Laser processing equipment, laser processing method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- SUMITOMO HEAVY IND LTD
- Filing Date
- 2024-12-03
- Publication Date
- 2026-06-15
AI Technical Summary
Existing laser processing technologies face issues with incomplete equalization of energy distribution, leading to adverse effects on the annealing process due to residual intensity unevenness.
A laser processing apparatus that irradiates a workpiece with multiple lasers having different two-dimensional energy density distributions multiple times, reducing irregularities through cumulative irradiation to achieve a uniform energy distribution.
This approach allows for appropriate laser processing by effectively reducing energy density distribution irregularities, ensuring consistent and uniform treatment of the workpiece.
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