away from the side 50E. 【0059】 In this embodiment, the inductor L12 specifically includes two first columnar conductors T1 and two second columnar conductors T2, each extending in the stacking direction T, and a conductor layer 41 connecting the two first columnar conductors T1 and the two second columnar conductors T2. The conductor layer 41 extends in a direction parallel to the axis intersecting the sides 50E and 50F (the first direction). The conductor layer 41 also has a first end 41a and a second end 41b located at both ends in its longitudinal direction. The axis intersecting the sides 50E and 50F may be an axis extending in a direction parallel to the Y direction, i.e., the Y-axis, or an axis extending in a direction inclined with respect to the Y-axis. In this embodiment, in particular, the axis intersecting the sides 50E and 50F is an axis extending in a direction parallel to the Y direction (the Y-axis), and the first direction is the direction parallel to the Y direction. The first end 41a is an end located near the side 50E. The second end 41b is the end opposite to the first end 41a. 【0060】 The two first columnar conductors T1 are aligned along a second direction parallel to the axis intersecting the sides 50C and 50D. Similarly, the two second columnar conductors T2 are aligned along the second direction. The axis intersecting the sides 50C and 50D may be an axis extending in a direction parallel to the X direction, i.e., the X-axis, or an axis extending in a direction inclined with respect to the X-axis. In this embodiment in particular, the axis intersecting the sides 50C and 50D is an axis extending in a direction parallel to the X direction (X-axis), and the second direction is a direction parallel to the X direction. As shown in Figure 8, the two first columnar conductors T1 are connected to the vicinity of the first end 41a of the conductor layer 41. The two second columnar conductors T2 are connected to the vicinity of the second end 41b of the conductor layer 41. 【0061】 The inductor L12 is wound around a first axis A1 parallel to the direction perpendicular to the stacking direction T, such that an opening is formed surrounded by the conductor layer 41, two first columnar conductors T1, and two second columnar conductors T2. The first axis A1 may be an axis extending in a direction parallel to the X direction, i.e., the X-axis, or an axis extending in a direction inclined with respect to the X-axis. The opening of the inductor L12 faces the side surface 50C (side surface 50D). 【0062】 As shown in Figure 9, the inductor L12 further includes a conductor layer 42 and two through-holes 41T1 and one through-hole 41T2 that electrically connect the conductor layer 41 and the conductor layer 42. The conductor layer 42 is positioned to overlap at least a portion of the conductor layer 41 when viewed from the stacking direction T. Figure 8 shows the planar shape of a portion of the inductor L12 as viewed from the stacking direction T, namely the conductor layer 41, the two first columnar conductors T1 and the two second columnar conductors T2. Figure 9 shows the overall planar shape of the inductor L12 as viewed from the stacking direction T. 【0063】 The conductor layer 42 extends in a first direction (a direction parallel to the Y direction). The conductor layer 42 also has a first end 42a and a second end 42b located at both ends in its longitudinal direction. The first end 42a is the end located near the side surface 50E. The second end 42b is the end opposite to the first end 42a. 【0064】 The two through-holes 41T1 are aligned along a second direction (parallel to the X direction). As shown in Figure 9, the two through-holes 41T1 are connected to the vicinity of the first end 41a of the conductor layer 41 and to the vicinity of the first end 42a of the conductor layer 42. The through-hole 41T2 is connected to the vicinity of the second end 41b of the conductor layer 41 and to the vicinity of the second end 42b of the conductor layer 42. 【0065】 Next, the relationship between inductor L12 and sides 50C and 50E will be explained with reference to Figures 8 and 9. In Figures 8 and 9, the arrows labeled D1 represent the distance between inductor L12 and side 50C. The arrows labeled D2 represent the distance between inductor L12 and side 50E. The distance D1 between inductor L12 and side 50C is greater than the distance D2 between inductor L12 and side 50E. 【0066】 Conductor layer 41 has a first width, which is its dimension in the shorter direction. The distance D1 between the inductor L12 and the side surface 50C is greater than the first width. Similarly, conductor layer 42 has a second width, which is its dimension in the shorter direction. The distance D1 between the inductor L12 and the side surface 50C is greater than the second width. 