Resin composition, cured product, and method for producing the cured product

Abstract

The present invention provides a resin composition that has good lamination properties and can form cured products with excellent dimensional stability and dielectric properties. [Solution] The resin composition contains (A) a novolac-type epoxy compound comprising a constituent unit represented by general formula (1), (B) a polyphenylene ether resin having phenolic hydroxyl groups at both ends, (C) a bismaleimide compound, and (D) a filler. TIFF2026096928000032.tif56170

Description

[Technical Field] 【0001】 This disclosure relates to resin compositions, cured products, and methods for producing cured products. [Background technology] 【0002】 In recent years, with the miniaturization of electronic devices, the required characteristics of electronic components have become stricter, and a wide range of performance is being demanded. Patent Document 1 proposes a resin composition for printed circuit boards for use in electronic components, which includes a preliminary reaction product obtained by reacting polyphenylene ether with an epoxy compound having an epoxy group, and a cyanate ester compound, etc. [Prior art documents] [Patent Documents] 【0003】 [Patent Document 1] Japanese Patent Publication No. 2019-194345 [Overview of the Initiative] [Problems that the invention aims to solve] 【0004】 In the field of electronic components, resin compositions used in electronic components are sometimes required to have good lamination properties, as well as dimensional stability and low dielectric properties of the cured products formed from these resin compositions. Low dielectric properties refer to low relative permittivity and dielectric loss tangent, and in this disclosure, cured products exhibiting low dielectric properties may be conveniently described as cured products with excellent dielectric performance. 【0005】 In view of the circumstances described above, this disclosure aims to provide a resin composition that has good lamination suitability and can form a cured product with excellent dimensional stability and dielectric properties. [Means for solving the problem] 【0006】 In other words, the present disclosure provides a resin composition comprising (A) a novolac-type epoxy compound, (B) a polyphenylene ether resin having phenolic hydroxyl groups at both ends, (C) a bismaleimide compound, and (D) a filler, wherein the (A) novolac-type epoxy compound comprises a structural unit represented by the following general formula (1). 【0007】 TIFF2026096928000001.tif56170 (In the above general formula (1), Ar represents an aromatic ring, R 1 R represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms. 2 This represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an arylalkylene group having 7 to 20 carbon atoms, a cycloalkyl ring-containing group having 3 to 20 carbon atoms, a group represented by the following general formula (2), or a group represented by the following general formula (3). * represents a bond. 【0008】 TIFF2026096928000002.tif65170(In the above general formula (2), R 3 (where * represents a hydrogen atom or an alkyl group with 1 to 10 carbon atoms, and * represents a bond.) 【0009】 TIFF2026096928000003.tif14170(In the above general formula (3), R 11 and R 12 Each of these independently represents an alkylene group with 1 to 10 carbon atoms, and Ar 11 (where * represents an arylene group with 6 to 18 carbon atoms, and * represents a bond.) [Effects of the Invention] 【0010】 According to this disclosure, it is possible to provide a resin composition that can form a cured product with good lamination suitability, as well as excellent dimensional stability and dielectric properties. [Modes for carrying out the invention] 【0011】 1.Resin composition A resin composition according to one embodiment of the present disclosure (hereinafter sometimes simply referred to as "resin composition") contains (A) a novolac-type epoxy compound (hereinafter sometimes referred to as "component (A)") comprising a structural unit represented by general formula (1), (B) a polyphenylene ether resin having phenolic hydroxyl groups at both ends (hereinafter sometimes referred to as "component (B)"), (C) a bismaleimide compound (hereinafter sometimes referred to as "component (C)"), and (D) a filler (hereinafter sometimes referred to as "component (D)"). 【0012】 By containing the above-mentioned specific components, the resin composition can form a cured product with good lamination properties, as well as excellent dimensional stability and dielectric properties. The elements constituting the resin composition will be described in detail below. 【0013】 1-1. (A) Novolac-type epoxy compounds The resin composition contains (A) a novolac-type epoxy compound (component (A)). The novolac-type epoxy compound can be synthesized by introducing epoxy groups into a novolac resin obtained by condensation polymerization of aromatic hydroxy compounds such as phenol, cresol, and naphthol with aldehydes or ketones. The (A) novolac-type epoxy compound contains a constituent unit represented by the following general formula (1). The resin composition may contain one novolac-type epoxy compound containing the constituent unit represented by general formula (1) alone, or it may contain two or more of them. 【0014】 TIFF2026096928000004.tif56170 【0015】 In general formula (1), Ar represents an aromatic ring, and R 1 R represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms. 2represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an arylalkylene group having 7 to 20 carbon atoms, a cycloalkyl ring-containing group having 3 to 20 carbon atoms, a group represented by the following general formula (2), or a group represented by the following general formula (3). * represents a bond. 【0016】 TIFF2026096928000005.tif65170 【0017】 In general formula (2), R 3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and * represents a bond. 【0018】 TIFF2026096928000006.tif14170 【0019】 In general formula (3), R 11 and R 12 each independently represent an alkylene group having 1 to 10 carbon atoms, Ar 11 represents an arylene group having 6 to 18 carbon atoms, and * represents a bond. 【0020】 In general formula (1), examples of the aromatic ring represented by Ar include aromatic hydrocarbon rings. Examples of the aromatic hydrocarbon ring include a benzene ring, a naphthalene ring, and an anthracene ring, etc. 【0021】 Examples of the halogen atom represented by R 1 in general formula (1) include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom, etc. 【0022】 R 1The alkyl group having 1 to 10 carbon atoms, represented by , may be linear, branched, or cyclic. Specific examples of the alkyl group include methyl, ethyl, propyl, iso-propyl, butyl, sec-butyl, tert-butyl, iso-butyl, amyl, iso-pentyl, tert-pentyl, cyclopentyl, hexyl, 2-hexyl, 3-hexyl, cyclohexyl, 4-methylcyclohexyl, heptyl, 2-heptyl, 3-heptyl, iso-heptyl, tert-heptyl, 1-octyl, iso-octyl, tert-octyl, 2-ethylhexyl, nonyl, isononyl, and decyl groups. 【0023】 R in general formula (1) 1 The alkenyl group represented by , having 2 to 10 carbon atoms, can be any group having a carbon-carbon double bond, and may be linear or branched. Specific examples of the above alkenyl group include vinyl, 2-propenyl, 3-butenyl, 2-butenyl, 4-pentenyl, 3-pentenyl, 2-hexenyl, 3-hexenyl, 5-hexenyl, 2-heptenyl, 3-heptenyl, 4-heptenyl, 3-octenyl, 3-nonenyl, and 4-decenyl groups. 【0024】 R in general formula (1) 2 Examples of alkylene groups with 1 to 20 carbon atoms represented by include groups obtained by removing one hydrogen atom from an alkyl group with 1 to 20 carbon atoms. Examples of alkyl groups with 1 to 20 carbon atoms include R 1In addition to the groups exemplified as alkyl groups having 1 to 10 carbon atoms, other examples include undecyl, dodecyl, tridecyl, tetradecyl, pentadecyl, hexadecyl, heptadecyl, octadecyl, nonadecyl, and eicosyl groups. Specific examples of the alkylene groups include methylene, methylidene, ethylene, ethylidene, n-propylene, propylene, isopropylidene, methylethylene, n-butylene, butylidene, isobutylidene, sec-butylidene, 1,2-dimethylethylene, 1-methylpropylene, and 2-methylpropylene. 