Rubber compositions, rubber components, and semiconductor manufacturing-related equipment

Abstract

The present invention provides rubber compositions, rubber components, and semiconductor manufacturing-related equipment that exhibit excellent corrosion resistance. [Solution] A rubber composition comprising an olefin-based rubber and an anti-aging agent, which comes into contact with corrosive substances.

Description

[Technical Field] 【0001】 This disclosure relates to rubber compositions, rubber components, and semiconductor manufacturing-related equipment. [Background technology] 【0002】 It has been proposed to use a specific mixture of resin and rubber as a gasket for sealed batteries (see, for example, Patent Document 1). [Prior art documents] [Patent Documents] 【0003】 [Patent Document 1] Japanese Patent Publication No. 2008-7671 [Overview of the Initiative] [Problems that the invention aims to solve] 【0004】 This disclosure aims to provide rubber compositions, rubber components, and semiconductor manufacturing-related equipment that exhibit excellent corrosion resistance. [Means for solving the problem] 【0005】 (1) This disclosure is a rubber composition comprising an olefin-based rubber and an anti-aging agent, which comes into contact with corrosive substances. 【0006】 Disclosure (2) is the rubber composition according to Disclosure (1), comprising 0.1 to 10.0 parts by mass of the anti-aging agent per 100 parts by mass of the olefin rubber. 【0007】 Disclosure (3) is the rubber composition according to Disclosure (1) or (2) wherein the antioxidant comprises an amine-based antioxidant. 【0008】 The present disclosure (4) is the rubber composition according to the present disclosure (3), wherein the amine-based antioxidant contains at least one selected from the group consisting of 2,2,4-trimethyl-1,2-dihydroquinoline polymer and 4,4'-bis(α,α-dimethylbenzyl)diphenylamine. 【0009】 The present disclosure (5) is the rubber composition according to the present disclosure (3) or (4), which contains 0.1 to 5.0 parts by mass of the amine-based antioxidant with respect to 100 parts by mass of the olefin-based rubber. 【0010】 The present disclosure (6) is the rubber composition according to the present disclosure (1) or (2), wherein the antioxidant contains a sulfur-based antioxidant. 【0011】 The present disclosure (7) is the rubber composition according to the present disclosure (6), wherein the sulfur-based antioxidant contains a benzimidazole-based antioxidant. 【0012】 The present disclosure (8) is the rubber composition according to the present disclosure (7), wherein the benzimidazole-based antioxidant contains 2-mercaptobenzimidazole. 【0013】 The present disclosure (9) is the rubber composition according to any one of the present disclosures (6) to (8), which contains 0.1 to 5.0 parts by mass of the sulfur-based antioxidant with respect to 100 parts by mass of the olefin-based rubber. 【0014】 The present disclosure (10) is the rubber composition according to any one of the present disclosures (1) to (9), wherein the antioxidant contains an amine-based antioxidant and a sulfur-based antioxidant. 【0015】 The present disclosure (11) is the rubber composition according to the present disclosure (10), which contains 0.1 to 5.0 parts by mass of the amine-based antioxidant and 0.1 to 5.0 parts by mass of the sulfur-based antioxidant with respect to 100 parts by mass of the olefin-based rubber. 【0016】 The present disclosure (12) is the rubber composition according to any one of the present disclosures (1) to (11), wherein the olefin rubber is at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber. 【0017】 The present disclosure (13) is the rubber composition according to the present disclosure (12), wherein the ethylene content of the ethylene-propylene-diene rubber and the ethylene-propylene rubber is 50 to 70% by mass. 【0018】 The present disclosure (14) is the rubber composition according to any one of the present disclosures (1) to (13), wherein the diene monomer amount of the olefin rubber is 0 to 5% by mass. 【0019】 The present disclosure (15) is the rubber composition according to any one of the present disclosures (1) to (14), wherein the Mooney viscosity (ML 【0022】 , , 【0024】 , , , 【0020】 , , , 【0021】 , , , , 【0023】 , (100 °C)) is 10 to 200. 【0020】 The present disclosure (16) is the rubber composition according to any one of the present disclosures (1) to (15), wherein the pH of the corrosive substance is 6 or less. 【0021】 The present disclosure (17) is the rubber composition according to any one of the present disclosures (1) to (16), wherein the redox potential (vsNHE) of the corrosive substance is 0 to 3.0 V. 【0022】 The present disclosure (18) is the rubber composition according to any one of the present disclosures (1) to (17), wherein the corrosive substance is at least one selected from the group consisting of an acidic substance, an oxidizing substance, an organic solvent, and salt water. 【0023】 The present disclosure (19) is the rubber composition according to the present disclosure (18), wherein the acidic substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid. <000​​Disclosure (20) is a rubber composition according to any one of Disclosures (1) to (19), wherein the corrosive substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid. 【0025】 Disclosure (21) is a rubber composition according to any one of Disclosures (1) to (20), wherein a crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition is immersed in the following two chemical solutions for one week, and the relative value of the mass after immersion, with the mass before immersion set to 100, is 25 or more and 175 or less in both cases. (Medicinal solution) 98% by mass sulfuric acid (90°C), and, A mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid and 69-71% nitric acid by mass in a volume ratio of 1:100) (at 20°C). 【0026】 Disclosure (22) is a rubber composition according to any one of Disclosures (1) to (21), wherein a crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition is immersed in one of the following chemical solutions for one week, and the relative value of the mass after immersion, with the mass before immersion set to 100, is 93 or more and 107 or less. (Medicinal solution) A mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid and 69-71% nitric acid by mass in a volume ratio of 1:100) (at 20°C). 【0027】 Disclosure (23) is a rubber composition according to any one of Disclosures (1) to (22), wherein the corrosive substance is a corrosive gas containing plasma. 【0028】 The present disclosure (24) is a rubber composition according to the present disclosure (23), wherein the corrosive gas containing the plasma is at least one selected from the group consisting of noble gases, organic halogen gases, inorganic halogen gases, hydrocarbon gases, oxygen, hydrogen, nitrogen, carbon monoxide, oxygen dioxide, ammonia, ozone, nitrous oxide, nitrogen dioxide, silane, diborane, and sulfur dioxide. 【0029】 Disclosure (25) is a rubber composition according to any one of Disclosures (1) to (24), wherein the crosslinked rubber obtained from the rubber composition has a tensile strength at break of 9 MPa or more after being subjected to O2 plasma irradiation under the following conditions. (O2 plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ 【0030】 (26) is a rubber composition according to any one of (1) to (25) of this disclosure, wherein the rate of change in the tensile strength at break after O2 plasma irradiation under the following conditions is -50% to 50% from before irradiation to the crosslinked rubber obtained from the rubber composition. (O2 plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ 【0031】 Disclosure (27) is a rubber composition according to any one of Disclosures (1) to (26), wherein the crosslinked rubber obtained from the rubber composition exhibits a tensile elongation at break of 80% or more after being subjected to O2 plasma irradiation under the following conditions. (O2 plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ 【0032】 (28) This disclosure is a rubber composition according to any one of (1) to (27) of this disclosure, wherein the rate of change of the tensile elongation at break from before irradiation after O2 plasma irradiation under the following conditions is -25% to 25% for the crosslinked rubber obtained from the rubber composition. (O2 plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ 【0033】 The present disclosure (29) is a rubber composition according to any one of the present disclosures (1) to (28), wherein the rate of change in the tensile elongation at break after irradiating the crosslinked rubber obtained from the rubber composition with CF4 plasma under the following conditions is 10% or less compared to before irradiation. (CF4 plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ 【0034】 Disclosure (30) is a rubber member using a rubber composition described in any of Disclosures (1) to (29). 【0035】 The present disclosure (31) is a rubber member according to the present disclosure (30), which is at least one member selected from the group consisting of building materials, mobility components, aerospace components, semiconductor components, semiconductor manufacturing equipment components, medical components, and information and communication components. 【0036】 The present disclosure (32) is a rubber component according to the present disclosure (30) or (31), which is at least one selected from the group consisting of seals, containers, pipes, nozzles, tubes, tanks, fittings, valves, pumps and spin chucks. 【0037】 The present disclosure (33) is a rubber member according to the present disclosure (32), wherein the sealing material is at least one selected from the group consisting of O-rings, square-rings, gaskets, packings, oil seals, bearing seals and lip seals. 【0038】 This disclosure (34) is a rubber member described in any of this disclosure (30) to (33), which is a component for semiconductor manufacturing equipment. 【0039】 This disclosure (35) is a rubber member according to this disclosure (34), wherein the semiconductor manufacturing-related equipment is equipment in which chemicals are used within the equipment. 【0040】 Disclosure (36) is a semiconductor manufacturing apparatus equipped with a rubber member as described in any of Disclosures (30) to (35). 【0041】 The present disclosure (37) is a semiconductor manufacturing-related apparatus according to the present disclosure (36), which is at least one selected from the group consisting of a mask / reticle manufacturing apparatus, a wafer manufacturing apparatus, a wafer processing apparatus, an assembly apparatus, an inspection apparatus, and an apparatus related to semiconductor manufacturing apparatus. 【0042】 This disclosure (38) states that the mask reticle manufacturing apparatus is at least one selected from the group consisting of a photolithography apparatus, a thin film formation / etching / cleaning / drying apparatus, and an inspection and evaluation apparatus. The wafer manufacturing apparatus is a wafer processing apparatus, The wafer processing apparatus is at least one selected from the group consisting of a resist processing apparatus, an etching apparatus, a cleaning and drying apparatus, a heat processing apparatus, an ion implantation apparatus, a thin film formation apparatus, a CVD apparatus, a sputtering apparatus, an inspection and evaluation apparatus, a CMP apparatus, and a processing apparatus. The assembly apparatus is at least one selected from the group consisting of a dicing apparatus, a bonding apparatus, and a packaging apparatus. The inspection device is at least one selected from the group consisting of a testing device, a probing device, a handler, an aging device, a cold / heat testing device, a temperature / humidity testing device, a pressure cooker device, a laser processing system, and a life testing device. The semiconductor manufacturing equipment described in (37) is a semiconductor manufacturing equipment according to the present disclosure, wherein the semiconductor manufacturing equipment is at least one selected from the group consisting of a conveying device, a pure water / chemical solution device, a gas device, a cleanroom device, a jig cleaning / drying device, a flow control device, a taping device, a packaging device, and a liquid / gas measuring device. 【0043】 This disclosure (39) states that the photolithography apparatus is at least one selected from the group consisting of a coating apparatus, a resist stripping apparatus, a developing apparatus (developer), a baking apparatus, and a discam apparatus. The thin film formation, etching, cleaning, and drying apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a sputtering apparatus, a CVD apparatus, a cleaning apparatus, and a drying apparatus. The inspection and evaluation device is a defect correction device, The wafer processing apparatus is a wafer marking apparatus, The resist processing apparatus is at least one selected from the group consisting of a coating apparatus, a developing apparatus, a resist stripping apparatus, an ashing apparatus, and a baking apparatus. The etching apparatus is at least one selected from the group consisting of a dry etching apparatus and a wet etching apparatus. The aforementioned washing and drying apparatus is at least one selected from the group consisting of a dry washing apparatus, a wet washing apparatus, a scrubbing washing apparatus, and a drying apparatus. The heat treatment apparatus is at least one selected from the group consisting of an oxidation apparatus, a diffusion apparatus, and an annealing apparatus. The ion implanter is at least one selected from the group consisting of a high-current ion implanter, a medium-current ion implanter, and a high-energy ion implanter. The CVD apparatus is at least one selected from the group consisting of high-pressure CVD apparatus, SACVD, reduced-pressure CVD, plasma CVD apparatus, metal CVD apparatus, and ALD apparatus. The thin film formation apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus. The CMP device is at least one selected from the group consisting of a CMP device and a CMP cleaning device. The inspection and evaluation apparatus is an Auger electron spectrometer, The processing apparatus is at least one selected from the group consisting of a wafer marking apparatus, a back grinding machine, a bump plating apparatus, a tape application machine for a back grinder, a back grinder, and a tape peeling machine for a back grinder. The dicing apparatus is at least one selected from the group consisting of a dicing apparatus and a wafer mounting apparatus. The bonding apparatus is at least one selected from the group consisting of a die bonding apparatus, a hybrid bonding apparatus, a wire bonding apparatus, an inner lead bonding apparatus, an outer lead bonding apparatus, and a flip-chip bonding apparatus. The packaging apparatus is at least one selected from the group consisting of a molding apparatus, a deburring apparatus, and a soldering apparatus. The testing apparatus is at least one selected from the group consisting of electron beam testing apparatus and laser beam testing apparatus. The aforementioned proping device is a propper, The aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus. The transport device is at least one selected from the group consisting of an in-process wafer transport device, an inter-process wafer transport device, and a stocker. The aforementioned pure water / chemical solution system is at least one selected from the group consisting of a pure water production system, an ultrafiltration system, a reverse osmosis system, a sterilization system, a chemical supply system, a slurry supply system, a chemical purification system, and a wastewater treatment system. The gas apparatus is at least one selected from the group consisting of a gas generator, a gas purification device, a gas mixing device, a gas detection device, and an exhaust gas treatment device. The aforementioned cleanroom apparatus is the semiconductor manufacturing apparatus described in (38) of this disclosure, wherein the cleanroom apparatus is at least one selected from the group consisting of a clean bench, a clean tunnel, a thermal chamber, an environmental testing apparatus, an air shower, and a pass box. 