Resin parts molding method

JP2026096380APending Publication Date: 2026-06-15TOYOTA JIDOSHA KK

Patent Information

Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
TOYOTA JIDOSHA KK
Filing Date
2024-12-03
Publication Date
2026-06-15

AI Technical Summary

Technical Problem

Existing resin part molding methods fail to effectively remove air bubbles from liquid resin, leading to defects such as voids, especially in parts with protruding tips, which impair their functionality.

Method used

A resin part molding method using molds with grooves that narrow in cross-section, followed by a semi-solidification step and pulsed laser defoaming of air bubbles in a semi-solid intermediate product, ensuring air bubbles accumulate at the tip for easy removal.

🎯Benefits of technology

The method effectively eliminates air bubbles, preventing defects in resin parts, particularly at protruding tips, by maintaining the intermediate product's shape and utilizing buoyancy and laser defoaming to remove air bubbles, enhancing adhesion and functionality.

✦ Generated by Eureka AI based on patent content.

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  • Figure 2026096380000001_ABST
    Figure 2026096380000001_ABST
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Abstract

The present invention provides a resin part molding method that can eliminate air bubbles that form in molded resin parts. [Solution] The resin part molding method is characterized by comprising: a mold clamping step of clamping an upper mold 41 and a lower mold 42 so that a molding space S is formed by the groove 410 and the surface of the lower mold 42; a filling step of filling the molding space S with liquid resin 1; a first molding step of semi-solidifying the liquid resin 1 filled in the molding space S and molding an intermediate product 2 which is a semi-solidified resin part having a shape in which the tip portion 21 protrudes according to the cross-sectional shape of the groove 410; a defoaming step of removing the upper mold 41 and defoaming air bubbles B in the intermediate product 2 by irradiating the tip portion 21 of the intermediate product 2 with pulsed laser light L; a second molding step of solidifying the defoamed intermediate product 2 and molding a resin part 3; and a removal step of removing the molded resin part 3 from the lower mold 42.
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