【0067】 Next, the relationship between the inductor L12 and other elements will be described with reference to Figures 7 to 9. The electronic component 1 may further include at least one other element, of which at least a portion is located between the inductor L12 and the side surface 50C when viewed from the stacking direction T. The at least one other element may be an inductor or a capacitor. In the example shown in Figures 7 and 9, the at least one other element is the inductor L11 and capacitors C1, C2, C4 of the first filter 11 of the first circuit portion 10. 【0068】 The inductor L11 is wound around a second axis A2 parallel to the stacking direction T. 【0069】 The laminate 50 includes conductive layers 43 and 44. The electrode 111 and conductive layer 43 constitute at least a portion of each of the capacitors C1 and C2. Conductive layers 43 and 44 constitute at least a portion of the capacitor C4. 【0070】 Furthermore, no components are required to be placed between the inductor L12 and the side surface 50E. 【0071】 Next, the operation and effects of the electronic component 1 according to this embodiment will be described. In this embodiment, the inductor L12 is positioned closer to side surface 50C than to side surface 50D, and closer to side surface 50E than to side surface 50F. The opening of the inductor L12 does not face side surface 50E, but it does face side surface 50C. Therefore, the magnetic flux generated from the inductor L12 acts more strongly on the first conductor portion 80C of the shield conductor 80 covering side surface 50C than on the second conductor portion 80E of the shield conductor 80 covering side surface 50E. As a result, the inductor L12 and the first conductor portion 80C are coupled, and the magnetic flux generated from the inductor L12 may affect the characteristics of other elements of the electronic component 1 via the first conductor portion 80C. In particular, if these other elements together with the inductor L12 constitute a single resonant circuit, the characteristics of the resonant circuit may deviate from the desired characteristics. As a result, the characteristics of the entire electronic component 1 may deviate from the desired characteristics. 【0072】 Furthermore, in this embodiment, the Q value of the inductor L12 is increased by configuring the inductor L12 using a plurality of first columnar conductors T1 and at least one second columnar conductor T2, thereby reducing the insertion loss of the electronic component 1, which is a bandpass filter. However, as described above, if the magnetic flux generated from the inductor L12 affects the characteristics of other elements of the electronic component 1, it may become impossible to achieve the desired characteristics. 【0073】 In contrast, in this embodiment, the distance D1 between the inductor L12 and the side surface 50C is greater than the distance D2 between the inductor L12 and the side surface 50E. This suppresses coupling between the inductor L12 and the first conductor portion 80C. Thus, according to this embodiment, the occurrence of problems caused by the shield conductor 80 can be suppressed, and the desired characteristics can be achieved. 【0074】 Furthermore, by arranging the inductor L12 as described above, there is space between the inductor L12 and the side surface 50C where at least a portion of at least one other element can be placed. The at least one other element may be an element that forms a single resonant circuit together with the inductor L12, or an element that forms another resonant circuit. In addition, the at least one other element may be positioned and oriented in such a way that it does not strongly couple with the inductor L12. 【0075】 In this embodiment, when viewed from the stacking direction T, inductor L11 is positioned between inductor L12 and side surface 50C. In particular, in this embodiment, inductor L11, together with inductor L12, constitutes the resonant circuit of the first filter 11. Inductor L11 is wound around a second axis A2 parallel to the stacking direction T. As a result, according to this embodiment, the space within the laminate 50 can be efficiently utilized while suppressing coupling between inductor L11 and inductor L12. Note that inductor L11 may be positioned at a different location from the opening of inductor L12 in the stacking direction T. 【0076】 Furthermore, in this embodiment, when viewed from the stacking direction T, at least a portion of each of the capacitors C1, C2, and C4 is arranged between the inductor L12 and the side surface 50C. In particular, in this embodiment, the capacitors C1, C2, and C4 together with the inductor L12 constitute the resonant circuit of the first filter 11. Note that the capacitors C1, C2, and C4 may be arranged in positions different from the opening of the inductor L12 in the stacking direction T. As a result, according to this embodiment, the space within the stacked body 50 can be efficiently utilized while suppressing coupling between the inductor L12 and the capacitors C1, C2, and C4. 