【0044】 This disclosure (40) is a semiconductor manufacturing apparatus as described in any of these disclosures (36) to (39), in which corrosive substances are used within the apparatus. 【0045】 The present disclosure (41) is a semiconductor manufacturing-related apparatus according to any of the present disclosures (36) to (40), wherein a corrosive substance is used in the apparatus and the corrosive substance comes into contact with the rubber member. [Effects of the Invention] 【0046】 According to this disclosure, it is possible to provide a rubber composition, a rubber component, and semiconductor manufacturing-related equipment that have excellent corrosion resistance. [Modes for carrying out the invention] 【0047】 The following provides a detailed explanation of this disclosure. 【0048】 This disclosure relates to a rubber composition comprising an olefin-based rubber and an antioxidant, which comes into contact with corrosive substances. The rubber composition disclosed herein exhibits excellent corrosion resistance (particularly chemical resistance and plasma resistance). 【0049】 The rubber composition disclosed herein also exhibits excellent normal physical properties such as tensile strength at break and elongation at break, and can maintain these properties at a good level even when in contact with corrosive substances. Furthermore, it can suppress metal leaching to a low level. 【0050】 The rubber composition of this disclosure includes olefin-based rubber. Olefin-based rubber is rubber that contains constituent units derived from olefins as its main constituent units. 【0051】 Examples of the above-mentioned olefin-based rubbers include ethylene-α-olefin-nonconjugated diene rubbers such as ethylene-propylene-diene rubber (EPDM); ethylene-α-olefin rubbers such as ethylene-propylene rubber (EPM); butyl rubber (IIR); isoprene rubber (IR); cyclopentene rubber (CR); butadiene rubber (BR); natural rubber (NR); styrene-butadiene rubber (SBR), etc., and one or more of these can be used. As for the olefin-based rubber mentioned above, at least one selected from the group consisting of ethylene-α-olefin-non-conjugated diene rubber, ethylene-α-olefin rubber, and butyl rubber is preferred in terms of further improving corrosion resistance and normal physical properties, and further suppressing metal elution; at least one selected from the group consisting of ethylene-α-olefin-non-conjugated diene rubber and ethylene-α-olefin rubber is more preferred; and ethylene-α-olefin-non-conjugated diene rubber is even more preferred. Furthermore, from a similar viewpoint, at least one selected from the group consisting of ethylene-propylene-diene rubber, ethylene-propylene rubber, and butyl rubber is preferred, at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber is more preferred, and ethylene-propylene-diene rubber is even more preferred. 【0052】 Examples of the α-olefins mentioned above include propylene, 1-butene, 1-pentene, 1-hexene, 1-heptene, 1-octene, 1-nonene, and 1-decene, and one or more of these can be used. Among these, propylene, 1-butene, and 1-hexene are preferred. 【0053】 Examples of the above non-conjugated dienes include chain-like non-conjugated dienes such as 1,4-hexadiene, 1,6-octadiene, 2-methyl-1,5-hexadiene, 6-methyl-1,5-heptadiene, and 7-methyl-1,6-octadiene; dicyclopentadiene, vinylcyclohexene, cyclohexadiene, methyltetrahydroindene, 5-vinylnorbornene, 5-ethylidene-2-norbornene, and 5-methylene-2-norbornene. Examples include cyclic non-conjugated dienes such as 5-isopropylidene-2-norbornene and 6-chloromethyl-5-isopropenyl-2-norbornene; and trienes such as 2,3-diisopropylidene-5-norbornene, 2-ethylidene-3-isopropylidene-5-norbornene, 2-propenyl-2,2-norbornadiene, 1,3,7-octatriene, and 1,4,9-decatriene, and one or more of these can be used. Among these, cyclic non-conjugated dienes and 1,4-hexadiene are preferred. 【0054】 The above-mentioned olefin-based rubber preferably has a diene monomer content of 20% by mass or less, more preferably 10% by mass or less, even more preferably 7% by mass or less, even more preferably 5% by mass or less, and may be 0% by mass or more, preferably 1% by mass or more, more preferably 2% by mass or more, and even more preferably 3% by mass or more, in terms of further improving corrosion resistance and normal physical properties and further suppressing metal elution. The above diene monomer amounts are measured in accordance with ASTM D 6047. 【0055】 When the above-mentioned olefin-based rubber is rubber containing ethylene units, it is preferable that the amount of ethylene in the olefin-based rubber be 30% by mass or more, more preferably 40% by mass or more, even more preferably 45% by mass or more, even more preferably 50% by mass or more, even more preferably 55% by mass or more, and particularly preferable that it be 60% by mass or more, in order to further improve corrosion resistance and normal physical properties and to further suppress metal elution. Furthermore, the amount of ethylene may be 90% by mass or less, preferably 85% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, and particularly preferable that it be 70% by mass or less. The above ethylene amount is measured in accordance with ASTM D 3900. 【0056】 The above-mentioned olefin-based rubber offers further improvements in corrosion resistance and normal physical properties, and further suppression of metal leaching, and has a Mooney viscosity (ML). 1+4 The temperature (at 100°C) is preferably 10 or higher, more preferably 20 or higher, even more preferably 30 or higher, and preferably 400 or lower, more preferably 200 or lower, and even more preferably 170 or lower. Also, Mooney viscosity (ML 1+4 The (125℃) is preferably 10 or more, more preferably 20 or more, even more preferably 30 or more, even more preferably 40 or more, even more preferably 50 or more, and also preferably 400 or less, more preferably 200 or less, even more preferably 170 or less, and even more preferably 120 or less. The above Mooney viscosity is measured in accordance with ASTM D 1646. 【0057】 The above-mentioned olefin-based rubber is usually crosslinked. The crosslinking method is not limited, but it is preferable to crosslink with a peroxide crosslinking agent and / or a sulfur-based crosslinking agent, and more preferably with a peroxide crosslinking agent, in that it further improves corrosion resistance and normal physical properties and further suppresses metal elution. 【0058】 As the peroxide crosslinking agent mentioned above, known agents can be used, and organic peroxides are preferred. Examples of organic peroxides include diacyl peroxides such as benzoyl peroxide, dibenzoyl peroxide, and p-chlorobenzoyl peroxide; peroxyesters such as 1-butyl peroxyacetate, t-butyl peroxybenzoate, and t-butyl peroxyphthalate; methyl ethyl ketone peroxide, 2,2-bis(t-butylperoxy)octane, 1,1-bis(t-butylperoxy)cyclohexane, 1,1-bis(t-butylperoxy)-3,3,5-trimethylcyclohexane, and 4,4-di(t-butylperoxy)-n-butylvalerate. Examples include peroxyketals such as di-t-butylperoxybenzoate, 1,3-bis(1-butylperoxyisopropyl)benzene, dicumyl peroxide, t-butylcumyl peroxide, di-t-butyl peroxide, di-t-amyl peroxide, 1,3-bis(t-butylperoxyisopropyl)benzene, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-bis(t-butylperoxy)hexane, and hydroperoxides such as t-butylhydroperoxide. 【0059】 In particular, organic peroxides with a half-life of 1 minute at temperatures in the range of 130°C to 200°C are preferred, and dialkyl peroxides are preferably used. 【0060】 As the sulfur-based crosslinking agent mentioned above, known substances can be used, such as elemental sulfur or sulfur compounds. 【0061】 The amount of crosslinking agent used is preferably 0.5 parts by mass or more, more preferably 1.0 part by mass or more, more preferably 3.0 parts by mass or more, and also preferably 10 parts by mass or less, more preferably 8.0 parts by mass or less, and even more preferably 6.0 parts by mass or less, per 100 parts by mass of uncrosslinked olefin rubber. 【0062】 The rubber composition of this disclosure may further contain an olefin resin. This can further improve corrosion resistance. When the olefin rubber is ethylene-α-olefin rubber (preferably EPM), it is particularly preferable to use an olefin resin in combination. 【0063】 The above-mentioned olefin resin is a resin obtained by polymerizing at least one type of olefin, and may be a homopolymer or a copolymer. 【0064】 Examples of the olefin resins mentioned above include polyethylene resin, polypropylene resin, ethylene-propylene copolymer resin, amorphous cyclic olefin resin, crystalline cyclic olefin resin, polymethylpentene resin, amorphous polystyrene resin, crystalline polystyrene resin, and polybutylene resin, and one or more of these can be used. Among these, polyethylene resin is preferred from the viewpoint of corrosion resistance and dispersibility. 【0065】 Examples of polyethylene resins include high-density polyethylene (HDPE), medium-density polyethylene (MDPE), low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), very low-density polyethylene (VLDPE), very high molecular weight polyethylene (UHPE), and cross-linked polyethylene (PEX). Among these, at least one selected from the group consisting of high-density polyethylene and very high molecular weight polyethylene is preferred from the viewpoint of corrosion resistance. 【0066】 The high-density polyethylene mentioned above has a density of 0.940 g / m³. 3 Preferably, it is 0.945 g / cm³ or more. 3 It is more preferable that the amount be greater than or equal to 0.970 g / m². 3 Preferably, it is 0.965 g / m 3 The following is more preferable: The density of polyethylene is measured in accordance with JIS K7112. 【0067】 The above-mentioned high-density polyethylene may be modified high-density polyethylene. The above-mentioned modified high-density polyethylene is a resin obtained by grafting at least one monomer selected from the group consisting of unsaturated carboxylic acids and their derivatives onto unmodified high-density polyethylene in the presence of a radical generator. 【0068】 Unsaturated carboxylic acids and their derivatives used in the production of the above-mentioned modified high-density polyethylene include monobasic unsaturated carboxylic acids and dibasic unsaturated carboxylic acids, as well as their metal salts, amides, imides, esters, and anhydrides. Of these, monobasic unsaturated carboxylic acids generally have at most 20 carbon atoms, preferably 15 or fewer. The number of carbon atoms in their derivatives is usually at most 20 or fewer, preferably 15 or fewer. Furthermore, dibasic unsaturated carboxylic acids generally have 30 carbon atoms or fewer, preferably 25 or fewer. The number of carbon atoms in their derivatives is usually 30 or fewer, preferably 25 or fewer. Among these unsaturated carboxylic acids and their derivatives, acrylic acid, methacrylic acid, maleic acid and its anhydride, 5-norbornene-2,3-dicarboxylic acid and its anhydride, and glycidyl methacrylate are preferred, with maleic anhydride and 5-norbornene anhydride being particularly preferred. 【0069】 The radical generating agent used in the production of the above-mentioned modified high-density polyethylene is not particularly limited, but organic peroxides are preferred. Suitable organic peroxides have a half-life decomposition temperature of 100°C or higher. Suitable organic peroxides include dicumyl peroxide, benzoyl peroxide, di-t-butyl peroxide, 2,5-dimethyl-di-(t-butylperoxy)hexane, 2,5-dimethyl-2,5-(t-butylperoxy)hexane-3, lauroyl peroxide, and t-butylperoxybenzoate. 【0070】 The above-mentioned modified high-density polyethylene is produced by uniformly mixing and treating an unmodified high-density polyethylene resin, an unsaturated carboxylic acid and / or its derivative, and a radical generator. Specifically, methods such as a melt-kneading method using an extruder, a Banbury mixer, a kneader, etc., a solution method of dissolving in an appropriate solvent, a slurry method of suspending in an appropriate solvent, or a so-called gas-phase grafting method can be mentioned. The treatment temperature is appropriately selected in consideration of the deterioration of high-density polyethylene, the decomposition of unsaturated carboxylic acids and their derivatives, the decomposition temperature of the peroxide used, etc. Taking the above melt-kneading method as an example, it is usually 190 to 350 °C, and particularly 200 to 300 °C is preferable. 【0071】 In producing the above-mentioned modified high-density polyethylene, for the purpose of improving its performance, as described in JP-A-62-010107, known methods can be adopted, such as a method of treating with an epoxy compound or a polyfunctional compound containing an amino group or a hydroxyl group, etc. during the above graft modification or after modification, and further a method of removing unreacted monomers (unsaturated carboxylic acids and their derivatives) and by-produced components, etc. by heating, washing, etc. The higher the graft amount of at least one monomer selected from the group consisting of the above unsaturated carboxylic acid and its derivative is, the more desirable it is, but generally it is in the range of 0.001 to 10% by mass. 【0072】 The above ultra-high molecular weight polyethylene preferably has a weight average molecular weight of 1.0×10 6 [[ID=l4]]or more, more preferably 1.2×10 6 or more, and preferably 7.0×10 7 or less, more preferably 7.0×10 6 or less. The molecular weight of polyethylene is measured by conversion to polystyrene by gel permeation chromatography (GPC), and the molecular weight of ultra-high molecular weight polyethylene is measured by conversion from the intrinsic viscosity by the viscosity method. 【0073】 Examples of the above-mentioned ultra-high molecular weight polyethylene include ultra-high molecular weight ethylene homopolymers; ultra-high molecular weight ethylene-α-olefin copolymers such as ultra-high molecular weight ethylene-propylene copolymers, ultra-high molecular weight ethylene-1-butene copolymers, ultra-high molecular weight ethylene-1-hexene copolymers, and ultra-high molecular weight ethylene-1-octene copolymers; and the like. 【0074】 The above-mentioned ultra-high molecular weight polyethylene may be in any form, such as particulate, pelletized, sheeted, or lumpy. Among these forms, particulate polyethylene with an average particle size of 1 to 1000 μm is preferred because it offers excellent productivity during processing and the resulting material has superior physical properties and moldability. The above average particle size can be measured by methods such as the sieving test method using a standard sieve specified in JIS Z8801. 【0075】 The above-mentioned ultra-high molecular weight polyethylene preferably has an intrinsic viscosity ([η]) of 10 dl / g or more, more preferably 15 dl / g or more, even more preferably 20 dl / g or more, and also preferably 80 dl / g or less, more preferably 60 dl / g or less, and even more preferably 50 dl / g or less, from the viewpoint of mechanical strength and heat resistance. The above-mentioned intrinsic viscosity can be measured, for example, using an Ubbelohde viscometer with a polymer concentration of 0.0005 to 0.01% by mass in a solution with decahydronaphthalene as the solvent, at 135°C. 【0076】 The above-mentioned ultra-high molecular weight polyethylene may be obtained as a commercially available product. Examples of commercially available products (product names) include GUR4113, GUR4120, GUR4130 (all manufactured by Celanese), Sunfine UH900, Sunfine UH950 (both manufactured by Asahi Kasei Chemicals Corporation), Hyzex Million 240M, Hyzex Million 340M (both manufactured by Mitsui Chemicals, Inc.). 