Photoelectric mixed galvanizing system

Abstract

To provide an optical-electric mixed-signal device having an optical connection structure with high connectivity reliability. [Solution] The photoelectric mixed-signal device comprises a first wiring board, a second wiring board electrically connected to the first wiring board via a connecting member located in a first region of the first wiring board, a semiconductor device mounted on the first or second wiring board, a sealing resin filled between the first region of the first wiring board and the second wiring board to cover the connecting member and the semiconductor device, an optical integrated circuit mounted on the second wiring board and electrically connected to the semiconductor device, an optical component located on the second region of the first wiring board to enable transmission and reception of optical signals with the optical integrated circuit, and a first bonding material located between the optical integrated circuit and the optical component, and between the sealing resin and the optical component, to bond the optical integrated circuit, the optical component and the sealing resin, wherein the sealing resin extends from the first region to the second region, and the first side surface of the sealing resin that bonds with the first bonding material is an inclined surface that slopes toward the inside of the sealing resin.

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