【0077】 [Second Embodiment] Next, a second embodiment of the present invention will be described with reference to Figures 10 and 11. Figure 10 is a plan view showing a part of the interior of the laminate 50 in this embodiment. Figure 11 is a plan view showing another part of the interior of the laminate 50 in this embodiment. 【0078】 In this embodiment, the inductor L12 includes conductor layers 141, 142, at least one first columnar conductor T11, at least one second columnar conductor T12, and two through-holes 41T1 and 41T2, instead of the conductor layers 41, 42, a plurality of first columnar conductors T1, at least one second columnar conductor T12, and two through-holes 141T11 and 141T12 in the first embodiment. 【0079】 The conductor layer 141 extends in a third direction D3. The third direction D3 is parallel to axis A3, which is inclined with respect to each of the sides 50C and 50E and intersects with the inductor L12 but does not intersect with both sides 50C and 50E. Axis A3 may intersect with either side 50C or 50E, as long as it satisfies the requirement that it does not intersect with both sides 50C and 50E. Alternatively, axis A3 may intersect with a corner located at the intersection of sides 50C and 50E. Axis A3 further intersects with a corner located at the intersection of side 50D, side 50F, or sides 50D and 50F. Note that axis A3 is not perpendicular to side 50C and is not perpendicular to side 50E. 【0080】 The third direction D3 may be a direction perpendicular to the stacking direction T, similar to the first direction in the first embodiment, or it may be a direction that intersects the stacking direction T at an angle other than 90°. 【0081】 The conductor layer 141 has a first end 141a and a second end 141b located at both ends in its longitudinal direction. In this embodiment in particular, the third direction is inclined with respect to the direction parallel to the X direction and the direction parallel to the Y direction, respectively. The first end 141a is the end located near the side surfaces 50C and 50E. The second end 141b is the end opposite to the first end 141a. 【0082】 In this embodiment, at least one first columnar conductor T11 is a plurality of first columnar conductors T11, and at least one second columnar conductor T12 is a plurality of second columnar conductors T12. In particular, in the example shown in Figure 10, the plurality of first columnar conductors T11 are two first columnar conductors T11, and the plurality of second columnar conductors T12 are two second columnar conductors T12. 【0083】 The two first columnar conductors T11 may be aligned along a fourth direction D4 that intersects the third direction D3. Similarly, the two second columnar conductors T2 may be aligned along the fourth direction D4. In this embodiment in particular, the fourth direction D4 is perpendicular to the third direction D3 and inclined with respect to the direction parallel to the X direction and the direction parallel to the Y direction. 【0084】 In this embodiment, the inductor L12 is wound around a first axis A11 perpendicular to the lamination direction T such that an opening is formed surrounded by the conductor layer 141, two first columnar conductors T11, and two second columnar conductors T12. The first axis A11 may be parallel to the fourth direction D4 or may be inclined with respect to the fourth direction D4. 【0085】 As shown in Figure 11, the inductor L12 further includes a conductor layer 142 and two through-holes 141T11 and 141T12 that electrically connect the conductor layer 141 and the conductor layer 142. The conductor layer 142 is positioned to overlap at least a portion of the conductor layer 141 when viewed from the stacking direction T. Figure 10 shows the planar shape of a portion of the inductor L12 as viewed from the stacking direction T, namely the conductor layer 141, the two first columnar conductors T11, and the two second columnar conductors T12. Figure 11 shows the overall planar shape of the inductor L12 as viewed from the stacking direction T. 【0086】 The conductor layer 142 extends in a third direction D3. The conductor layer 142 also has a first end 142a and a second end 142b located at both ends in its longitudinal direction. The first end 142a is the end located near the sides 50C and 50E. The second end 142b is the end opposite to the first end 142a. 【0087】 The two through-holes 141T11 may be aligned along a fourth direction D4. As shown in Figure 11, the two through-holes 141T11 are connected to the vicinity of the first end 141a of the conductor layer 141 and to the vicinity of the first end 142a of the conductor layer 142. The through-hole 141T12 is connected to the vicinity of the second end 141b of the conductor layer 141 and to the vicinity of the second end 142b of the conductor layer 142. 