【0025】 R in general formula (1) 2 Arylene groups, represented by , have 6 to 20 carbon atoms and are divalent groups having an aromatic hydrocarbon ring, where two carbon atoms on the aromatic hydrocarbon ring within the group form bonding sites. Examples of such arylene groups include those obtained by removing one hydrogen atom from the aromatic hydrocarbon ring in an aryl group. Examples of the above aryl groups include monocyclic aromatic hydrocarbon groups such as phenyl, tolyl, and xylyl groups (hereinafter sometimes referred to as monocyclic aromatic hydrocarbon groups); and condensed ring groups in which multiple monocyclic aromatic rings are fused together, such as naphthyl, anthracenyl, phenanthryl, fluorenyl, and pyrenyl groups (hereinafter sometimes referred to as condensed aromatic hydrocarbon groups). Furthermore, the above-mentioned aryl group may also include compounds in which two or more monocyclic aromatic rings or fused rings formed by the condensation of multiple monocyclic aromatic rings are linked by a single bond, such as biphenyl groups and benzophenone groups, or compounds linked via linking groups such as carbonyl groups (-CO-) or sulfide groups (-S-), from which one or more hydrogen atoms in the aromatic hydrocarbon ring have been removed. Note that groups in which one or more hydrogen atoms in the aromatic hydrocarbon ring are substituted with alkyl groups, such as tolyl groups, are included in aryl groups. Also, tolyl groups are monocyclic aromatic hydrocarbon groups. Specific examples of the above-mentioned arylene group include phenylene groups, biphenylene groups, and naphthylene groups. 【0026】 R in general formula (1) 2Examples of arylalkylene groups having 7 to 20 carbon atoms, represented by , include groups obtained by removing one hydrogen atom from an arylalkyl group. Examples of the above arylalkyl group include groups in which one or more hydrogen atoms in the alkyl group are replaced with the above-mentioned aryl group. Examples of the above alkyl group include the above-mentioned R 1 Examples of alkyl groups represented by can be given. In addition, the above aryl group is R 2 Examples of aryl groups can be given in the explanation of the arylene group represented by . 【0027】 R in general formula (1) 2 The cycloalkyl ring-containing group having 3 to 20 carbon atoms represented by can be any group containing a cycloalkyl ring. Examples of the above cycloalkyl ring-containing group include a cycloalkylene group obtained by removing two hydrogen atoms from the cycloalkyl ring, that is, a group obtained by removing one hydrogen atom from the ring of a cycloalkyl group having 3 to 20 carbon atoms. Examples of the above cycloalkyl group include a cyclopropyl group, a cyclobutyl group, a cyclopentyl group, a cyclohexyl group, a cycloheptyl group, a cyclooctyl group, a cyclononyl group, and a cyclodecyl group. In addition, examples of the above cycloalkyl group include a condensed cycloalkyl ring group formed by the condensation of multiple cycloalkyl rings, such as an adamantyl group, a decahydronaphthyl group, an octahydropentalene group, a bicyclo[1.1.1]pentanyl group, a tetradecahydroanthracenyl group, and a tricyclo[5.2.1.0(2,6)]decane group. Besides cycloalkylene groups, other examples of cycloalkyl ring-containing groups include groups in which an alkylene group and a cycloalkylene group are bonded in that order, and groups in which an alkylene group, a cycloalkylene group, and an alkylene group are bonded in that order. 【0028】 R in general formula (2) 3 The alkyl group having 1 to 10 carbon atoms represented by the above general formula (1) is R 1 This is explained in the same way as alkyl groups with 1 to 10 carbon atoms, represented by [formula]. 【0029】 R in general formula (3) 11 and R 12 Examples of alkylene groups having 1 to 10 carbon atoms represented by include groups obtained by removing one hydrogen atom from an alkyl group having 1 to 10 carbon atoms. Examples of alkyl groups having 1 to 10 carbon atoms include R in the general formula (1) above. 1 This is explained in the same way as alkyl groups with 1 to 10 carbon atoms represented by . A specific example of the alkylene group is R in the general formula (1) above. 2 Examples of alkylene groups represented by this formula include those shown above. 【0030】 Ar in general formula (3) 11 As an arylene group having 6 to 18 carbon atoms represented by the above general formula (1), R 2 Among those that can be described similarly to the arylene group, which has 6 to 20 carbon atoms and is represented by , those that satisfy the requirement of having 6 to 18 carbon atoms can be listed. 【0031】 In one embodiment of the resin composition, the aromatic ring represented by Ar in general formula (1) is preferably a benzene ring or a naphthalene ring. It is even more preferable that Ar is a benzene ring. That is, it is even more preferable that the structural unit represented by general formula (1) in the (A) novolac-type epoxy compound is the structural unit represented by the following general formula (1a). In other words, it is preferable that the (A) novolac-type epoxy compound is an alkyl-substituted phenol novolac-type epoxy compound such as a phenol novolac-type epoxy compound or a cresol novolac-type epoxy compound. By using a novolac-type epoxy compound containing a structural unit represented by general formula (1) in which the aromatic ring Ar is a benzene ring or a naphthalene ring as component (A), it becomes easier to obtain a resin composition capable of forming a cured product with an excellent balance of dimensional stability and dielectric properties. 【0032】 TIFF2026096928000007.tif55170 【0033】 In general formula (1a), R 1 , R 2, and * are R in general formula (1), respectively. 1 , R 2 This is synonymous with *. 【0034】 In one embodiment of the resin composition, R in general formula (1) 1 It is preferably a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. In particular, R 1 It is more preferably a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, even more preferably a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, even more preferably a hydrogen atom or a methyl group, and particularly preferably a hydrogen atom. For example, when Ar in general formula (1) is a benzene ring, it is preferable that the novolac-type epoxy compound is a cresol novolac-type epoxy compound. As component (A), R 1 By using a novolac-type epoxy compound containing the constituent unit represented by the general formula (1) as described above, it becomes easier to obtain a resin composition that has excellent lamination suitability and can form a cured product with excellent dimensional stability and dielectric properties. 【0035】 In one embodiment of the resin composition, R in general formula (1) 2 It is preferable that R is an alkylene group having 1 to 20 carbon atoms, an arylalkylene group having 7 to 20 carbon atoms, or a cycloalkyl ring-containing group having 3 to 20 carbon atoms. In particular, 2 It is more preferably an alkylene group having 1 to 20 carbon atoms, or a cycloalkyl ring-containing group having 3 to 20 carbon atoms, and even more preferably a cycloalkyl ring-containing group having 3 to 20 carbon atoms. (A) component is R 2 By using a novolac-type epoxy compound containing the constituent unit represented by the general formula (1) described above, it becomes easier to obtain a resin composition that has excellent lamination suitability and can form a cured product with excellent dimensional stability and dielectric properties. 【0036】 R in general formula (1) 2When is a cycloalkyl ring-containing group having 3 to 20 carbon atoms, it is preferable that it is a dicyclopentadiene-type novolac epoxy compound containing a dicyclopentadiene structure. That is, the constituent unit represented by general formula (1) in the (A) novolac epoxy compound is preferably the constituent unit represented by the following general formula (1b). By using a dicyclopentadiene-type novolac epoxy compound containing the constituent unit represented by the following general formula (1b) as component (A), it becomes easier to obtain a resin composition that can form a cured product with an excellent balance of dimensional stability and dielectric properties. 【0037】 TIFF2026096928000008.tif52170 【0038】 In general formula (1b), R 1 And * are R in general formula (1), respectively. 