【0077】 Any method may be used to produce the ultra-high molecular weight polyethylene described above. For example, a method can be used to perform homopolymerization of ethylene or copolymerization of ethylene with other olefins using a polyethylene production catalyst. Examples of α-olefins in this case include propylene, 1-butene, 4-methyl-1-pentene, 1-hexene, and 1-octene. As for the polymerization method, examples include solution polymerization, bulk polymerization, gas-phase polymerization, and slurry polymerization. Among these, slurry polymerization is particularly preferred because it enables the production of ultra-high molecular weight polyethylene with uniform particle shape, and allows for the efficient and stable production of ultra-high molecular weight polyethylene compositions that have a high melting point, high crystallinity, and excellent mechanical strength, heat resistance, and abrasion resistance. Furthermore, any commonly used organic solvent can be used as the solvent for the slurry polymerization method, such as benzene, toluene, xylene, pentane, hexane, and heptane. Liquefied gases such as isobutane and propane, and olefins such as propylene, 1-butene, 1-octene, and 1-hexene can also be used as solvents. 【0078】 The content of the olefin resin is preferably 1 part by mass or more, more preferably 15 parts by mass or more, even more preferably 30 parts by mass or more, even more preferably 45 parts by mass or more, and preferably 60 parts by mass or less, and even more preferably 55 parts by mass or less, per 100 parts by mass of the olefin rubber. 【0079】 The above rubber composition contains an anti-aging agent. One or more types of antioxidants can be used, but it is preferable to use two or more types from the viewpoint of corrosion resistance and normal physical properties. Examples of primary antioxidants include amine-based antioxidants and phenol-based antioxidants. Examples of secondary antioxidants include sulfur-based antioxidants and phosphorus-based antioxidants. 【0080】 As a primary antioxidant, amine-based antioxidants are preferred. Examples of amine-based antioxidants include dihydroquinoline-based antioxidants such as 2,2,4-trimethyl-1,2-dihydroquinoline polymer and 6-ethoxy-2,2,4-trimethyl-1,2-dihydroxyquinoline; diarylamine-based antioxidants such as 4,4'-bis(α,α-dimethylbenzyl)diphenylamine, octylated diphenylamine, and alkylated diphenylamine; and diphenyl-p-phenylenediamine and diphenyl-p-phenylenediamine. Examples of aryl-p-phenylenediamine-based antioxidants include alkyl·aryl-p-phenylenediamine-based antioxidants such as N-isopropyl-N'-phenyl-p-phenylenediamine, N-1,3-dimethylbutyl-N'-phenyl-p-phenylenediamine, N-(3-methacryloyloxy-2-hydroxypropyl)-N'-phenyl-p-phenylenediamine, and N-(methacryloyl)-N'-phenyl-p-phenylenediamine. Among these, at least one selected from the group consisting of dihydroquinoline-based antioxidants and diarylamine-based antioxidants is preferred, and at least one selected from the group consisting of 2,2,4-trimethyl-1,2-dihydroquinoline polymer and 4,4'-bis(α,α-dimethylbenzyl)diphenylamine is more preferred. The amine-based antioxidant is preferably a diarylamine-based antioxidant, and also preferably 4,4'-bis(α,α-dimethylbenzyl)diphenylamine. The amine-based antioxidant may be an amine-based antioxidant other than the 2,2,4-trimethyl-1,2-dihydroquinoline polymer. 【0081】 As a secondary anti-aging agent, a sulfur-based anti-aging agent is preferred. Examples of sulfur-based antioxidants include benzimidazole-based antioxidants such as 2-mercaptobenzimidazole and its zinc salt, and 2-mercaptomethylbenzimidazole and its zinc salt; thiobisphenol-based antioxidants such as 4,4'-thiobis(3-methyl-6-t-butylphenol), 4,4'-bis(3,5-di-t-butyl-4-hydroxybenzyl) sulfide, and 4,4'-thiobis(6-t-butyl-o-cresol); thiourea-based antioxidants such as 1,3-bis(dimethylaminopropyl)thiourea and tributylthiourea; thioether-based antioxidants such as dilauryl-3,3-thiodipropionate, distearyl-3,3-thiodipropionate, and pentaerythritol tetrakis(3-laurylthiopropionate); and dithiocarbamate-based antioxidants such as dibutyldithiocarbamate nickel. Among these, benzimidazole-based anti-aging agents are preferred, and 2-mercaptobenzimidazole is more preferred. The sulfur-based antioxidant may be any sulfur-based antioxidant other than 2-mercaptobenzimidazole. From the viewpoint of corrosion resistance and normal physical properties, the combined use of a primary antioxidant and a secondary antioxidant is preferred, and a combination of an amine-based antioxidant and a sulfur-based antioxidant is particularly preferred. 【0082】 The content of the anti-aging agent is preferably 0.1 parts by mass or more, more preferably 0.3 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 1.5 parts by mass or more, even more preferably 2.5 parts by mass or more, and also preferably 30 parts by mass or less, even more preferably 10 parts by mass or less, even more preferably 7.0 parts by mass or less, and even more preferably 5.0 parts by mass or less. A content exceeding 30 parts by mass is undesirable because it will cause blooming. 【0083】 The above-mentioned anti-aging agent preferably includes an amine-based anti-aging agent. If the above rubber composition contains an amine-based antioxidant, the content of the amine-based antioxidant is preferably 0.1 parts by mass or more, more preferably 0.3 parts by mass or more, even more preferably 0.5 parts by mass or more, and also preferably 5.0 parts by mass or less, more preferably 3.0 parts by mass or less, even more preferably 2.0 parts by mass or less, and even more preferably 1.0 part by mass or less, per 100 parts by mass of the above olefin-based rubber. 【0084】 The above-mentioned antioxidant may also preferably include a sulfur-based antioxidant. If the above rubber composition contains a sulfur-based antioxidant, the content of the sulfur-based antioxidant is preferably 0.1 parts by mass or more, more preferably 0.3 parts by mass or more, even more preferably 0.5 parts by mass or more, even more preferably 1.0 part by mass or more, and also preferably 5.0 parts by mass or less, more preferably 3.0 parts by mass or less, and even more preferably 2.0 parts by mass or less, per 100 parts by mass of the above olefin-based rubber. 【0085】 The above-mentioned antioxidant may also preferably include amine-based antioxidants and sulfur-based antioxidants. In this case, the content of each antioxidant is preferably within the range described above. 【0086】 The rubber composition of this disclosure is intended to come into contact with corrosive substances. A portion of the rubber composition may come into contact with the corrosive substance, or the entire rubber composition may come into contact with the corrosive substance. 【0087】 The corrosive substance mentioned above may be any substance that is corrosive, and may be a substance that is corrosive to rubber, resin, metal, etc. Furthermore, the corrosive substance may be a liquid, solid, or gas. It is preferable that it be a liquid or gas in which the effects of this disclosure are more pronounced. 【0088】 The above-mentioned corrosive substance has an oxidation-reduction potential (vsNHE) of preferably -2.0V or higher, more preferably -1.0V or higher, even more preferably -0.5V or higher, even more preferably 0.0V or higher, and also preferably 3.0V or lower, more preferably 2.5V or lower, and even more preferably 2.1V or lower. The above-mentioned corrosive substance has a pH of 6 or less, preferably 5 or less, and more preferably 4 or less. 【0089】 Examples of the above-mentioned corrosive substances include acidic substances, basic substances, oxidizing substances, organic solvents, saltwater, and corrosive gases including plasma. 【0090】 Examples of the above-mentioned acidic substances include chemical solutions with a pH of 6 or less, preferably 5 or less, and more preferably 4 or less. Specifically, these include acids such as sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, and hydrochloric acid; mixtures of these acids; and mixtures of these acids with other substances (such as hydrogen peroxide). In particular, at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide and sulfuric acid is preferred, and at least one selected from the group consisting of sulfuric acid and a mixed acid of hydrofluoric acid and nitric acid is more preferred. 【0091】 Examples of the above basic substances include chemical solutions with a pH of 8 or higher, preferably 9 or higher, and more preferably 10 or higher. Specifically, TMAH([(CH3)4N] + [OH] - Examples include sodium hydroxide solution, ammonia and other bases; mixtures of these bases; and mixtures of these bases with other substances (such as hydrogen peroxide). In particular, TMAH([(CH3)4N] + [OH] - Preferably, at least one selected from the group consisting of aqueous sodium hydroxide solution, aqueous ammonia solution, and a mixed chemical solution of hydrogen peroxide solution and aqueous ammonia solution. 【0092】 Examples of basic substances include chemical solutions with an oxidation-reduction potential (vsNHE) of -2.0 to 0V, preferably -1.0 to 0V, and more preferably -0.5 to 0V. Specifically, TMAH([(CH3)4N] + [OH] - Examples include basic substances such as aqueous sodium hydroxide solution, aqueous ammonia, hydroxylamine, hydrazine, hydrogen water, and sodium sulfite; and mixtures of these basic substances with other substances. In particular, TMAH([(CH3)4N] + [OH] - Preferably, at least one selected from the group consisting of aqueous sodium hydroxide solution, aqueous ammonia solution, and a mixed chemical solution of hydrogen peroxide solution and aqueous ammonia solution. 【0093】 Examples of the oxidizing substances mentioned above include chemical solutions with an oxidation-reduction potential (vsNHE) of 0 to 3.0 V, preferably 0.5 to 2.5 V, and more preferably 1.0 to 2.1 V. Specifically, these include sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide, and mixtures of these oxidizing substances with other substances (such as hydrofluoric acid). In particular, at least one selected from the group consisting of sulfuric acid, nitric acid, hydrochloric acid, hydrogen peroxide solution, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid is preferred, and at least one selected from the group consisting of nitric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid is more preferred. 【0094】 Examples of the above-mentioned organic solvents include esters such as methyl acetate, ethyl acetate, propyl acetate, n-butyl acetate, and tert-butyl acetate; ketones such as acetone, methyl ethyl ketone, and cyclohexanone; aliphatic hydrocarbons such as hexane, cyclohexane, octane, nonane, decane, undecane, dodecane, and mineral spirits; aromatic hydrocarbons such as benzene, toluene, xylene, naphthalene, and solvent naphtha; alcohols such as methanol, ethanol, isopropyl alcohol, tert-butanol, and ethylene glycol monoalkyl ethers; cyclic ethers such as tetrahydrofuran, tetrahydropyran, and dioxane; nitriles such as acetonitrile and propionitrile; amides such as dimethyl sulfoxide, N,N-dimethylformamide, and N,N-dimethylacetamide; halogenated hydrocarbons such as dichloromethane, dichloroethane, and chloroform, and mixtures thereof. Among these, alcohols are preferred, and isopropyl alcohol is more preferred. 【0095】 Corrosive gases containing the above-mentioned plasma include noble gases, organic halogen gases, inorganic halogen gases, hydrocarbon gases, oxygen, hydrogen, nitrogen, carbon monoxide, carbon dioxide, ammonia, ozone, nitrous oxide, nitrogen dioxide, hydrogen sulfide, silane, diborane, and sulfur dioxide. In particular, at least one selected from the group consisting of noble gases, organic halogen gases, inorganic halogen gases, hydrocarbon gases, oxygen, hydrogen, nitrogen, carbon monoxide, oxygen dioxide, ammonia, ozone, nitrous oxide, nitrogen dioxide, silane, diborane, and sulfur dioxide is preferred, at least one selected from the group consisting of oxygen and organic halogen gases is more preferred, and at least one selected from the group consisting of oxygen and methane tetrafluoride is even more preferred. 【0096】 The corrosive substance is preferably at least one selected from the group consisting of acidic substances, basic substances, oxidizing substances, organic solvents, brine, and corrosive gases including plasma, and more preferably at least one selected from the group consisting of acidic substances and corrosive gases including plasma. The corrosive substance may also be at least one selected from the group consisting of acidic substances, oxidizing substances, organic solvents, and brine, with acidic substances being more preferred. As the above-mentioned corrosive substance, corrosive gases containing plasma are also preferred. 【0097】 The corrosive substance described above is preferably at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, mixed acid of hydrofluoric acid and nitric acid, mixed chemical solution of hydrogen peroxide and hydrochloric acid, mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH, aqueous sodium hydroxide solution, aqueous ammonia, mixed chemical solution of hydrogen peroxide and aqueous ammonia, isopropyl alcohol, brine, and corrosive gases including plasma; more preferably at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, hydrochloric acid, mixed acid of hydrofluoric acid and nitric acid, mixed chemical solution of hydrogen peroxide and hydrochloric acid, mixed chemical solution of hydrogen peroxide and sulfuric acid, TMAH, aqueous sodium hydroxide solution, mixed chemical solution of hydrogen peroxide and aqueous ammonia, and corrosive gases including plasma; and even more preferably at least one selected from the group consisting of sulfuric acid, mixed acid of hydrofluoric acid and nitric acid, oxygen, and methane tetrafluoride. 【0098】 The crosslinked rubber pieces obtained from the rubber composition of this disclosure preferably have a durometer hardness of 30 or more, more preferably 50 or more, even more preferably 60 or more, even more preferably 65 or more, even more preferably 67 or more, even more preferably 70 or more, and also preferably 95 or less, more preferably 85 or less, even more preferably 80 or less, and even more preferably 75 or less. The durometer hardness is a value measured by the method described in the examples below. 【0099】 The crosslinked rubber pieces obtained from the rubber composition of this disclosure preferably have a tensile strength at break of 10 MPa or more, more preferably 15 MPa or more, even more preferably 20 MPa or more, even more preferably 24 MPa or more, and also preferably 40 MPa or less, more preferably 35 MPa or less, even more preferably 30 MPa or less, and even more preferably 27 MPa or less. The tensile strength at break is the value measured by the method described in the examples below. 【0100】 The crosslinked rubber pieces obtained from the rubber composition of this disclosure preferably have a tensile elongation at break of 100% or more, more preferably 120% or more, even more preferably 150% or more, even more preferably 180% or more, even more preferably 220% or more, and even more preferably 260% or more. There is no particular upper limit, but it may be 500% or less. The tensile elongation at break is the value measured by the method described in the examples below. 【0101】 The crosslinked rubber pieces obtained from the rubber composition of this disclosure preferably have a compression set of 25% or less, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less at 100°C for 72 hours. A lower compression set is preferable, but it may be 1% or more. The compression set is a value measured by the method described in the examples below. 【0102】 It is preferable that a crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition of this disclosure is immersed in two chemical solutions (1) and (2) described later for one week, and the relative value of the mass after immersion, with the mass before immersion set to 100, is between 25 and 175 in both cases. A rubber composition that satisfies this requirement has excellent corrosion resistance, particularly acid resistance. The above relative values ​​are more preferably 50 or higher, even more preferably 80 or higher, even more preferably 90 or higher, particularly preferably 100 or higher, and more preferably 170 or lower, even more preferably 165 or lower, even more preferably 160 or lower, and even more preferably 155 or lower. The ideal (most preferred) relative value is 100. 