【0088】 As described in the first embodiment, the inductor L12 is positioned closer to side 50C than to side 50D and closer to side 50E than to side 50F. The distance between the inductor L12 and side 50C may be equal to the distance between the inductor L12 and side 50E, or it may be different from the distance between the inductor L12 and side 50E. 【0089】 Next, the relationship between the inductor L12 and the other elements will be described with reference to Figures 10 and 11. Electronic component 1 includes wiring, one end of which is connected to the other elements. This wiring includes a conductor layer 45 that extends between two first columnar conductors T11 and two second columnar conductors T12. The other end of the wiring may be connected to the inductor L12, or to another element, or to any of the electrodes 111 to 119. 【0090】 Next, the operation and effects of the electronic component 1 according to this embodiment will be described. In this embodiment, the inductor L12 is wound around a first axis A11. The direction of the first axis A11 is defined by the direction in which the conductor layer 141 of the inductor L12 extends. In this embodiment, the conductor layer 141 extends in a third direction D3 perpendicular to the lamination direction T. The third direction D3 intersects with a first direction parallel to the axis intersecting the sides 50E and 50F, and a second direction parallel to the axis intersecting the sides 50C and 50D. The first axis A11 extends in the direction intersecting the third direction D3. In this embodiment, the first axis A11 and the opening of the inductor L12 are inclined with respect to both the side 50C and the side 50E. As a result, according to this embodiment, coupling between the inductor L12 and the first conductor portion 80C can be suppressed compared to the case where the first axis A11 is perpendicular to the side surface 50C, i.e., the opening of the inductor L12 is substantially parallel to the side surface 50C, and coupling between the inductor L12 and the second conductor portion 80E can be suppressed compared to the case where the first axis A11 is perpendicular to the side surface 50E, i.e., the opening of the inductor L12 is substantially parallel to the side surface 50E. As a result, according to this embodiment, the occurrence of problems caused by the shield conductor 80 can be suppressed and the desired characteristics can be achieved. 【0091】 Furthermore, in this embodiment, the wiring, one end of which is connected to another element, extends so as to pass between the first columnar conductor T11 and the second columnar conductor T12. As a result, according to this embodiment, the space within the laminate 50 can be utilized more efficiently compared to the case where the wiring is provided to bypass the inductor L12. 【0092】 Other configurations, operations, and effects in this embodiment are the same as those in the first embodiment. 【0093】 It should be noted that the present invention is not limited to the above embodiments, and various modifications are possible. The present invention is not limited to the electronic components of the circuit configuration shown in Figure 2, but can be applied to electronic components of various circuit configurations as long as the requirements of the claims are met. For example, the number of first columnar conductors T1 and second columnar conductors T2 included in the inductor L12 is not limited to two, but may be one or three or more. 【0094】 Furthermore, the second filter 12 of the first circuit section 10 may include an inductor having a similar structure and arrangement to the inductor L12. Similarly, each of the second circuit section 20 and the third circuit section 30 may include an inductor having a similar structure and arrangement to the inductor L12. 【0095】 As described above, a laminated electronic component according to a first aspect of the present invention comprises a laminate including a plurality of stacked dielectric layers, a shield conductor integrated with the laminate, a plurality of first columnar conductors and at least one second columnar conductor each extending in the stacking direction of the plurality of dielectric layers, and a conductor layer, as well as an inductor integrated with the laminate. The laminate has a first face and a second face located at both ends in the stacking direction, and a first side, a second side, a third side, and a fourth side connecting the first face and the second face. The first side and the second side face opposite each other. The third side and the fourth side face opposite each other. The shield conductor includes a first conductor portion covering the first side and a second conductor portion covering the third side. The inductor is positioned closer to the first side than to the second side and closer to the third side than to the fourth side. The conductor layer extends in a first direction parallel to the axis intersecting the third and fourth sides, and has first and second ends located at both ends in its longitudinal direction. A plurality of first columnar conductors are connected to the vicinity of the first end of the conductor layer. At least one second columnar conductor is connected to the vicinity of the second end of the conductor layer. The distance between the inductor and the first side is greater than the distance between the inductor and the third side. 