1 This is synonymous with *. 【0039】 As the (A) novolac-type epoxy compound containing the constituent unit represented by general formula (1), the novolac-type epoxy compound represented by the following general formula (4) is preferred. Among these, the novolac-type epoxy compound represented by the following general formula (4a), in which the aromatic ring Ar is a benzene ring, is more preferred, and the novolac-type epoxy compound represented by the following general formula (4b) is even more preferred. By using such a (A) component, it becomes easier to obtain a resin composition that has excellent lamination properties and can form a cured product with excellent dimensional stability and dielectric properties. 【0040】 TIFF2026096928000009.tif51170 【0041】 In general formula (4), Ar, R 1 , and R 2 These are Ar and R in general formula (1), respectively. 1 , and R 2 This is equivalent to the above, where n represents an integer greater than or equal to 1. 【0042】 TIFF2026096928000010.tif55170 【0043】 In general formula (4a), R 1 , R 2 , and n are, respectively, R in general formula (4). 1 , R 2 This is synonymous with n. 【0044】 TIFF2026096928000011.tif53170 【0045】 R in general formula (4b) 1 and n are, respectively, R in general formula (4) 1 This is synonymous with n. 【0046】 In general formulas (4), (4a), and (4b), n is preferably an integer between 1 and 50, more preferably an integer between 2 and 30, even more preferably an integer between 3 and 20, and particularly preferably an integer between 4 and 10. Using such a (A) component makes it easier to obtain a resin composition that has excellent lamination properties and can form a cured product with excellent dimensional stability and dielectric properties. 【0047】 (A) Novolac-type epoxy compounds can be obtained, for example, by reacting a phenolic resin such as phenol novolac resin and cresol novolac resin with an epihalohydrin such as epichlorohydrin. 【0048】 (A) For novolac-type epoxy compounds, commercially available products can also be used. In general formula (1), R 2 Examples of commercially available products in which the atom is an alkylene group with 1 to 20 carbon atoms include the product names "EOCN-1020," "EOCN-102S," "EOCN-103S," "EOCN-104S," "EPPN-201," "BREN-S," and "BREN-105" manufactured by Nippon Kayaku Co., Ltd., and the product name "EP-4100" manufactured by ADEKA Corporation. 【0049】 In general formula (1), R 2Examples of commercially available products in which the group is represented by general formula (3) include the product names "NC-3000-FH", "NC-3000-H", "NC-3000", "NC-3000-L", "NC-3100", and "NC-2000-L" manufactured by Nippon Kayaku Co., Ltd. 【0050】 In general formula (1), R 2 Examples of commercially available products in which the group is represented by general formula (2) include the product names "EPPN-501H", "EPPN-501HY", and "EPPN-502H" manufactured by Nippon Kayaku Co., Ltd. 【0051】 In general formula (1), R 2 Examples of commercially available products in which the group contains a cycloalkyl ring include "XD-1000" manufactured by Nippon Kayaku Co., Ltd., and "HP-7200" and "HP-7200L" manufactured by DIC Corporation. 【0052】 The content of the (A) novolac-type epoxy compound in the resin composition is preferably 1 to 50 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). By setting the content of component (A) within the above range, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and a good balance of dimensional stability and dielectric properties. From this viewpoint, the content of the (A) novolac-type epoxy compound is more preferably 3 to 40 parts by mass, even more preferably 5 to 40 parts by mass, and particularly preferably 6 to 35 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). 【0053】 Furthermore, the content of the (A) novolac-type epoxy compound in the resin composition is preferably 0.1 to 50 parts by mass per 100 parts by mass of component (D). By setting the content of component (A) relative to component (D) within the above range, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and a good balance of dimensional stability and dielectric properties. From this viewpoint, the content of the (A) novolac-type epoxy compound is more preferably 0.1 to 35 parts by mass, even more preferably 0.1 to 20 parts by mass, and particularly preferably 0.1 to 10 parts by mass per 100 parts by mass of component (D). 【0054】 1-2. (B) Polyphenylene ether resin having phenolic hydroxyl groups at both ends The resin composition contains (B) a polyphenylene ether resin having phenolic hydroxyl groups at both ends (component (B)). In this disclosure, (B) the polyphenylene ether resin having phenolic hydroxyl groups at both ends is a homopolymer or copolymer containing at least one of the constituent units represented by the following general formula (11) and the constituent units represented by the following general formula (12) as repeating units, and having phenolic hydroxyl groups at both ends. The resin composition may contain one of the polyphenylene ether resins having phenolic hydroxyl groups at both ends (B) alone, or may contain two or more. 【0055】 TIFF2026096928000012.tif34170 【0056】 In general formula (11), R 21 and R 22 Each of these independently represents a hydrogen atom, a halogen atom, an unsubstituted or substituted alkyl group having 1 to 4 carbon atoms, or an aryl group, and * represents a bond. In general formula (12), R 23 , R 24 , R 25 , and R 26 Each of these independently represents a hydrogen atom, a halogen atom, an unsubstituted or substituted alkyl group having 1 to 4 carbon atoms, or an aryl group. However, R 25 and R 26It is not a hydrogen atom at the same time. * represents a bonding bond. 【0057】 R in general formula (11) 21 and R 22 , and R in general formula (12) 23 ~R 26 The alkyl group represented by , having 1 to 4 carbon atoms and being either unsubstituted or substituted, may be linear, branched, or cyclic. Specific examples of the alkyl group include methyl, ethyl, propyl, iso-propyl, cyclopropyl, butyl, sec-butyl, tert-butyl, iso-butyl, and cyclobutyl groups. Substituents include halogen atoms and hydroxyl groups, with halogen atoms including fluorine, chlorine, bromine, and iodine atoms. 【0058】 R in general formula (11) 21 and R 22 , and R in general formula (12) 23 ~R 26 Examples of aryl groups represented by include monocyclic aromatic hydrocarbon groups such as phenyl, tolyl, and xylyl groups; and condensed aromatic hydrocarbon groups such as naphthyl, anthracenyl, phenanthryl, fluorenyl, and pyrenyl groups. In addition, examples of the above aryl groups include compounds in which two or more monocyclic aromatic rings or condensed rings formed by the fusion of multiple monocyclic aromatic rings are linked by a single bond, or compounds linked via linking groups such as carbonyl (-CO-) or sulfide (-S-), from which one or more hydrogen atoms have been removed from the aromatic hydrocarbon ring. 【0059】 Examples of the homopolymer component (B) mentioned above include poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-phenylene) ether, poly(2-ethyl-6-n-propyl-1,4-phenylene) ether, poly(2,6-di-n-propyl-1,4-phenylene) ether, poly(2-methyl-6-n-butyl-1,4-phenylene) ether, poly(2-ethyl-6-isopropyl-1,4-phenylene) ether, poly(2-methyl-6-chloroethyl-1,4-phenylene) ether, poly(2-methyl-6-hydroxyethyl-1,4-phenylene) ether, and poly(2-methyl-6-chloroethyl-1,4-phenylene) ether. 【0060】 Examples of the copolymer component (B) include copolymers of 2,6-dimethylphenol and 2,3,6-trimethylphenol, copolymers of 2,6-dimethylphenol and o-cresol, and copolymers of 2,6-dimethylphenol, 2,3,6-trimethylphenol, and o-cresol. Thus, component (B) encompasses polyphenylene ether copolymers mainly composed of a polyphenylene ether structure. 【0061】 Component (B) is preferably a polyphenylene ether resin which is a homopolymer or copolymer containing a constituent unit represented by general formula (11) as a repeating unit and having phenolic hydroxyl groups at both ends. Using such a component (B) makes it easier to obtain a resin composition that has excellent lamination properties and can form a cured product with excellent dimensional stability and dielectric properties. 【0062】 R in general formula (11) 21 and R 22 Each of these groups is more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. 