【0103】 A crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition of this disclosure is immersed in the chemical solution (1) described later for one week. The relative value of the mass after immersion, with the mass before immersion set to 100, is preferably 50 or more, more preferably 80 or more, even more preferably 90 or more, particularly preferably 100 or more, and also preferably 170 or less, more preferably 165 or less, even more preferably 160 or less, and even more preferably 155 or less. The ideal (most preferred) relative value is 100. This further improves corrosion resistance, especially acid resistance. 【0104】 A crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition of this disclosure is immersed in the chemical solution (2) described later for one week. The relative value of the mass after immersion, with the mass before immersion set to 100, is preferably 50 or more, more preferably 80 or more, even more preferably 90 or more, even more preferably 93 or more, even more preferably 97 or more, particularly preferably 100 or more, and also preferably 150 or less, more preferably 125 or less, even more preferably 110 or less, even more preferably 108 or less, even more preferably 107 or less, and even more preferably 106 or less. The ideal (most preferred) relative value is 100. This further improves corrosion resistance, especially acid resistance. 【0105】 When a crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition of this disclosure is immersed in two chemical solutions (1) and (2) described later for one week each, and the relative mass after immersion is calculated with the mass before immersion set to 100, the average of the above relative values ​​for the two chemical solutions is preferably 50 or more, more preferably 80 or more, even more preferably 90 or more, even more preferably 95 or more, even more preferably 98 or more, and also preferably 170 or less, more preferably 160 or less, even more preferably 150 or less, even more preferably 140 or less, even more preferably 135 or less, and particularly preferably 130 or less. The ideal (most preferred) average of the relative values ​​is 100. This further improves corrosion resistance, especially acid resistance. 【0106】 When a crosslinked rubber piece (size: 10 mm × 50 mm × 2 mm) obtained from the rubber composition of this disclosure is immersed in two chemical solutions (1) and (2) described later for one week each, and the relative mass after immersion is calculated with the mass before immersion set to 100, the standard deviation of the above relative values ​​for the two chemical solutions is preferably 50 or less, more preferably 40 or less, even more preferably 35 or less, even more preferably 30 or less, and even more preferably 25 or less. It may also be 0 or more, 5 or more, or 10 or more. The ideal (most preferred) standard deviation of the relative value is 0. This can further improve corrosion resistance, especially acid resistance. 【0107】 The chemical solution used for immersing the above test specimens is as follows: (1)98% by mass sulfuric acid (90℃) (2) Mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid by mass and 69-71% nitric acid by mass in a volume ratio of 1:100) (20℃) 【0108】 When a crosslinked rubber piece obtained from the rubber composition of this disclosure is subjected to O2 plasma irradiation under the following conditions, the relative value of the mass after irradiation, with the mass before irradiation set to 100, is preferably 80 or more, more preferably 90 or more, even more preferably 95 or more, even more preferably 98 or more, and also preferably 120 or less, more preferably 110 or less, and even more preferably 100 or less. The ideal (most preferred) relative value is 100. This further improves plasma resistance. 【0109】 The durometer hardness of a crosslinked rubber piece obtained from the rubber composition of this disclosure after O2 plasma irradiation under the following conditions is preferably 30 or higher, more preferably 50 or higher, even more preferably 60 or higher, even more preferably 65 or higher, even more preferably 70 or higher, and also preferably 95 or lower, more preferably 85 or lower, even more preferably 80 or lower, and even more preferably 75 or lower. This further improves plasma resistance. The durometer hardness is a value measured by the method described in the examples below. 【0110】 The change in durometer hardness from before irradiation after O2 plasma irradiation of a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -10% or more, more preferably -7% or more, even more preferably -5% or more, even more preferably -3% or more, even more preferably -1% or more, and may also be 0% or less. The ideal (most preferred) change is 0%. This further improves plasma resistance. The above rate of change is calculated using the formula {(durometer hardness after O2 plasma irradiation) / (durometer hardness before O2 plasma irradiation)-1}×100. 【0111】 The tensile strength at break of a crosslinked rubber piece obtained from the rubber composition of this disclosure after O2 plasma irradiation under the following conditions is preferably 9 MPa or more, more preferably 15 MPa or more, even more preferably 20 MPa or more, preferably 40 MPa or less, more preferably 35 MPa or less, and even more preferably 30 MPa or less. This further improves plasma resistance. The tensile strength at break is the value measured by the method described in the examples below. 【0112】 The percentage change in tensile strength at break after O2 plasma irradiation of a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -50% or more, more preferably -30% or more, even more preferably -20% or more, even more preferably -10% or more, and also preferably 50% or less, may be 0% or less, and may be -5% or less. The ideal (most preferred) percentage change is 0%. This further improves plasma resistance. The above rate of change is calculated using the formula {(tensile strength at break after O2 plasma irradiation) / (tensile strength at break before O2 plasma irradiation)-1}×100. 【0113】 The tensile elongation at break of a crosslinked rubber piece obtained from the rubber composition of this disclosure after O2 plasma irradiation under the following conditions is preferably 80% or more, more preferably 100% or more, even more preferably 120% or more, even more preferably 180% or more, even more preferably 200% or more, and particularly preferably 220% or more. The upper limit is not particularly limited, but may be 500% or less. This further improves plasma resistance. The tensile elongation at break is the value measured by the method described in the examples below. 【0114】 The percentage change in tensile elongation at break after O2 plasma irradiation of a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -30% or more, more preferably -25% or more, even more preferably -20% or more, even more preferably -15% or more, even more preferably -10% or more, and also preferably 25% or less, may be 0% or less, and may be -5% or less. The ideal (most preferred) percentage change is 0%. This further improves plasma resistance. The above rate of change is calculated using the formula {(tensile elongation at cutting after O2 plasma irradiation) / (tensile elongation at cutting before O2 plasma irradiation)-1}×100. 【0115】 When a crosslinked rubber piece obtained from the rubber composition of this disclosure is subjected to CF4 plasma irradiation under the following conditions, the relative value of the mass after irradiation, with the mass before irradiation set to 100, is preferably 80 or more, more preferably 90 or more, even more preferably 95 or more, even more preferably 99 or more, and also preferably 120 or less, more preferably 110 or less, and even more preferably 100 or less. The ideal (most preferred) relative value is 100. This further improves plasma resistance. 【0116】 The durometer hardness of a crosslinked rubber piece obtained from the rubber composition of this disclosure after irradiating it with CF4 plasma under the following conditions is preferably 30 or higher, more preferably 50 or higher, even more preferably 60 or higher, even more preferably 65 or higher, even more preferably 70 or higher, and also preferably 95 or lower, more preferably 85 or lower, even more preferably 80 or lower, and even more preferably 75 or lower. This further improves plasma resistance. The durometer hardness is a value measured by the method described in the examples below. 【0117】 The change in durometer hardness from before irradiation after CF4 plasma irradiation of a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -10% or more, more preferably -7% or more, even more preferably -5% or more, even more preferably -3% or more, even more preferably -1% or more, and may be 2% or less. The ideal (most preferred) change is 0%. This further improves plasma resistance. The above rate of change is calculated using the formula {(durometer hardness after CF4 plasma irradiation) / (durometer hardness before CF4 plasma irradiation)-1}×100. 【0118】 The tensile strength at break of a crosslinked rubber piece obtained from the rubber composition of this disclosure after CF4 plasma irradiation under the following conditions is preferably 10 MPa or more, more preferably 15 MPa or more, even more preferably 20 MPa or more, even more preferably 24 MPa or more, and also preferably 40 MPa or less, more preferably 35 MPa or less, and even more preferably 30 MPa or less. This further improves plasma resistance. The tensile strength at break is the value measured by the method described in the examples below. 【0119】 The percentage change in tensile strength at break after CF4 plasma irradiation of a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -30% or more, more preferably -20% or more, even more preferably -10% or more, even more preferably -5% or more, even more preferably -2% or more, and may also be 0% or less, or -5% or less. The ideal (most preferred) percentage change is 0%. This further improves plasma resistance. The above rate of change is calculated using the formula {(tensile strength at cutting after CF4 plasma irradiation) / (tensile strength at cutting before CF4 plasma irradiation)-1}×100. 【0120】 The tensile elongation at break of a crosslinked rubber piece obtained from the rubber composition of this disclosure after CF4 plasma irradiation under the following conditions is preferably 100% or more, more preferably 120% or more, even more preferably 180% or more, even more preferably 200% or more, and particularly preferably 240% or more. There is no particular upper limit, but it may be 500% or less. This further improves plasma resistance. The tensile elongation at break is the value measured by the method described in the examples below. 【0121】 The percentage change in tensile elongation at break after CF4 plasma irradiation of a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -30% or more, more preferably -20% or more, even more preferably -15% or more, even more preferably -10% or more, even more preferably -5% or more, and also preferably 10% or less, even more preferably 5% or less, and may be 0% or less. The ideal (most preferred) percentage change is 0%. This further improves plasma resistance. The above rate of change is calculated using the formula {(tensile elongation at cutting after CF4 plasma irradiation) / (tensile elongation at cutting before CF4 plasma irradiation)-1}×100. 【0122】 The conditions for the O2 plasma irradiation and CF4 plasma irradiation described above are as follows: (O2 plasma conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ (CF4 plasma conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ 【0123】 The durometer hardness after performing a thermal aging test on a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably 30 or higher, more preferably 50 or higher, even more preferably 60 or higher, even more preferably 65 or higher, even more preferably 70 or higher, and also preferably 95 or lower, more preferably 85 or lower, even more preferably 80 or lower, and even more preferably 75 or lower. This further improves heat aging resistance. The durometer hardness is a value measured by the method described in the examples below. 【0124】 The change in durometer hardness from before the test after a thermal aging test is performed on a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -10% or more, more preferably -7% or more, even more preferably -5% or more, even more preferably -3% or more, even more preferably -1% or more, and may be 2% or less. The ideal (most preferred) change is 0%. This further improves heat aging resistance. The above rate of change is calculated using the formula {(durometer hardness after thermal aging test) / (durometer hardness before thermal aging test)-1}×100. 【0125】 The tensile strength at break of a crosslinked rubber piece obtained from the rubber composition of this disclosure after a thermal aging test under the following conditions is preferably 10 MPa or more, more preferably 15 MPa or more, even more preferably 20 MPa or more, even more preferably 24 MPa or more, and also preferably 40 MPa or less, more preferably 35 MPa or less, and even more preferably 30 MPa or less. This further improves heat aging resistance. The tensile strength at break is the value measured by the method described in the examples below. 【0126】 The percentage change in tensile strength at break after a thermal aging test is performed on a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions is preferably -30% or more, more preferably -20% or more, even more preferably -15% or more, even more preferably -10% or more, even more preferably -5% or more, even more preferably -3% or more, and may also be 5% or less, 3% or less, or 0% or less. The ideal (most preferred) percentage change is 0%. This further improves heat aging resistance. The above rate of change is calculated using the formula {(tensile strength at break after thermal aging test) / (tensile strength at break before thermal aging test)-1}×100. 【0127】 The tensile elongation at break of a crosslinked rubber piece obtained from the rubber composition of this disclosure after a thermal aging test under the following conditions is preferably 100% or more, more preferably 120% or more, even more preferably 150% or more, even more preferably 180% or more, even more preferably 220% or more, and even more preferably 240% or more. There is no particular upper limit, but it may be 500% or less. This further improves heat aging resistance. The tensile elongation at break is the value measured by the method described in the examples below. 【0128】 The change in tensile elongation at break from before the test, after a thermal aging test is performed on a crosslinked rubber piece obtained from the rubber composition of this disclosure under the following conditions, is preferably -45% or more, more preferably -30% or more, even more preferably -20% or more, even more preferably -15% or more, even more preferably -10% or more, and even more preferably -5% or more. It may also be -10% or less, -5% or less, or 0% or less. The ideal (most preferred) change is 0%. Because the rubber composition of this disclosure contains an anti-aging agent, the change in tensile elongation at break before and after the thermal aging test tends to be good. This makes it possible to further improve the heat aging resistance. The above rate of change is calculated using the formula {(tensile elongation at break after thermal aging test) / (tensile elongation at break before thermal aging test)-1}×100. 【0129】 (Thermal aging test conditions) The test specimens after the initial testing were subjected to a thermal aging test in accordance with JIS K 6257:2017 "Vulcanized rubber and thermoplastic rubber - Method for determining thermal aging properties". The conditions were as follows: Test method: Accelerated aging test, AtA-1 (forced circulation type thermal aging test machine (cross-wind type)) Test temperature: 100±1℃ Exam duration: 72 hours Testing equipment: Gear-type aging tester AG-1110, manufactured by Ueshima Seisakusho Co., Ltd. 