Resin parts molding method
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- TOYOTA JIDOSHA KK
- Filing Date
- 2024-12-03
- Publication Date
- 2026-06-15
AI Technical Summary
Existing resin part molding methods fail to effectively remove air bubbles from liquid resin, leading to defects such as voids, especially in parts with protruding tips, which impair their functionality.
A resin part molding method using molds with grooves that narrow in cross-section, followed by a semi-solidification step and pulsed laser defoaming of air bubbles in a semi-solid intermediate product, ensuring air bubbles accumulate at the tip for easy removal.
The method effectively eliminates air bubbles, preventing defects in resin parts, particularly at protruding tips, by maintaining the intermediate product's shape and utilizing buoyancy and laser defoaming to remove air bubbles, enhancing adhesion and functionality.
Smart Images

Figure 2026096380000001_ABST