【0096】 In a stacked electronic component according to a first aspect of the present invention, the conductor layer may have a width that is its dimension in the shorter direction. The distance between the inductor and the first side surface may be greater than the width of the conductor layer. 【0097】 Furthermore, in the stacked electronic component according to the first aspect of the present invention, the plurality of first columnar conductors may be arranged along a second direction parallel to the axis intersecting the first and second side surfaces. 【0098】 Furthermore, in the stacked electronic component according to the first aspect of the present invention, no element is required to be placed between the inductor and the third side surface. 【0099】 Furthermore, the stacked electronic component according to the first aspect of the present invention may further include other elements, at least a portion of which are disposed between the inductor and the first side surface when viewed from the stacking direction. 【0100】 Furthermore, a laminated electronic component according to a first aspect of the present invention may further include a resonant circuit integrated with the laminate, comprising an inductor and a capacitor. The electronic component may further include another inductor, at least a portion of which is positioned between the inductor and a first side surface when viewed from the lamination direction. The resonant circuit may further include another inductor. The inductor may be wound around a first axis parallel to a direction perpendicular to the lamination direction. The other inductor may be wound around a second axis parallel to the lamination direction. The resonant circuit may constitute a low-pass filter. 【0101】 A laminated electronic component according to a second aspect of the present invention comprises a laminate including a plurality of stacked dielectric layers, a shield conductor integrated with the laminate, and an inductor including at least one first columnar conductor and at least one second columnar conductor, each extending in the stacking direction of the plurality of dielectric layers, and a conductor layer. The laminate has a first face and a second face located at both ends in the stacking direction, and a first side, a second side, a third side, and a fourth side connecting the first face and the second face. The first side and the second side face opposite each other. The third side and the fourth side face opposite each other. The shield conductor includes a first conductor portion covering the first side and a second conductor portion covering the third side. The inductor is positioned closer to the first side than to the second side and closer to the third side than to the fourth side. The conductor layer extends in a direction parallel to an axis that is inclined with respect to each of the first and third sides and intersects the inductor but does not intersect both the first and third sides, and has first and second ends located at both ends in its longitudinal direction. At least one first columnar conductor is connected to the portion of the conductor layer near the first end. At least one second columnar conductor is connected to the portion of the conductor layer near the second end. 【0102】 In a stacked electronic component according to a second aspect of the present invention, at least one first columnar conductor may be a plurality of first columnar conductors. At least one second columnar conductor may be a plurality of second columnar conductors. 【0103】 Furthermore, a stacked electronic component according to a second aspect of the present invention may further include wiring that extends between at least one first columnar conductor and at least one second columnar conductor. 【0104】 1...Multilayer electronic component, 2...First signal terminal, 3...Second signal terminal, 7...Solder bump, 10...First circuit section, 11...First filter, 12...Second filter, 20...Second circuit section, 21,22...Elastic wave element, 23...LC parallel circuit, 30...Third circuit section, 41,42...Conductor layer, 50...Laminate, 50A...First face, 50B...Second face, 50C~50F...Side, 60...Mounted component, 61~64...Terminal, 80...Shield conductor, 111~119...Electrodes, C1~C12,C21~C23,C31~C33...Capacitors, L11~L15,L21,L31,L32...Inductors, T1,T2...Columnar conductors.