【0063】 R in general formula (12) 23 , R 24 , R 25, and R 26 Each of these groups is more preferably an alkyl group having 1 to 3 carbon atoms, and even more preferably a methyl group. 【0064】 (B) Polyphenylene ether resins having phenolic hydroxyl groups at both ends are available commercially. Examples of such commercially available products include the trade names "PPO(trademark)SA120-100" and "PPO(trademark)SA90-100" manufactured by SABIC Innovative Plastics. 【0065】 The content of polyphenylene ether resin having phenolic hydroxyl groups at both ends (B) in the resin composition is preferably 1 to 50 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). By setting the content of component (B) within the above range, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and an excellent balance of dimensional stability and dielectric properties. From this viewpoint, the content of polyphenylene ether resin having phenolic hydroxyl groups at both ends (B) is more preferably 3 to 40 parts by mass, even more preferably 5 to 40 parts by mass, and particularly preferably 6 to 35 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). 【0066】 1-3. (C) Bismaleimide compounds The resin composition contains a (C) bismaleimide compound (component (C)). In this disclosure, the bismaleimide compound is a compound having two maleimide structures in its molecule. The resin composition may contain one of the (C) bismaleimide compounds alone, or it may contain two or more of them. 【0067】 (C) The bismaleimide compound is not particularly limited as long as it is a compound having two maleimide structures in its molecule, but a bismaleimide compound represented by the following general formula (31) is preferred. By using a bismaleimide compound represented by the following general formula (31) as component (C), it becomes easier to obtain a resin composition that has excellent lamination suitability and can form a cured product with excellent dimensional stability and dielectric properties. 【0068】 TIFF2026096928000013.tif33170 【0069】 In general formula (31), R 31 This represents an unsubstituted or substituted aliphatic hydrocarbon group having 1 to 50 carbon atoms, or a group in which one or more methylene groups in the aliphatic hydrocarbon group are replaced by a divalent group selected from group I below. The substituted aliphatic hydrocarbon group represents a group in which one or more hydrogen atoms in the aliphatic hydrocarbon group are replaced by an atom or group selected from group II below. Group I: -O-, -S-, -SO-, -SO2-, -NR'-, -NR'-CO-, -CO-NR'-, -NR'-COO-, -OCO-NR'-, and -SiR'R”-. Group II: Halogen atoms, cyano groups, nitro groups, acrylic groups, methacrylic groups, -CO-H, -OH, -SH, -NH2, -C(R')=N-OH, -COOH, or -SO3H. The above R' and R'' each independently represent a hydrogen atom or an unsubstituted aliphatic hydrocarbon group, and if there are multiple R' or R'', they may be the same or different. 【0070】 R in general formula (31) 31It is preferable that the (C) component is an unsubstituted aliphatic hydrocarbon group having 1 to 50 carbon atoms, or a group in which one or more methylene groups in the aliphatic hydrocarbon group are replaced with a divalent group selected from group I, more preferably an unsubstituted aliphatic hydrocarbon group having 1 to 50 carbon atoms, and even more preferably an unsubstituted aliphatic hydrocarbon group having 25 to 50 carbon atoms. By using such a (C) component, it becomes easier to obtain a resin composition that has excellent lamination properties and can form a cured product with excellent dimensional stability and dielectric properties. 【0071】 In this disclosure, examples of aliphatic hydrocarbon groups include divalent aliphatic hydrocarbon groups obtained by removing one hydrogen atom from monovalent aliphatic hydrocarbon groups such as alkyl groups having 1 to 50 carbon atoms, alkenyl groups having 2 to 50 carbon atoms, cycloalkyl groups having 3 to 50 carbon atoms, and cycloalkylalkyl groups having 4 to 50 carbon atoms. In this disclosure, from the viewpoint of obtaining a resin composition capable of forming a cured product with excellent lamination suitability and further excellent dimensional stability and dielectric properties, the above-mentioned monovalent aliphatic hydrocarbon group is preferably an alkyl group having 1 to 50 carbon atoms or a cycloalkylalkyl group having 4 to 50 carbon atoms, and more preferably a cycloalkylalkyl group having 4 to 50 carbon atoms. 【0072】 In this disclosure, the alkyl group having 1 to 50 carbon atoms may be linear or branched. Examples of alkyl groups having 1 to 50 carbon atoms include R in general formula (1). 1 and R 2In addition to the alkyl groups mentioned in the explanation, examples of linear alkyl groups include, for instance, henicosyl group, docosyl group, tricosyl group, tetracosyl group, pentacosyl group, hexacosyl group, heptacosyl group, octacosyl group, nonacosyl group, triacontyl group, hentriacontyl group, dotriacontyl group, tritriacontyl group, tetratriacontyl group, pentatriacontyl group, hexatriacontyl group, octatriacontyl group, tetracontyl group, hentetracontyl group, dotetracontyl group, tritetracontyl group, tetratetracontyl group, pentatetracontyl group, octatetracontyl group, and pentacontyl group. 【0073】 In this disclosure, the alkenyl group having 2 to 50 carbon atoms may be linear or branched. It may also be a terminal alkenyl group having an unsaturated bond at its terminal end, or an internal alkenyl group having an unsaturated bond internally. As an alkenyl group having 2 to 50 carbon atoms, R in general formula (1) is... 1 In addition to the alkenyl groups mentioned in the explanation, examples of linear alkenyl groups include, for instance, undecenyl group, dodecenyl group, tridecenyl group, tetradecenyl group, pentadecenyl group, hexadecenyl group, heptadecenyl group, octadecenyl group, nonadecenyl group, icocenyl group, henicocenyl group, dococenyl group, tricocenyl group, tetracocenyl group, pentacocenyl group, hexacocenyl group, heptacocenyl group, octacocenyl group, nona Examples include cosenyl group, triacontenyl group, hentriacontenyl group, dotriacontenyl group, tritriacontenyl group, tetratriacontenyl group, pentatriacontenyl group, hexatriacontenyl group, tetracontenyl group, hentetracontenyl group, dotetracontenyl group, tritetracontenyl group, tetratetracontenyl group, pentatetracontenyl group, octatetracontenyl group, and pentacontenyl group. 【0074】 In this disclosure, cycloalkyl groups having 3 to 50 carbon atoms include saturated monocyclic alkyl groups having 3 to 50 carbon atoms, saturated polycyclic alkyl groups having 3 to 50 carbon atoms, and groups having 3 to 50 carbon atoms in which one or more hydrogen atoms in the ring of these groups are substituted with an alkyl group. Examples of the saturated monocyclic alkyl groups include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, and cyclodecyl groups. Examples of the saturated polycyclic alkyl groups include adamantyl, decahydronaphthyl, octahydropentalene, and bicyclo[1.1.1]pentanyl groups. Examples of alkyl groups that substitute hydrogen atoms in the ring of saturated monocyclic or saturated polycyclic alkyl groups include the groups exemplified above as alkyl groups having 1 to 50 carbon atoms. Examples of groups in which one or more hydrogen atoms in the ring of a saturated polycyclic alkyl group are substituted with an alkyl group include bornyl. 【0075】 In this disclosure, a cycloalkylalkyl group having 4 to 50 carbon atoms means a group having 4 to 50 carbon atoms in which one or more hydrogen atoms of the alkyl group are substituted with a cycloalkyl group. The cycloalkyl group in the cycloalkylalkyl group may be monocyclic or polycyclic. 【0076】 R in general formula (31) 31 When the above aliphatic hydrocarbon group is a group in which one or more methylene groups are replaced by a divalent group selected from group I, the divalent group selected from group I is preferably -O-, -S-, -SO-, or -SO2-. Using such a (C) component makes it easier to obtain a resin composition that has excellent lamination properties and can form a cured product with excellent dimensional stability and dielectric properties. From this viewpoint, the divalent group selected from group I is more preferably -O- or -S-, and even more preferably -O-. 