【0130】 The rubber member of this disclosure preferably has a metal leaching amount (by mass) of 15 elements (Li, Na, Mg, Al, K, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) of 30 ppb or less, more preferably 25 ppb or less, even more preferably 20 ppb or less, even more preferably 15 ppb or less, even more preferably 10 ppb or less, even more preferably 5 ppb or less, even more preferably 3 ppb or less, and even more preferably 2.5 ppb or less when a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in 3.6 mass% hydrochloric acid at 23°C for one week. 【0131】 The rubber member of this disclosure preferably has a metal leaching amount of Ca (by mass) of 100 ppb or less, more preferably 50 ppb or less, even more preferably 30 ppb or less, even more preferably 25 ppb or less, and even more preferably 20 ppb or less when a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in 3.6 mass% hydrochloric acid at 23°C for one week. 【0132】 The rubber member of this disclosure preferably has a metal leaching amount (by mass) of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) of 100 ppb or less, more preferably 50 ppb or less, even more preferably 30 ppb or less, even more preferably 25 ppb or less, and even more preferably 20 ppb or less when a test piece of the rubber member (size: 10 mm x 50 mm x 2 mm) is immersed in 3.6 mass% hydrochloric acid at 23°C for one week, and the amount of metal leaching (by mass) of each of the 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) is 100 ppb or less, more preferably 50 ppb or less, even more preferably 30 ppb or less, even more preferably 25 ppb or less, and even more preferably 20 ppb or less. 【0133】 Ideally (most preferably) the amount of any of the above-mentioned elements to be eluted is 0 ppb, but it may also be greater than or equal to the detection limit. 【0134】 The rubber composition of this disclosure contains an anti-aging agent, but can keep the amount of metal leaching low. Therefore, it can be suitably used in applications where low metal leaching is required. 【0135】 This disclosure also discloses rubber members using the above rubber composition. The rubber member may have only a portion (layer) containing the above rubber composition, or it may have a portion (layer) containing the above rubber composition and other portions (layers). However, from the viewpoint of ensuring corrosion resistance, it is preferable that at least a portion of the surface that comes into contact with the corrosive substance is composed of a portion (layer) containing the above rubber composition, and it is more preferable that the entire surface that comes into contact with the corrosive substance is composed of a portion (layer) containing the above rubber composition. 【0136】 The rubber compositions and rubber components of this disclosure have excellent corrosion resistance and can therefore be suitably used in a wide range of applications where corrosion resistance is required. The rubber compositions and rubber components of this disclosure are particularly suitable for a wide range of applications requiring acid resistance, due to their excellent acid resistance. The rubber compositions and rubber components of this disclosure also exhibit excellent plasma resistance and can therefore be suitably used in a wide range of applications requiring plasma resistance. 【0137】 The rubber compositions and rubber members of this disclosure are suitably used in at least one member selected from the group consisting of, for example, building materials, mobility components, aerospace components, semiconductor components, semiconductor manufacturing equipment components, medical components, and information and communication components. The above members are preferably used in semiconductor components and semiconductor manufacturing equipment components, and more preferably in semiconductor manufacturing equipment components (articles for semiconductor manufacturing equipment), due to their excellent corrosion resistance and low metal leaching. 【0138】 Examples of building materials (construction materials) components include interior building materials such as baseboards, ceiling materials, and plumbing materials, as well as exterior building materials such as waterproofing sheets, water-stopping materials, exterior wall materials, and roofing materials. Examples of mobility components mentioned above include parts used in ferries, railways, automobiles, motorcycles, drones, robots, and the like. Examples of the above-mentioned aerospace components include exterior and interior materials for aircraft and rockets, wire insulation materials, cable protection materials, jet engines, cabin interior materials, and their components. Examples of semiconductor materials mentioned above include process materials used in semiconductor manufacturing and components for semiconductor manufacturing-related equipment. Examples of the above-mentioned medical components include medical rubber gloves, rubber stoppers for blood transfusion bags and vacuum blood collection tubes, gaskets for syringes, wound protection materials for wound healing, elastic cords and seals for medical masks, check valves for ventilators, and packaging materials for infusion bags and blood transfusion bags. Furthermore, the above-mentioned medical components also include piping materials, medical devices, laboratory and analytical instruments, and packaging materials. Examples of the above-mentioned information and communication components include parts for devices such as wireless LAN transmission and reception circuits, circuit boards, and parts for devices such as optical communications. 【0139】 Examples of rubber components in this disclosure include sealing materials, containers, piping, nozzles, tubes, tanks, fittings, valves, pumps, housings, spin chucks, washers, nuts, bolts, films, bottles, wire insulation, hoses, pipes, sheets, rollers, cocks, connectors, filter housings, filter cages, flow meters, wafer carriers, wafer boxes, and the like. 【0140】 The rubber member of this disclosure can be suitably applied to at least one selected from the group consisting of sealants, containers, pipes, nozzles, tubes, tanks, fittings, valves, pumps, housings, spin chucks, and washers, given the requirement for corrosion resistance. In particular, it can be suitably applied to at least one selected from the group consisting of sealants, containers, pipes, nozzles, tubes, tanks, fittings, valves, pumps, and spin chucks. Furthermore, it can be suitably used in sealing materials, piping, nozzles, and tubes within semiconductor manufacturing equipment. 【0141】 The sealing material is preferably at least one selected from the group consisting of O-rings, square-rings, gaskets, packings, oil seals, bearing seals, and lip seals. While not particularly limited, the sealing material is often required to have excellent elasticity, low compression set, high wear resistance, excellent heat resistance, resistance to the liquid or gas it is applied to, and a long service life. 【0142】 O-rings and square rings, especially those used in semiconductor manufacturing equipment, are often exposed to various plasmas and other harsh chemical environments, requiring high heat resistance, chemical resistance, and plasma resistance. The compression set is preferably 25% or less at 100°C for 72 hours, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less. 【0143】 While there are no particular limitations on packings and gaskets, they are often required to have a low compression set, a low coefficient of friction, and excellent wear resistance. To prevent leaks, they may also be required to have heat resistance, cold resistance, pressure resistance, and chemical resistance. The compression set is preferably 25% or less at 100°C for 72 hours, more preferably 20% or less, even more preferably 15% or less, and even more preferably 10% or less. 【0144】 The piping is not particularly limited, but in terms of shape, an inner diameter of 2 mm to 400 mm is preferred, 2 mm to 100 mm is more preferred, and 2 mm to 40 mm is particularly preferred. Examples include robust pipe types, flexible hoses that can be incorporated according to the installation space, and bellows pipes that can be bent despite having a large diameter. Furthermore, the inside of the piping may be made of a material that is clean (less contamination of the chemical solution by extracted ions) and chemical resistant, and may be subjected to high-precision polishing that does not generate dust and does not disturb the liquid flow or gas flow. Depending on the type of chemical being used, such as organic solvents, antistatic properties may be required to prevent static electricity buildup. In such cases, conductive fillers (carbon black, carbon nanotubes, etc.) may be added to provide antistatic properties, provided that cleanliness is not compromised. 【0145】 While there are no particular limitations on the nozzle itself, the tip may be precisely machined to match the size and shape of the part. In addition, since it comes into contact with the part, it can be made of a highly hard and durable material that is resistant to friction and bending. 【0146】 While there are no particular limitations on the type of tube, the tube diameter is preferably 2 mm to 400 mm, more preferably 2 mm to 100 mm, and particularly preferably 2 mm to 40 mm. Materials with stress crack resistance, chemical resistance, excellent mechanical strength, and cleanliness (minimal contamination of the chemical solution by extracted ions) are used. Depending on the chemical solution being circulated, such as organic solvents, antistatic properties may be required to prevent electrostatic charge buildup. In such cases, conductive fillers (carbon black, carbon nanotubes, etc.) may be added to provide antistatic properties, within a range that does not impair cleanliness. 【0147】 The containers and tanks are not particularly limited, but they may be subjected to precision cleaning (water washing, acetic acid immersion, hydrochloric acid immersion, nitric acid immersion, wiping cleaning, pure water washing, etc.) to remove dirt and residue. Packaging after cleaning may be carried out in a cleanroom or clean booth environment. 【0148】 The fittings and valves are not particularly limited, but they are required to be oil-free, particle-free, dead space-free, and externally leak-free, and their size is preferably in the range of Φ3.2mm to 40mm, and more preferably in the range of Φ3.2mm to 12.7mm. 【0149】 While not particularly limited, a pump may sometimes require retractability. 【0150】 While there are no particular limitations on the housing, liquid-repellent properties are sometimes required to suppress the adhesion of splashed chemicals during rotary dispensing. 【0151】 While not particularly limited, spin chucks may require hardness, corrosion resistance, and dimensional stability, and conductivity may be added. 【0152】 While washers are not particularly limited, they are often intended for use in cleanrooms and similar environments, requiring durability, corrosion resistance, and rust prevention. 【0153】 The rubber compositions and rubber components of this disclosure can be used, for example, in the following applications: <Building materials> Exterior materials for furniture, interior building materials for walls, ceilings, floors, etc. Exterior building materials such as siding, fences, roofs, gates, and gable boards; Window frames, doors, handrails, thresholds, lintels, etc. - decorative surface materials; Membrane materials (roofing materials, ceiling materials, exterior wall materials, interior wall materials, covering materials, etc.) for membrane structures (sports facilities, horticultural facilities, atriums, etc.); Outdoor-use lumber (soundproof walls, windbreak fences, wave overhang fences, garage canopies, shopping malls, walkway walls, roofing materials); Building materials such as tent materials for tent warehouses, sunshade membranes, partial roofing materials for letting in light, window materials to replace glass, fire-resistant partition membranes, curtains, exterior wall reinforcement, waterproof membranes, smoke barriers, non-combustible transparent partitions, and road reinforcement; Agricultural films, weather-resistant covers for various roofing materials and side walls; Covering materials for glass, such as non-combustible fire-resistant safety glass; etc. Among these, given the requirement for corrosion resistance, it is particularly suitable for use in membrane materials for membrane structures, outdoor paneling, tent materials for tent warehouses, sunshade membranes, partial roofing materials for letting in light, window materials as an alternative to glass, fire-resistant partition membranes, curtains, exterior wall reinforcement, waterproof membranes, smoke-proof membranes, non-combustible transparent partitions, road reinforcement and other building materials, agricultural films, and weather-resistant covers for various roofing materials and side walls. When using the rubber composition and rubber member of the present disclosure in the above applications, from the viewpoint of corrosion resistance and weather resistance, at least one olefin rubber selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber is preferred. 【0154】 <Mobility> O-rings, tubes, gaskets, valve cores, hoses, seals, and diaphragms used in the fuel systems and peripheral equipment of automobiles (for example, injector O-rings, injector gaskets, fuel pump O-rings, diaphragms, fuel hoses, filler hoses, and evaporator hoses) (these may be for sour gasoline, alcohol fuel, or fuels containing gasoline additives such as methyl tert-butyl ether and amines). Hoses and sealing materials used in automatic transmission (AT) systems of automobiles (e.g., ATF hoses); Gaskets, shaft seals, valve stem seals, sealing materials, and hoses used in automobile engines and peripheral equipment (e.g., carburetor flange gaskets, engine head gaskets, metal gaskets, crankshaft seals, camshaft seals, valve stem seals, manifold packings, oil hoses); Oxygen sensor for automotive engines; Automotive components such as brake hoses, air conditioning hoses, radiator hoses, radiator tanks, chemical tanks, bellows, spacers, rollers, gasoline tanks, bumpers, door trims, instrument panels, wire insulation materials, and other automotive parts; O-rings, tubes, gaskets, valve cores, hoses, seals, and diaphragms used in the fuel systems and peripheral equipment of ships; Corrosion-preventive tapes for pipes, such as tapes used to wrap around pipes on ship decks; etc. Among these, due to the requirement of corrosion resistance, it can be particularly suitably used in O(square) rings, tubes, gaskets, hoses, and sealing materials used in the fuel systems and peripheral equipment of automobiles; hoses and sealing materials used in the automatic transmission systems of automobiles; other automobile components such as brake hoses, air conditioning hoses, radiator hoses, bellows, spacers, rollers, bumpers, door trims, and wire insulation materials; and O(square) rings, tubes, gaskets, valve cores, hoses, sealing materials, and diaphragms used in the fuel systems and peripheral equipment of ships. When using the rubber compositions and rubber components of the present disclosure in the above applications, from the viewpoint of corrosion resistance and oil resistance, at least one olefin rubber selected from the group consisting of ethylene-propylene-diene rubber, ethylene-propylene rubber, and butyl rubber is preferred. 【0155】 <Aerospace> O-rings, tubes, packings, valve cores, hoses, seals, and diaphragms used in the fuel systems and peripheral equipment of aircraft and rockets; etc. Among these, due to the requirement of corrosion resistance, it can be particularly suitable for use in O-rings, tubes, packings, hoses, and sealing materials used in the fuel systems and peripheral equipment of aircraft and rockets. When using the rubber composition and rubber member of the present disclosure in the above applications, from the viewpoint of corrosion resistance and weather resistance, at least one olefin rubber selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber is preferred. 