Claims

[Claim 1] A laminate containing multiple stacked dielectric layers, A shielding conductor integrated with the aforementioned laminate, Each comprises a plurality of first columnar conductors and at least one second columnar conductor extending in the stacking direction of the plurality of dielectric layers, and a conductor layer, and an inductor integrated with the laminate, The laminate has a first surface and a second surface located at both ends in the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side and the second side face opposite each other. The third and fourth sides face opposite each other. The shield conductor includes a first conductor portion covering the first side surface and a second conductor portion covering the third side surface. The inductor is positioned closer to the first side than to the second side and closer to the third side than to the fourth side. The conductor layer extends in a first direction parallel to the axis intersecting the third and fourth sides, and has first and second ends located at both ends in its longitudinal direction. The plurality of first columnar conductors are connected to the portion near the first end of the conductor layer, The at least one second columnar conductor is connected to the portion of the conductor layer near the second end, A multilayer electronic component characterized in that the distance between the inductor and the first side surface is greater than the distance between the inductor and the third side surface. [Claim 2] The conductor layer has a width which is its dimension in the shorter direction, The laminated electronic component according to claim 1, characterized in that the distance between the inductor and the first side surface is greater than the width of the conductor layer. [Claim 3] The laminated electronic component according to claim 1, characterized in that the plurality of first columnar conductors are arranged along a second direction parallel to the axis intersecting the first side surface and the second side surface. [Claim 4] The multilayer electronic component according to claim 1, characterized in that no elements are disposed between the inductor and the third side surface. [Claim 5] Furthermore, the stacked electronic component according to claim 1 is characterized by comprising another element, the portion of which is disposed between the inductor and the first side surface when viewed from the stacking direction. [Claim 6] Furthermore, the laminated electronic component according to claim 1 is characterized by including a resonant circuit that includes the inductor and capacitor and is integrated with the laminate. [Claim 7] Furthermore, the system includes another inductor, at least a portion of which is positioned between the inductor and the first side surface when viewed from the stacking direction, The resonant circuit further includes the other inductor, The inductor is wound around a first axis parallel to the direction perpendicular to the stacking direction, The stacked electronic component according to claim 6, characterized in that the other inductor is wound around a second axis parallel to the stacking direction. [Claim 8] The multilayer electronic component according to claim 6 or 7, characterized in that the resonant circuit constitutes a low-pass filter. [Claim 9] A laminate containing multiple stacked dielectric layers, A shielding conductor integrated with the aforementioned laminate, Each inductor includes at least one first columnar conductor and at least one second columnar conductor extending in the stacking direction of the plurality of dielectric layers, and a conductor layer. The laminate has a first surface and a second surface located at both ends in the stacking direction, and a first side surface, a second side surface, a third side surface, and a fourth side surface connecting the first surface and the second surface. The first side and the second side face opposite each other. The third and fourth sides face opposite each other. The shield conductor includes a first conductor portion covering the first side surface and a second conductor portion covering the third side surface. The inductor is positioned closer to the first side than to the second side and closer to the third side than to the fourth side. The conductor layer extends in a direction parallel to an axis that is inclined with respect to each of the first and third sides and intersects with the inductor but does not intersect with both the first and third sides, and has a first end and a second end located at both ends in its longitudinal direction. The at least one first columnar conductor is connected to the portion of the conductor layer near the first end, A laminated electronic component characterized in that the at least one second columnar conductor is connected to a portion near the second end of the conductor layer. [Claim 10] The at least one first columnar conductor is a plurality of first columnar conductors, The stacked electronic component according to claim 9, characterized in that the at least one second columnar conductor is a plurality of second columnar conductors. [Claim 11] Furthermore, the laminated electronic component according to claim 9 is characterized by comprising wiring that extends to pass between the at least one first columnar conductor and the at least one second columnar conductor.

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