【0077】 In this disclosure, the number of carbon atoms in a group refers to the number of carbon atoms in the group after a substituent has replaced a hydrogen atom in the group. For example, if a hydrogen atom in an alkyl group with 1 to 50 carbon atoms is substituted, the number of carbon atoms (1 to 50) refers to the number of carbon atoms after the hydrogen atom has been replaced, and not to the number of carbon atoms before the hydrogen atom was replaced. Furthermore, in this disclosure, the definition of the number of carbon atoms in a group in which a methylene group has been replaced by a divalent group is the same as the definition of the number of carbon atoms in the group before the substitution. For example, the number of carbon atoms in an alkyl group with 1 to 50 carbon atoms in which a methylene group has been replaced by a divalent group is 1 to 50. 【0078】 (C) As the bismaleimide compound, commercially available products can also be used. Examples of commercially available (C) bismaleimide compounds include "MIR-3000" and "MIR-5000" from Nippon Kayaku Co., Ltd., "BMI-4000", "BMI-2300", "BMI-TMH", "BMI-4000", and "BMI-5100" from Yamato Kasei Kogyo Co., Ltd., and "BMI-689", "BMI-1500", "BMI-3000J", and "BMI-5000" from Designer Molecules Inc. 【0079】 The content of the (C) bismaleimide compound in the resin composition is preferably 10 to 100 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). By setting the content of component (C) within the above range, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and a good balance of dimensional stability and dielectric properties. From this viewpoint, the content of the (C) bismaleimide compound is more preferably 25 to 90 parts by mass, even more preferably 35 to 85 parts by mass, and particularly preferably 40 to 80 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). 【0080】 1-4. (D) Filler The resin composition contains (D) filler (component (D)). At least one of a spherical filler and a plate-shaped filler can be used as the filler. From the viewpoint of easily obtaining a resin composition that can form a cured product with excellent lamination suitability and a good balance of dimensional stability and dielectric properties, a spherical filler is preferred. 【0081】 (Spherical filler) As the spherical filler, known spherical fillers can be used. Specific examples of spherical fillers include spherical alumina (spherical aluminum oxide), spherical silica, spherical magnesium oxide, spherical boron nitride, spherical aluminum nitride, spherical zinc oxide, and spherical carbon. One or more of these can be used. 【0082】 In this disclosure, "spherical" in reference to spherical fillers means a shape having a circularity of 0.90 or higher. The circularity of the spherical filler is preferably 0.95 or higher, and more preferably 0.98 or higher. The circularity can be determined by inputting the area and perimeter measured by image analysis from SEM (scanning electron microscope) images of the spherical filler into the following formula (A). Note that the circularity is the average circularity, which is the average value of the circularity of 10 or more spherical fillers arbitrarily extracted from the SEM image. Roundness = 4π × (area) ÷ (perimeter) 2 ...(A) 【0083】 In one embodiment of the resin composition, from the viewpoint of easily obtaining a resin composition capable of forming a cured product with an excellent balance of dimensional stability and dielectric properties, the spherical filler is preferably a spherical inorganic filler, and more preferably spherical silica. Furthermore, since it is possible to impart excellent insulation and heat dissipation properties to the formed cured product, it is preferable to use at least one spherical inorganic filler selected from the group consisting of spherical boron nitride, spherical zinc oxide, spherical magnesium oxide, spherical alumina, and spherical aluminum nitride. 【0084】 Furthermore, surface-treated spherical fillers may be used. For example, spherical inorganic fillers whose surfaces have been modified with silane-based coupling agents or titanate-based coupling agents can be used. 【0085】 The particle size of the spherical filler is not particularly limited, and spherical fillers with the particle size necessary to obtain a cured product of the desired size can be selected and used. For example, spherical fillers with an average particle size of about 1 nm to 300 μm can be used. Preferably, the average particle size of the spherical filler is 3 nm to 200 μm. An average particle size of 3 nm to 200 μm makes it easier to obtain a resin composition that can form a cured product with an excellent balance of dimensional stability and dielectric properties. From this viewpoint, the average particle size of the spherical filler is more preferably 5 nm to 100 μm, even more preferably 5 nm to 50 μm, particularly preferably 10 nm to 50 μm, and most preferably 20 nm to 50 μm. The average particle size of the spherical filler can be determined using a particle size distribution analyzer that measures particle size distribution by laser diffraction and scattering, and is defined as the particle size that accounts for 50% of the cumulative particle size distribution based on volume (D50). Multiple types of spherical fillers or spherical fillers with different average particle sizes can be combined and contained in the resin composition. 【0086】 (Sheet-shaped filler) In this disclosure, "plate-shaped filler" means a filler with an aspect ratio of 10 or more. The aspect ratio means the ratio of the maximum length to the thickness of the particle (filler) (maximum length / thickness). From the viewpoint of obtaining a resin composition that can form a cured product with excellent warp resistance, the aspect ratio of the plate-shaped filler is preferably 15 or more, more preferably 17 or more, and even more preferably 20 or more. The aspect ratio can be determined from the average value of the aspect ratios of a sufficient number (e.g., 30) of particles (fillers) observed using an SEM (scanning electron microscope). 【0087】 As the plate-shaped filler, known plate-shaped fillers can be used. Specific examples of plate-shaped fillers include plate-shaped boron nitride, plate-shaped alumina (plate-shaped aluminum oxide), plate-shaped silica, plate-shaped magnesium oxide, plate-shaped aluminum nitride, plate-shaped zinc oxide, and graphene. One or more of these can be used. 【0088】 The plate-shaped filler is preferably a plate-shaped inorganic filler. More preferably, the plate-shaped inorganic filler is at least one selected from the group consisting of boron nitride, zinc oxide, magnesium oxide, alumina (aluminum oxide), and aluminum nitride. By using these plate-shaped inorganic fillers, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and a good balance of dimensional stability and dielectric properties. 【0089】 As the plate-shaped filler, surface-treated plate-shaped fillers may be used. For example, plate-shaped inorganic fillers whose surfaces have been modified with silane-based coupling agents or titanate-based coupling agents can be used. The resin composition may contain a combination of multiple types of plate-shaped fillers or plate-shaped fillers with different aspect ratios. 【0090】 The content of filler (D) in the resin composition is preferably 200 to 800 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). By setting the content of component (D) within the above range, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and an excellent balance of dimensional stability and dielectric performance. From this viewpoint, the content of filler (D) is more preferably 250 to 750 parts by mass, even more preferably 350 to 750 parts by mass, and particularly preferably 400 to 700 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). 【0091】 1-5. Other additives In one embodiment, the resin composition may contain other additives in addition to the components described above. Examples of other additives include resins other than those described above, silane coupling agents, curing agents, solvents, flux activators, stress reducers, antioxidants, flame retardants, leveling agents, and various additives to improve compatibility with other resins, stability, workability, and other properties. 