【0156】 <Medical> Medical rubber gloves; Rubber stoppers for IV bags, rubber stoppers for blood transfusion bags, rubber stoppers for vacuum blood collection tubes, rubber stoppers for tracheal intubation, rubber stoppers for drug solution blood collection tubes, and other sealing components; Medical infusion tubes, blood collection tubes, drainage tubes, catheters, catheter connectors, stents, piping, tube connectors, and other piping materials; Packaging materials for IV bags, blood transfusion bags, etc. Sealing materials such as gaskets for syringes, wound protection materials for wound healing, elastic cords and seals for medical masks, and check valves for ventilators; Housings for electronic devices such as medical sensors, cardiac devices, and pacemakers; Packaging components, connectors for infusion bags; Laboratory and analytical equipment such as rubber stoppers, sockets, socket holders, and pipettes; etc. Among these, from the viewpoint of chemical resistance and heat resistance, it can be used particularly suitably in medical rubber gloves, rubber stoppers for infusion bags, rubber stoppers for blood transfusion bags, rubber stoppers for vacuum blood collection tubes, rubber stoppers for tracheal intubation, rubber stoppers for drug solution blood collection tubes, medical infusion tubes, blood collection tubes, drain tubes, catheters, piping, infusion bags, blood transfusion bags, gaskets for syringes, wound protection materials for wound healing, rubber straps and seals for medical masks, and check valves for ventilators. 【0157】 <Information and Communication> Insulating boards for high-frequency circuits, insulating materials for connecting components, printed circuit boards; Bases and antenna covers for high-frequency vacuum tubes; Wire insulation material for coaxial cables, LAN cables, etc. Optical fiber coating material; LCD displays and other types of displays; Components for mobile phones; etc. Among these, due to the requirement of corrosion resistance, it can be particularly suitable for use in insulating boards for high-frequency circuits, insulating materials for connecting components, printed circuit boards; bases and antenna covers for high-frequency vacuum tubes; wire coverings for coaxial cables, LAN cables, etc.; and optical fiber coverings. When using the rubber compositions and rubber components of the present disclosure in the above applications, from the viewpoint of corrosion resistance, at least one olefin rubber selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber is preferred. 【0158】 <Semiconductors> Chemical transfer components for semiconductor factories and semiconductor manufacturing-related equipment, including chemical tanks, containers, piping, O-rings, tubes, packings, valve cores, hoses, seals, rolls, gaskets, diaphragms, fittings, coatings, and inner linings for pipes; Drug stoppers and packaging films; Containers, tubes, hoses, and other components for transporting waste liquids; Containers, tubes, hoses, and other components for transporting high-temperature liquids; Steam piping components such as tubes and hoses for steam piping; etc. Among these, due to the requirement of corrosion resistance, it can be particularly suitable for use in O-rings, tubes, packings, hoses, sealing materials, rolls, gaskets, diaphragms, and fittings in semiconductor manufacturing-related equipment. When using the rubber compositions and rubber members of the present disclosure in the above applications, at least one olefin-based rubber selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber is preferred. 【0159】 The above-mentioned semiconductor manufacturing-related equipment includes semiconductor manufacturing equipment (mask and reticle manufacturing equipment, wafer manufacturing equipment, wafer processing equipment, assembly equipment, inspection equipment), and related equipment for semiconductor manufacturing equipment. The above-mentioned semiconductor manufacturing-related equipment includes mask and reticle manufacturing equipment (photolithography equipment, thin film formation / etching / cleaning / drying equipment, inspection and evaluation equipment), wafer manufacturing equipment (wafer processing equipment), wafer process processing equipment (resist processing equipment, etching equipment, cleaning / drying equipment, heat processing equipment, ion implantation equipment, thin film formation equipment, CVD equipment, sputtering equipment, inspection and evaluation equipment, CMP equipment, processing equipment), assembly equipment (dicing equipment, bonding equipment, packaging equipment), inspection equipment (testing equipment, probing equipment, handlers, aging equipment, cold / heat testing equipment, temperature / humidity testing equipment, pressure cooker equipment, laser processing systems, lifetime testing equipment), and semiconductor manufacturing equipment-related equipment (transport equipment, pure water / chemical equipment, gas equipment, cleanroom equipment, jig cleaning / drying equipment, flow control equipment, taping equipment, packaging equipment, liquid / gas measuring equipment). 【0160】 The above semiconductor manufacturing-related equipment includes photolithography equipment (coating equipment, resist stripping equipment, developing equipment (developer), baking equipment, discam equipment), thin film formation / etching / cleaning and drying equipment (vacuum deposition equipment, sputtering equipment, CVD equipment, cleaning equipment, etching equipment, drying equipment, scrub cleaning equipment), inspection and evaluation equipment and other manufacturing equipment (defect correction equipment), wafer processing equipment (wafer marking equipment), resist processing equipment (coating equipment, developing equipment, resist stripping equipment, ashing equipment, baking equipment), etching equipment (dry etching equipment, wafer marking equipment), and etching equipment (dry etching equipment, wafer marking equipment). (Etching equipment), cleaning and drying equipment (dry cleaning equipment, wet cleaning equipment, scrub cleaning equipment, drying equipment), heat treatment equipment (oxidation equipment, diffusion equipment, annealing equipment), ion implantation equipment (high-current ion implantation equipment, medium-current ion implantation equipment, high-energy ion implantation equipment), thin film formation equipment, CVD equipment (high-pressure CVD equipment, SACVD, reduced-pressure CVD, plasma CVD equipment, metal CVD equipment, ALD equipment), sputtering equipment, other thin film formation equipment (vacuum deposition equipment, silicon epitaxial growth equipment, compound semiconductor epitaxial equipment (MOCVD equipment, MBE equipment)) Plating equipment, inspection and evaluation equipment (Auger electron spectrometer), CMP equipment (CMP equipment, CMP cleaning equipment), other processing equipment (wafer marking equipment, back grinding machine, bump plating equipment, tape application machine for back grinder, back grinder, tape removal machine for back grinder), dicing equipment (dicing equipment, wafer mounting equipment), bonding equipment (die bonding equipment, hybrid bonding equipment, wire bonding equipment, inner lead bonding equipment, outer lead bonding equipment, flip-chip bonding equipment) (Placement), packaging equipment (molding equipment, deburring equipment, soldering equipment), other testing equipment (electron beam testing equipment, laser beam testing equipment), proping equipment (proppers), handlers, aging equipment (aging equipment, burn-in equipment, IC insertion equipment, IC extraction equipment), other inspection equipment (cold and heat testing equipment, temperature and humidity testing equipment, pressure cooker equipment, laser processing systems, various life testing equipment), various transport equipment (in-process wafer transport equipment, inter-process wafer transport equipment, stockers), pure water and chemical solution equipment (pure water production equipment,Examples include ultrafiltration systems, reverse osmosis systems, sterilization systems, chemical supply systems, slurry supply systems, chemical purification systems, and wastewater treatment systems; various gas systems (gas generators, gas purification systems, gas mixing systems, gas detection systems, and exhaust gas treatment systems); cleanroom systems (clean benches, clean tunnels, thermal chambers, environmental testing equipment, air showers, and pass boxes); and other manufacturing-related equipment (various jig cleaning and drying systems, flow control equipment, various taping systems, various packaging systems, and measuring instruments for liquids and various gases). 【0161】 Among these, semiconductor manufacturing equipment that uses corrosive substances within the device is not particularly limited, but from the perspective of utilizing the chemical resistance properties, photolithography process equipment (coating equipment, resist stripping equipment, developing equipment (developer), discam equipment), thin film formation / etching / cleaning and drying equipment (vacuum deposition equipment, CVD equipment, cleaning equipment, etching equipment, drying equipment, scrub cleaning equipment), inspection and evaluation equipment / other manufacturing equipment (defect correction equipment), resist processing equipment (coating equipment, developing equipment, resist stripping equipment, ashing equipment), etching equipment (dry etching equipment, wet etching equipment), washing Cleaning and drying equipment (wet cleaning equipment, scrub cleaning equipment, drying equipment), CVD equipment (high-pressure CVD equipment, SACVD, reduced-pressure CVD, plasma CVD equipment, metal CVD equipment, ALD equipment), other thin-film deposition equipment (vacuum deposition equipment, silicon epitaxial growth equipment, compound semiconductor epitaxial equipment (MOCVD equipment, MBE equipment), plating equipment), CMP equipment (CMP equipment, cleaning equipment for CMP), other processing equipment (bump plating equipment), aging equipment (aging equipment, burn-in equipment, IC insertion equipment, IC extraction equipment), and other inspection equipment (various life testing equipment) are preferred. As related equipment for semiconductor manufacturing equipment (related equipment for the above-mentioned semiconductor manufacturing equipment), preferred equipment includes pure water and chemical equipment (chemical supply equipment, slurry supply equipment, chemical purification equipment, waste liquid treatment equipment), various gas equipment (gas generators, gas purification equipment, gas mixing equipment, gas detection equipment, exhaust gas treatment equipment), cleanroom equipment (thermal chambers, environmental testing equipment), and other manufacturing-related equipment (various jig cleaning and drying equipment, flow control equipment, various packaging equipment, measuring instruments for liquids and various gases). 【0162】 As described above, the rubber compositions and rubber members of this disclosure can be suitably used as components (articles for semiconductor manufacturing equipment) for semiconductor manufacturing equipment, but due to their excellent chemical resistance, they are more suitable as components constituting semiconductor manufacturing equipment in which chemicals are used, particularly as components that come into contact with chemicals. 【0163】 The above-mentioned chemicals are not particularly limited, but examples include chemicals used in semiconductor manufacturing equipment. These chemicals can be used individually or in combination of two or more. 【0164】 Specifically, the above-mentioned chemical is TMAH([(CH3)4N] + [OH] - Examples include at least one selected from the group consisting of sodium hydroxide aqueous solution, sulfuric acid, isopropyl alcohol, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, SPM (Sulfuric Acid Hydrogen Peroxide Mixture), SC1 (a mixture of NH4OH, H2O2, and H2O), SC2 (a mixture of HCl, H2O2, and H2O), phosphoric acid, and hydrochloric acid. Among these, TMAH, isopropyl alcohol, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, SPM, SC1, SC2, phosphoric acid, and hydrochloric acid are preferred, and TMAH, hydrofluoric acid, a mixed acid of hydrofluoric acid and nitric acid, and SPM are more preferred. 【0165】 Other examples of the above-mentioned chemicals include at least one selected from the group consisting of silicon-based gases, arsenic-based gases, phosphorus-based gases, boron-based gases, metal hydride gases, metal alkyl gases, halogenated hydrocarbon gases, halogen / halogen gases, nitrogen oxide gases, hydrogen sulfide gases, ammonia gas, trimethylamine gas, propane gas, trimethylaluminum gas, hydrogen gas, helium gas, nitrogen gas, oxygen gas, argon gas, and carbon dioxide gas. 【0166】 Examples of the silicon-based gases mentioned above include monosilane, dichlorosilane, trichloride silane, silicon tetrachloride, silicon tetrafluoride, and disilane. Examples of the above-mentioned arsenic gases include arsine, arsenic(III) fluoride, arsenic(V) fluoride, arsenic(III) chloride, and arsenic(V) chloride. Examples of the phosphorus-based gases mentioned above include phosphine, phosphorus(III) fluoride, phosphorus(V) fluoride, phosphorus(III) chloride, phosphorus(V) chloride, and phosphorus oxychloride. Examples of the boron-based gases mentioned above include diborane, boron trifluoride, boron trichloride, and boron tribromide. Examples of the above-mentioned metal hydride gases include hydrogen selenide, monogermane, hydrogen telluride, styvin, and tin hydride. Examples of the above-mentioned alkyl metal gases include trialkylgallium and trialkylindium. Examples of the above-mentioned halogenated hydrocarbon gases include methane tetrafluoride, methane trifluoride, methane difluoride, propane hexafluoride, propane octafluoride, and cyclobutane octafluoride. Examples of the above-mentioned halogen and halide gases include fluorine, hydrogen fluoride, chlorine, hydrogen chloride, carbon tetrachloride, hydrogen bromide, sulfur hexafluoride, nitrogen trifluoride, sulfur tetrafluoride, tungsten(VI) fluoride, molybdenum(VI) fluoride, germanium tetrachloride, tin(IV) chloride, antimony(V) chloride, tungsten(VI) chloride, and molybdenum hexachloride. Examples of the nitrogen oxide gases mentioned above include nitric oxide, nitrogen dioxide, and dinitrogen monoxide. Among these, ammonia gas, nitrogen trifluoride, nitrous oxide, monosilane, and cyclobutane octafluoride are preferred, and ammonia gas, nitrogen trifluoride, and nitrous oxide are more preferred. 【0167】 The number of particles per 1 mL of ultrapure water released from the rubber member of this disclosure is preferably within the following ranges for each particle size. The number of particles with a particle size of 0.5 μm or larger is preferably 10 or less, more preferably 7 or less, even more preferably 5 or less, even more preferably 3 or less, and even more preferably 1 or less. The number of particles with a particle size of 0.3 μm or larger is preferably 30 or less, more preferably 20 or less, even more preferably 15 or less, even more preferably 10 or less, and even more preferably 5 or less. The number of particles with a particle size of 0.2 μm or larger is preferably 70 or less, more preferably 50 or less, even more preferably 30 or less, even more preferably 20 or less, and even more preferably 10 or less. The number of particles with a particle size of 0.1 μm or larger is preferably 500 or less, more preferably 300 or less, even more preferably 200 or less, even more preferably 100 or less, and even more preferably 50 or less. The number may be zero, or it may be one or more. The above particle count is determined by completely immersing the material in ultrapure water (resistivity: ≥18.0 MΩ·cm), storing it for 24 hours, and then analyzing the immersion solution using a particle counter. 【0168】 The rubber component disclosed herein has a total organic carbon (TOC) elution amount of 40,000 μg / m³ from its surface into ultrapure water. 