【0092】 The resin composition preferably contains, in addition to the aforementioned components (A) to (D), (E) cyanate resin (hereinafter sometimes referred to as "component (E)"). Furthermore, the resin composition more preferably contains, in addition to the aforementioned components (A) to (D), (E) cyanate resin, (F) silane coupling agent (hereinafter sometimes referred to as "component (F)"), and (G) curing agent (hereinafter sometimes referred to as "component (G)"). By using these optional components, it becomes easier to obtain a resin composition capable of forming a cured product with an excellent balance of dimensional stability and dielectric properties. 【0093】 1-5-1. (E) Cyanate resin The resin composition preferably contains (E) a cyanate resin (component (E)). In this disclosure, a cyanate resin means a resin having one or more cyanate groups (-OCN) in its molecule. There are no particular restrictions on the molecular structure and molecular weight of the cyanate resin, and known cyanate resins can be used. The cyanate resin can be used alone or in combination of two or more types. 【0094】 Examples of the cyanate resin include novolac type cyanate resin; bisphenol type cyanate resin: etc. Examples of the bisphenol type cyanate resin include bisphenol A type cyanate resin, bisphenol E type cyanate resin, and tetramethyl bisphenol F type cyanate resin etc. From the viewpoint that it is easy to obtain a resin composition capable of forming a cured product excellent in lamination suitability and having an excellent balance between dimensional stability and dielectric properties, the cyanate resin preferably contains a bisphenol type cyanate resin, and more preferably contains a bisphenol A type cyanate resin. 【0095】 From the viewpoint that it is easy to obtain a resin composition capable of forming a cured product excellent in lamination suitability and having an excellent balance between dimensional stability and dielectric properties, it is preferable that the cyanate resin has two or more cyanate groups (-OCN) in its molecule. Specifically, the cyanate resin preferably contains at least one selected from the group consisting of the compound represented by the following general formula (5-1) and the compound represented by the following general formula (5-2), and more preferably contains the compound represented by the following general formula (5-2). 【0096】 TIFF2026096928000014.tif14170 【0097】 In general formula (5-1), R 51 represents a divalent hydrocarbon group, and R 52 and R 53 each independently represent a phenylene group, and the hydrogen atoms in the phenylene group may be substituted with 1 to 4 alkyl groups. 【0098】 TIFF2026096928000015.tif35170 【0099】 In general formula (5-2), R 54 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and m represents an integer of 1 to 10. 【0100】 In the compound represented by general formula (5-1), R in general formula (5-1)51 As the divalent hydrocarbon group represented by , an alkanediyl group is preferred. Examples of alkanediyl groups include a methylene group, an ethylene group, a propylene group, an ethanediyl group, and an octanediyl group. 【0101】 Furthermore, in compounds represented by general formula (5-1), R in general formula (5-1) 52 and R 53 As alkyl groups in which hydrogen atoms in the phenylene group represented by can be substituted, alkyl groups having 1 to 10 carbon atoms are preferred. Examples of alkyl groups having 1 to 10 carbon atoms include methyl group, ethyl group, propyl group, isopropyl group, butyl group, isobutyl group, tertiary butyl group, amyl group, isoamyl group, tertiary amyl group, hexyl group, isohexyl group, octyl group, 2-ethylhexyl group, tertiary octyl group, nonyl group, and decyl group. 【0102】 In a compound represented by general formula (5-2), R in general formula (5-2) 54 Alkyl alkyl groups with 1 to 4 carbon atoms, as represented by , can be listed as those that satisfy the requirement of 1 to 4 carbon atoms, among those that are explained in the same way as the alkyl groups with 1 to 10 carbon atoms described above. 【0103】 The content of (E) cyanate resin in the resin composition is preferably 10 to 100 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). By setting the content of component (E) within the above range, it becomes easier to obtain a resin composition that can form a cured product with excellent lamination suitability and a good balance of dimensional stability and dielectric performance. From this viewpoint, the content of (E) cyanate resin is more preferably 20 to 80 parts by mass, even more preferably 25 to 70 parts by mass, and particularly preferably 30 to 60 parts by mass per 100 parts by mass of the total of components (A), (B), and (C). 【0104】 1-5-2. (F) Silane coupling agent In one embodiment, the resin composition preferably contains a (F) silane coupling agent (component (F)). As the silane coupling agent, one of the known silane coupling agents can be used alone or in combination of two or more. 【0105】 Specific examples of silane coupling agents include vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane, p-styryltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, 3-acryloxypropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropylmethyldimethoxysilane, N-2-(aminoethyl)-3- Examples include aminopropyltrimethoxysilane, N-2-(aminoethyl)-3-aminopropyltriethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N-(1,3-dimethylbutylidene)propylamine, N-phenyl-3-aminopropyltrimethoxysilane, hydrochloride of N-(vinylbenzyl)-2-aminoethyl-3-aminopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-chloropropyltrimethoxysilane, 3-mercaptopropylmethyldimethoxysilane, 3-mercaptopropyltrimethoxysilane, bis(triethoxysilylpropyl)tetrasulfide, and 3-isocyanatetopropyltriethoxysilane. 【0106】 The content of the (F) silane coupling agent in the resin composition is preferably 0.01 to 20 parts by mass per 100 parts by mass of the total of components (A) and (B). By setting the content of component (F) within the above range, it becomes easier to obtain a resin composition capable of forming a cured product with excellent adhesion and hygroscopicity. From this viewpoint, the content of the (F) silane coupling agent is more preferably 0.02 to 15 parts by mass, even more preferably 0.03 to 10 parts by mass, and particularly preferably 0.03 to 5 parts by mass per 100 parts by mass of the total of components (A) and (B). 【0107】 1-5-3. (G) Hardener In one embodiment, the resin composition preferably contains (G) a curing agent ((G) component). The (G) curing agent can be any curing agent used to cure epoxy resins. Examples of (G) curing agents include imidazole compounds, amine adducts, sulfonium salts, onium salts, ketimines, acid anhydrides, tertiary amines, polyamine compounds, and polyphenol compounds. One or more of these can be used. From the viewpoint of easily obtaining a resin composition with excellent curability and storage stability, it is preferable to use an imidazole compound as the (G) curing agent. 【0108】 Specific examples of imidazole compounds include 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6-[2-(2-methyl-1-imidazole)ethyl]-1,3,5-thiazine, 2-phenyl-1-benzyl-1H-imidazole, 1-cyanoethyl-2-undecylimidazolium trimellitate, 2-methylimidazole, 2-phenylimidazole, 2- Undecylimidazole, 2-heptadecylimidazole, 2-phenyl-4-methylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 2,4-diamino-6(2'-methylimidazole (1'))ethyl-s-triazine, 2,4-diamino-6(2'-undecylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'-ethyl,4-methylimidazole(1'))ethyl-s-triazine, 2,4-diamino-6(2'-methylimidazole(1'))ethyl-s-triazine isocyanuric acid adduct, 2-methylimidazole isocyanuric acid 2:3 adduct, 2-phenylimidazole isocyanuric acid adduct Additives include imidazoles such as 2-phenyl-3,5-dihydroxymethylimidazole, 2-phenyl-4-hydroxymethyl-5-methylimidazole, and 1-cyanoethyl-2-phenyl-3,5-dicyanoethoxymethylimidazole; and salts of these imidazoles with polycarboxylic acids such as phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalenedicarboxylic acid, maleic acid, and oxalic acid. Among these, imidazoles are preferred in terms of curability and storage stability, and 2-phenyl-4,5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole are even more preferred. Examples of commercially available imidazoles include the trade names "2PHZ-PW" (manufactured by Shikoku Chemicals Co., Ltd.) and "2P4MHZ-PW" (manufactured by Shikoku Chemicals Co., Ltd.). 【0109】 The content of (G) curing agent in the resin composition is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 15 parts by mass, and even more preferably 1 to 10 parts by mass, based on 100 parts by mass of the total of components (A), (B), and (C). 【0110】 1-6.Applications The resin composition of this embodiment is suitable as a thermosetting low-dielectric material. For example, the resin composition of this embodiment can be suitably used as a resin material for semiconductor devices such as prepreg impregnation resins, encapsulants, adhesive sheets, build-up substrate interlayer insulating materials, and multilayer substrate core materials. 【0111】 2.Cured product A cured product of one embodiment of the present disclosure is a cured product of the resin composition of one embodiment of the present disclosure described above. The cured product of this embodiment can be formed by curing the aforementioned resin composition. A method for manufacturing a cured product of one embodiment of the present disclosure comprises the step of curing the resin composition of one embodiment of the present disclosure described above. 【0112】 The shape of the cured product is not particularly limited. Examples of cured product shapes include sheets, films, and plates. The cured product can be obtained, for example, by heating the aforementioned resin composition at a temperature range of 100 to 220°C for 0.5 to 120 minutes as part of the above process. By this method, it is possible to produce a cured product with excellent warp resistance. 【0113】 Well-known methods can be applied to the manufacturing method of the cured product. For example, a sheet-like cured product can be manufactured by applying the aforementioned resin composition onto a support such as a carrier film or metal foil, forming a coating layer, and then curing the resulting coating. Alternatively, a sheet-like cured product can be manufactured by transferring the coating layer formed with the aforementioned resin composition from the support to a substrate and then curing it. Examples of substrates include silicon wafers and aluminum wafers. Examples of substrate shapes include sheets, films, and plates. 【0114】 When manufacturing a sheet-like cured product, the aforementioned resin composition may be applied to a support using various coating devices, or it may be applied to the support by spraying it with a spray device. Examples of coating devices include roll coaters, bar coaters, knife coaters, gravure coaters, die coaters, comma coaters, slit coaters, curtain coaters, and screen printing devices. Alternatively, the resin composition may be applied to the support by brush application. 【0115】 When a resin composition containing an organic solvent is cured, a cured product containing the organic solvent may be obtained, or a cured product in which the organic solvent has evaporated and is substantially free of residue (does not contain the organic solvent) may be obtained. The cured products of this embodiment include both cured products containing the organic solvent and cured products that are substantially free of the organic solvent. 【0116】 3. Others The following aspects are included in this disclosure: [1] (A) Novolac type epoxy compound, (B) Polyphenylene ether resin having phenolic hydroxyl groups at both ends, (C) Bismaleimide compounds, and (D) Contains filler, The (A) novolac-type epoxy compound is a resin composition comprising a structural unit represented by the following general formula (1). 【0117】 TIFF2026096928000016.tif56170(In the general formula (1), Ar represents an aromatic ring, and R 1 represents a hydrogen atom, a hydroxy group, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms. R 2 represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an arylalkylene group having 7 to 20 carbon atoms, a cycloalkyl ring-containing group having 3 to 20 carbon atoms, a group represented by the following general formula (2), or a group represented by the following general formula (3). * represents a bond.) 【0118】 TIFF2026096928000017.tif65170(In the general formula (2), R 3 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and * represents a bond.) 【0119】 TIFF2026096928000018.tif14170(In the general formula (3), R 11 and R 12 each independently represent an alkylene group having 1 to 10 carbon atoms, Ar 11 represents an arylene group having 6 to 18 carbon atoms, and * represents a bond.) 【0120】 [2] Furthermore, the resin composition according to [1], which contains (E) a cyanate resin. [3] The resin composition according to [1] or [2], wherein the (D) filler contains a spherical filler. [4] The resin composition according to any one of [1] to [3], wherein Ar in the general formula (1) is a benzene ring. [5] The R 2 in the general formula (1) is a cycloalkyl ring-containing group having 3 to 20 carbon atoms, and the resin composition according to any one of [1] to [4]. [6] The resin composition according to any one of [1] to [5], wherein the polyphenylene ether resin having phenolic hydroxyl groups at both ends of (B) is a homopolymer or copolymer containing at least one of the structural units represented by the following general formula (11) and the structural units represented by the following general formula (12) as repeating units. 【0121】 TIFF2026096928000019.tif34170(In the above general formula (11), R 21 and R 22 Each of these independently represents a hydrogen atom, a halogen atom, an unsubstituted or substituted alkyl group having 1 to 4 carbon atoms, or an aryl group, and * represents a bond. In the above general formula (12), R 23 , R 24 , R 25 , and R 26 Each of these independently represents a hydrogen atom, a halogen atom, an unsubstituted or substituted alkyl group having 1 to 4 carbon atoms, or an aryl group. However, R 25 and R 26 It is not a hydrogen atom at the same time. * represents a bonding bond. 【0122】 [7] A cured product of any of the resin compositions described in [1] to [6]. [8] A method for producing a cured product, comprising the step of curing a resin composition described in any of [1] to [6]. 【0123】 This disclosure is not limited to the embodiments described above. The embodiments described above are illustrative, and all that have substantially the same configuration as the technical idea described in the claims and that produce similar effects are included within the technical scope of this disclosure. [Examples] 【0124】 The present disclosure will be described in more detail below with reference to examples, but the present disclosure is not limited in any way to the following examples. 【0125】 <(A) component> As component (A), we prepared A-1 to A-3 as shown below. In addition, as a comparative component of component (A), we prepared a-1 as shown below. A-1: Novolac-type epoxy compound (trade name "HP-7200", manufactured by DIC Corporation; R in general formula (1b)) 1 (R 1 Compounds represented by general formula (4b), where the atom is a hydrogen atom. • A-2: Novolac-type epoxy compound (product name "HP-7200L", manufactured by DIC Corporation; R in general formula (1b) 1 (R 1 Compounds represented by general formula (4b), where the atom is a hydrogen atom. · A-3: Compound represented by the following formula (A-3) (R 1 is a hydrogen atom, R 2 (A compound represented by general formula (4a), where n is an isopropylidene group and n is 1) a-1: Isocyanuric acid derivative (product name "DA-MGIC", manufactured by Shikoku Chemicals Co., Ltd.) 【0126】 TIFF2026096928000020.tif36170 【0127】 <(B) component> As component (B), we prepared B-1 as shown below. • B-1: Polyphenylene ether resin having phenolic hydroxyl groups at both ends (product name "SA90-100", manufactured by SABIC Innovative Plastics Co., Ltd.) 【0128】 <(C) component> As component (C), we prepared C-1 to C-5 as shown below. • C-1: Compound represented by the following formula (C-1) • C-2: Compound represented by the following formula (C-2) • C-3: Compound represented by the following formula (C-3) • C-4: Bis(4-N-maleimidylphenyl)methane (manufactured by Tokyo Chemical Industry Co., Ltd.) • C-5: Compound represented by the following formula (C-5) (trade name "BMI-689", manufactured by Designer Molecules Inc.) 