2 Preferably, it is 20,000 μg / m² 2 It is more preferable that the following conditions are met: 10,000 μg / m² 2 It is even more preferable that the following conditions apply: 5000 μg / m² 2 It is even more preferable that the following conditions are met, and also 100 μg / m² 2 It may be greater than or equal to 1000 μg / m². 2 That's fine too. The amount of total organic carbon (TOC) eluted is determined in accordance with SEMI F57 "Specifications for polymer materials and components used in ultrapure water and chemical supply systems." The component is placed in a PFA container, fully immersed in ultrapure water, and stored at 85±3°C for 7 days (168 hours). The eluate is then measured for TOC concentration using a TOC meter. 【0169】 The above-mentioned semiconductor manufacturing equipment component (semiconductor manufacturing equipment article) may have only a portion (layer) containing the olefin rubber, or it may have a portion (layer) containing the olefin rubber and other portions (layers). However, in order to ensure chemical resistance, it is preferable that at least a part of the surface that comes into contact with the chemical is composed of a portion (layer) containing the olefin rubber, and it is more preferable that the entire surface that comes into contact with the chemical is composed of a portion (layer) containing the olefin rubber. 【0170】 The rubber compositions and rubber components of this disclosure can be manufactured, for example, by crosslinking a raw material composition. The raw material composition may consist only of olefin rubber and an antioxidant, but may also contain other components. 【0171】 Other components mentioned above include known additives used in rubber compositions, such as vulcanization accelerators (zinc oxide, etc.), vulcanization accelerators (stearic acid, etc.), fillers, crosslinking aids, processing aids, acid acceptors, ultraviolet absorbers, flame retardants, colorants, foaming agents, coupling agents, dispersants, and mold release agents. 【0172】 Lubricants and tackifiers can be used as processing aids. Examples of lubricants include paraffin and hydrocarbon resins such as paraffin wax, microcrystalline wax, and polyethylene wax; fatty acids such as stearic acid; fatty acid amides such as stearic acid amide; fatty acid esters such as butyl stearate and ester waxes; higher aliphatic alcohols such as stearyl alcohol; partial esters of fatty acids and polyhydric alcohols such as glycerin fatty acid esters; and fatty acid metal salts such as zinc stearate. Furthermore, examples of tackifiers include coumarone resins such as coumarone-indene resin; phenolic and terpene resins such as phenol-formaldehyde resin, terpene-phenol resin, and alkylphenol-formaldehyde resin; synthetic polyterpene resins, aromatic hydrocarbon resins, aliphatic hydrocarbon resins, and petroleum-based hydrocarbon resins such as polybutene; and rosin derivatives such as rosin esters and various esters of hydrogenated rosin. 【0173】 As fillers, common ones used in rubber compositions can be used, such as carbon black, silicic acid, silica, silicates, alumina, alumina hydrate, calcium carbonate, magnesium carbonate, barium sulfate, magnesium sulfate, clay, talc, kaolin, short fibers (synthetic fibers, glass fibers, carbon fibers, etc.), conductive oxides (zinc oxide, etc.), ferrites, metal powders, mica, graphite, molybdenum disulfide, barium titanate, boron nitride, etc. 【0174】 Examples of colorants include inorganic pigments such as white pigments (titanium dioxide, zinc oxide, gypsum, etc.), black pigments (carbon black, etc.), red pigments, and blue pigments; organic pigments such as azo pigments and phthalocyanine pigments; and dyes. 【0175】 Examples of foaming agents include inorganic foaming agents such as sodium bicarbonate and ammonium bicarbonate, and organic foaming agents such as p,p'-oxybis(benzenesulfonyl hydrazide), azodicarbonamide, and dinitrosopentamethylenetetramine. 【0176】 Examples of coupling agents include white filler coupling agents such as vinyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, and bis(3-(triethoxysilyl)propyl)tetrasulfide, and carbon black coupling agents such as N,N′-bis(2-methyl-2-nitropropyl)-1,6-diaminohexane. 【0177】 The content of the above-mentioned other components is preferably 0.1 parts by mass or more, more preferably 1.0 part by mass or more, and preferably 150 parts by mass or less, and more preferably 100 parts by mass or less, per 100 parts by mass of the above-mentioned olefin rubber. 【0178】 The mixing method is not particularly limited, and known methods using a closed-type mixer, a roll kneader, etc., can be employed. When incorporating the olefin resin mentioned above, a method including a step of mixing at a temperature above the melting point of the olefin resin is preferred from the viewpoint of more uniform mixing. 【0179】 The method of crosslinking is not particularly limited, and known methods such as hot pressing can be used. The crosslinking temperature is preferably 100°C or higher, more preferably 130°C or higher, preferably 250°C or lower, and more preferably 200°C or lower. The bridge-building time is preferably 5 minutes or more, more preferably 10 minutes or more, preferably 120 minutes or less, and more preferably 60 minutes or less. 【0180】 This disclosure also relates to semiconductor manufacturing equipment fitted with the rubber member of this disclosure described above. The use of the member of this disclosure can provide the equipment with excellent corrosion resistance. Therefore, it is preferable that the semiconductor manufacturing equipment is used in which chemicals (especially corrosive substances) are used, and furthermore, it is preferable that chemicals (especially corrosive substances) are used in the equipment and that the corrosive substances come into contact with the member. The above-mentioned components can also be used as other components that the member may contain. 【0181】 Although embodiments have been described above, it should be understood that various modifications to the form and details are possible without departing from the spirit and scope of the claims. [Examples] 【0182】 The present disclosure will now be further described with reference to examples, but the present disclosure is not limited to these examples. 【0183】 The rubber sheets obtained in the examples and comparative examples were cut to predetermined sizes, and various physical properties were measured before or after the corrosion resistance test and the heat aging test using the methods described below. 【0184】 <Hardness Test (Durometer Hardness)> The rubber sheets obtained in the examples and comparative examples were subjected to hardness tests in accordance with the specified JIS K 6253-3:2012 "Vulcanized rubber and thermoplastic rubber - Method for determining hardness - Part 3: Durometer hardness". The conditions were as follows. Specimen shape: Sheet-like (3 layers of 20mm x 20mm x 2mm) Number of measurements: 5 Test temperature: 23±2℃ Test equipment: Durometer (Type A) GS-721N, manufactured by Teclock Co., Ltd. 【0185】 <Tensile Test (Tensile Strength at Break and Tensile Elongation at Break)> Tensile tests were conducted in accordance with JIS K 6251:2017 "Vulcanized rubber and thermoplastic rubber - Method for determining tensile properties," and the tensile strength at break and tensile elongation at break were measured. The conditions were as follows: Test specimen shape: Dumbbell-shaped, type 6 Number of test specimens: 3 Test temperature: 23±2℃ Test speed: 500 mm / min Equipment: Tensilon Universal Tester RTI-1225, manufactured by A&D Co., Ltd. 【0186】 <Compression permanent strain test> The compression set test was conducted in accordance with JIS K 6262:2013 "Vulcanized rubber and thermoplastic rubber - Method for determining compression set at room temperature, high temperature and low temperature". Specimen shape: Three layers of 13mm diameter x 2mm thickness stacked together. Number of test specimens: 3 Test specimen compressibility: 25±2% Heating temperature: 100±1℃ Heating time: 72 hours Test completion: Method A (Measurement taken after leaving the sample at room temperature for 30±3 minutes after opening) Laboratory temperature: 23±2℃ Lubricant: None 【0187】 <Corrosion resistance test (acidic substances)> The rubber sheets obtained in the examples and comparative examples were cut to a size of 10 mm × 50 mm × 2 mm to be used as test specimens. The test specimens were completely immersed in the respective chemical solutions (1) and (2) below and kept there for one week (168 hours). After holding, the test specimens were washed with pure water, surface water droplets were wiped off, and they were dried at 60°C for 12 hours. The mass of the immersed test specimens was measured under room temperature (20°C) conditions. From the measured masses before and after immersion, the relative value of the mass after immersion was calculated, with the mass before immersion set to 100. Furthermore, the mean and standard deviation of the immersion mass (relative value) for (1) and (2) were calculated. (Medicinal solution) (1)98% by mass sulfuric acid (90℃) (2) Mixture of hydrofluoric acid and nitric acid (mixture of 49% by mass hydrofluoric acid and 69 - 71% by mass nitric acid with a volume ratio of 1:100) (20 °C) 【0188】 <Corrosion resistance test (corrosive gas)> The rubber sheets obtained in the examples and comparative examples were punched out into dumbbell-shaped No. 6 according to JIS K 6251:2017 to obtain test pieces. The test pieces were subjected to O2 plasma and CF4 plasma irradiation treatment under the following conditions. Under the condition of room temperature (20 °C), the mass of the test piece after irradiation was measured. From the measured mass after irradiation, the relative value of the mass after irradiation with the mass before irradiation taken as 100 was calculated. (O2 plasma irradiation conditions) Gas flow rate: 16 SCCM RF output: 400 W Pressure: 2.66 Pa Etching time: 30 minutes (CF4 plasma irradiation conditions) Gas flow rate: 16 SCCM RF output: 400 W Pressure: 2.66 Pa Etching time: 30 minutes 【0189】 <Thermal aging test> For the test pieces after the test, a thermal aging test was carried out in accordance with JIS K 6257:2017 "Vulcanized rubber and thermoplastic rubber - Method for determining thermal aging characteristics". Each condition is as follows. Test method: Accelerated aging test, AtA-1 (forced circulation type thermal aging tester (crosswind type)) Test temperature: 100 ± 1 °C Test time: 72 hours Test device: Gear type aging tester AG-1110 manufactured by Ueshima Seisakusho Co., Ltd. 【0190】 <Metal elution test> The rubber sheets obtained in the examples and comparative examples were cut into a size of 10 mm × 50 mm × 2 mm to obtain test pieces. As a pre-cleaning step, the test specimens were immersed in 3.6% by mass hydrochloric acid for 1 hour, followed by rinsing with pure water. Then, the test specimens were immersed in 100 mL of 3.6% by mass hydrochloric acid at 23°C. One week (168 hours) after the start of immersion, a portion of each immersion solution was withdrawn, and the metal concentrations of 16 elements (Li, Na, Mg, Al, K, Ca, Ti, Cr, Mn, Fe, Ni, Cu, Zn, Ag, Cd, Pb) were measured using ICP-MSI (Agilent 8900, Agilent Technologies) to determine the amount of metal leached. 【0191】 The materials used in the examples and comparative examples are shown below. (rubber) EP57C: Manufactured by ENEOS Material Co., Ltd., EPDM, Mooney viscosity ML 1+4 (125℃): 58, Diene monomer content: 4.5% by mass, Ethylene content: 67% by mass EPT0045: Manufactured by Mitsui Chemicals, Inc., EPM, Mooney viscosity ML 1+4 (100℃): 40, Diene monomer content: 0% by mass, Ethylene content: 51% by mass (Carbon Black) Seast G-SO: Manufactured by Tokai Carbon Co., Ltd., FEF Carbon Black (Crosslinking agent) Perkmyl D-40: Manufactured by NOF Corporation, dicumyl peroxide (Anti-aging agent) Antege RD: Manufactured by Kawaguchi Chemical Industry Co., Ltd., 2,2,4-trimethyl-1,2-dihydroquinoline polymer Nocrack CD: Manufactured by Ouchi Shinko Chemical Co., Ltd., 4,4'-bis(α,α-dimethylbenzyl)diphenylamine Nocrac MB: Manufactured by Ouchi Shinko Chemical Co., Ltd., 2-mercaptobenzimidazole 【0192】 Examples 1-9 and Comparative Examples 1-2 According to the mixing ratios shown in Table 1, kneading (A kneading) was performed using a closed-type mixer (Laboplastmill Banbury type mixer B-250, manufactured by Toyo Seiki Seisakusho Co., Ltd.) for 5 minutes from a predetermined starting temperature. Next, kneading (B kneading) was performed using an electrically heated high-temperature roll press (manufactured by Ikeda Machinery Industry Co., Ltd.) at a predetermined temperature. After kneading, the mixture was crosslinked at 170°C for 13 minutes using an electric heat press (manufactured by Otake Machinery Industry Co., Ltd.) to produce a rubber sheet (rubber material). Various tests were conducted using the obtained rubber sheets. The results are shown in Tables 2-4. 【0193】 [Table 1] 【0194】 [Table 2] 【0195】 [Table 3] 【0196】 [Table 4] A "-" in the table indicates that the test was not conducted. 【0197】 In the corrosion resistance tests (acidic substances) conducted in Examples 1-8 and Comparative Example 1, using EP57C as the rubber, the relative mass after immersion (with the mass before immersion set to 100), as well as its mean and standard deviation, were better in the Examples than in Comparative Example 1. Furthermore, in the corrosion resistance tests (acidic substances) conducted in Example 9 and Comparative Example 2 using EPT0045 as the rubber, the relative values ​​of the mass after immersion (with the mass before immersion set to 100) and their mean and standard deviations were better in Example 9 than in Comparative Example 2. Therefore, from the above results, it can be said that the rubber members of Examples 1 to 9 are excellent in chemical resistance. 【0198】 As a result of the corrosion resistance test (corrosive gas) in Examples 1 to 8 and Comparative Example 1 using EP57C as the rubber, when the mass before irradiation was set to 100 after irradiation with O2 plasma, the relative value after irradiation was better in the examples than in Comparative Example 1. Also, the change rates of hardness, tensile strength at break, and elongation at break after irradiation from before irradiation were also better in the examples. Further, the change rates of tensile strength at break and elongation at break after irradiation with CF4 plasma were better in the examples than in Comparative Example 1. Also, as a result of the corrosion resistance test (corrosive gas) in Example 9 and Comparative Example 2 using EPT0045 as the rubber, when the mass before irradiation was set to 100 after irradiation with O2 plasma, the relative value after irradiation was better in the example than in Comparative Example 2. Also, the change rates of hardness, tensile strength at break, and elongation at break after irradiation from before irradiation were also better in Example 9. Further, the change rates of hardness, tensile strength at break, and elongation at break after irradiation with CF4 plasma were better in the example than in Comparative Example 2. Therefore, from the above results, it can be said that the rubber members of Examples 1 to 9 are excellent in plasma resistance. 【0199】 In addition, in the normal physical properties of the rubber members of Examples 1 to 8 using EP57C as the rubber, the hardness, tensile strength at break, and elongation at break were better than those of Comparative Example 1. Also, in the normal physical properties of the rubber member of Example 9 using EPT0045 as the rubber, the hardness, tensile strength at break, and elongation at break were better than those of Comparative Example 2. Further, the change rates of hardness, tensile strength at break, and elongation at break after the heat aging test of the rubber members of Examples 1 to 9 from before heat aging were low, and it can be said that they are also excellent in heat aging resistance. 【0200】 Furthermore, in the metal elution test of the rubber members of the examples, the metal elution amounts of 16 elements were 25 ppb or less, and in particular, the metal elution amounts of 15 elements excluding Ca were 2.5 ppb or less, and it was suitable for applications that require low metal elution, for example, members (parts) in which chemicals are used inside semiconductor manufacturing-related devices.