【0129】 TIFF2026096928000021.tif37170 【0130】 TIFF2026096928000022.tif36170 【0131】 TIFF2026096928000023.tif31170 【0132】 TIFF2026096928000024.tif62170 【0133】 <(D) component> As component (D), we prepared D-1 to D-3 as shown below. • D-1: Spherical silica (product name "SFP-130MC", manufactured by Denka Co., Ltd., average particle size (D50): approx. 0.6 μm, circularity: 0.98) • D-2: Spherical alumina (product name "DAW-20", manufactured by Denka Co., Ltd., average particle size (D50): approx. 18.6 μm, circularity: 0.98) • D-3: Plate-shaped boron nitride (product name "PT110", manufactured by Momentive, aspect ratio: 35.7) 【0134】 <(E) component> As component (E), we prepared E-1 and E-2 as shown below. • E-1: Compound represented by the following formula (E-1) • E-2: Cyanate resin (product name "PT-30", manufactured by Lonza Japan Co., Ltd.) 【0135】 TIFF2026096928000025.tif50170 【0136】 <(F) component> As component (F), we prepared F-1 as shown below. • F-1: Silane coupling agent (product name "KBM-403", manufactured by Shin-Etsu Chemical Co., Ltd.) 【0137】 <(G) component> As component (G), we prepared G-1 as shown below. • G-1: Imidazole compound (product name "2P4MHZ-PW", manufactured by Shikoku Chemicals Co., Ltd.) 【0138】 <Examples 1-14 and Comparative Examples 1-4> (Manufacturing of resin compositions) After mixing each component to achieve the composition (in parts by mass) shown in the upper section of Table 1 (Tables 1-1 and 1-2), the mixture was dispersed using a planetary mixer and a bead mill to obtain each resin composition. 【0139】 (Manufacturing of hardened products) Each manufactured resin composition was applied to a PET film to a thickness of 20 μm using the slit-coating method, and then heated at 100°C for 10 minutes to dry. After cutting out 30 mm squares, the PET film was peeled off to obtain the coating. Next, using a vacuum laminator (manufactured by Japan Steel Works Ltd., model: MVLP-500 / 600), the coatings were bonded together under the conditions of lamination temperature: 100°C, press pressure: 1 MPa, and press time: 5 seconds. The coatings were then heated at 190°C for 90 minutes to cure, obtaining cured products with a thickness of 100 μm and cured products with a thickness of 800 μm, respectively. 【0140】 <Rating> The following items were evaluated for each resin composition and the cured products obtained therefrom using the following evaluation method. The evaluation results are shown in the lower part of Table 1. 【0141】 [Lamination suitability] In the manufacturing of each cured product, the lamination suitability when bonding the coating films together using the vacuum laminator described above under the above conditions was evaluated according to the evaluation criteria shown below. A: No peeling occurred after bonding. C: After bonding, peeling occurred. 【0142】 [Dielectric properties] In each example and comparative example, a cured material with a thickness of 800 μm was used as a test specimen, and the relative permittivity Dk and dielectric loss tangent Df were measured using the coaxial resonator method. A dielectric constant measurement system manufactured by AET Co., Ltd. was used as the measuring instrument, and the measurement conditions were a frequency of 10 GHz and a measurement temperature of 25°C. For samples where the lamination suitability evaluation result was "C", it was not possible to prepare a test specimen, and therefore the relative permittivity Dk and dielectric loss tangent Df could not be measured (indicated as "-" in the dielectric properties (Dk) and (Df) columns in Table 1). 【0143】 (Relative permittivity Dk) Based on the measured relative permittivity Dk, the dielectric properties (Dk) were evaluated according to the evaluation criteria shown below. A: The relative permittivity Dk was less than 3.0. B: The relative permittivity Dk was 3.0 or greater and less than 3.5. C: The relative permittivity Dk was 3.5 or higher. 【0144】 (Dielectric loss tangent Df) Based on the measured dielectric loss tangent Df, the dielectric properties (Df) were evaluated according to the evaluation criteria shown below. A: The dielectric loss tangent Df was less than 0.003. B: The dielectric loss tangent Df was between 0.003 and less than 0.01. C: The dielectric loss tangent Df was 0.01 or greater. 【0145】 [Coefficient of linear expansion α1] In each example and comparative example, a cured material with a thickness of 100 μm was used as a test specimen, and the coefficient of linear expansion α1 was measured. The measurement was performed in accordance with JIS K 7197, and the average linear expansion curve was created using a thermomechanical analysis (TMA) apparatus to determine the coefficient of linear expansion α1. A smaller coefficient of linear expansion α1 indicates better dimensional stability. For samples where the lamination suitability evaluation result was "C", it was not possible to prepare a test specimen, and therefore the coefficient of linear expansion α1 could not be measured (indicated as "-" in the coefficient of linear expansion α1 column of Table 1). 【0146】 TIFF2026096928000026.tif146170 【0147】 TIFF2026096928000027.tif147170

Claims

[Claim 1] (A) Novolac-type epoxy compound, (B) Polyphenylene ether resin having phenolic hydroxyl groups at both ends, (C) Bismaleimide compounds, and (D) Contains filler, The (A) novolac-type epoxy compound is a resin composition comprising a constituent unit represented by the following general formula (1). (In the above general formula (1), Ar represents an aromatic ring, R １ R represents a hydrogen atom, a hydroxyl group, a halogen atom, an alkyl group having 1 to 10 carbon atoms, or an alkenyl group having 2 to 10 carbon atoms. ２ This represents an alkylene group having 1 to 20 carbon atoms, an arylene group having 6 to 20 carbon atoms, an arylalkylene group having 7 to 20 carbon atoms, a cycloalkyl ring-containing group having 3 to 20 carbon atoms, a group represented by the following general formula (2), or a group represented by the following general formula (3). * represents a bond. (In the above general formula (2), R ３ (where * represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, and * represents a bond.) (In the above general formula (3), R １１ and R １２ Each of these independently represents an alkylene group with 1 to 10 carbon atoms, and Ar １１ (where * represents an arylene group with 6 to 18 carbon atoms, and * represents a bond.) [Claim 2] Furthermore, the resin composition according to claim 1, further comprising (E) a cyanate resin. [Claim 3] The resin composition according to claim 1, wherein the (D) filler includes a spherical filler. [Claim 4] The resin composition according to claim 1, wherein the Ar in the general formula (1) is a benzene ring. [Claim 5] The R in the general formula (1) ２ The resin composition according to claim 4, wherein the group is a cycloalkyl ring containing 3 to 20 carbon atoms. [Claim 6] The resin composition according to claim 1, wherein the polyphenylene ether resin having phenolic hydroxyl groups at both ends (B) is a homopolymer or copolymer containing at least one of the structural units represented by the following general formula (11) and the structural units represented by the following general formula (12) as repeating units. (In the general formula (11), R ２１ and R ２２ each independently represents a hydrogen atom, a halogen atom, an unsubstituted or substituted alkyl group having 1 to 4 carbon atoms, or an aryl group, and * represents a bond. In the general formula (12), R ２３ , R ２４ , R ２５ , and R ２６ each independently represents a hydrogen atom, a halogen atom, an unsubstituted or substituted alkyl group having 1 to 4 carbon atoms, or an aryl group. However, R ２５ and R ２６ are not hydrogen atoms at the same time. * represents a bond.) [Claim 7] A cured product of the resin composition according to any one of claims 1 to 6. [Claim 8] A method for producing a cured product, comprising the step of curing a resin composition according to any one of claims 1 to 6.

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