Claims

[Claim 1] A rubber composition comprising olefin-based rubber and an anti-aging agent, which comes into contact with corrosive substances. [Claim 2] The rubber composition according to claim 1, comprising 0.1 to 10.0 parts by mass of the aging inhibitor per 100 parts by mass of the olefin rubber. [Claim 3] The rubber composition according to claim 1 or 2, wherein the aforementioned antioxidant comprises an amine-based antioxidant. [Claim 4] The rubber composition according to claim 3, wherein the amine-based antioxidant comprises at least one selected from the group consisting of 2,2,4-trimethyl-1,2-dihydroquinoline polymer and 4,4'-bis(α,α-dimethylbenzyl)diphenylamine. [Claim 5] The rubber composition according to claim 3, comprising 0.1 to 5.0 parts by mass of the amine-based antioxidant per 100 parts by mass of the olefin-based rubber. [Claim 6] The rubber composition according to claim 1 or 2, wherein the aforementioned antioxidant comprises a sulfur-based antioxidant. [Claim 7] The rubber composition according to claim 6, wherein the sulfur-based antioxidant comprises a benzimidazole-based antioxidant. [Claim 8] The rubber composition according to claim 7, wherein the benzimidazole-based antioxidant comprises 2-mercaptobenzimidazole. [Claim 9] The rubber composition according to claim 6, comprising 0.1 to 5.0 parts by mass of the sulfur-based antioxidant per 100 parts by mass of the olefin-based rubber. [Claim 10] The rubber composition according to claim 1 or 2, wherein the anti-aging agent comprises an amine-based anti-aging agent and a sulfur-based anti-aging agent. [Claim 11] The rubber composition according to claim 10, comprising 0.1 to 5.0 parts by mass of the amine-based antioxidant and 0.1 to 5.0 parts by mass of the sulfur-based antioxidant per 100 parts by mass of the olefin-based rubber. [Claim 12] The rubber composition according to claim 1 or 2, wherein the olefin rubber is at least one selected from the group consisting of ethylene-propylene-diene rubber and ethylene-propylene rubber. [Claim 13] The rubber composition according to claim 12, wherein the ethylene content of the ethylene-propylene-diene rubber and the ethylene content of the ethylene-propylene rubber is 50 to 70% by mass. [Claim 14] The rubber composition according to claim 1 or 2, wherein the amount of diene monomer in the olefin rubber is 0 to 5% by mass. [Claim 15] Mooney viscosity (ML) of the olefin-based rubber. １＋４ The rubber composition according to claim 1 or 2, wherein the temperature (at 100°C) is 10 to 200°C. [Claim 16] The rubber composition according to claim 1 or 2, wherein the pH of the corrosive substance is 6 or less. [Claim 17] The rubber composition according to claim 1 or 2, wherein the oxidation-reduction potential (vsNHE) of the corrosive substance is 0 to 3.0 V. [Claim 18] The rubber composition according to claim 1 or 2, wherein the corrosive substance is at least one selected from the group consisting of acidic substances, oxidizing substances, organic solvents, and brine. [Claim 19] The rubber composition according to claim 18, wherein the acidic substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid. [Claim 20] The rubber composition according to claim 1 or 2, wherein the corrosive substance is at least one selected from the group consisting of sulfuric acid, hydrofluoric acid, nitric acid, phosphoric acid, a mixed acid of hydrofluoric acid and nitric acid, a mixed chemical solution of hydrogen peroxide solution and hydrochloric acid, and a mixed chemical solution of hydrogen peroxide solution and sulfuric acid. [Claim 21] The rubber composition according to claim 1 or 2, wherein a crosslinked rubber piece (size: 10 mm x 50 mm x 2 mm) obtained from the rubber composition is immersed in the following two chemical solutions for one week, and the relative value of the mass after immersion, with the mass before immersion set to 100, is 25 or more and 175 or less in both cases. (Medicinal solution) 98% by mass sulfuric acid (90°C), and A mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid and 69-71% nitric acid by mass in a volume ratio of 1:100) (20°C). [Claim 22] The rubber composition according to claim 1 or 2, wherein a crosslinked rubber piece (size: 10 mm x 50 mm x 2 mm) obtained from the rubber composition is immersed in one of the following chemical solutions for one week, and the relative value of the mass after immersion, with the mass before immersion set to 100, is 93 or more and 107 or less. (Medicinal solution) A mixed acid of hydrofluoric acid and nitric acid (a mixture of 49% hydrofluoric acid and 69-71% nitric acid by mass in a volume ratio of 1:100) (20°C). [Claim 23] The rubber composition according to claim 1 or 2, wherein the corrosive substance is a corrosive gas containing plasma. [Claim 24] The rubber composition according to claim 23, wherein the corrosive gas containing the plasma is at least one selected from the group consisting of noble gases, organic halogen gases, inorganic halogen gases, hydrocarbon gases, oxygen, hydrogen, nitrogen, carbon monoxide, oxygen dioxide, ammonia, ozone, nitrous oxide, nitrogen dioxide, silane, diborane, and sulfur dioxide. [Claim 25] The crosslinked rubber obtained from the aforementioned rubber composition is subjected to the following conditions: ２ The rubber composition according to claim 1 or 2, wherein the tensile strength at the time of cutting after plasma irradiation is 9 MPa or more. (O ２ Plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ [Claim 26] The crosslinked rubber obtained from the aforementioned rubber composition is subjected to the following conditions: ２ The rubber composition according to claim 1 or 2, wherein the rate of change of the tensile strength at break after plasma irradiation is -50% to 50% compared to before irradiation. (O ２ Plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ [Claim 27] The crosslinked rubber obtained from the aforementioned rubber composition is subjected to the following conditions: ２ The rubber composition according to claim 1 or 2, wherein the tensile elongation at the time of cutting after plasma irradiation is 80% or more. (O ２ Plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ [Claim 28] The crosslinked rubber obtained from the aforementioned rubber composition is subjected to the following conditions: ２ The rubber composition according to claim 1 or 2, wherein the rate of change of the tensile elongation at the time of cutting after plasma irradiation is -25% to 25% compared to before irradiation. (O ２ Plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ [Claim 29] The following conditions apply to the crosslinked rubber obtained from the aforementioned rubber composition: CF ４ The rubber composition according to claim 1 or 2, wherein the rate of change of the tensile elongation at the time of cutting after plasma irradiation is 10% or less compared to before irradiation. (CF ４ Plasma irradiation conditions) Cross-linked rubber shape: Dumbbell-shaped, type 6 Gas flow rate: 16 SCCM RF output: 400Wh Pressure: 2.66 Pa Etching time: 30 minutes Temperature: 100℃ [Claim 30] A rubber member using the rubber composition according to claim 1 or 2. [Claim 31] The rubber member according to claim 30, which is at least one member selected from the group consisting of building materials, mobility components, aerospace components, semiconductor components, semiconductor manufacturing equipment components, medical components, and information and communication components. [Claim 32] The rubber member according to claim 30, which is at least one selected from the group consisting of sealing materials, containers, pipes, nozzles, tubes, tanks, fittings, valves, pumps and spin chucks. [Claim 33] The rubber member according to claim 32, wherein the sealing material is at least one selected from the group consisting of O-rings, square rings, gaskets, packings, oil seals, bearing seals, and lip seals. [Claim 34] The rubber member according to claim 30, which is a component for semiconductor manufacturing equipment. [Claim 35] The rubber member according to claim 34, wherein the semiconductor manufacturing-related apparatus is an apparatus in which chemicals are used. [Claim 36] A semiconductor manufacturing apparatus equipped with the rubber member described in claim 30. [Claim 37] The semiconductor manufacturing-related apparatus according to claim 36, which is at least one selected from the group consisting of a mask / reticle manufacturing apparatus, a wafer manufacturing apparatus, a wafer processing apparatus, an assembly apparatus, an inspection apparatus, and a semiconductor manufacturing apparatus-related apparatus. [Claim 38] The mask reticle manufacturing apparatus is at least one selected from the group consisting of a photolithography apparatus, a thin film formation / etching / cleaning / drying apparatus, and an inspection and evaluation apparatus. The wafer manufacturing apparatus is a wafer processing apparatus, The wafer processing apparatus is at least one selected from the group consisting of a resist processing apparatus, an etching apparatus, a cleaning and drying apparatus, a heat processing apparatus, an ion implantation apparatus, a thin film forming apparatus, a CVD apparatus, a sputtering apparatus, an inspection and evaluation apparatus, a CMP apparatus, and a processing apparatus. The assembly apparatus is at least one selected from the group consisting of a dicing apparatus, a bonding apparatus, and a packaging apparatus. The inspection device is at least one selected from the group consisting of a testing device, a probing device, a handler, an aging device, a cold / heat testing device, a temperature / humidity testing device, a pressure cooker device, a laser processing system, and a life testing device. The semiconductor manufacturing apparatus according to claim 37, wherein the semiconductor manufacturing apparatus is at least one selected from the group consisting of a conveying device, a pure water / chemical solution device, a gas device, a cleanroom device, a jig cleaning / drying device, a flow control device, a taping device, a packaging device, and liquid / gas measuring instruments. [Claim 39] The photolithography apparatus is at least one selected from the group consisting of a coating apparatus, a resist stripping apparatus, a developing apparatus (developer), a baking apparatus, and a discam apparatus. The thin film formation, etching, cleaning, and drying apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a sputtering apparatus, a CVD apparatus, a cleaning apparatus, and a drying apparatus. The inspection and evaluation device is a defect correction device, The wafer processing apparatus is a wafer marking apparatus, The resist processing apparatus is at least one selected from the group consisting of a coating apparatus, a developing apparatus, a resist stripping apparatus, an ashing apparatus, and a baking apparatus. The etching apparatus is at least one selected from the group consisting of a dry etching apparatus and a wet etching apparatus. The washing and drying apparatus is at least one selected from the group consisting of a dry washing apparatus, a wet washing apparatus, a scrubbing washing apparatus, and a drying apparatus. The heat treatment apparatus is at least one selected from the group consisting of an oxidation apparatus, a diffusion apparatus, and an annealing apparatus. The ion implanter is at least one selected from the group consisting of a high-current ion implanter, a medium-current ion implanter, and a high-energy ion implanter. The CVD apparatus is at least one selected from the group consisting of high-pressure CVD apparatus, SACVD, reduced-pressure CVD, plasma CVD apparatus, metal CVD apparatus, and ALD apparatus. The thin film formation apparatus is at least one selected from the group consisting of a vacuum deposition apparatus, a silicon epitaxial growth apparatus, a compound semiconductor epitaxial apparatus (MOCVD apparatus, MBE apparatus), and a plating apparatus. The CMP apparatus is at least one selected from the group consisting of a CMP apparatus and a CMP cleaning apparatus. The inspection and evaluation apparatus is an Auger electron spectrometer, The processing apparatus is at least one selected from the group consisting of a wafer marking apparatus, a back grinding machine, a bump plating apparatus, a tape application machine for a back grinder, a back grinder, and a tape peeling machine for a back grinder. The dicing apparatus is at least one selected from the group consisting of a dicing apparatus and a wafer mounting apparatus. The bonding apparatus is at least one selected from the group consisting of a die bonding apparatus, a hybrid bonding apparatus, a wire bonding apparatus, an inner lead bonding apparatus, an outer lead bonding apparatus, and a flip-chip bonding apparatus. The packaging apparatus is at least one selected from the group consisting of a molding apparatus, a deburring apparatus, and a soldering apparatus. The testing apparatus is at least one selected from the group consisting of electron beam testing apparatus and laser beam testing apparatus. The aforementioned proping device is a propper, The aging apparatus is at least one selected from the group consisting of an aging apparatus, a burn-in apparatus, an IC insertion apparatus, and an IC extraction apparatus. The transfer device is at least one selected from the group consisting of an in-process wafer transfer device, an inter-process wafer transfer device, and a stocker. The aforementioned pure water / chemical solution system is at least one selected from the group consisting of a pure water production system, an ultrafiltration system, a reverse osmosis system, a sterilization system, a chemical supply system, a slurry supply system, a chemical purification system, and a wastewater treatment system. The gas apparatus is at least one selected from the group consisting of a gas generator, a gas purification device, a gas mixing device, a gas detection device, and an exhaust gas treatment device. The semiconductor manufacturing apparatus according to claim 38, wherein the cleanroom apparatus is at least one selected from the group consisting of a clean bench, a clean tunnel, a thermal chamber, an environmental testing apparatus, an air shower, and a pass box. [Claim 40] The semiconductor manufacturing apparatus according to claim 36, wherein a corrosive substance is used within the apparatus. [Claim 41] The semiconductor manufacturing apparatus according to claim 36, wherein a corrosive substance is used in the apparatus and the corrosive substance comes into contact with the rubber member.

Images